KR20040046799A - Elastomer mold fabrication method for patterning and method for forming cathode separator wall of organic light emitting device by using it - Google Patents

Abstract

PURPOSE: A method for manufacturing an elastic mold and a method for forming barrier ribs are provided to reduce manufacturing procedures and achieve improved yield rate by eliminating the necessity of performing a photo process. CONSTITUTION: A method for manufacturing an elastic mold comprises a step of forming a thick film negative photoresist on a base substrate and forming a mask having a predetermined pattern on the negative photoresist; a step of producing a master mold having an inverse pattern by selectively removing the negative photoresist through an exposure and developing process using the mask as a shielding screen; a step of depositing an elastic material on the master mold and solidifying the elastic material; and a step of obtaining an elastic mold(110) having an inverse pattern by removing the solidified elastic material from the master mold.

Description

A method of manufacturing an elastomeric mold for patterning and a method for forming a cathode separation partition of an organic light emitting device using the same.

The present invention relates to a flat panel display device, and more particularly, to an organic light emitting device suitable for displaying a target color image through light emission by recombination energy of electrons and holes injected from the outside. The present invention relates to a method for forming a cathode separation partition of an organic light-emitting device.

Recently, with the development of semiconductor manufacturing technology and image processing technology, commercialization and widespread use of flat panel display devices, which are easy to lighten and thin, and can realize high image quality, are rapidly progressing. Organic light emitting devices having many advantages, such as ease of use, simplicity of process, and flexibility of structure, have been spotlighted as next generation display devices.

In more detail, the organic light emitting diode has characteristics superior to the inorganic light emitting diode in terms of excellent luminous efficiency, ease of large area, simplicity of process, direct current low voltage driving, high speed response, and multicolorization, and thus, a positive electrode (anode electrode) and a negative electrode It is an element which injects electrons and holes from the outside using a (cathode electrode), and displays an arbitrary image on a panel through light emission by their recombination energy.

In manufacturing such an organic light emitting device, the process of forming a negative electrode on the organic light emitting layer is one of the key process to determine the device characteristics. Such a negative electrode cannot be manufactured by using a conventional exposure and patterning process, because the organic or high molecular materials used in the organic light emitting device are exposed to moisture, oxygen, or solvents, and their light emission or electric field transport capacity is rapidly decreased. Because it becomes.

On the other hand, as a means for forming the cathode of the organic light emitting device that can not use the exposure process, a method using a cathode separation barrier is widely used, and as a well known conventional technique for forming a cathode separation barrier as described above, negative photoresist And a method using etching selectivity.

Among the above methods, the method using the negative photoresist is coated with a negative photoresist on the ITO glass (positive electrode) on which the positive electrode pattern is formed, and then using the difference in the amount of light exposure depending on the thickness, that is, The density of the crosslinks decreases toward the lower portion, which causes the cathode separation partition (i.e., reverse phase pattern) in such a manner that the photoresist remaining after development (i.e., the photoresist to be used as the cathode separation partition) becomes a substantially reverse phase pattern. Method of forming a cathode separation barrier of the insulating layer, and using etching selectivity, a silicon nitride film (Si ₃ N ₄ ), a low etch selectivity (Porous Si), and a high etch selectivity (I) on an ITO glass (positive electrode) ), And the sidewalls of the lower layer film have more sidewalls than the upper film through etching using this etching selectivity It is a method of forming a cathode partition in such a manner that the etching, such the conventional methods can basically using the photo process (that is, exposure, development, etching, cleaning process, etc).

However, the conventional technique using the photo fixing as described above has the following fundamental problems.

First, it has to be equipped with expensive exposure equipment, thereby increasing the manufacturing cost of the product.

Second, since many complex processes such as coating, exposure, development, cleaning, and the like are inevitably involved, it is a factor that causes a decrease in production yield and a rise in manufacturing cost.

Therefore, in view of the above problems, there is an urgent need for a technique capable of forming a cathode separation barrier by a simple process without performing a photo process, but at present there is no suggestion or suggestion for such a technique.

The present invention is to solve the above-mentioned problems of the prior art, a method for producing an elastic mold for patterning that can form a reverse phase negative electrode separation partition wall by a simple patterning process using an elastic mold of a reverse phase pattern that does not require a photo process and It is an object of the present invention to provide a method for forming a cathode separation barrier of an organic light emitting device using the same.

Another object of the present invention is to provide a patterning method for producing an elastomeric mold for patterning which can simultaneously form an insulating film and an inverted negative electrode separation partition by a simple patterning process using an elastic mold of a composite pattern that does not require a photo process, and an organic light emitting device using the same. The present invention provides a method for forming a cathode separation barrier rib.

According to one aspect of the present invention for achieving the above object, there is provided a method for producing an elastic mold for patterning having a negative reversed pattern of any shape, wherein a negative photoresist of a thick film is formed on a base substrate. Forming a mask having an arbitrary pattern thereon; Manufacturing a master mold having a reversed pattern by selectively removing the negative photoresist through an exposure and development process using the mask as an exposure blocking film; Applying and curing an elastomeric material on the master mold; And removing the cured elastic material from the master mold, thereby completing an elastic mold having a negative reversed pattern.

The present invention according to one aspect of another aspect for achieving the above object, in the method for forming a reverse phase cathode separation partition for separating the negative electrode of each pixel in the organic light emitting element having a positive electrode, an organic layer and a negative electrode, A first step of preparing an elastic mold having a reversed pattern; A second process of contacting the pattern surface of the elastic mold on the positive electrode and injecting a negative electrode forming material into the negative reversed pattern to crosslink the positive electrode; And removing the elastic mold, thereby forming a cathode separating partition of the organic light emitting device using the elastic mold for patterning, the third process of forming a negative phase separating partition on the positive electrode.

According to another aspect of the present invention for achieving the above object, there is provided a method of manufacturing an elastic mold for patterning having an intaglio pattern of any shape, the flat film pattern having an arbitrary pattern on the base substrate Forming process; Forming a negative photoresist of a thick film on the entire surface of the base substrate, and forming a mask having an arbitrary pattern thereon; By selectively removing the negative photoresist through the exposure and development process using the mask as an exposure blocking film to leave a negative resist on the flat film pattern, to produce a master mold having a negative composite pattern including a reversed pattern process; Applying and curing an elastomeric material on the master mold; And removing the cured elastomeric material from the master mold, thereby completing an elastic mold having a composite pattern including a reverse phase.

The present invention according to another aspect of another aspect for achieving the above object, in a method of forming a reverse phase cathode separation partition for separating the negative electrode of each pixel in an organic light emitting device having a positive electrode, an organic layer and a negative electrode, the reverse phase pattern A first process of preparing an elastic mold having an intaglio composite pattern comprising a; A second process of contacting the composite pattern surface of the elastic mold on the positive electrode and injecting an insulating film and a cathode forming material into the negative composite pattern to crosslink and bond the second electrode; And removing the elastic mold, thereby forming a cathode separating partition of the organic light emitting device using the elastic mold for patterning, the third process of forming a negative electrode separating partition on the positive electrode.

1A to 1D are process flowcharts illustrating a process of manufacturing an elastic mold for patterning according to an embodiment of the present invention;

2A and 2B are process flowcharts illustrating a process of forming a cathode separation barrier of an organic light emitting device using an elastic mold for patterning manufactured according to an embodiment of the present invention;

3A to 3E are process flowcharts illustrating a process of manufacturing an elastic mold for patterning according to another embodiment of the present invention;

4A and 4B are process flowcharts showing a process of simultaneously forming a cathode separation barrier of an organic light emitting device using an elastic mold for patterning manufactured according to another embodiment of the present invention;

FIG. 5 is an image of a main process of fabricating an elastomeric mold for patterning and forming a cathode separation partition of an organic light emitting device by using the SEM device. FIG. 5a illustrates an image of a master mold. 5b is a photograph photographing an elastic mold for patterning, 5c is a photograph photographing an inverted negative electrode separating partition wall formed on ITO glass using an elastomer mold,

6 is a photograph taken after the cathode is formed using a cathode separation barrier formed on the ITO glass according to an embodiment of the present invention.

7 is a photograph photographing a state in which an organic light emitting diode manufactured by applying an embodiment of the present invention is driven.

<Description of the code | symbol about the principal part of drawing>

102, 302: silicon substrate 104, 306: reversed phase pattern

106, 308: Mask 108, 307: Master Mold

110, 309: elastomer mold 202, 402: substrate

204, 404: positive electrode 206, 406b1: negative electrode separation partition

304: insulating film pattern 406a1: insulating film

The above and other objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention described below with reference to the accompanying drawings by those skilled in the art.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, a key technical aspect of the present invention, unlike the above-described conventional method of forming a negative phase separation partition wall through a photo process including an exposure, development, and etching process, corresponds to the cathode separation partition without performing a photo process Separating the negative separation barrier or the insulating layer and the negative electrode on the glass substrate through a simple patterning process using the elastic mold or the negative electrode separation partition formed with the negative reverse phase pattern and the elastic mold having the negative reverse phase pattern corresponding to the insulating film below By forming the partition wall, it is possible to easily achieve the object of the present invention through this technical means.

Example 1

First, an elastic mold (cathode separation partition to be formed on ITO glass) used to form a cathode separation partition of an organic light emitting device without performing a photo process (coating, exposure, development, etching, cleaning, etc.) according to the present embodiment. A process for producing an elastic mold having a corresponding negative inverted pattern is described.

1A to 1D are process flowcharts illustrating a process of manufacturing an elastic mold for patterning according to an embodiment of the present invention.

Referring to FIG. 1A, a negative photoresist 104a of a thick film is formed on a base substrate, for example, a silicon substrate 102 by, for example, spin coating, and a mask 106 is formed thereon. By sequentially performing post-exposure, mask strip, development, cleaning, and the like, a master mold 108 having a silicon substrate 102 and an inverted pattern 104 is manufactured as an example, as shown in FIG. 1B. do.

Next, as an example, as shown in FIG. 1C, the master mold 108 is placed in a container, for example, the elastomer solution 110a, such as PDMS, is poured and then cured, or the elastomer powder 110a is placed in the container. To cure.

Then, the elastic body is removed from the master mold 108, and as an example, as shown in FIG. 1D, an elastic mold 110 having a negative reverse phase pattern usable for forming a cathode separating partition of the organic light emitting element, for example For example, complete the PDMS template. At this time, the elastic mold in which the negative reversed phase pattern corresponding to the negative electrode separation partition wall is formed has some elastic force, and this elastic force is very useful for patterning in a subsequent process.

Meanwhile, the elastic mold having the negative reverse phase pattern manufactured according to the present embodiment is not limited to being used only to form the cathode separation partition of the organic light emitting device, and may be used to manufacture any device or device requiring the reverse phase pattern. Of course, it can be applied.

Next, a process of forming the cathode separation barrier of the organic light emitting diode according to the present invention using an elastic mold having an inverted reverse phase pattern corresponding to the cathode separation barrier manufactured through the series of processes described above will be described. .

2A and 2B are flowcharts illustrating a process of forming a cathode separation barrier of an organic light emitting device using an elastic mold for patterning manufactured according to an embodiment of the present invention.

Referring to FIG. 2A, an ITO glass of transparent material formed in an arbitrary pattern on the substrate 202, for example, a positive electrode formed in an arbitrary pattern on the substrate 202 through a sputtering process, a wet or dry etching process, or the like On the upper part of 204, the pattern surface of the elastic mold 110 manufactured according to this embodiment, that is, the elastic mold 110 in which the negative reverse phase pattern corresponding to the cathode separation partition was formed, was contacted with high precision, and the inlet side of the reverse phase pattern ( Dropping the barrier forming material 206a such as a prepolymer having a low viscosity (for example, in the range of approximately 100 to 500 cps) at one inlet or both inlets) causes the barrier forming material 206a to be inside the negative reversed pattern by a capillary effect. By flowing in, the inside of the negative reversed pattern is filled with the partition forming material 206a.

Next, crosslinking of the partition forming material 206a is promoted by performing a process such as ultraviolet treatment or heat treatment corresponding to the type of the partition forming material 206a.

On the other hand, the method of forming the cathode separation barrier of the organic light emitting device according to the present embodiment is not limited to the same method as in the above-described embodiment (microcapillary molding: MIMIC (micro molding in capillaries)), CFL (capillary force lithography) : Capillary lithography), soft molding (soft molding), solvent assisted micro molding (SAMIM) and the like can be used.

Here, the capillary force lithography method and the soft molding method use a physical capillary force by directly contacting the pattern surface of the elastomer mold on the polymer material in a state in which a polymer material having a low viscosity is formed on the glass substrate. It is a technique of forming a negative phase separation partition wall by flowing into a negative reversed phase pattern and removing a polymer material remaining in an area other than the reversed phase pattern by, for example, full surface etching.

In addition, the SAMIM method injects a polymer dissolving material (e.g., a solvent) into the inverse phase pattern of the elastomer mold or contains a solvent in the inverse phase pattern itself, and the polymer material is formed on a glass substrate. It is a technique of forming a negative phase separation partition wall by injecting a polymer material into the negative reverse phase pattern by using physical capillary force and a dissolving material by minutely pressing the pattern surface.

Next, through a series of processes as described above, the cross-linking material of the partition forming material is sufficiently crosslinked, and then the elastic mold 110 is removed, for example, as shown in FIG. 2B, on the positive electrode 204. Cathode separation partition 206 is formed.

Since the description is omitted since it does not directly relate to the present invention, a hole injection is performed on the positive electrode 204 where the cathode separation barrier 206 is not formed by using a selective deposition process using a shadow mask. The organic light emitting element is completed by forming an organic material layer including a / transport layer, an electron injection / transport layer, a light emitting layer, and a negative electrode.

On the other hand, the inventors of the present invention manufactured an elastic mold having a negative inverse pattern, and performed an experiment to form a cathode separation partition of the organic light emitting device using the same, the experimental results are shown in Figures 5 to 7 same.

5 is an image of a main process of fabricating an elastomeric mold for patterning and forming a cathode separation partition of an organic light emitting device by using the SEM device, wherein 5a is an image of a master mold according to an embodiment of the present invention. 5b shows the photograph which image | photographed the elastic mold for patterning, and 5c shows the photograph which imaged the reverse phase negative electrode separation partition formed on the ITO glass using an elastic mold.

Therefore, it can be clearly seen that through the simple patterning process using the elastic mold having the negative reversed phase pattern prepared according to the present embodiment, the reverse phase negative electrode separation partition can be accurately formed on the positive electrode.

6 is a photograph taken after forming a cathode using a cathode separation barrier formed on ITO glass according to an embodiment of the present invention, as shown in the figure, the cathode is completely separated by the cathode separation barrier It was found that the cathode was not deposited on the side wall of the cathode separation partition.

FIG. 7 is a photograph of a state in which an organic light emitting device manufactured by applying an embodiment of the present invention is driven. As illustrated in the drawing, each pixel is completely separated by a cathode separation barrier. .

Therefore, the cathode separation barrier formation method of the organic light emitting diode according to the present exemplary embodiment does not form the reverse phase cathode separation barrier through a complicated photo process requiring many processes such as exposure, development, and etching processes as in the conventional method. Rather, by forming a reverse phase cathode separation partition on the positive electrode with high precision through a simple patterning process using an elastic mold having a negative reverse phase pattern corresponding to the cathode separation partition, the product production process can be simplified and the production yield can be improved. This can reduce the manufacturing cost of the product.

Example 2

First, an elastic mold (formed on ITO glass) used to form a cathode separation barrier of an organic light emitting diode and an insulating layer thereunder without performing a photo process (coating, exposure, development, etching, cleaning, etc.) according to this embodiment. A process of manufacturing an elastic mold having a negative reverse phase pattern corresponding to the insulating film and the cathode separation partition wall will be described.

3A to 3E are flowcharts illustrating a process of manufacturing an elastic mold for patterning according to another embodiment of the present invention.

Referring to FIG. 3A, a silicon substrate 302 is formed by forming an insulating material on a silicon substrate 302 through a process such as deposition and selectively removing a portion of the insulating material by performing a photo process well known in the art. ), A flat film pattern having an arbitrary shape, for example, an insulating film pattern 304 is formed.

Next, a negative photoresist 306a of a thick film is formed on the silicon substrate 302 by, for example, spin coating (FIG. 3B), and a mask 308 is formed thereon, followed by exposure and a mask strip. By sequentially performing processes such as development, cleaning, and the like, the master mold 307 having the silicon substrate 302, the insulating film pattern 304, and the reversed phase pattern 306, as shown in FIG. 3C, is illustrated as an example. Manufacture. Here, integrally forming the insulating film pattern 304 and the reversed phase pattern 306 is a subsequent patterning process (ie, one patterning process using an elastomer mold) to simultaneously form the insulating film and the cathode separation electrode on the positive electrode. To do that.

Next, as an example, as shown in FIG. 3D, the master mold 307 is placed in a container, and for example, the elastomer solution 309a, such as PDMS, is poured and then cured, or the elastomer powder 309a is poured into the container. To cure.

Subsequently, by removing the elastic body from the master mold 307, as shown in FIG. 3E, as shown in FIG. 3E, the composite pattern in which the planar film pattern and the reverse phase pattern, which can be used to simultaneously form the cathode separating partition and the insulating film, are mixed. For example, an elastic mold 307 having a negative insulating film pattern 310 and a reverse phase pattern 312 is completed, that is, a PDMS mold. At this time, the elastic mold having the negative insulating pattern and the reverse phase pattern corresponding to the insulating film and the negative electrode separation partition wall has a certain elastic force, and this elastic force is very useful for patterning in subsequent steps.

Meanwhile, the elastic mold having the negative reversed phase pattern manufactured according to the present embodiment is not limited to being used only for forming the insulating film and the cathode separation partition of the organic light emitting device as in the above-described first embodiment, As in the first embodiment, of course, it can be applied to the manufacture of any device or device that requires a reversed phase pattern of this structure.

Next, the insulating film and the cathode separating partition of the organic light emitting device according to the present invention are formed by using an elastic mold having an insulated insulating film pattern and a reverse phase pattern corresponding to the insulating film and the cathode separating partition formed through the above-described process. The formation process at the same time will be described.

4A and 4B are process flowcharts illustrating a process of simultaneously forming a cathode separation barrier of an organic light emitting device by using an elastic mold for patterning prepared according to another embodiment of the present invention.

Referring to FIG. 4A, an ITO glass of transparent material formed in an arbitrary pattern on the substrate 402, for example, a positive electrode formed in an arbitrary pattern on the substrate 402 through a sputtering process, a wet or dry etching process, or the like On the upper part of the 404, the elastic mold manufactured according to the present embodiment, that is, the insulated insulating film pattern corresponding to the insulating film and the cathode separation partition and the pattern surface of the elastic mold 309 in which the reverse phase pattern is integrally formed are contacted with high precision. When the insulating film and the partition forming materials 406a and 406b having a low viscosity (for example, approximately 400 cps or less) are dropped on the inlet side (one or both inlets) of the reversed phase pattern, the insulating film and the partition wall are formed by the capillary effect. As the materials 406a and 406b flow into the negative reversed pattern, the negative insulating layer and the reverse phase pattern are filled with the insulating film and the barrier rib forming materials 406a and 406b.

Next, crosslinking of the insulating film and the barrier rib forming materials 406a and 406b is promoted by performing a process such as ultraviolet treatment or heat treatment corresponding to the type of the insulating film and the barrier rib forming materials 406a and 406b.

On the other hand, the method of forming the insulating film and the cathode separation partition wall of the organic light emitting device according to the present embodiment is not limited to the same method as in the above embodiment (microcapillary molding: MIMIC (micro molding in capillaries)), As in Example 1, methods such as capillary force lithography (CFL), soft molding (soft molding), and solvent assisted micro molding (SAMIM) may be used.

Subsequently, after the cross-linking of the insulating film and the barrier rib forming materials 406a and 406b through the series of processes described above, the elastic mold 309 is removed, for example, as shown in FIG. 4B. An insulating film 406a1 and a reverse phase negative electrode separation partition 406b1 are formed on 404. That is, in the method according to the present embodiment, the insulating film 406a1 and the reverse phase negative electrode separation partition 406b1 are simultaneously formed in one process using the elastic mold 308.

Subsequently, since the description is omitted because it is not directly related to the present invention, the positive electrode 404 in which the insulating film 406a1 and the cathode separation barrier 406b1 are not formed by using a selective deposition process using a shadow mask, or the like. The organic light emitting device is completed by forming an organic material layer including a hole injection / transport layer, an electron injection / transport layer, a light emitting layer, a negative electrode, and the like.

Therefore, according to the present embodiment, substantially the same result (effect) as in the above-described first embodiment can be obtained, and the elastic mold can be produced when the structure is required to have an insulating film between the positive electrode and the negative electrode separation partition. Since the insulating film and the cathode separation partition are simultaneously formed in one patterning process, another effect can be obtained to further simplify the manufacturing process.

As described above, according to the present invention, unlike the conventional method of forming a reverse phase negative electrode separation partition through a photo process including an exposure, development, and etching process, the intaglio corresponding to the negative electrode separation partition without performing the photo process is performed. By precisely forming the insulating film and the reverse phase cathodic separation partition on the glass substrate through a simple patterning process using an elastic mold having the reverse phase pattern formed therein or the negative electrode separation partition formed thereon and the negative mold having the negative reverse phase pattern formed thereon. The product production process can be simplified and production yield can be increased, thereby reducing the manufacturing cost of the product.

Claims (16)

In the method for producing an elastic mold for patterning having a negative reversed pattern of any shape, Forming a negative photoresist of a thick film on the base substrate, and forming a mask having an arbitrary pattern thereon; Manufacturing a master mold having a reversed pattern by selectively removing the negative photoresist through an exposure and development process using the mask as an exposure blocking film; Applying and curing an elastomeric material on the master mold; And And removing the cured elastomeric material from the master mold, thereby completing an elastomeric mold having an inverted reverse phase pattern. The method of claim 1, wherein the elastomer mold is PDMS. In an organic light emitting device having a positive electrode, an organic layer and a negative electrode, a method of forming a negative electrode separating partition wall for separating the negative electrode of each pixel, A first step of preparing an elastic mold having a negative inverse pattern; A second process of contacting the pattern surface of the elastic mold on the positive electrode and injecting a negative electrode forming material into the negative reversed pattern to crosslink the positive electrode; And And removing the elastic mold, thereby forming a negative electrode separating partition on the positive electrode. 4. The method of claim 3, wherein the first process is: An eleventh step of forming a negative photoresist of a thick film on the base substrate and forming a mask having an arbitrary pattern thereon; A twelfth step of manufacturing a master mold having a reversed pattern by selectively removing the negative photoresist through an exposure and development process using the mask as an exposure blocking film; A thirteenth process of applying an elastomeric material to the master mold and then curing it; And And removing the cured elastic material from the master mold, thereby completing a fourteenth step of completing an elastic mold having a negative reverse phase pattern. The cathode of an organic light-emitting device using an elastic mold for patterning according to claim 3 or 4, wherein the injection of the cathode-forming material into the negative reversed pattern is performed by a micro molding in capillaries (MIMIC) method. Separation bulkhead formation method. 5. The cathode separation of an organic light emitting device using an elastic mold for patterning according to claim 3, wherein the injection of the cathode forming material into the negative reversed pattern is performed by a capillary force lithography (CFL) method. How to form a bulkhead. 5. The cathode separation of the organic light emitting device using the patterning elastomer mold according to claim 3, wherein the injection of the cathode-forming material into the negative reversed pattern is performed by a soft molding method. How to form a bulkhead. The cathode of an organic light-emitting device using an elastic mold for patterning according to claim 3 or 4, wherein the injection of the cathode-forming material into the negative reversed pattern is performed by a solvent assisted micro molding (SAMIM) method. How to form a separating bulkhead. In the method for producing an elastic mold for patterning having an intaglio pattern of any shape, Forming a flat film pattern having an arbitrary pattern on the base substrate; Forming a negative photoresist of a thick film on the entire surface of the base substrate, and forming a mask having an arbitrary pattern thereon; By selectively removing the negative photoresist through the exposure and development process using the mask as an exposure blocking film to leave a negative resist on the flat film pattern, to produce a master mold having a negative composite pattern including a reversed pattern process; Applying and curing an elastomeric material on the master mold; And And removing the cured elastic material from the master mold, thereby completing an elastic mold having a complex pattern including a reverse phase. 10. The method of claim 9, wherein the elastic mold of the composite pattern is PDMS. In an organic light emitting device having a positive electrode, an organic layer and a negative electrode, a method of forming a negative electrode separating partition wall for separating the negative electrode of each pixel, A first step of preparing an elastic mold having a negative composite pattern including an inverse phase pattern; A second process of contacting the composite pattern surface of the elastic mold on the positive electrode and injecting an insulating film and a cathode forming material into the negative composite pattern to crosslink and bond the second electrode; And A method of forming a cathode separation barrier of an organic light-emitting device using a patterning elastomer mold comprising a third process of removing the elastic mold to form an insulator separating partition on the positive electrode. The method of claim 11, wherein the first process comprises: An eleventh step of forming a flat film pattern having an arbitrary pattern on the base substrate; Forming a negative photoresist of a thick film on the entire surface of the base substrate, and forming a mask having an arbitrary pattern thereon; By selectively removing the negative photoresist through the exposure and development process using the mask as an exposure blocking film to leave a negative resist on the flat film pattern, to produce a master mold having a negative composite pattern including a reversed pattern The thirteenth process; A fourteenth process of applying an elastomeric material to the master mold and then curing it; And A method of manufacturing an elastic mold for patterning, comprising a fifteenth process of removing the cured elastic material from the master mold to complete an elastic mold having a composite pattern including a reverse phase. The organic light emitting diode according to claim 11 or 12, wherein the insulating film and the cathode-forming material are injected into the intaglio composite pattern by a micro molding in capillaries (MIMIC) method. Method of forming a cathode separation partition wall. The organic light emitting device of claim 11, wherein the insulating layer and the cathode forming material are injected into the intaglio composite pattern by a capillary force lithography (CFL) method. Cathode Separation Bulkhead Formation Method. The method of claim 11 or 12, wherein the injection of the insulating film and the cathode forming material into the intaglio composite pattern is performed by a soft molding method of the organic light emitting device using an elastic mold for patterning. Cathode Separation Bulkhead Formation Method. The organic light emitting diode according to claim 11 or 12, wherein the insulating film and the cathode-forming material are injected into the intaglio composite pattern by a solvent assisted micro molding (SAMIM) method. Method of forming a cathode separation partition wall.