KR20040024352A - PCB Tester - Google Patents

PCB Tester Download PDF

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Publication number
KR20040024352A
KR20040024352A KR1020020055941A KR20020055941A KR20040024352A KR 20040024352 A KR20040024352 A KR 20040024352A KR 1020020055941 A KR1020020055941 A KR 1020020055941A KR 20020055941 A KR20020055941 A KR 20020055941A KR 20040024352 A KR20040024352 A KR 20040024352A
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KR
South Korea
Prior art keywords
circuit board
printed circuit
test
main computer
measuring
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KR1020020055941A
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Korean (ko)
Inventor
신원철
이호덕
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(주)킵스
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Priority to KR1020020055941A priority Critical patent/KR20040024352A/en
Publication of KR20040024352A publication Critical patent/KR20040024352A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Abstract

PURPOSE: A test apparatus is provided to test short circuit of printed circuit board and resistance or impedance in an accurate and rapid manner. CONSTITUTION: A test apparatus comprises a main computer(10) where test software and test data are stored; a size measurement unit(20) for measuring the thickness of the printed circuit board, and thickness or width of the wire; and an electrical characteristics measurement unit(30) for measuring electrical characteristics of the printed circuit board. The electrical characteristics measurement unit includes a plurality of input side multiplexer modules(120) connected to the main computer through input/output interfaces(110), wherein the input side multiplexer modules distribute the test signal current in accordance with the control of the main computer; a detection pin fixture having the input side connected to the multiplexer modules, wherein the detection pin fixture has a plurality of detection pins corresponding to the test points of the printed circuit board; a plurality of output side multiplexer modules(140) connected to the output side of the detection pin fixture, wherein the output side multiplexer modules distribute the signal current passed through the printed circuit board; and A/D converters(150) connected to the rear ends of the output side multiplexer modules, wherein the A/D converters convert the signal current into a multi-channel digital signal and transmit the digital signal to the main computer.

Description

인쇄회로기판의 테스트장치 {PCB Tester}Tester for Printed Circuit Board {PCB Tester}

본 발명은 인쇄회로기판의 테스트장치에 대한 것으로서, 좀 더 상세히는 회로기판의 단락여부와 저항 또는 임피던스를 정밀하게 고속으로 검사할 수 있는 새로운 구조의 테스트장치에 대한 것이다.The present invention relates to a test apparatus for a printed circuit board, and more particularly, to a test apparatus having a new structure capable of inspecting whether a short circuit of a circuit board and resistance or impedance is precise and high speed.

인쇄회로기판에는 다양한 종류의 회로패턴이 형성된다. 종래의 회로패턴에는 접점과 접점을 연결하는 배선만이 인쇄되어 있으나, 근래에는 저항이나 코일 또는 캐패시터 등의 소자들이 패턴형태로 인쇄되어 내장되기도 한다. 종래의 배선위주의 인쇄회로기판의 경우에는 인쇄회로기판의 테스트는 배선회로의 단락이나 개방여부만을 판단하는 수준에서 이루어졌으나, 이와 같이 배선회로의 단락여부만을 판단하는 것으로는, 배선이나 인쇄된 소자들의 정확한 저항값이나 임피던스값을 측정할 수 없다. 따라서, 종래의 테스트장치만으로는 점점 고기능화, 고밀도화되어 복잡해지고 다층화되는 인쇄회로기판의 품질을 정확하게 검사하여 정확한 회로동작을 보장하기 어렵다는 문제점이 있었다. 그러므로, 종래에는 인쇄회로기판의 저항값이나 임피턴스값 등을 수동적인 검사방법으로 행할 수 밖에 없어서, 인쇄회로기판 제품에 대한 전수검사는 기대하기 어렵고 샘플링검사 수준에 머물렀으며, 이에 따라, 다양한 종류의 고기능, 고밀도 인쇄회로기판이 대량으로 설계되고 제작되는 업계의 요구에 충분히 부응할 수 없다는 문제점이 있었다.Various types of circuit patterns are formed on the printed circuit board. In the conventional circuit pattern, only wires connecting the contact and the contact are printed, but recently, elements such as resistors, coils, or capacitors are printed and embedded in a pattern form. In the case of the conventional wiring-oriented printed circuit board, the test of the printed circuit board is performed at the level of judging only whether the wiring circuit is shorted or open. Their exact resistance or impedance cannot be measured. Therefore, there is a problem that it is difficult to ensure accurate circuit operation by accurately inspecting the quality of a printed circuit board which is increasingly functionalized, densified, and complicated by a conventional test apparatus. Therefore, conventionally, the resistance value or the impedance value of the printed circuit board has to be performed by a manual inspection method, so that the total inspection of the printed circuit board products is difficult to expect and remained at the sampling inspection level. There has been a problem that high-performance, high-density printed circuit boards of various kinds cannot sufficiently meet the demands of the industry that are designed and manufactured in large quantities.

본 발명은 전술한 바와 같은 종래의 문제점에 착안하여 제안된 것으로서, 본 발명은 인쇄회로기판의 배선의 단락여부는 물론, 회로기판 내에 인쇄된 소자들의 저항값이나 임피던스값을 고속으로 정밀하게 측정함으로써, 고기능화, 고밀도화되어가는 인쇄회로기판의 검사의 신뢰성을 확보하고 전수검사를 가능하게 하는 새로운 구조의 인쇄회로기판의 테스트장치를 제공하고자 하는 것이다.SUMMARY OF THE INVENTION The present invention has been proposed in view of the above-described problems, and the present invention provides a high-speed and accurate measurement of resistance values or impedance values of elements printed in a circuit board as well as short circuits of a printed circuit board. To provide a test apparatus for a printed circuit board with a new structure that ensures the reliability of the inspection of the printed circuit board, which is becoming highly functionalized and densified and enables full inspection.

도 1은 본 발명에 따른 테스터기의 개략구성도1 is a schematic configuration diagram of a tester according to the present invention

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10. 메인컴퓨터 20. 치수측정부10. Main computer 20. Dimension measuring unit

30. 전기적특성측정부 110. 입출력인터페이스30. Electrical characteristics measuring unit 110. I / O interface

120. 멀티플렉서모듈 130. 검출핀 픽스쳐120. Multiplexer Module 130. Detection Pin Fixture

140. 멀티플렉서모듈 150. A/D컨버터140. Multiplexer Module 150. A / D Converter

본 발명에 따르면, 순차공급되는 인쇄회로기판의 단락여부와 저항값 및 임피던스값를 측정하는 테스트장치에 있어서,According to the present invention, in the test device for measuring whether the short circuit of the sequentially supplied printed circuit board, the resistance value and the impedance value,

상기 테스트장치는 인쇄회로기판의 테스트용 소프트웨어와 테스트용 데이터가 저장된 메인컴퓨터(10)와, 테스트할 인쇄회로기판의 두께나 배선의 라인두께 또는 폭 등을 측정하는 치수측정부(20)와, 테스트할 인쇄회로기판의 전기적특성을 측정하는 전기적특성 측정부(30)로 이루어지고, 상기 전기적특성 측정부(30)는 입출력인터페이스(110)를 통해 상기 메인컴퓨터(10)에 연결되며 이 메인컴퓨터(10)로부터의 제어에 따라 테스트용 신호전류를 분배하는 다수의 입력측 멀티플렉서모듈(120)과, 입력측이 상기 멀티플렉서모듈(120)에 접속되며 테스트할 인쇄회로기판(P)의 테스트포인트에 대응하여 다수의 검출핀(132)이 돌출형성된 검출핀 픽스쳐(130)와, 상기 검출핀 픽스쳐(130)의 출력측에 접속되며 테스트할 인쇄회로기판(10)을 통과한 신호전류를 분배하는 다수의 출력측 멀티플렉서모듈(140)과, 이 멀티플렉서모듈(140)의 후단에 접속되며 각각의 신호전류를 복수레벨(멀티채널)의 디지털신호로 변환하여 상기 메인컴퓨터(10)로 전송하는 A/D컨버터(150)로 이루어진 것을 특징으로 하는 인쇄회로기판 테스트장치가 제공된다.The test apparatus includes a main computer 10 in which test software and test data of a printed circuit board are stored, a dimension measuring unit 20 measuring a thickness of a printed circuit board to be tested, a line thickness or a width of a wiring, and the like; And an electrical characteristic measuring unit 30 for measuring electrical characteristics of the printed circuit board to be tested, and the electrical characteristic measuring unit 30 is connected to the main computer 10 through an input / output interface 110. A plurality of input-side multiplexer modules 120 for distributing a test signal current according to the control from 10 and an input side connected to the multiplexer module 120 and corresponding to the test points of the printed circuit board P to be tested A plurality of detection pins 132 protrude from the detection pin fixture 130 and connected to the output side of the detection pin fixture 130 and distributes the signal current passed through the printed circuit board 10 to be tested. A / D connected to the number of output multiplexer module 140 and the rear end of the multiplexer module 140, and converting each signal current into a multi-level (multi-channel) digital signal for transmission to the main computer 10. Provided is a printed circuit board test apparatus comprising a converter 150.

본 발명의 다른 특징에 따르면, 상기 치수측정부(10)는 더블 또는 다층회로기판의 임의의 층간 두께를 측정할 수 있는 레이저빔 방식 두께측정기로 이루어진 것을 특징으로 하는 인쇄회로기판의 테스트장치가 제공된다.According to another feature of the present invention, the dimension measuring unit 10 is provided with a test apparatus for a printed circuit board, characterized in that made of a laser beam type thickness measuring instrument capable of measuring any interlayer thickness of the double or multilayer circuit board. do.

이하에서 도면을 참조하여 본 발명의 바람직한 실시예를 설명한다. 도 1은 본 발명에 따른 테스트장치의 개략적 구성도로서, 도시된 바와 같이, 본 발명에 따르면, 크게 인쇄회로기판 테스트용 소프트웨어가 저장된 메인컴퓨터(10)와, 인쇄회로기판의 두께를 측정하는 두께측정부(20) 및 인쇄회로기판의 전기적특성을 검출하는 전기적특성 측정부(30)로 구성된다.Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention. Figure 1 is a schematic configuration diagram of a test apparatus according to the present invention, as shown, according to the present invention, the thickness for measuring the thickness of the main computer 10 and the printed circuit board is largely stored for the printed circuit board test software The measuring unit 20 and the electrical characteristic measuring unit 30 for detecting the electrical characteristics of the printed circuit board.

상기 두께측정부(20)는 인쇄회로기판의 소정 부위에 대한 절연층의 두께를 측정하기 위한 것으로서, 바람직하게는 다층회로기판에서 임의의 층간의 절연층 두께를 측정할 수 있는 레이저빔 측정기로 구성된다. 이와 같이, 인쇄회로기판의 절연층의 두께를 측정함으로써, 인쇄되어 내장된 캐패시터나 코일의 특성치를 계산해낼 수 있다.The thickness measuring unit 20 is for measuring the thickness of the insulating layer for a predetermined portion of the printed circuit board, preferably composed of a laser beam meter that can measure the thickness of the insulating layer between any layer in the multilayer circuit board. do. In this way, by measuring the thickness of the insulating layer of the printed circuit board, it is possible to calculate the characteristic values of the printed capacitor and the coil.

상기 전기적특성 측정부(30)는 다수의 입출력인터페이스(110)를 통해 메인컴퓨터(10)에 전기적으로 접속되는 다수의 입력측 멀티플렉서모듈(120)이 구비된다.이 입력측 멀티플렉서모듈(120)은 메인컴퓨터(10)의 제어신호에 따라 도시안돤 전원부로부터 공급되는 테스트용 아날로그 신호전류를 테스트프로그램에 의해 미리 정해진 인쇄회로기판의 테스트포인트에 대하여 미리 정해진 순서에 따라 분배하기 위한 것이다. 상기 입력측 멀티플렉서모듈(120)의 후단에는 커넥터케이블을 통해 테스트할 인쇄회로기판(P)이 탑재되는 검출핀 픽스쳐(130)가 접속된다. 이에 따라 인쇄회로기판(P)이 검출핀 픽스쳐(130)에 탑재되면, 인쇄회로기판(P)의 테스트포인트와 검출핀 픽스쳐(130)의 검출핀이 접촉되며, 메인컴퓨터(10)의 제어에 따라 아날로그 신호전류가 인쇄회로기판의 임의 쌍의 테스트포인트 중의 어느 하나에 인가되어 다른 하나로 출력된다.The electrical characteristic measuring unit 30 includes a plurality of input-side multiplexer modules 120 electrically connected to the main computer 10 through a plurality of input / output interfaces 110. The input-side multiplexer module 120 includes a main computer. In accordance with the control signal (10), the test analog signal current supplied from the city power supply unit is distributed in a predetermined order with respect to the test points of the printed circuit board predetermined by the test program. The rear end of the input-side multiplexer module 120 is connected to the detection pin fixture 130 on which the printed circuit board P to be tested is mounted via a connector cable. Accordingly, when the printed circuit board P is mounted on the detection pin fixture 130, the test point of the printed circuit board P and the detection pin of the detection pin fixture 130 come into contact with each other. Accordingly, the analog signal current is applied to any one of the test points of any pair of printed circuit boards and output to the other.

상기 검출핀 픽스쳐(130)의 후단에도 역시 다수의 출력측 멀티플렉서모듈(140)이 전기적으로 접속되며, 이 멀티플렉서모듈(140)의 후단에는 다수의 A/D컨버터(150)가 접속된다. 이 A/D컨버터(150)는 입력멀티플렉서모듈(120)과 검출핀 픽스쳐(130)를 거쳐서 흐르는 아날로그 신호전류를 고분해능의 디지털신호로 변환한다. 바람직한 예로는 신호전류를 65,000 채널의 디지털신호로 변환한다. 이와 같이 디지털신호로 변환된 신호전류는 메인컴퓨터(10)로 입력되어 처리된다. 이러한 본 발명에 따르면, 테스트할 인쇄회로기판을 거친 아날로그 신호전류를 온오프만을 구분하는 이진신호로 처리하지 않고, 세밀한 신호레벨로 구분하여 처리함으로써, 배선패턴의 저항값 등을 정밀하게 측정할 수 있어서, 인쇄회로기판의 품질의 양부나 회로동작에 대한 정확한 측정이 가능하다.A plurality of output side multiplexer modules 140 are also electrically connected to the rear end of the detection pin fixture 130, and a plurality of A / D converters 150 are connected to the rear end of the multiplexer module 140. The A / D converter 150 converts the analog signal current flowing through the input multiplexer module 120 and the detection pin fixture 130 into a high resolution digital signal. As a preferred example, the signal current is converted into a digital signal of 65,000 channels. The signal current converted into the digital signal in this way is input to the main computer 10 for processing. According to the present invention, it is possible to precisely measure the resistance value of the wiring pattern by processing the analog signal current passed through the printed circuit board to be tested as a binary signal for distinguishing ON / OFF, instead of processing it as a fine signal level. Therefore, accurate measurement of the quality of the printed circuit board and the circuit operation is possible.

또한, 전술한 바와 같이 치수측정부(20)를 통해 다층회로기판 임의의 층간두께를 측정함으로써 기판 내의 절연층 또는 유전층의 두께를 알 수 있어서, 검출된 배선의 라인폭 및 라인두께와 함께 소정의 산출공식을 적용함으로써, 내장된 캐패시터의 용량이나 코일의 임피던스 등의 값을 정확하게 산출할 수 있다. 이에 따라 인쇄회로기판의 품질기준에의 적합 여부를 좀 더 정밀하게 측정할 수 있어서, 제품의 품질의 양부의 판단이나 회로동작의 예측을 통해 인쇄회로기판의 품질검사 수준을 높일 수 있다.In addition, as described above, the thickness of the insulating layer or the dielectric layer in the substrate can be obtained by measuring an arbitrary interlayer thickness of the multilayer circuit board through the dimension measuring unit 20, so that the predetermined width together with the line width and line thickness of the detected wiring can be determined. By applying the calculation formula, it is possible to accurately calculate values such as the capacity of the built-in capacitor and the impedance of the coil. As a result, it is possible to more accurately measure whether the printed circuit board meets the quality standards, thereby increasing the quality inspection level of the printed circuit board by determining the quality of the product or predicting the circuit operation.

미설명 번호 180은 RS232 시리얼포트이고, 182는 FDD이고, 184는 프린터이다. 또한, 도면에는 도시되지 않았으나, 본 발명의 테스트장치에는 인쇄회로기판의 로딩장치 및 언로딩장치를 치수측정부(20) 또는 전기적특성 측정부(30)의 전후단에 배치함으로써, 테스트공정을 완전히 전자동화시킬 수 있다. 또한, 바람직하게는 치수측정부(20)는 전기적특성 측정부(30)의 전단에 배치하여, 먼저 인쇄회로기판의 두께 등의 치수를 측정한 후에 전기적 특성을 측정을 측정하는 것이 바람직하지만, 치수측정부(20)와 전기적특성 측정부(30)의 배치 위치는 이에 국한되지 않고 적절히 배치될 수 있다.Unexplained number 180 is the RS232 serial port, 182 is the FDD, and 184 is the printer. In addition, although not shown in the drawing, in the test apparatus of the present invention, the loading and unloading apparatuses of the printed circuit board are disposed at the front and rear ends of the dimension measuring unit 20 or the electrical characteristic measuring unit 30, thereby completely completing the test process. Fully automated. In addition, preferably, the dimension measuring unit 20 is disposed at the front end of the electrical characteristic measuring unit 30, and then, first, the size of the printed circuit board is measured, and then the electrical characteristics are measured. The arrangement position of the measuring unit 20 and the electrical characteristic measuring unit 30 may be appropriately arranged without being limited thereto.

이상에서 설명한 본 발명에 따르면, 인쇄회로기판의 테스트장치에 있어서, 인쇄회로기판의 전기적특성 측정시에, 아날로그 신호전류를 복수의 신호레벨을 가진 고분해능의 A/D컨버터를 통해 디지털신호로 변환하여 처리함으로써, 인쇄회로기판의 단락여부는 물론, 실제의 저항값을 정밀하게 측정할 수 있고, 인쇄회로기판의배선의 폭이나 두께, 또는 더블 또는 다층회로기판의 절연층이나 임의의 층간 두께를 측정함으로써, 미리 저장된 재료의 유전율 등의 물리적 특성치와 함께 소정의 공식으로 내장된 코일이나 캐패시터의 임피던스값을 산출할 수 있기 때문에, 정확한 인쇄회로기판의 정확한 품질검사가 가능해지고, 이러한 검사과정을 메인컴퓨터(10)를 통해 전반적으로 제어할 수 있어서, 고속으로 대량의 품질검사가 가능하게 된다.According to the present invention described above, in the test apparatus of a printed circuit board, when measuring the electrical characteristics of the printed circuit board, the analog signal current is converted into a digital signal through a high-resolution A / D converter having a plurality of signal levels By processing, the actual resistance value as well as the short circuit of the printed circuit board can be precisely measured, and the width or thickness of the wiring of the printed circuit board, or the insulating layer or arbitrary interlayer thickness of the double or multilayer circuit board is measured. By doing so, it is possible to calculate the impedance value of the coil or capacitor embedded in the predetermined formula together with the physical characteristic values such as the dielectric constant of the pre-stored material, so that accurate quality inspection of the printed circuit board is possible, and this inspection process is performed by the main computer. Overall control is possible through (10), so that a large amount of quality inspection can be performed at high speed.

Claims (2)

순차공급되는 인쇄회로기판의 단락여부와 저항값 및 임피던스값를 측정하는 테스트장치에 있어서,In the test apparatus for measuring whether the short circuit of the sequentially supplied printed circuit board, the resistance value and the impedance value, 상기 테스트장치는 인쇄회로기판의 테스트용 소프트웨어와 테스트용 데이터가 저장된 메인컴퓨터(10)와, 테스트할 인쇄회로기판의 두께나 배선의 라인두께 또는 폭 등을 측정하는 치수측정부(20)와, 테스트할 인쇄회로기판의 전기적특성을 측정하는 전기적특성 측정부(30)로 이루어지고, 상기 전기적특성 측정부(30)는 입출력인터페이스(110)를 통해 상기 메인컴퓨터(10)에 연결되며 이 메인컴퓨터(10)로부터의 제어에 따라 테스트용 신호전류를 분배하는 다수의 입력측 멀티플렉서모듈(120)과, 입력측이 상기 멀티플렉서모듈(120)에 접속되며 테스트할 인쇄회로기판(P)의 테스트포인트에 대응하여 다수의 검출핀(132)이 돌출형성된 검출핀 픽스쳐(130)와, 상기 검출핀 픽스쳐(130)의 출력측에 접속되며 테스트할 인쇄회로기판(10)을 통과한 신호전류를 분배하는 다수의 출력측 멀티플렉서모듈(140)과, 이 멀티플렉서모듈(140)의 후단에 접속되며 각각의 신호전류를 복수레벨의 멀티채널 디지털신호로 변환하여 상기 메인컴퓨터(10)로 전송하는 A/D컨버터(150)로 이루어진 것을 특징으로 하는 인쇄회로기판의 테스트장치.The test apparatus includes a main computer 10 in which test software and test data of a printed circuit board are stored, a dimension measuring unit 20 measuring a thickness of a printed circuit board to be tested, a line thickness or a width of a wiring, and the like; And an electrical characteristic measuring unit 30 for measuring electrical characteristics of the printed circuit board to be tested, and the electrical characteristic measuring unit 30 is connected to the main computer 10 through an input / output interface 110. A plurality of input-side multiplexer modules 120 for distributing a test signal current according to the control from 10 and an input side connected to the multiplexer module 120 and corresponding to the test points of the printed circuit board P to be tested A plurality of detection pins 132 protrude from the detection pin fixture 130 and connected to the output side of the detection pin fixture 130 and distributes the signal current passed through the printed circuit board 10 to be tested. An A / D converter connected to a number of output-side multiplexer modules 140 and a rear end of the multiplexer module 140, which converts each signal current into a multi-channel digital signal of multiple levels and transmits them to the main computer 10. Test device for a printed circuit board, characterized in that consisting of 150). 제 1 항에 있어서, 상기 치수측정부(10)는 더블 또는 다층회로기판의 임의의층간 두께를 측정할 수 있는 레이저빔 방식 두께측정기로 이루어진 것을 특징으로 하는 인쇄회로기판의 테스트장치.The apparatus of claim 1, wherein the dimension measuring unit (10) comprises a laser beam type thickness measuring instrument capable of measuring an arbitrary interlayer thickness of a double or multilayer circuit board.
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KR100732776B1 (en) * 2004-04-20 2007-06-28 박진홍 Experiment device for designing of PCB
KR100769537B1 (en) * 2005-05-18 2007-10-23 인더스트리얼 테크놀로지 리서치 인스티튜트 Apparatus and method for testing component built in circuit board
KR101448558B1 (en) * 2012-08-28 2014-10-13 프롬써어티 주식회사 Apparatus for testing of PCB

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KR960016655A (en) * 1994-10-31 1996-05-22 김광호 Inspection regulator of image signal output of printed circuit board for image signal and detection adjustment method thereby
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950013332A (en) * 1993-10-20 1995-05-17 배순훈 Automatic jig for mass production inspection of printed circuit board (PCB) using microcomputer
KR960016655A (en) * 1994-10-31 1996-05-22 김광호 Inspection regulator of image signal output of printed circuit board for image signal and detection adjustment method thereby
KR970032303A (en) * 1995-11-03 1997-06-26 김광호 Printed Circuit Board for Known Good Die with Pogo Pins
KR970064331A (en) * 1996-02-29 1997-09-12 배순훈 Method and apparatus for aging inspection of printed circuit board
JPH11150352A (en) * 1997-11-14 1999-06-02 Hitachi Telecom Technol Ltd Printed wiring board checking equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100732776B1 (en) * 2004-04-20 2007-06-28 박진홍 Experiment device for designing of PCB
KR100769537B1 (en) * 2005-05-18 2007-10-23 인더스트리얼 테크놀로지 리서치 인스티튜트 Apparatus and method for testing component built in circuit board
KR101448558B1 (en) * 2012-08-28 2014-10-13 프롬써어티 주식회사 Apparatus for testing of PCB

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