KR20040040110A - tube cleaning device of semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE: A tube cleaning apparatus of semiconductor manufacturing equipment is provided to exactly and safely carry out an etching and cleaning process on a predetermined thickness film or layer by using a motor connected with a roller and a shaft. CONSTITUTION: A tube cleaning apparatus of semiconductor manufacturing equipment is provided with a deionized water bath for storing deionized water, an etching solution bath(8) located at the lateral portion of the deionized water bath for storing an etching solution(6), and a basket(12) for etching and cleaning a tube(10) by repeatedly moving from the deionized water bath to the etching solution bath. A motor(30) is installed at the outer portion of the etching solution bath. A shaft(20) and a plurality of rollers(14) are connected with the motor. At this time, the shaft is made of the first and second shaft(21,22).

Description

Tube cleaning device of semiconductor manufacturing apparatus

The present invention relates to a tube cleaning apparatus for semiconductor manufacturing equipment, and more specifically, a semiconductor capable of accurately and safely etching and cleaning a film or film having a predetermined thickness in a tube through which various process gases flow in semiconductor manufacturing equipment. A tube cleaning device for manufacturing equipment.

In general, various chemical vapor deposition equipment for semiconductor manufacturing are provided with a plurality of tubes through which various process gases flow, and such tubes are usually made of quartz or silicon carbide (SiC) material so as not to react with the various process gases. have.

However, as the use time of the tubes installed in the semiconductor manufacturing equipment, the film and the film having a predetermined thickness are formed on the part in contact with the process gas inside, which is fatal to the accurate process gas supply of the semiconductor manufacturing equipment. In effect, the film or film formed on the tube must be etched and cleaned periodically.

To this end, a tube cleaning apparatus as shown in Figures 1a and 1b is used, where Figure 1a is a side cross-sectional view of the tube cleaning apparatus of the conventional semiconductor manufacturing equipment, Figure 1b is a front sectional view of the etching solution bath in Figure 1a. It is shown.

As shown, the tube cleaning device 100 ′ of the conventional semiconductor manufacturing equipment is located in the deionized water tank 4 containing the deionized water 2 and the side of the deionized water tank 4, and the etching solution ( 6) and the basket 12 for etching and washing the tube (10) by reciprocating between the deionized water tank (4) and the etching solution tank (8).

Here, the tube 10 is stably positioned and supported on the bottom surface of the basket 12, and a plurality of rotatable rollers 14 are provided.

The tube cleaning apparatus 100 ′ of the conventional semiconductor manufacturing equipment includes placing a tube 10 separated from the semiconductor manufacturing equipment between the rollers 14 of the basket 12, and then placing the basket 12 into an etching solution tank ( 8) The film and film of the tube 10 are etched while locking and bubbling.

The tube 10 etched by the etching solution 6 is then moved to the deionized water tank 4 to finish the rinse, and then stored in a stocker, thereby cleaning the conventional tube 10. The process is complete.

However, this conventional tube cleaning device has a problem that when the tube carried in the etching solution bath is located on the bottom surface of the basket, the tube is not completely immersed under the etching solution, so that the etching and cleaning are incomplete.

Therefore, the operator must manually rotate the tube visible over the etching solution. In this case, in the case of a tube in which a poly film is deposited, a band may be formed in an area in contact with the etching solution.

In addition, when the etching solution contains the hydrofluoric acid (HF), it may be exposed to the hydrofluoric acid during the manual rotation of the tube, which may cause a fatal industrial disaster for workers.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, an object of the present invention is a semiconductor that can accurately and safely etch and clean the film or film of a predetermined thickness in the tube flowing various process gases in the semiconductor manufacturing equipment It is to provide a tube cleaning device of the manufacturing equipment.

Figure 1a is a side cross-sectional view showing a tube cleaning device of a conventional semiconductor manufacturing equipment, Figure 1b is a front sectional view showing an etching solution bath in Figure 1a.

Figure 2 is a front sectional view showing an etching solution tank in the tube cleaning device of the semiconductor manufacturing equipment according to the present invention.

3 is an enlarged cross-sectional view of region A of FIG. 2.

Description of the main symbols in the drawings

100; Tube cleaning apparatus of semiconductor manufacturing equipment according to the present invention

2; Deionized water 4; Deionized water tank

6; Etching solution 8; Etch solution tank

10; Tube 12; basket

14; Roller 20; shaft

21; First shaft 22; 2nd shaft

24; Support 30; motor

40; Control

In order to achieve the above object, the present invention is a deionized water tank containing deionized water, located on the side of the deionized water tank, an etching solution tank containing an etching solution and the reciprocating motion between the deionized water tank and the etching solution tank In the tube cleaning apparatus of the semiconductor manufacturing equipment consisting of a basket for etching and washing the tube, the motor is installed on the outside of the etching solution tank, the motor penetrates into the inside of the etching solution tank, the bottom surface of the basket An extended shaft is installed, and a plurality of rollers are coupled to the shaft.

Here, the shaft is preferably made of a first shaft that penetrates the etching solution tank and is directly coupled to the motor, and a second shaft that is coupled to and detachable from the first shaft and is located on the bottom surface of the basket. . In addition, a groove portion may be formed at an end portion of the first shaft, and a protrusion portion may be formed at an end portion of the second shaft so as to be coupled to and separated from the groove portion of the first shaft.

In addition, the shaft is preferably coated with Teflon on the surface so as not to react with various etching solutions.

According to the tube cleaning apparatus of the semiconductor manufacturing equipment according to the present invention as described above, the motor is connected to the roller and the shaft mounted on the basket, it is possible to automatically rotate the tube by the operation of the motor, Accordingly, the etching solution acts uniformly on the tube, and thus, there is an advantage that the film and the film formed on the tube can be accurately and safely etched and cleaned.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

Here, the same parts as in the prior art will use the same reference numerals, and the description of the technical details overlapping with the conventional will be minimized so as not to obscure the subject matter of the present invention.

First, referring to Figure 2, there is shown a front cross-sectional view of the etching solution tank 8 in the tube cleaning device 100 of the semiconductor manufacturing equipment according to the present invention.

Of course, the tube cleaning device 100 according to the present invention is also located in the deionized water tank (4) containing the deionized water (2), the side of the deionized water tank (4), containing the etching solution (6) The etching solution tank 8, and the basket 12 for etching and washing the tube 10 by reciprocating between the deionized water tank (4) and the etching solution tank (8), this configuration Same as before.

However, in the present invention, the motor 30 is installed outside the etching solution tank 8, and the motor 30 penetrates into the etching solution tank 8 to the bottom surface of the basket 12. An extended shaft 20 is installed, and a plurality of rollers 14 are coupled to the shaft 20.

Here, a plurality of supports 24 are provided on the bottom surface of the basket 12, and the supports 24 are rotatable in one direction while the position of the shaft 20 is fixed. Of course, the thickness of the support 24 is smaller than the diameter of the roller 14, it is preferable not to contact the tube 10.

In addition, the motor 30 is connected to the control unit 40, it is determined whether the operation according to the signal of the control unit 40, although not shown, the horizontal and vertical movement of the basket 12 is also the control unit ( It is preferable to carry out by 40).

Meanwhile, referring to FIG. 3, which shows an enlarged area A of FIG. 2, the shaft 20 has a first shaft 21 directly penetrating the etching solution tank 8 and directly coupled to the motor 30. The second shaft 22 is provided to be coupled to and detachable from the first shaft 21 and to be positioned on the bottom surface of the basket 12.

In more detail, the groove portion 21a having a predetermined depth is formed at the end of the first shaft 21, and the groove portion 21a of the first shaft 21 is formed at the end of the second shaft 22. Protruding portion 22a having a predetermined length is formed to be coupled to and separated from each other, so that the first shaft 21 and the second shaft 22 can be easily combined and separated.

On the other hand, the shaft 20 is preferably coated with a Teflon or its equivalent on the surface so as not to react with various etching solutions (6). Of course, in addition to the shaft 20, the roller 14 does not react with the etching solution 6 as a rubber material as in the prior art.

Referring to the operation of the pipe cleaning apparatus 100 of the semiconductor manufacturing equipment according to the present invention as follows.

First, in the tube cleaning apparatus 100 of the semiconductor manufacturing equipment according to the present invention, the tube 10 separated from the semiconductor manufacturing equipment is positioned between the shafts 20 of the basket 12, and then the basket 12 is etched. Immerse in solution bath (8).

Here, the shaft 20 is a state in which the first shaft 21 and the second shaft 22 of the motor 30 are separated, and when the basket 12 is immersed in the etching solution tank 8 as described above, The first shaft 21 of the motor 30 approaches the second shaft 22 and is coupled to each other. That is, the recess 21a of the first shaft 21 is coupled to the protrusion 22a of the second shaft 22, thereby being coupled to each other.

Subsequently, the motor 30 is operated by the signal of the controller 40, and accordingly, the shaft 20 including the first shaft 21 and the second shaft 22 rotates, and the second shaft is rotated. A plurality of rollers 14 coupled to 22 also rotate.

When the roller 14 rotates as described above, the tube 10 located on the upper surface of the roller 14 also rotates in a predetermined direction, whereby the etching solution 6 acts uniformly on the tube 10. Done.

Of course, at this time, locking and bubbling by the etching solution 6 are simultaneously performed, whereby the film and the film of the tube 10 are etched cleanly.

Subsequently, after the etching process is completed, the first shaft 21 and the second shaft 22 are separated from each other.

Subsequently, the basket 12 on which the tube 10 is seated moves from the etching solution tank 8 to the deionized water tank 4 to rinse the tube 10 and then the tube 10. By storing in a stocker, the cleaning process of the tube 10 according to the invention is completed.

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

Therefore, according to the tube cleaning apparatus of the semiconductor manufacturing equipment according to the present invention, the motor is connected to the roller and the shaft mounted on the basket, it is possible to automatically rotate the tube by the operation of the motor, thereby etching The solution acts uniformly on the tube, which in turn has the effect of accurately and safely etching and cleaning the films and membranes formed on the tube.

Claims (4)

A deionized water tank containing deionized water, a deionized water tank positioned in the side of the deionized water tank, and an etching solution containing an etching solution, and the basket for etching and washing the tube by reciprocating between the deionized water tank and the etching solution tank In the tube cleaning apparatus of the semiconductor manufacturing equipment, A motor is installed outside the etching solution tank, and the motor is provided with a shaft penetrating into the etching solution tank and extending toward the bottom surface of the basket, and the rollers are coupled to the shaft. Tube cleaning apparatus for semiconductor manufacturing equipment. The shaft of claim 1, wherein the shaft penetrates through the etching solution tank and is directly coupled to the motor, and a second shaft coupled to and detachable from the first shaft and positioned on a bottom surface of the basket. Tube cleaning apparatus of a semiconductor manufacturing equipment, characterized in that made. The semiconductor manufacturing apparatus of claim 2, wherein a recess is formed at an end of the first shaft, and a protrusion is formed at an end of the second shaft so as to be coupled to and separated from the recess of the first shaft. Tube washing device. The apparatus of claim 1, wherein the shaft is coated with Teflon on a surface of the shaft so as not to react with various etching solutions.