KR20040047112A - Instant cooling light emitting diode - Google Patents

Abstract

PURPOSE: An instant cooling light emitting diode is provided to improve heat exchange efficiency by conducting heat through a dielectric enclosing a chip, a substrate and a lead frame. CONSTITUTION: A substrate(32) includes a set of chips(31) on its surface. A glass cover with various specification and shapes is made of material with high heat exchange efficiency. The inner space of the glass cover is for a substrate and the body of the chip. The glass cover is filled with a dielectric(37). The heat is transferred by the dielectric(37) enclosing the chips(31), the substrate(32) and the lead frames(34). The dielectric may be a vacuum.

Description

Instant Cooling Light Emitting Diodes {INSTANT COOLING LIGHT EMITTING DIODE}

FIELD OF THE INVENTION The present invention relates to light emitting diodes, in particular instantaneous cooling light emitting diodes used to replace conventional lighting devices, which simplifies the layout of the circuit, reduces energy consumption and increases luminous efficiency to increase the lifetime of the internal light emitting chip. Improve.

Light emitting diodes (LEDs) are widely used in the modern technology industry and provide various specifications used in fields such as displays, images, traffic lights, and lighting.

However, the conventional LED 10 (FIG. 1) is formed by covering the circuit of the chip 11 and the electrode 12 with a heat insulating epoxy 13 to protect the chip 11 and the lead frame 14, as described above. The disadvantages of the LEDs are listed below.

The circuit of the set of chips and the electrodes 12 is wrapped in an epoxy 13 which forms a closed space for heat. Although the chip 11 of the LED is usually a low temperature light source, the chip 11 still generates heat when emitting light, and the temperature of the active layer reaches 400 ° C. Nevertheless, radiation efficiency is not a concern because of the good energy exchange efficiency. Further, the periphery of the chip 11 is a very good radiation zone, but heat cannot be radiated because the chip 11 is wrapped in an epoxy 13. The heat has only one direction in which it is dissipated, i.e. conducts down the lead frame 14, which violates the law of heat rise. Thus, even if the temperature of the appearance of the LED 10 is constant or low, this does not mean that the LED 10 does not generate heat. The LED 10 is an element made of a semiconductor, so that the overheated temperature causes the junction (active layer of the P-N junction) to break, resulting in reduced radiation efficiency and even destruction. Moreover, excessively high currents acting on the LEDs 10 burn them, so heat is one of the main reasons for degrading the quality of the LEDs 10 and 11.

Wet and easy to oxidize-Since the material surrounding the circuit of the chip 11 and the electrode 12 is epoxy 13, the connection between the lead frame 14 and the epoxy when the heat is generated is a gap 15 (Fig. 2). ) Therefore, moisture, air, and other impurities are easily penetrated and erode the chip 11, which accelerates corrosion and shortens the life.

Accordingly, it is an object of the present invention that the circuits of the chip and the electrodes are fixed on the substrate and the lead frame and packed in a radiation tight cover (e.g. a glass cover), and then completely extract (vacuum) and seal the gas therein. An insulating cooling liquid or gas (dielectric) is injected to provide an instant cooled light emitting diode in which the LED can operate in a stable environment without the ingress of air, moisture and impurities that will damage the chip. For the heat generated by the chip, heat can be conducted to the radiation zone around the chip or to the outer fins, then quickly through the dielectric to the hermetic cover and dissipate into the air, further limiting the specification Feature and lifespan are greatly improved.

It is a second object of the present invention to provide an instantaneous cooling light emitting diode comprising more chips since it has excellent emissivity. For example, light of white color may be generated by mixing blue chips and yellow chips, and mixing blue chips, green chips, and red chips may produce light of various colors. Due to the high brightness, this can replace conventional light bulbs and LED array devices.

In the drawings showing the modes of operation and preferred embodiments of the invention, like reference numerals designate the same or similar parts throughout the several views.

1 is a cross-sectional view showing a conventional light emitting diode.

FIG. 2 is a partially enlarged view of FIG. 1 showing a gap between a lead frame and an epoxy. FIG.

3 is a perspective view of the instantaneous cooling light emitting diode according to the embodiment of the present invention;

4 is a cross-sectional view showing a cooling state of the present invention.

Fig. 5 is a sectional view showing another embodiment of the present invention.

Figure 6 is a perspective view showing another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

31: Chip

32: substrate

33: electrode

34: lead frame

36: cover

37: dielectric

38: pin

3, this is a perspective view of an embodiment of the present invention. The chip 31 is mainly mounted on the substrate 32 and connected to the electrode 33, and the lead frame 34 extends from the seal 35. The body of the element is packed with an airtight cover 36 and the gas is completely extracted inside. As a result, dielectric 32 is injected into the cover. A set of pins 38 are mounted on the substrate 32. The airtight cover 36 is a cover made of a material having a high coefficient of thermal conduction and of various specifications and shapes, and an internal space is reserved for the main body of the element. The dielectric 37 fully injected into the hermetic cover 36 contacts the chip 31, and the substrate 32 is directly based on the gas or insulating cooling liquid. Another example is in a vacuum space as shown in FIG. In this situation, the heat 50 generated from the chip 31 is distributed by radiation, and there is enough space for the chip to be mounted in the vacuum space.

The characteristics of the element are described as follows.

Also, referring to Fig. 5, this is a cross-sectional view of another embodiment of the present invention showing a light emitting diode injected with a dielectric. As shown in this figure, the chip 31 is powered for light emission, while the columns 50 pass through the dielectric 37 surrounding the chip 31, the substrate 32 and the lead frame 34. Conduction and are instantaneously dispersed from the surface of the hermetic cover and the substrate fins 38 to improve the heat exchange rate.

In particular, the present invention is a radical invention using structural materials and electronic properties, which greatly improves the heat exchange rate and obeys the laws of physics so as to overcome the specification of the light emitting diode and extend its life. It also considers cost efficiency in the industry and meets real needs and stability.

Although the present patent application specification has been described in the embodiments and the drawings, it is apparent that those skilled in the art can easily change the above embodiments, so that changes or modifications from the field of the present invention still belong to the field of the present invention. .

In the instantaneous cooling light emitting diode according to the above configuration, when power is supplied to the chip, heat is conducted through the dielectric surrounding the chip, the substrate and the lead frame, and from the surface of the hermetic cover and the substrate fin to improve the heat exchange rate. It can be distributed instantaneously.

Claims (2)

A substrate having a set of chips fixed on the surface thereof, A gas tight cover made of a material with high thermal conductivity and manufactured in various specifications and shapes, and whose inner surface is secured for installation of the substrate and the main body of the chip; With electrodes, A plurality of chips fixed on the substrate and connected to the electrodes, At least two lead frames extending from the seal of the hermetic cover, An instant cooled light emitting diode that is completely injected into the hermetic cover and includes a dielectric based on insulating cooling liquid or gas in contact with the chip and the substrate, To extract the gas in the sealed hermetic cover and inject the dielectric therein, heat is conducted through the dielectric surrounding the chip, substrate and lead frame, improving heat exchange rate when the chip is powered for light emission. Wherein the instantaneous cooling light emitting diode is dispersed from the surface of the hermetic cover and the substrate fins. The instantaneous cooling light emitting diode of claim 1, wherein the dielectric may exhibit a vacuum and heat generated by the chip is dissipated by radiation.