KR20040074690A - A floor with cloud pattern quality and process for producing it - Google Patents

A floor with cloud pattern quality and process for producing it Download PDF

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Publication number
KR20040074690A
KR20040074690A KR1020030010067A KR20030010067A KR20040074690A KR 20040074690 A KR20040074690 A KR 20040074690A KR 1020030010067 A KR1020030010067 A KR 1020030010067A KR 20030010067 A KR20030010067 A KR 20030010067A KR 20040074690 A KR20040074690 A KR 20040074690A
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South Korea
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layer
parts
weight
flooring
chip
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KR1020030010067A
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Korean (ko)
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김상호
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주식회사 금강고려화학
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Priority to KR1020030010067A priority Critical patent/KR20040074690A/en
Publication of KR20040074690A publication Critical patent/KR20040074690A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/70—Structural association with built-in electrical component with built-in switch
    • H01R13/71—Contact members of coupling parts operating as switch, e.g. linear or rotational movement required after mechanical engagement of coupling part to establish electrical connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
    • H01R35/04—Turnable line connectors with limited rotation angle with frictional contact members

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  • Laminated Bodies (AREA)

Abstract

PURPOSE: A flooring with a cloud-like texture and a process for producing the same are provided to enable a cloud pattern quality to be naturally represented on the flooring by uniformly distributing chips on an adhesive layer, followed by thermally treating the resultant product to impart flowability to the chips, scattering chip patterns using a horizontally moving roll, and roll pressing while inducing whirlpool by a cold pressing method. CONSTITUTION: The flooring with a cloud-like texture comprises: a base layer(1); a surface layer(10) formed on the base layer(1) and including sequentially deposited multiple layers consisting of an adhesive layer(2), a chip layer(3) having a cloud pattern, a transparent layer(4) formed at user's option, and a surface treatment layer(5); and a back layer(20) formed under the base layer(1) and including a non-woven fabric or plainly-woven plywood layer(11), and a non-foaming lower layer formed at user's option.

Description

구름무늬 질감의 바닥재 및 그 제조방법{A FLOOR WITH CLOUD PATTERN QUALITY AND PROCESS FOR PRODUCING IT}Flooring material with cloud pattern and manufacturing method thereof {A FLOOR WITH CLOUD PATTERN QUALITY AND PROCESS FOR PRODUCING IT}

본 발명은 구름무늬 질감의 바닥재 및 그 제조방법에 관한 것으로서, 좀더 상세하게는 칩층을 형성함에 있어서 구름무늬 질감이 부여될 수 있는 칩을 접착층 상부에 균일하게 산포하고, 고온으로 칩을 용융시켜 유동성을 부여하고나서, 좌ㆍ우 이동 롤에 의해 무늬를 흩트린 후, 콜드프레싱 공법으로 와류를 유도하면서 롤 프레스하므로써 자연스러운 구름 무늬 질감을 표현한 바닥재 및 그 제조방법에 관한 것이다.The present invention relates to a flooring material having a cloud pattern texture and a method of manufacturing the same. More specifically, in forming a chip layer, a chip having a cloud pattern texture may be uniformly dispersed on an adhesive layer, and the chip may be melted at a high temperature to provide fluidity. After applying the pattern, the pattern is dispersed by the left and right moving rolls, and then the roll member is pressed while inducing a vortex by a cold pressing method, and a flooring material expressing a natural cloud pattern texture and its manufacturing method.

종래에 칩을 응용한 바닥재의 경우는 크기와 색상이 다양한 칩을 일정량 산포하여 가열압착한 후 표면처리하는 방법이 통상적으로 적용되었으나, 크기, 색상, 형상에 의해 제약된 칩에 의한 다양한 외관효과 및 장식성 부여에는 한계가 있었다.Conventionally, in the case of a flooring material using chips, a method of surface treatment after spreading and compressing a predetermined amount of chips having various sizes and colors has been generally applied, but various appearance effects due to chips restricted by size, color, and shape and There was a limit to the decoration.

본 발명은 상기한 바와 같은 종래 칩을 응용한 바닥재의 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 다양한 효과의 구름무늬 질감을 부여한 바닥재 및 그 제조방법을 제공하는 것이다.The present invention has been made to solve the problems of the flooring material applying the conventional chip as described above, an object of the present invention is to provide a flooring material and a method of manufacturing the same giving a cloud pattern texture of various effects.

도 1은 본 발명에 따른 바닥재의 제조공정을 설명하기 위한 블록선도,1 is a block diagram illustrating a manufacturing process of a flooring material according to the present invention;

도 2와 도 3은 본 발명에 따른 바닥재의 일실시예를 나타낸 단면도.2 and 3 is a cross-sectional view showing an embodiment of the flooring according to the invention.

도 4는 본 발명에 사용되는 좌·우 이동 롤을 나타낸 도면.4 is a view showing a left and right moving roll used in the present invention.

*** 도면의 주요부분에 대한 부호의 설명 ****** Explanation of symbols for main parts of drawing ***

1 : 기재층 2 : 접착층1: base material layer 2: adhesive layer

3 : 칩층 4 : 투명층3: chip layer 4: transparent layer

5 : 표면처리층 10 : 표면층5: surface treatment layer 10: surface layer

11 : 부직포 또는 평직합판층 12 : 비발포하부층11 nonwoven fabric or flat laminated layer 12 non-foamed lower layer

20 : 이면층20: back layer

본 발명에 따른 구름무늬 질감의 바닥재는 기재층(1) 위에 구름무늬 질감이 부여된 칩층(3)이 형성되어 이루어지며, 이러한 본 발명의 바닥재는 기재층(1) 위에 접착졸을 코팅하여 접착층을 형성한 후, 접착층 상부에 칩을 균일하게 산포하고, 고온으로 칩을 용융시켜 유동성을 부여하고나서, 좌ㆍ우 이동 롤에 의해 무늬를 흩트린 후, 콜드프레싱 공법으로 와류를 유도하면서 롤 프레스하므로써 자연스러운 구름 무늬 질감을 표현하는 제조방법에 의해 제조된다.The flooring material of the cloud pattern texture according to the present invention is made by forming a chip layer (3) given a cloud pattern texture on the base layer 1, the floor material of the present invention is coated with an adhesive sol on the base layer (1) adhesive layer After forming the film, the chips are uniformly spread on the adhesive layer, the chips are melted at a high temperature to impart fluidity, and then the pattern is dispersed by the left and right moving rolls, and then the roll press is induced by the cold pressing method. It is thereby produced by a manufacturing method that expresses a natural cloud pattern texture.

본 발명의 구름무늬 질감의 바닥재는 다층구조로서, 바람직한 구조의 일예를 들면, 도 2에 나타낸 바와 같이, 기재층(1)을 중심으로 상부의 표면층(10)과 하부의 이면층(20)으로 구성되어 있으며, 기재층(1) 상부의 표면층(10)은 기재층(1)위에 차례로 접착층(2), 칩층(3) 및 생략될 수 있는 투명층(4)과 표면처리층(5)으로 이루어져 있고, 기재층(1) 하부의 이면층(20)은 기재층(1) 아래로 부직포 또는 평직 합판층(11)으로 이루어져 있으며, 경우에 따라서는 도 3에 나타낸 바와 같이 비발포하부층(12) 구조로 이루어져 있다.The flooring of the cloud pattern texture of the present invention is a multi-layered structure, for example, a preferred structure, as shown in Figure 2, the upper surface layer 10 and the lower back layer 20 around the base layer (1) The surface layer 10 on the substrate layer 1 is composed of an adhesive layer 2, a chip layer 3, and a transparent layer 4 and a surface treatment layer 5 which can be omitted in turn on the substrate layer 1. The back layer 20 below the base layer 1 is composed of a nonwoven fabric or a plain woven plywood layer 11 under the base layer 1, and in some cases, as shown in FIG. It consists of a structure.

본 발명의 구름무늬 질감의 바닥재 및 그 제조방법을 본 발명에 첨부된 예시적인 도면을 참조하여 상세하게 설명하면 다음과 같다.Referring to the cloud pattern texture flooring of the present invention and a manufacturing method thereof in detail with reference to the exemplary drawings attached to the present invention.

본 발명에 따른 구름무늬 질감 바닥재의 제조방법에 대한 개요는 도 1에 나타내었다. 도 1에 따라 도 2에 도시된 본 발명의 구름무늬 질감의 바닥재의 일예의 제조방법을 설명하면 다음과 같다.An overview of a method of manufacturing a cloud pattern textured flooring according to the present invention is shown in FIG. 1. Referring to Figure 1 describes the manufacturing method of an example of the flooring of the cloud pattern texture of the present invention shown in Figure 2 as follows.

우선 제품의 치수 안정성을 부여하는 기재층(1)을 제조하는데, 상기 기재층(1)으로는 유리섬유와 같은 기재 위에 함침용 조성물을 적정 두께로 나이프코팅하여 형성되는 그라스화이버함침층이 바람직하고, 이면층으로서 부직포 또는 평직합판층이 적층된 제품의 경우 상기 그라스화이버함침층을 부직포 또는 평직합판층(11)과 합판후 130∼210℃에서 3∼10m/min의 속도로 10∼200초간 가열하여 합판과 동시에 겔(gel)화시켜 반제품을 형성시킨다. 부직포 또는 평직합판을 적층하지 않은 제품의 경우에는 이면층으로서 비발포하부층(12)을 형성할 수도 있다. 부직포 또는 평직합판이 적층된 제품의 경우 두께는 다양할 수 있으나 합판후의 두께가 0.5∼1.2mm인 것이 적당하며, 부직포 또는 평직합판 미적층 제품의 경우도 두께는 다양할 수 있으나 겔링후 0.3∼1.0mm가 적당하다.First of all, a substrate layer 1 for imparting dimensional stability of a product is prepared. The substrate layer 1 is preferably a glass fiber impregnated layer formed by knife coating an impregnating composition on a substrate such as glass fiber to an appropriate thickness. In the case of the non-woven fabric or the flat laminate layer as a back layer, the glass fiber impregnated layer is laminated with the nonwoven fabric or the flat laminate layer 11 and heated at 130 to 210 ° C. at a speed of 3 to 10 m / min for 10 to 200 seconds. To gel together with plywood to form a semi-finished product. In the case of the product which has not laminated nonwoven fabric or a flat laminated board, the non-foaming lower layer 12 may be formed as a back surface layer. The thickness of the non-woven fabric or the flat laminated board may vary, but the thickness after plywood is suitable to 0.5 ~ 1.2mm, the thickness of non-woven or flat laminated plywood products may vary, but 0.3 ~ 1.0 after gelling mm is suitable.

이때 기재층(1)으로서의 그라스화이버함침층에 적용되는 함침용 조성물은, 예를 들어 중합도가 1000∼2000인 염화비닐수지 100중량부에 가소제 30∼70중량부, 안정제 1∼5중량부, 충진제 50∼200중량부와 기타 첨가제 1∼5중량부를 혼합하여 졸(Sol) 상태로 만든 것이다.At this time, the composition for impregnation applied to the glass fiber impregnated layer as the base material layer 1 may be, for example, 100 parts by weight of a vinyl chloride resin having a polymerization degree of 1000 to 2000, 30 to 70 parts by weight of a plasticizer, 1 to 5 parts by weight of a stabilizer, and a filler. 50 to 200 parts by weight and 1 to 5 parts by weight of other additives are mixed to form a sol (Sol) state.

기재층(1) 위에 칩을 산포하기 전에 접착졸을 0.2∼1.0mm의 두께로 나이프 코팅하므로써 접착층(2)을 형성하는데, 상기 접착졸은 예를 들어 중합도가 1000∼2000인 염화비닐수지 100중량부에 가소제 30∼70중량부, 안정제 1∼5중량부, 안료 0∼10중량부와 기타 첨가제 1∼5중량부를 혼합하여 졸(Sol)상태로 만든 것이다.The adhesive layer 2 is formed by knife coating the adhesive sol to a thickness of 0.2 to 1.0 mm before dispersing the chip on the base layer 1, which is 100 weight of vinyl chloride resin having a polymerization degree of 1000 to 2000, for example. 30 to 70 parts by weight of a plasticizer, 1 to 5 parts by weight of a stabilizer, 0 to 10 parts by weight of a pigment, and 1 to 5 parts by weight of other additives are mixed to form a sol (Sol) state.

접착층(2) 코팅후 겔링 전에, 접착층 상부에 칩을 산포기로 균일하게 전면에 산포시킨다. 칩을 접착층(2) 상부에 균일하게 산포시킨 후 표면온도 150∼220℃의 열량으로 칩을 용융시킨 상태에서, 칩을 프레스하기 전에 칩에 의한 무늬의 방향성을 제어하여 구름무늬가 형성되도록 좌ㆍ우 이동 롤에 의해 무늬를 흩트린 후, 롤 프레스(Roll Press)하게 되는데, 상기 좌·우 이동 롤(도 4)은 구름무늬 질감을 얻을 수 있는 선형의 연속적인 문양을 롤에 음각 또는 양각하거나, 코일을 롤에 연속적으로 감는 형태로 제조하여, 용융된 칩의 형상을 흩뜨려서 단순 방향성 무늬가 아닌 구름무늬 질감을 효과적으로 표현할 수 있도록 한다.After coating the adhesive layer 2 and before gelling, the chip is spread evenly over the adhesive layer on the entire surface. After the chip is uniformly spread on the adhesive layer 2, the chip is melted at a surface temperature of 150 to 220 ° C., and the directional pattern of the chip is controlled before pressing the chip to form a cloud pattern. After dispersing the pattern by the right shifting roll, a roll press is performed, and the left and right shifting roll (Fig. 4) is used to engrav or emboss a linear continuous pattern on the roll to obtain a cloud pattern texture. The coil is manufactured in the form of a continuous winding on the roll to disperse the shape of the molten chip so that the cloud pattern texture can be effectively expressed instead of the simple directional pattern.

또한 상기 롤 프레스를 시행함에 있어 사용하는 프레스 롤(Press Roll)의 상부롤은 속도 변속이 가능하면서 60℃ 이하로(콜드프레싱 공법) 설정하여 온도차를 급격하게 주어 와류를 유도하므로써 구름무늬 질감을 효과적으로 부여한 칩층(3)을형성한다.In addition, the upper roll of the press roll used in the roll press can be speed-shifted and set to 60 ° C. or lower (cold-pressing method) to sharply give a temperature difference to induce vortices so that the cloud texture is effectively obtained. The provided chip layer 3 is formed.

라인 스피드(LINE SPEED), 저어주는 속도(무늬 흩트림) 등에 의해 구름 무늬가 부여되는 정도의 차이가 발생되므로 균일한 조건부여가 중요하며, 프레스 롤의 경우 상·하부가 동일한 재질인 강철이 효과적이다.The difference in the degree to which the cloud pattern is given due to the line speed and the stir speed (scattering of the pattern) occurs, so uniform conditions are important.In the case of the press roll, steel having the same material as the upper and lower parts is effective. to be.

이때 사용되는 칩은 고온에서 용융될 수 있는 조성물로 제조된 것이 사용되는데, 예를 들어 중합도가 700∼1000인 염화비닐수지 100중량부에 가소제 15∼50중량부, 로진 30∼200중량부, 아크릴파우더 30∼100중량부, 조분 20∼200 중량부, 안정제 1∼5중량부, 충진제 70∼300중량부, 내외부활제 2∼4중량부 및 산화방지제 1∼3중량부를 포함하는 조성물을 칩 형태로 만든 것이 바람직하다.At this time, the chip used is made of a composition which can be melted at a high temperature, for example, 15 to 50 parts by weight of plasticizer, 30 to 200 parts by weight of rosin, acryl in 100 parts by weight of vinyl chloride resin having a polymerization degree of 700 to 1000. 30 to 100 parts by weight of powder, 20 to 200 parts by weight of coarse powder, 1 to 5 parts by weight of stabilizer, 70 to 300 parts by weight of filler, 2 to 4 parts by weight of internal and external lubricants and 1 to 3 parts by weight of antioxidant It is preferable to make it.

상기 칩의 제조에 사용된 조분은 40Mesh 또는 60Mesh 이하 정도의 크기를 갖는 탄산칼슘 분말로서 무늬 흩트림시 효과적인 유동특성을 돕는 역할을 한다.Coarse powder used in the manufacture of the chip is a calcium carbonate powder having a size of about 40Mesh or less than 60Mesh, and serves to help effective flow characteristics during pattern scattering.

상기의 칩층(3) 위에 필요에 따라 투명층(4)을 적층한다. 투명층(4)은 칩층(3) 위에 투명층 형성용 조성물을 0.05∼0.5mm의 두께로 나이프 코팅하여 130∼230℃에서 3∼10m/min의 속도로 60∼240초 동안 가열하여 겔(Gel)화 시켜 형성시킨다.The transparent layer 4 is laminated on the chip layer 3 as needed. The transparent layer 4 is gel-coated by heating the composition for forming a transparent layer on the chip layer 3 at a thickness of 0.05 to 0.5 mm and heating at 130 to 230 ° C. at a speed of 3 to 10 m / min for 60 to 240 seconds. To form.

투명층 형성용 조성물은 예를 들어 중합도 1000∼2000의 염화비닐수지 100중량부에 가소제 20∼60중량부, 안정제 1∼5중량부 및 기타 첨가제를 혼합하여 졸(Sol)상태로 만든 것이다.The transparent layer-forming composition is made into a sol state by mixing 20 to 60 parts by weight of a plasticizer, 1 to 5 parts by weight of a stabilizer and other additives to 100 parts by weight of a vinyl chloride resin having a polymerization degree of 1000 to 2000, for example.

이렇게 형성된 투명층(4) 위에 표면처리층(5)을 형성시킨다. 표면처리층(5)은 자외선 경화형 폴리우레탄 도료를 투명층(4)위에 10∼25㎛ 두께로 적층하여3∼10m/min의 속도로 60∼300Watt/in 출력의 UV램프 3∼8개를 사용하여 경화시킴으로써 형성된다.The surface treatment layer 5 is formed on the transparent layer 4 thus formed. The surface treatment layer 5 is laminated with a UV curable polyurethane paint on the transparent layer 4 with a thickness of 10 to 25 μm and using 3 to 8 UV lamps having a power of 60 to 300 Watt / in at a speed of 3 to 10 m / min. It is formed by hardening.

상기에서 본 발명을 특정 적층구조와 특정의 조성물들을 사용하여 제조된 바닥재를 예로 하여 설명하였으나, 본 발명은 상기한 구조와 조성물들에 한정되는 것은 아니다.Although the present invention has been described with reference to the example of flooring manufactured using a specific laminate structure and specific compositions, the present invention is not limited to the above structures and compositions.

본 발명에 의하면, 바닥재에 칩층을 형성함에 있어서 칩을 접착층 상부에 균일하게 산포하고, 고온으로 칩을 용융시켜 유동성을 부여하고나서, 좌ㆍ우 이동 롤에 의해 무늬를 흩트린 후, 콜드프레싱 공법으로 와류를 유도하면서 롤 프레스하므로써 바닥재에 자연스러운 구름 무늬 질감 효과를 나타낼 수 있다.According to the present invention, in forming the chip layer on the flooring material, the chip is uniformly dispersed on the adhesive layer, the chip is melted at a high temperature to impart fluidity, and then the pattern is dispersed by the left and right moving rolls. Roll-pressing while inducing eddy currents can produce a natural cloud texture effect on the flooring.

Claims (5)

기재층의 상부에 접착층을 형성하고, 이 접착층 상부에 칩을 균일하게 산포하고, 고온으로 칩을 용융시켜 유동성을 부여하고나서, 좌ㆍ우 이동 롤에 의해 무늬를 흩트린 후, 콜드프레싱 공법으로 와류를 유도하면서 롤 프레스하므로써 칩층을 형성하는 단계를 포함하는 것을 특징으로 하는 구름무늬 질감의 바닥재의 제조방법.After forming an adhesive layer on the upper part of a base material layer, disperse | distributing a chip | tip uniformly on this adhesive layer, melt | dissolving a chip | tip at high temperature, imparting fluidity, and disperse | distributing a pattern with a left-right moving roll, and then cold-pressing method Method of producing a flooring of a cloud pattern texture comprising the step of forming a chip layer by roll pressing while inducing vortex. 제 1항에 있어서, 상기 칩은 중합도가 700∼1000인 염화비닐수지 100중량부에 가소제 15∼50중량부, 로진 30∼200중량부, 아크릴파우더 30∼100중량부, 조분 20∼200중량부, 안정제 1∼5중량부, 충진제 70∼300중량부, 내외부활제 2∼4중량부 및 산화방지제 1∼3중량부를 포함하는 조성물을 칩 형태로 제조한 것임을 특징으로 하는 구름무늬 질감의 바닥재의 제조방법.According to claim 1, wherein the chip is 15 to 50 parts by weight of plasticizer, 30 to 200 parts by weight of rosin, 30 to 100 parts by weight of acryl powder, 20 to 200 parts by weight of coarse powder in 100 parts by weight of vinyl chloride resin having a polymerization degree of 700 to 1000. Of the flooring material having a cloud pattern texture, wherein the composition comprises 1 to 5 parts by weight of stabilizer, 70 to 300 parts by weight of filler, 2 to 4 parts by weight of internal and external lubricants, and 1 to 3 parts by weight of antioxidant. Manufacturing method. 제 1항 또는 제 2항의 제조방법으로 제조되어 구름무늬 질감이 부여된 칩층을 포함하는 바닥재.A flooring material prepared by the method of claim 1 or 2, comprising a chip layer provided with a cloud pattern texture. 제 3항에 있어서, 상기 바닥재는 부직포 또는 평직합판층(11), 기재층(1), 접착층(2), 칩층(3), 투명층(4) 및 표면처리층(5)으로 이루어져 있는 것을 특징으로 하는 바닥재.4. The flooring material according to claim 3, wherein the flooring material is made of a nonwoven or flat laminated layer (11), a substrate layer (1), an adhesive layer (2), a chip layer (3), a transparent layer (4) and a surface treatment layer (5). Flooring. 제 3항에 있어서, 상기 바닥재는 비발포하부층(12), 기재층(1), 접착층(2), 칩층(3), 투명층(4) 및 표면처리층(5)으로 이루어져 있는 것을 특징으로 하는 바닥재.4. The flooring material according to claim 3, characterized in that the flooring consists of a non-foamed lower layer (12), a base material layer (1), an adhesive layer (2), a chip layer (3), a transparent layer (4) and a surface treatment layer (5). Flooring.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120070646A1 (en) * 2009-09-25 2012-03-22 Lg Hausys, Ltd. Conductive flooring material and a production method therefor
WO2013036022A2 (en) * 2011-09-06 2013-03-14 Lg Hausys, Ltd. Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120070646A1 (en) * 2009-09-25 2012-03-22 Lg Hausys, Ltd. Conductive flooring material and a production method therefor
US9677286B2 (en) * 2009-09-25 2017-06-13 Lg Hausys, Ltd. Conductive flooring material and a production method therefor
WO2013036022A2 (en) * 2011-09-06 2013-03-14 Lg Hausys, Ltd. Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof
WO2013036022A3 (en) * 2011-09-06 2013-05-02 Lg Hausys, Ltd. Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof
CN103781629A (en) * 2011-09-06 2014-05-07 乐金华奥斯株式会社 Inlaid type floor sheet having polyvinyl chloride chip and method of manufacturing thereof
JP2014529696A (en) * 2011-09-06 2014-11-13 エルジー・ハウシス・リミテッド PVC chip inlaid flooring material and method for producing the same

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