KR20040019579A - structure and manufacturing methode of photo sensor for infrared remote controller - Google Patents

Abstract

PURPOSE: A sensor for receiving light of an infrared remote controller is provided to install a photo diode and an amplifying IC on a minimal space without using a shield case, and to sufficiently cut off light irradiated on the amplifying IC, thereby miniaturizing size of the sensor and preventing noise from passing into the amplifying IC. CONSTITUTION: A substrate(10) forms circuit patterns on both sides thereof. An amplifying IC(30) is made by cutting a wafer, which is formed with signal in/out, ground, BPF, and Vcc electrodes on one side of each electrode unit by using bump bonders, with a sawing machine. Each electrode of the amplifying IC(30) is bonded on the substrate(10). The amplifying IC(30) amplifies a signal transmitted from a photo diode(20). The photo diode(20) is adhered by a nonconductive adhesive in order to cover a surface of the amplifying IC(30), receives light irradiated from a remote controller, and converts the light into an electrical signal. Each electrode of the photo diode(20) is wire-bonded on the substrate(10). A lens(40) induces the light irradiated from the remote controller to a light receiving surface of the photo diode(20).

Description

Infrared remote control light-receiving sensor and its manufacturing method {structure and manufacturing methode of photo sensor for infrared remote controller}

The present invention relates to an infrared remote control light-receiving sensor, and more particularly to bump in / out, ground, power, and filters (signal in / out, ground, BPF, Vcc electrodes) of an amplification IC for a remote control in a bare chip state. The present invention relates to an infrared remote control light receiving sensor which cuts bump-bonded bare chips and directly bonds them to a printed circuit board by flip-chip bonding.

In addition, the present invention protects the surface of the amplification IC from external light by photodiode by bonding the photodiode with a non-conductive adhesive to the surface facing the lens of the amplification IC and wire-bonding the anode and cathode electrodes of the photodiode to the pattern on the substrate. The present invention relates to an infrared remote control light receiving sensor which can prevent malfunction by blocking noise.

Moreover, the structure as described above can reduce the overall size by eliminating the case for protecting the amplifier from disturbance light, and prevent damage to the amplifier or photodiode due to the pressure applied during assembly of the case. The present invention relates to an infrared remote control light receiving sensor and a method of manufacturing the same.

As a means for operating an electronic device or equipment, an operation panel or a wireless remote controller (also referred to as a remote controller, hereinafter referred to as a remote controller) provided in the equipment itself is used.

Among such operation means, the electronic device using the remote control is provided with a light receiving sensor for detecting the infrared light received from the remote control, which is configured as shown in Figs. 3a and 3b.

That is, the photodiode 2 and the amplifying IC 3 are arranged on the surface on which the circuit pattern of the substrate (printed circuit board or lead frame) is formed and connected by conductive wires. In addition, the lens 4 is installed on the light receiving surface of the photodiode 2 so that the infrared rays irradiated from the remote control can be detected better.

In the infrared remote control light receiving sensor configured as described above, when light is irradiated on the surface of the amplifying IC 3, noise is generated in the amplifying IC 3 and malfunctions. A hole through which the lens 4 can pass is formed in 5) so that light is incident only on the light receiving surface of the photodiode 2.

However, the conventional infrared remote control light-receiving sensor configured as described above should limit the size of the lens 4 and reduce the size of the lens 4 to prevent light from being incident on the amplifying IC 3 like electricity. There is a problem that the remote control does not operate over a certain distance because the infrared signal emitted from the remote control, that is, the area for receiving light is reduced, and if the size of the lens 4 is increased, the amplification IC 3 should be separated from the lens. As a result, the overall size was a problem.

In addition, as described above, the conventional infrared remote control light-receiving sensor requires a shield case for preventing light from being irradiated to the amplification IC 3, and thus, a process for installing the shield case in a manufacturing process is further required, There was a problem in that the pressure is applied to the built-in parts in the process of folding the end of the shield case during the installation process damage the built-in parts to reduce the yield.

Therefore, to solve the conventional problems as described above of the present invention, it is easy to manufacture by configuring the infrared remote control light receiving sensor so as not to use the shield case to prevent the irradiation of light to the amplifier IC. It is an object of the present invention to provide an infrared remote control light receiving sensor that is inexpensive and can block noise.

1A is a longitudinal sectional view of a first embodiment of an infrared remote control light receiving sensor according to the present invention;

1B is a cross-sectional view of a first embodiment of an infrared remote control light receiving sensor according to the present invention;

2A is a longitudinal sectional view of a second embodiment of an infrared remote control light receiving sensor according to the present invention;

2B is a cross-sectional view of a second embodiment of an infrared remote control light receiving sensor according to the present invention;

Figure 3a is a longitudinal sectional view of a conventional infrared remote control light receiving sensor,

Figure 3b is a cross-sectional view of a conventional infrared remote control light receiving sensor,

* Description of the symbols for the main parts of the drawings *

10: substrate 20: photodiode

30 amplifier 31 flip-chip bonding unit

40 lens

An object of the present invention is a substrate with a circuit pattern formed on both sides; A signal is formed by cutting a wafer in which each electrode is formed by a sawing machine using a bump bonder at each electrode portion of a bare chip having an amplification circuit, and bonding each electrode on a substrate, and transmitting a signal from a photodiode. An amplification IC to amplify the signal; A photodiode bonded by a nonconductive adhesive to cover the surface of the amplifying IC, each electrode bonded to the substrate, and receiving a light emitted from a remote controller and converting the light into an electrical signal; It is made by an infrared remote control light receiving sensor consisting of a lens for guiding the light emitted from the remote control to the light receiving surface of the photodiode.

It is also an object of the present invention to flip-chip bond each electrode of the amplification IC to each connection terminal of a circuit pattern formed on a substrate, and the lens is molded with plastic epoxy, but molding the whole to protect the components and the lens portion By forming the bay convexly, the effect can be enhanced.

When described in detail with reference to the accompanying drawings an embodiment of the infrared remote control light-receiving sensor according to the present invention as follows.

Figure 1a is a longitudinal cross-sectional view of a first embodiment of the infrared remote control light receiving sensor according to the present invention, Figure 1b is a cross-sectional view of a first embodiment of the infrared remote control light receiving sensor according to the present invention, Figure 2a is an infrared remote control light receiving sensor according to the present invention 2B is a cross-sectional view of a second embodiment of an infrared remote control light receiving sensor according to the present invention.

As shown, the infrared remote control light receiving sensor according to the present invention includes an amplification IC 30 whose surface is covered by the photodiode 20.

The amplification IC 30 is formed by forming an electrode using a bump bonder on one surface of a bare-chip waver configured with an amplifying circuit and cutting it to a predetermined size using a sawing machine.

Each electrode of the amplifier IC 30 is bonded to a terminal of a circuit pattern formed on the substrate 10, respectively.

Flip-chip bonding is used as a method of bonding the amplification IC 30 to the substrate 10.

The photodiode 20 is provided on the surface of the amplifier IC 30, that is, the surface opposite to the surface facing the substrate 10.

The photodiode 20 is a device that senses light and converts it into an electrical signal. The light-receiving surface is installed to face the opposite side of the amplifying IC 30, and a non-conductive adhesive is formed between the amplifying IC 30. It is insulated by and serves as a light shielding film to block light from being irradiated to the surface of the amplifier IC 30.

Since each electrode of the photodiode 20 is spaced apart from the substrate 10, a wire bonding method using a conductive wire is used to connect each electrode to a terminal having a pattern formed on the substrate 10.

Molding is formed to surround the substrate 10, the photodiode 20, and the amplification IC 30. This molding is integrally formed with the lens 40.

That is, while molding, the portion where the light receiving surface of the photodiode 20, which is the portion where the lens 40 is to be formed, is projected in a hemispherical shape so that light emitted from the outside can be easily incident on the light receiving surface. .

As the material of the molding, a resin of a material having a property capable of condensing only infrared rays of a constant wavelength emitted from the remote control may be used, and preferably an epoxy resin may be used.

The substrate 10 is a printed circuit board or lead frame.

Hereinafter, the manufacturing process of the infrared remote control light receiving sensor configured as described above is as follows.

① First, prepare each component. In this step, each component including an amplifier IC 30, a substrate 10, and a photodiode 20 is prepared.

증폭 The amplification IC 30 constituting the infrared remote control light receiving sensor according to the present invention forms an electrode using a bump bonder at each electrode portion of a bare-chip wafer having an amplification circuit, which is then used as a sowing machine. Made by cutting.

기판 The substrate 10 is a substrate having a structure and a pattern similar to that of a general substrate constituting an infrared remote control light receiving sensor, and a terminal and a photodiode 20 to which each electrode of a bare chip-shaped amplifier IC 30 is connected. Terminals to which the electrodes are connected are formed, respectively.

② The prepared amplification IC 30 is installed on the substrate 10 to be electrically connected, but is connected by using a flip-chip bonding method. The condition at this time is 1 to 2 seconds at a temperature of 100 to 150 ° C.

(3) After applying a non-conductive adhesive to the surface of the amplification IC (30) installed on the substrate 10 as described above, put the adhesive on the back of the photodiode (20) in the state to be interviewed and put the adhesive Harden.

(4) When the adhesive is hardened and the photodiode 20 is fixed to the surface of the amplifying IC 30, each electrode of the photodiode 20 is bonded to each connection terminal on the substrate 10.

In this case, since the electrodes of the photodiode 20 face away from the substrate 10, it is preferable to wire bond using a conductive wire.

⑤ When each component is disposed on the substrate 10 as described above, the components are molded to protect each component from external impact.

At this time, the molding material uses an opaque material epoxy resin, and molding to surround the whole, but the lens 40 is formed by convexly protruding protruding to the light-receiving surface of the photodiode 20 facing.

Reference numeral 10a denotes terminals for connecting the infrared remote control light-receiving sensor of the present invention to the circuit of the electronic device, and 31 denotes a bonding portion that is integrated with the connection terminal portion among the patterns formed on the substrate.

The infrared remote control light receiving sensor according to the present invention as described above has an effect of miniaturizing the size of the conventional infrared remote control light receiving sensor by installing a photodiode and an amplifier IC in a minimum space without using a shield case.

In addition, as described above, by simplifying the components and the manufacturing process, it is possible to reduce the manufacturing cost has the effect of providing a low-cost product.

In addition, since the light irradiated to the amplification IC can be sufficiently blocked, noise does not penetrate the amplification IC, thereby improving the characteristics of the product.

In addition, by increasing the size of the lens for collecting the infrared signal emitted from the remote control can improve the light receiving range, that is, the distance and angle characteristics.

In addition, the structure of the infrared remote control light receiving sensor of the present invention can improve the productivity by enabling chip-mounted and automated work when installed in the electronic device, the shield case is not used is generated during the casing (casing) work Chip cracks, lead bents, and solder defects can be reduced.

Claims (5)

A substrate 10 having circuit patterns formed on both surfaces thereof; It is made by cutting a wafer with signal input / output, ground, power, and filter (Signal In / Out, Ground, BPF, Vcc electrodes) on the one surface using bump bonder at each electrode part of the bare chip with a sawing machine. An amplifying IC 30 bonded to each electrode on the substrate 10 and amplifying a signal transmitted from the photodiode 20; The photodiode 20 is bonded by a non-conductive adhesive to cover the surface of the amplification IC 30, each electrode is wire-bonded to the substrate 10, and receives the light irradiated from the remote control to convert the photodiode 20 into an electrical signal And; Infrared remote control light receiving sensor, characterized in that made of a lens (40) for guiding the light emitted from the remote control to the light receiving surface of the photodiode (20). A substrate 10 on which the conductor circuit pattern is formed; An amplifying IC 30 for amplifying a signal transmitted from the photodiode 20 as a bare chip; A photodiode 20 for receiving the light emitted from the remote controller and converting the light into an electrical signal; In the method for manufacturing an infrared remote control light receiving sensor comprising a lens 40 for inducing light emitted from the remote control to the light receiving surface of the photodiode 20, Forming each electrode using a bump bonder on a bare chip wafer having an amplification circuit and sawing the same to manufacture an amplification IC 30, and forming circuit patterns on both sides of the substrate 10; ; Bonding each electrode of the amplifier IC 30 to a connection terminal of a circuit pattern formed on the substrate 10; Bonding a photodiode 20 to the surface of the amplification IC 30 bonded to the substrate 10 and connecting each electrode of the photodiode to each connection terminal of a circuit pattern formed on the substrate 10; Molding the circuit configured in the above step, but forming a convex lens (40) in a portion where the light receiving surface of the photodiode is in contact with the infrared remote control light receiving sensor manufacturing method. The method of claim 1 or 2, wherein each electrode of the amplifying IC (30) is characterized in that the flip-chip bonding method is used as a method of bonding to each connection terminal of the circuit pattern formed on the substrate 10, respectively. Infrared remote control light receiving sensor and its manufacturing method. The infrared remote control light receiving sensor according to claim 1 or 2, wherein the lens (40) is an epoxy resin. The infrared remote control light receiving sensor according to claim 1 or 2, wherein an end portion of the lens 40 facing the light receiving surface of the photodiode 20 is formed in a hemispherical shape and extends from the hemispherical part in a semicircular rod shape. .