KR20040074913A - Wire bonding method - Google Patents

Wire bonding method Download PDF

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Publication number
KR20040074913A
KR20040074913A KR1020040000473A KR20040000473A KR20040074913A KR 20040074913 A KR20040074913 A KR 20040074913A KR 1020040000473 A KR1020040000473 A KR 1020040000473A KR 20040000473 A KR20040000473 A KR 20040000473A KR 20040074913 A KR20040074913 A KR 20040074913A
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South Korea
Prior art keywords
bump
conductor
wire
bonding
capillary
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KR1020040000473A
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Korean (ko)
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KR100577586B1 (en
Inventor
미이다츠나리
와타나베히로시
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가부시키가이샤 신가와
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Publication of KR20040074913A publication Critical patent/KR20040074913A/en
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Publication of KR100577586B1 publication Critical patent/KR100577586B1/en

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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
    • E04B2/02—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls built-up from layers of building elements
    • E04B2/42—Walls having cavities between, as well as in, the elements; Walls of elements each consisting of two or more parts, kept in distance by means of spacers, at least one of the parts having cavities
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
    • E04B2/02—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls built-up from layers of building elements
    • E04B2002/0256—Special features of building elements
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Abstract

PURPOSE: A wire bonding method is provided to freely control a tilt angle of a tilted surface formed on a bump by avoiding a contact between a wire and a circuit board or between the wire and an interconnection after the wire and the bump are attached and by removing the necessity of replacing a capillary. CONSTITUTION: After the first bonding process is performed on the first conductor, the second bonding process is performed on the second conductor. The first and second conductors are wire-bonded to each other. A ball bonding process is performed on the second conductor to form a bump(10). After a capillary(5) ascends, the capillary is transferred downward in an opposite direction to the first conductor to form a tilted surface on the bump. After the first bonding process is performed, a wire(4) is looped from the first conductor to the bump and the second bonding process is performed on the tilted surface on the bump.

Description

와이어본딩 방법{WIRE BONDING METHOD}Wire Bonding Method {WIRE BONDING METHOD}

본 발명은, 2개의 도체 사이를 와이어본딩하는 와이어본딩 방법에 관한 것이다.The present invention relates to a wire bonding method for wire bonding between two conductors.

제 2 도체상에 범프를 형성한 후, 제 1 도체와 제 2 도체상의 범프 사이에 와이어를 접속하는 와이어본딩 방법으로서, 특허문헌 1 및 특허문헌 2를 들 수 있다.Patent document 1 and patent document 2 are mentioned as a wire bonding method which connects a wire between the bump on a 1st conductor and a 2nd conductor after forming a bump on a 2nd conductor.

(특허문헌 1)(Patent Document 1)

일본 특개평 10-112471호 공보Japanese Patent Laid-Open No. 10-112471

(특허문헌 2)(Patent Document 2)

일본 특개 2002-280410호 공보Japanese Patent Application Laid-Open No. 2002-280410

특허문헌 1은, 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 그 웨지 본딩을 범프에 대해 제 1 도체와 반대측의 위치에서 행한 후, 제 1 도체상에 1차 본딩을 행하고, 이어서 범프에 대하여 제 1 도체측으로부터 와이어를 루핑하고 범프상에 2차 본딩을 행하고 있다.Patent document 1 forms a bump by performing ball bonding on a 2nd conductor, performs the wedge bonding at the position opposite to a 1st conductor with respect to a bump, and performs primary bonding on a 1st conductor, and then bumps The wire is looped from the first conductor side and secondary bonding is performed on the bumps.

특허문헌 2는, 제 2 도체상에 볼 본딩을 행하여 범프를 형성한 후, 캐필러리를 상방으로 이동시키고, 다음에 상기 캐필러리를 제 1 도체와 반대측의 위치에 이동시키고, 재차 상기 캐필러리를 하방으로 이동시켜 경사 웨지를 형성한 후, 제 1 도체상에 1차 본딩을 행하고, 이어서 상기 범프에 대하여 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사 웨지상에 2차 본딩을 행하고 있다.Patent document 2 forms a bump by performing ball bonding on a 2nd conductor, and then moves a capillary upwards, Next, moves the said capillary to the position opposite to a 1st conductor, and again the said After the pillars are moved downward to form the warp wedges, primary bonding is performed on the first conductors, and then the wires are looped from the first conductor side with respect to the bumps and secondary on the warp wedges above the bumps. Bonding is performed.

특허문헌 1은, 특허문헌 2의 [0006]항에 기재되어 있는 바와 같은 문제점을 갖는다. 범프 형성후의 웨지 본딩과 와이어부의 접합이 이루어지고, 즉 곡면끼리의 접합이 이루어져 접합 위치 어긋남을 일으킨 경우, 결과로서 와이어 구부러짐을 발생시켜, 이웃하는 와이어 사이에서 접촉이 발생한다. 또, 범프후의 웨지 본딩을 후방에 만곡 형상으로 형성함으로써 와이어 테일의 발생은 억제할 수 있지만, 와이어와 범프 접합에서 충분한 경사 및 평면을 확보할 수 없기 때문에, 범프와 와이어를 접합한 후에 발생하는 와이어와 회로기판과의 접촉, 와이어와 배선 사이의 접촉을 방지할 수 없다.Patent document 1 has the problem as described in the term of patent document 2. When the wedge bonding after the bump formation and the joining of the wire portion are made, that is, the joining of the curved surfaces is performed, resulting in the joining position shift, wire bending occurs as a result, and a contact occurs between neighboring wires. In addition, by forming the wedge bonding after the bump in a curved shape at the rear, the generation of the wire tail can be suppressed, but since the sufficient inclination and plane cannot be secured in the wire and bump bonding, the wire generated after the bump and the wire are joined. Contact with the circuit board and between the wire and the wiring cannot be prevented.

특허문헌 2는, 청구항 2 및 [0011]항에 기재되어 있는 바와 같이, 배선부상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 범프의 중심으로부터 제 1 도체측과 반대 방향으로 이동시키고, 그 후에 재차 캐필러리를 하방으로 밀어 내려 캐필러리 외벽면으로 경사 웨지를 범프상에 형성한다. 그리고, 경사 웨지상에 2차 본딩을 행하므로, 특허문헌 1에서와 같은 문제점은 생기지 않는다.Patent Document 2, as described in claims 2 and [0011], after the ball bonding on the wiring portion to form a bump, after raising the capillary, the direction opposite to the first conductor side from the center of the bump After that, the capillary is pushed downward again to form an inclined wedge on the bump with the capillary outer wall surface. And since secondary bonding is performed on the inclined wedge, the same problem as in patent document 1 does not arise.

그러나, 특허문헌 2는, 캐필러리를 아래쪽으로 밀어 내려서 캐필러리의 외벽면으로 경사 웨지를 범프상에 형성하므로, 경사 웨지의 경사각도는, 캐필러리의 외벽면의 형상에 의해 결정된다. 그런데, 제 1 도체와 제 2 도체간의 거리가 짧을 경우에는, 와이어 루프의 아래로 쳐짐이 작으므로, 경사 웨지의 경사각도는 작아도 좋다. 그러나, 제 1 도체와 제 2 도체 사이의 거리가 긴 경우에는, 와이어 루프의 아래로 쳐짐은 크므로, 경사 웨지의 경사각도를 크게 할 필요가 있다. 이러한 경우, 특허문헌 2에서는 그것에 적합한 캐필러리로 변경할 필요가 있었다.However, since patent document 2 pushes a capillary down and forms an inclined wedge on the bump by the outer wall surface of a capillary, the inclination angle of an inclined wedge is determined by the shape of the outer wall surface of a capillary. By the way, when the distance between a 1st conductor and a 2nd conductor is short, since the fall of the wire loop is small, the inclination angle of the inclined wedge may be small. However, when the distance between the first conductor and the second conductor is long, the downfall of the wire loop is large, so the inclination angle of the inclined wedge needs to be increased. In this case, in patent document 2, it was necessary to change into the capillary suitable for it.

본 발명의 과제는, 범프상에 형성하는 경사면의 경사각도를 자유롭게 설정할 수 있는 와이어본딩 방법을 제공하는 것에 있다.An object of the present invention is to provide a wire bonding method in which the inclination angle of the inclined surface formed on the bump can be freely set.

도 1은 본 발명의 1실시형태에 관계되는 와이어본딩 방법의 공정을 도시하는 공정도이다.BRIEF DESCRIPTION OF THE DRAWINGS It is process drawing which shows the process of the wire bonding method which concerns on one Embodiment of this invention.

도 2는 도 1의 이어지는 공정을 도시하는 공정도이다.FIG. 2 is a process chart showing the subsequent process of FIG. 1.

도 3은 본 발명의 1실시형태에 관계되는 와이어본딩 방법을 사용하여 다이와 배선 사이가 와이어본딩된 상태의 다른 예를 도시하는 도면이다.FIG. 3 is a diagram showing another example of a state in which wires are bonded between a die and wiring by using the wire bonding method according to the embodiment of the present invention.

(부호의 설명)(Explanation of the sign)

1 회로기판 2 다이1 circuit board 2 die

2a 패드 3 배선2a pad 3 wiring

4 와이어 4a, 4b 볼4 wire 4a, 4b ball

5 캐필러리 5a, 관통 구멍5 capillary 5a, through hole

5b 에지부 10 범프5b edge 10 bump

11 홀 부분 12 경사면11 hole part 12 slope

상기 과제를 해결하기 위한 본 발명의 청구항 1은, 제 1 도체상에 1차 본딩을 행한 후, 제 2 도체상에 2차 본딩을 행하고, 상기 제 1 도체와 상기 제 2 도체 사이를 와이어본딩하는 방법에 있어서, 상기 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 캐필러리를 상기 제 1 도체측과 반대 방향으로 비스듬히 하방으로 이동시켜 범프의 상부에 경사면을 형성시키고, 그 후 상기 1차 본딩을 행하고, 다음에 상기 범프에 대해 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사면상에 상기 2차 본딩을 행하는 것을 특징으로 한다.Claim 1 of the present invention for solving the above-mentioned problem, after performing the primary bonding on the first conductor, the secondary bonding on the second conductor, wire bonding between the first conductor and the second conductor In the method, a ball bonding is performed on the second conductor to form a bump, and after the capillary is raised, the capillary is moved obliquely downward in the direction opposite to the first conductor side to incline the upper surface of the bump. And then perform the primary bonding, then loop the wire from the first conductor side to the bump and perform the secondary bonding on the inclined surface of the upper portion of the bump.

상기 과제를 해결하기 위한 본 발명의 청구항 2는, 상기 청구항 1에 있어서, 상기 범프를 형성한 후에 캐필러리를 상승시키는 높이는, 범프 형성시에 상기 캐필러리의 관통 구멍에 솟아 오른 홀 부분의 높이 이내인 것을 특징으로 한다.Claim 2 of this invention for solving the said subject is a height of the hole part which rose to the through-hole of the said capillary at the time of bump formation in the said claim 1, The height which raises a capillary after forming the said bump is formed. It is characterized by the following.

(발명의 실시형태)Embodiment of the Invention

본 발명의 1실시형태에 관계되는 와이어본딩 방법을 도 1 및 도 2에 의해 설명한다. 도 2(b)는 본 발명의 1실시형태에 관계되는 와이어본딩 방법을 사용하여 다이와 배선 사이에 와이어본딩한 상태의 1예를 도시한다. 세라믹 기판이나 프린트 기판 등의 기판 또는 리드 프레임 등으로 이루어지는 회로기판(1)상에는, 패드(2a)가 형성된 다이(2)가 마운트되어 있다. 또 회로기판(1)에는 배선(3)이 형성되어 있다. 배선(3)상에는 범프(10)가 형성되어 있고, 패드(2a)와 범프(10) 사이에는 와이어(4)가 접속되어 있다. 5는 와이어(4)가 삽입통과된 캐필러리를 도시한다.The wire bonding method which concerns on one Embodiment of this invention is demonstrated by FIG. FIG.2 (b) shows an example of the state which wire-bonded between die | dye and wiring using the wire bonding method which concerns on one Embodiment of this invention. The die 2 on which the pad 2a is formed is mounted on a circuit board 1 made of a substrate such as a ceramic substrate, a printed board, or a lead frame. In addition, a wiring 3 is formed on the circuit board 1. A bump 10 is formed on the wiring 3, and a wire 4 is connected between the pad 2a and the bump 10. 5 shows the capillary through which the wire 4 is inserted.

다음에 도 2(b)에 도시하는 와이어본딩은 다음 공정에 의해 행해진다. 우선, 도 1(a)에 도시하는 바와 같이, 캐필러리(5)의 관통 구멍(5a)에 삽입통과된 와이어(4)의 선단에 도시하지 않은 전기 토치에 의해 볼(4a)을 형성한다. 다음에 도 1(b)에 도시하는 바와 같이, 캐필러리(5)를 하강시켜 배선(3)상에 볼 본딩을 행한다. 이것에 의해, 볼(4a)의 일부는 관통 구멍(5a)내에 솟아 오르고, 범프(10)상에 홀 부분(11)이 형성된다. 이어서 도 1(c)에 도시하는 바와 같이, 캐필러리(5)의 하단의 에지부(5b)가 홀 부분(11)의 높이 이내에 위치하도록 캐필러리(5)를 상승시킨다.Next, the wire bonding shown in FIG. 2 (b) is performed by the following process. First, as shown to Fig.1 (a), the ball 4a is formed by the electric torch which is not shown in the front-end | tip of the wire 4 inserted through the through-hole 5a of the capillary 5. . Next, as shown in FIG. 1B, the capillary 5 is lowered to perform ball bonding on the wiring 3. As a result, a part of the ball 4a rises in the through hole 5a, and the hole part 11 is formed on the bump 10. Subsequently, as shown in FIG.1 (c), the capillary 5 is raised so that the edge part 5b of the lower end of the capillary 5 may be located within the height of the hole part 11.

다음에 도 1(d)에 도시하는 바와 같이, 캐필러리(5)를 패드(2a)측(도 2(b) 참조)과 반대 방향으로 비스듬히 하방으로 이동시킨 후, 캐필러리(5)를 상승시켜서 와이어(4)를 절단한다. 이것에 의해, 범프(10)상에 캐필러리(5)의 에지부(5b)에 의해 경사면(12)이 형성된다. 이 경사면(12)의 경사각도(θ)는, 캐필러리(5)를 비스듬히 하방으로 이동시키는 경사각도에 의해 자유롭게 설정할 수 있다. 또 캐필러리(5)의 에지부(5b)에서 홀 부분(11)을 비스듬히 하방으로 누르므로, 면적이 커서 평탄한 경사면(12)이 형성된다.Next, as shown to Fig.1 (d), after moving the capillary 5 obliquely downward in the opposite direction to the pad 2a side (refer FIG.2 (b)), the capillary 5 The wire 4 is cut by raising. As a result, the inclined surface 12 is formed on the bump 10 by the edge portion 5b of the capillary 5. The inclination angle θ of the inclined surface 12 can be freely set by the inclination angle of moving the capillary 5 obliquely downward. Moreover, since the hole part 11 is pressed obliquely downward from the edge part 5b of the capillary 5, the flat inclined surface 12 is formed with a large area.

다음에 도 1(e)에 도시하는 바와 같이, 와이어(4)의 선단에 전기 토치에 의해 볼(4b)을 형성시킨다. 이어서 도 2(a)에 도시하는 바와 같이, 캐필러리(5)를 다이(2)의 패드(2a)상에 위치시키고 1차 본딩을 행한다. 다음에 도 2(b)에 도시하는 바와 같이, 와이어(4)의 루핑을 행하고, 와이어(4)를 범프(10)의 경사면(12)의상부에 위치시키고, 와이어(4)를 경사면(12)에 2차 본딩을 행하고, 와이어(4)를 절단한다.Next, as shown in Fig. 1E, the ball 4b is formed at the tip of the wire 4 by an electric torch. Subsequently, as shown to Fig.2 (a), the capillary 5 is located on the pad 2a of the die 2, and primary bonding is performed. Next, as shown in FIG. 2B, the wire 4 is looped, the wire 4 is positioned on the inclined surface 12 of the bump 10, and the wire 4 is placed on the inclined surface 12. ) Is subjected to secondary bonding, and the wire 4 is cut.

도 3은 본 발명의 1실시형태에 관계되는 와이어본딩 방법을 사용하여 다이와 배선 사이에 와이어본딩한 상태의 다른 예를 도시한다. 상기 실시형태에서는, 배선(3)상에 범프(10)를 형성하고, 패드(2a)상에 1차 본딩을 행하고, 범프(10)상의 경사면(12)에 2차 본딩을 행했다. 도 3의 경우는, 패드(2a)상에 도 1(a) 내지 도 1(e)의 공정에서 범프(10)를 형성하고, 범프(10)상의 경사면(12)을 배선(3)측의 반대측에 형성했다. 그리고, 도 2(a) 및 도 2(b)의 공정에서 배선(3)상에 1차 본딩을 행하고, 범프(10)상의 경사면(12)에 2차 본딩을 행하고 와이어(4)를 절단했다. 즉, 도 1 및 도 2의 경우는, 패드(2a)가 제 1 도체가 되고, 배선(3)이 제 2 도체가 된다. 도 3의 경우는, 배선(3)이 제 1 도체가 되고, 패드(2a)가 제 2 도체가 된다.3 shows another example of a state in which wire bonding is performed between the die and the wiring by using the wire bonding method according to the embodiment of the present invention. In the said embodiment, the bump 10 was formed on the wiring 3, the primary bonding was performed on the pad 2a, and the secondary bonding was performed to the inclined surface 12 on the bump 10. FIG. In the case of FIG. 3, bump 10 is formed in the process of FIG. 1 (a)-FIG. 1 (e) on the pad 2a, and the inclined surface 12 on bump 10 is the wiring 3 side. Formed on the opposite side. And the primary bonding was performed on the wiring 3 in the process of FIG.2 (a) and FIG.2 (b), the secondary bonding was performed to the inclined surface 12 on the bump 10, and the wire 4 was cut | disconnected. . That is, in the case of FIG. 1 and FIG. 2, the pad 2a becomes a 1st conductor and the wiring 3 becomes a 2nd conductor. In the case of FIG. 3, the wiring 3 becomes a 1st conductor, and the pad 2a becomes a 2nd conductor.

본 발명은, 제 1 도체상에 1차 본딩을 행한 후, 제 2 도체상에 2차 본딩을 행하고, 상기 제 1 도체와 상기 제 2 도체간을 와이어본딩하는 방법에 있어서, 상기 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 캐필러리를 상기 제 1 도체측과 반대 방향에서 비스듬히 하방으로 이동시켜 범프의 상부에 경사면을 형성시키고, 그 후 상기 1차 본딩을 행하고, 다음에 상기 범프에 대해 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사면상에 상기 2차 본딩을 행하므로, 범프상에 형성하는 경사면의 경사각도를 자유롭게 설정할 수 있다.The present invention relates to a method of performing a second bonding on a second conductor and performing wire bonding between the first conductor and the second conductor after performing primary bonding on the first conductor. Ball-bonding to form a bump, and after raising the capillary, the capillary is moved obliquely downward in a direction opposite to the first conductor side to form an inclined surface on the upper part of the bump, and then the primary Bonding is performed, and then the wire is looped from the first conductor side to the bump and the secondary bonding is performed on the inclined surface of the upper part of the bump, so that the inclination angle of the inclined surface formed on the bump can be freely set.

Claims (2)

제 1 도체상에 1차 본딩을 행한 후, 제 2 도체상에 2차 본딩을 행하고, 상기 제 1 도체와 상기 제 2 도체 사이를 와이어본딩하는 방법에 있어서, 상기 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 캐필러리를 상기 제 1 도체측과 반대 방향에서 비스듬히 하방으로 이동시켜 범프의 상부에 경사면을 형성시키고, 그 후 상기 1차 본딩을 행하고, 다음에 상기 범프에 대해 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사면상에 상기 2차 본딩을 행하는 것을 특징으로 하는 와이어본딩 방법.A method of performing primary bonding on a first conductor and then performing secondary bonding on a second conductor, and wire bonding between the first conductor and the second conductor, the ball bonding on the second conductor. And bumps are formed to raise the capillaries, and then the capillaries are moved obliquely downward in a direction opposite to the first conductor side to form an inclined surface on the upper part of the bumps, and then the primary bonding is performed. And then looping a wire from the first conductor side to the bump and performing the secondary bonding on the inclined surface of the upper part of the bump. 제 1 항에 있어서, 상기 범프를 형성한 후에 캐필러리를 상승시키는 높이는, 범프 형성시에 상기 캐필러리의 관통 구멍에 솟아 오른 홀 부분의 높이 이내인 것을 특징으로 하는 와이어본딩 방법.The wire bonding method according to claim 1, wherein the height of raising the capillary after forming the bump is within a height of a hole portion raised in the through hole of the capillary at the time of forming the bump.
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