KR200400364Y1 - Anti-static release film - Google Patents
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- KR200400364Y1 KR200400364Y1 KR20-2005-0023478U KR20050023478U KR200400364Y1 KR 200400364 Y1 KR200400364 Y1 KR 200400364Y1 KR 20050023478 U KR20050023478 U KR 20050023478U KR 200400364 Y1 KR200400364 Y1 KR 200400364Y1
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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- C08J2383/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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Abstract
본 고안은 산업 전반에 광범위하게 사용가능한 대전방지 이형필름 제조방법에 관한 것으로서, 특히 기존의 이형필름에서 기술적인 해결이 어려운 대전방지 기능을 부가하여 공정상 안정성을 갖는 대전방지 이형필름을 제조하는 데 있다. 본 고안에 따른 대전방지 이형필름은 기저 합성수지 필름 및 상기 기저 필름의 적어도 일면 상에 전도성 고분자로 대전층을 형성하고, 상기 대전층 위에 경화성 실리콘 이형층을 형성하여 제조하는 것으로써 기존의 이형특성을 유지하면서 대전방지 성능을 가지는 이형필름 제조를 목적으로 한다. The present invention relates to a method for manufacturing an antistatic release film that can be widely used throughout the industry, and in particular, to produce an antistatic release film having process stability by adding an antistatic function that is difficult to solve technically in a conventional release film. have. The antistatic release film according to the present invention is formed by forming a charging layer of a conductive polymer on at least one surface of a base synthetic resin film and the base film, and forming a curable silicone release layer on the charging layer to produce existing release characteristics. It is intended to manufacture a release film having an antistatic performance while maintaining.
Description
본 고안은 라벨, 라벨 스티커, 접착성 테이프, 점착성 테이프 등의 일시적 지지체로 사용되는 이형필름, 각종 세라믹 제품(MLCC 등)의 성형 시 세라믹 코팅이 요구되는 공정에서 캐리어 필름으로 사용되는 이형필름 및 전자부품의 보호목적으로 사용되는 점착성 보호필름의 지지체로 사용되는 이형필름에 정전기 방지 기능을 추가화한 대전방지 이형필름 제조방법에 관한 것이다. The present invention is a release film used as a temporary support such as a label, a label sticker, an adhesive tape, an adhesive tape, a release film used as a carrier film in the process requiring a ceramic coating when molding various ceramic products (MLCC, etc.) The present invention relates to an antistatic release film manufacturing method in which an antistatic function is added to a release film used as a support of an adhesive protective film used for protecting a part.
기존 이형필름은 이형층을 형성하기 위한 통상의 합성수지 시트 또는 합성수지 필름, 종이 등이 그 지지체로 사용되며 이 지지체 위에 여러 가지 이형성을 갖는 재료로 형성된다. 이형층으로서는 경화성을 갖는 어떠한 재료도 사용가능하며 예를 들면 우레탄 수지, 에폭시 수지 또는 알키드 수지등의 유기물로 변형된 변형 실리콘 수지, 경화성 실리콘 수지를 주로 사용한다. 이 중 경화성 실리콘 수지를 주로 포함하는 형태가 이형특성이 우수하기 때문에 바람직하게 사용되고 있다. Existing release film is a conventional synthetic resin sheet or synthetic resin film, paper, etc. for forming a release layer is used as the support and is formed of a material having a variety of release properties on the support. As the release layer, any material having curability may be used, and for example, a modified silicone resin or a curable silicone resin modified with an organic substance such as a urethane resin, an epoxy resin or an alkyd resin is mainly used. Among these, the form which mainly contains curable silicone resin is used preferably because it is excellent in a release property.
상기에서 제조된 이형필름의 경우, 공정상 사용 시 발생되는 정전기로 인해 작업 시 이물질이 유입되거나 생산성을 저하시키는 단점과 함께 제품 생산 시 다양한 형태의 불량요인을 제공한다. 뿐만아니라 이형필름 제거시 상당량의 정전기가 일반적으로 발생하므로 대기중의 먼지등과 같은 이물질이 흡착되기가 쉽다. 이러한 이형필름의 정전기 발생 문제를 해결하기 위한여 일부의 이형필름에서는 지지체인 폴리 에스터 필름의 생산 시 필름의 내부에 불활성 미립자, 이를테면 실리카, 탄산칼슘, 카오린, 티탄 산화물, 알루미늄 산화물, 황산바륨, 제올라이트 등과 같은 무기입자를 혼합하여 생산하는 방법이 제안되어 왔다. 그러나 이러한 금속성 물질의 이탈 및 오염등으로 제 2의 불량요인을 제공하여 사용을 기피하고 있다.In the case of the release film manufactured in the above, foreign substances are introduced during work due to the static electricity generated during the use of the process, or provide various defects in the production of the product with the disadvantage of lowering productivity. In addition, since a large amount of static electricity generally occurs when removing the release film, foreign substances such as dust in the air are easily adsorbed. In some release films to solve the static electricity generation problem of the release film, inert particles such as silica, calcium carbonate, kaolin, titanium oxide, aluminum oxide, barium sulfate, zeolite in the production of polyester film as a support There has been proposed a method of producing by mixing inorganic particles such as. However, the use of such a second defect factor is avoided due to the separation and contamination of the metallic material.
본 고안은 이러한 문제를 해결하기 위한 것으로서, 이형필름의 지지체가 되는 여러 가지 합성수지 필름 및 종이 등의 단면에 전도성 고분자를 1차 코팅하여 대전방지층을 형성하고, 그 위에 2차로 이형성을 갖는 기존의 경화성 이형 수지층을 코팅하여 이형특성을 유지하면서 우수한 대전방지 성능을 가지는 기능성 대전방지이형필름 제조방법을 제공하는 것이다. The present invention is to solve this problem, to form an antistatic layer by first coating a conductive polymer on the cross-section of a variety of synthetic resin film and paper that is a support of the release film, and the existing curability having a second release thereon It is to provide a functional antistatic release film manufacturing method having an excellent antistatic performance while maintaining the release characteristics by coating a release resin layer.
본 고안은 기존 이형필름의 이형특성을 저해하지 않는 범위에서 우수한 대전방지 특성을 갖는 대전방지 이형필름 제조에 관한 것으로써, 이형필름용 지지체로 사용 가능한 합성수지 필름 및 종이 단면에 전도성 고분자로 1차 코팅하여 대전층을 형성하고, 상기 대전층 위에 기존의 이형성 수지로 경화성 이형층을 형성하여 제조된 대전방지 이형필름에 관한 것이다. The present invention relates to the production of an antistatic release film having excellent antistatic properties in a range that does not inhibit the release characteristics of the existing release film, the first coating with a conductive polymer on the synthetic resin film and paper cross-section that can be used as a support for the release film It relates to an antistatic release film prepared by forming a charging layer, and forming a curable release layer with a conventional release resin on the charging layer.
이하 본 고안을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.
도 1은 본 고안에 따른 대전방지 이형필름를 나타낸 도면이다.1 is a view showing an antistatic release film according to the present invention.
본 고안에서 설명되는 대전방지 이형필름(10)의 제조에 있어서 지지체(11)로서 폴리에스터르 필름(PET)을 예로 들어 설명하겠으나, 본 고안이 여기에 한정되는 것은 아님을 밝혀 둔다. 이형필름의 용도로 여러 가지 종류의 폴리에스터르 필름이 시판되고 있으나 어떠한 종류의 것에도 사용이 가능하다.In the manufacture of the antistatic release film 10 described in the present invention will be described by taking a polyester film (PET) as an example, but the present invention is not limited thereto. Various kinds of polyester films are commercially available for use in release films, but they can be used in any kind of film.
PET 필름 단면에 전도성 고분자로 1차 대전방지층(12)을 형성하고 그 위에 이형수지로 이형층(13)을 2차 형성하여 대전 방지 이형필름(10)을 제조하는 방법이다. 대전방지용 전도성 코팅액의 조성물은 전도성 고분자 0.1~20 중량부, 접착성 증진용 바인더 5~55 중량부, 상기 성분의 분산을 돕는 기능성 첨가제 0.01~5 중량부, 실리콘 이형층과 양호한 밀착성 및 부착력을 제공하는 실란커플링제 0.1~10 중량부, 그리고 용매(이소프로필알콜, 물, 1-메틸-2-피롤리디논, 디메틸설폭사이드 등에서 선택된 적어도 1종 이상) 40~50 중량부를 혼합하여 제조한다. 상기와 같이 제조된 대전방지 코팅액을 그라비아, 오프셋, 키스바, 나이프, 메이어바 또는 코마법을 이용하여 0.1~10 미크론의 두께로 코팅하고 50~250℃에서 30초 ~ 1시간 정도 건조하여 투명 전도성 대전방지 기저필름을 제조한다. It is a method of manufacturing the antistatic release film 10 by forming a primary antistatic layer 12 with a conductive polymer on the PET film cross-section and secondary formation of the release layer 13 with a release resin thereon. The composition of the antistatic conductive coating liquid is 0.1 to 20 parts by weight of the conductive polymer, 5 to 55 parts by weight of the binder for improving adhesion, 0.01 to 5 parts by weight of functional additives to help the dispersion of the components, and provides good adhesion and adhesion to the silicone release layer 0.1 to 10 parts by weight of a silane coupling agent and 40 to 50 parts by weight of a solvent (at least one or more selected from isopropyl alcohol, water, 1-methyl-2-pyrrolidinone, and dimethyl sulfoxide) are prepared by mixing. The antistatic coating solution prepared as described above was coated with a thickness of 0.1 to 10 microns using a gravure, offset, kissbar, knife, mayer bar or coma method, and dried at 50 to 250 ° C. for 30 seconds to 1 hour to provide a transparent conductivity An antistatic base film is prepared.
상기에서 형성된 대전 코팅층위에 기존 사용중인 우레탄 수지, 에폭시 수지 또는 알키드 수지등의 유기물로 변형된 변형 경화성 실리콘 수지를 도포하여 전체 도포 표면에 대전방지 성능이(표면 저항 : ASTM D257 측정방법에 의해 10E6 ~ 10E9 Ω/sq을 나타내었다) 우수한 기능성 이형필름을 제조할 수 있다.Antistatic performance is applied to the entire surface of the coating by applying a strain-curable silicone resin modified with organic materials such as urethane resin, epoxy resin or alkyd resin in use on the electrification coating layer formed above (surface resistance: 10E6 ~ by ASTM D257 measuring method). 10E9 M / sq) excellent functional release film can be prepared.
본 고안의 전도성 고분자에 의한 대전방지층은 실란커플링제를 포함하고 있어 특히 경화성 실리콘계열의 이형층 간 화학적 친화성에 의해 우수한 밀착성 및 부착성을 갖는다. 상기의 방법은 이형필름을 여러 가지 공정에 사용함에 있어 실리콘 이형층의 전이현상을 없애주는 장점을 갖게 된다. The antistatic layer of the conductive polymer of the present invention contains a silane coupling agent, and in particular, has excellent adhesion and adhesion due to chemical affinity between the release layers of the curable silicone series. The above method has the advantage of eliminating the transition phenomenon of the silicon release layer in using the release film in various processes.
사용가능한 이형필름으로는, 기존에 사용중인 As the release film that can be used,
폴리프로필렌, 폴리에틸렌 등의 폴리올레핀, 폴리에틸렌테레프탈레이트등의 폴리에스테르, 폴리아미드, 폴리카보네이트, 폴리아세탈, 이들의 혼합물 및 공중합체 등으로 부터 선택된 중합체로서 단층 또는 복수의 층으로 구성되는 것등이 가능하다. Polyolefins such as polypropylene and polyethylene, polyesters such as polyethylene terephthalate, polyamides, polycarbonates, polyacetals, mixtures and copolymers thereof, and the like, and may be composed of a single layer or a plurality of layers. .
전도성 고분자로는 폴리아닐린, 폴리피롤, 폴리티오펜, 수용성 폴리(3,4-에틸렌티오펜), 이들의 유도체나 공중합체, 수용성 및 유기용매에 가용성인 π-공액계 전기 전도성 고분자를 들 수 있다. Examples of the conductive polymer include polyaniline, polypyrrole, polythiophene, water-soluble poly (3,4-ethylenethiophene), derivatives and copolymers thereof, and π-conjugated electrically conductive polymers soluble in water-soluble and organic solvents.
용매로는 디메틸설폭사이드(DMSO), 디메틸포름아미드(DMF), N-메틸-2-피롤리돈(NMP), 2-부탄온, 4-메틸-2-펜탄온, 에틸셀로솔브(ethyl cellosolve), 메틸셀로솔브(methyl cellosolve), 메틸알코올, 에틸알코올, 이소프로필알코올, 이소부틸알코올, t-부틸알코올, 벤질알코올, 에틸렌글리콜 등을 단독 또는 혼합하여 사용할 수 있다. 이 중에서 디메틸설폭사이드(DMSO), N-메틸-2-피롤리돈(NMP), 이소프로필알코올, 에틸셀로솔브 등이 바람직하다. Solvents include dimethyl sulfoxide (DMSO), dimethylformamide (DMF), N-methyl-2-pyrrolidone (NMP), 2-butanone, 4-methyl-2-pentanone, ethyl cellosolve (ethyl cellosolve), methyl cellosolve, methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol, t-butyl alcohol, benzyl alcohol, ethylene glycol and the like can be used alone or in combination. Among these, dimethyl sulfoxide (DMSO), N-methyl-2-pyrrolidone (NMP), isopropyl alcohol, ethyl cellosolve, and the like are preferable.
실란 커플링제는 일반식 R 1 Si(OR) 3 (R 1 은 유기치환기)로 나타내는 유기실란화합물이고, 아미노 실란계, 비닐 실란계, 에폭시 실란계, 메타크릴옥시 실란계, 이소시아네이트 실란계등이 있다. 특히, 트리메톡시페닐실란, 트리메톡시메틸실란, 비닐트리에톡시실란, 3-메타크릴로프로필트리메톡시실란, 3-글리시독시프로필트리메톡시실란, 3-아미노프로필트리에톡시실란이 바람직하다. The silane coupling agent is an organosilane compound represented by the general formula R 1 Si (OR) 3 (R 1 is an organic substituent), and an amino silane type, a vinyl silane type, an epoxy silane type, a methacryloxy silane type, an isocyanate silane type, etc. have. In particular, trimethoxyphenylsilane, trimethoxymethylsilane, vinyltriethoxysilane, 3-methacrylopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane This is preferred.
이형 필름의 이형층을 형성하는 소재로서 가장 일반적으로 사용되고 있는 것은 실옥산 단위를 함유하는 실리콘계 중합체 수지와 규소, 할로겐 원소도 포함하지 않는 이형제로서 폴리올레핀 또는 장쇄 알킬 함유 중합체 수지가 있다. 특히 바람직하게는 실리콘계 중합체 수지로서 무용매 자외선 경화형, 용매 부가형, 용매 축합형, 용매 자외선 경화형, 무용매 부가형, 무용매 축합형등 여러 가지의 경화 반응형을 사용할 수있다. The most commonly used materials for forming the release layer of the release film include silicone-based polymer resins containing siloxane units and polyolefins or long-chain alkyl-containing polymer resins as release agents containing no silicon or halogen elements. Especially preferably, various curing reaction types such as solvent-free ultraviolet curing, solvent addition, solvent condensation, solvent ultraviolet curing, solvent-free addition and solvent-free condensation may be used as the silicone polymer resin.
본 고안은 기저 합성수지 필름 및 상기 기저 필름의 적어도 일면 상에 전도성 고분자 또는 대전방지제로 대전층을 형성하고, 상기 대전층 위에 여러 가지 이형성 수지로 경화성 이형층을 형성하여 제조된 대전방지 이형필름 제조에 관한 것으로써, 기존 이형특성을 유지하면서 우수한 대전방지 기능을 첨가하여 정전기에 극히 민감한 반도체 또는 전자제품 (MLCC 등) 등의 내외 부 소재로 적용이 가능하다. The present invention is to form an antistatic release film prepared by forming a chargeable layer of a conductive polymer or an antistatic agent on at least one surface of the base synthetic film and the base film, and a curable release layer made of various release resins on the charge layer. Related to this, it is possible to apply to the internal and external materials such as semiconductor or electronic products (MLCC, etc.) that are extremely sensitive to static electricity by adding excellent antistatic function while maintaining the existing release characteristics.
도 1은 본 고안에 따른 대전방지 이형 필름을 나타낸 도면.1 is a view showing an antistatic release film according to the present invention.
* 도면의 주요 부분에 대한 부호설명 ** Explanation of Signs of Major Parts of Drawings *
10 : 대전방지 이형필름10: antistatic release film
11 : 기저 합성수지 필름 11: base synthetic film
12 : 전도성 고분자가 코팅된 대전층12: charged layer coated with conductive polymer
13 : 이형층13: release layer
Claims (5)
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| KR20-2005-0023478U KR200400364Y1 (en) | 2005-08-12 | 2005-08-12 | Anti-static release film |
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| KR20-2005-0023478U KR200400364Y1 (en) | 2005-08-12 | 2005-08-12 | Anti-static release film |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100716717B1 (en) * | 2006-09-27 | 2007-05-09 | (주)우경인더스트리 | Construction method of static-electricity proof tile |
| KR100718848B1 (en) | 2005-11-30 | 2007-05-17 | 도레이새한 주식회사 | Anti-static polyester film |
| KR100741000B1 (en) * | 2006-02-27 | 2007-07-19 | (주)우경인더스트리 | Tile having shrinking and expanding preventing means |
| KR101006456B1 (en) | 2009-04-15 | 2011-01-06 | 한국과학기술연구원 | Method for fabrication of conductive film using sputtering and conductive film |
| KR101051259B1 (en) * | 2007-09-28 | 2011-07-21 | 티디케이가부시기가이샤 | Method for manufacturing laminated film and laminated ceramic electronic component |
| CN115772283A (en) * | 2022-12-26 | 2023-03-10 | 苏州泰仑电子材料有限公司 | Special anti-static release film for OCA (optical clear adhesive) coating and preparation method thereof |
-
2005
- 2005-08-12 KR KR20-2005-0023478U patent/KR200400364Y1/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100718848B1 (en) | 2005-11-30 | 2007-05-17 | 도레이새한 주식회사 | Anti-static polyester film |
| KR100741000B1 (en) * | 2006-02-27 | 2007-07-19 | (주)우경인더스트리 | Tile having shrinking and expanding preventing means |
| KR100716717B1 (en) * | 2006-09-27 | 2007-05-09 | (주)우경인더스트리 | Construction method of static-electricity proof tile |
| KR101051259B1 (en) * | 2007-09-28 | 2011-07-21 | 티디케이가부시기가이샤 | Method for manufacturing laminated film and laminated ceramic electronic component |
| KR101006456B1 (en) | 2009-04-15 | 2011-01-06 | 한국과학기술연구원 | Method for fabrication of conductive film using sputtering and conductive film |
| CN115772283A (en) * | 2022-12-26 | 2023-03-10 | 苏州泰仑电子材料有限公司 | Special anti-static release film for OCA (optical clear adhesive) coating and preparation method thereof |
| CN115772283B (en) * | 2022-12-26 | 2024-01-30 | 苏州泰仑电子材料有限公司 | Special anti-static ionization film for OCA optical cement coating and preparation method thereof |
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