KR20040019534A - Belt Transferring Sprocket Wheel and Semiconductor Tin Plating System Having The Same - Google Patents
Belt Transferring Sprocket Wheel and Semiconductor Tin Plating System Having The Same Download PDFInfo
- Publication number
- KR20040019534A KR20040019534A KR1020020051107A KR20020051107A KR20040019534A KR 20040019534 A KR20040019534 A KR 20040019534A KR 1020020051107 A KR1020020051107 A KR 1020020051107A KR 20020051107 A KR20020051107 A KR 20020051107A KR 20040019534 A KR20040019534 A KR 20040019534A
- Authority
- KR
- South Korea
- Prior art keywords
- sprocket wheel
- cover
- nut
- groove
- lower cover
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 238000007747 plating Methods 0.000 title claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 9
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000004809 Teflon Substances 0.000 abstract description 4
- 229920006362 Teflon® Polymers 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 15
- 238000000465 moulding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G23/00—Driving gear for endless conveyors; Belt- or chain-tensioning arrangements
- B65G23/02—Belt- or chain-engaging elements
- B65G23/04—Drums, rollers, or wheels
- B65G23/06—Drums, rollers, or wheels with projections engaging abutments on belts or chains, e.g. sprocket wheels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
- F16B5/02—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of fastening members using screw-thread
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2812/00—Indexing codes relating to the kind or type of conveyors
- B65G2812/02—Belt or chain conveyors
- B65G2812/02128—Belt conveyors
- B65G2812/02138—Common features for belt conveyors
- B65G2812/02148—Driving means for the belts
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
본 발명은 스프로켓 휠(Sprocket Wheel)에 관한 것으로 보다 상세하게 설명하면 반도체 주석 도금 설비에서 벨트의 이송시 가이드 역할을 하는 스프로켓 휠에 관한 것이다.The present invention relates to a sprocket wheel, and more particularly, to a sprocket wheel that serves as a guide when transferring a belt in a semiconductor tin plating facility.
반도체 칩 패키지의 제작공정은 크게 웨이퍼(Wafer) 상에서 분리된 개별 칩을 리드 프레임에 실장하는 칩 접착(Chip Attach)공정, 칩과 리드 프레임의 내부 리드를 전기적으로 연결하는 와이어 본딩(Wire Bonding) 공정 및 본딩 와이어 및 내부 리드를 외부의 환경으로 부터 보호하기 위해 액상의 성형수지로 봉지하는 성형(Molding) 공정으로 구성되며, 공정의 순서는 칩 접착 공정, 와이어 본딩 공정, 성형 공정의 순서로 진행된다.The manufacturing process of the semiconductor chip package is largely a chip attach process in which individual chips separated on a wafer are mounted on a lead frame, and a wire bonding process of electrically connecting a chip and an internal lead of the lead frame. And a molding process of encapsulating the bonding wire and the inner lead with a liquid molding resin in order to protect the external lead from the external environment, and the process is performed in the order of a chip bonding process, a wire bonding process, and a molding process. .
성형 공정이 완료된 리드 프레임 표면에는 성형 수지의 찌꺼기 및 먼지등과 같은 불순물(Flash)이 존재하며 이를 제거하기 위하여, 디프레쉬(Deflash) 공정이란 세정 공정이 진행되고난 후, 패키지 몸체의 외측에 돌출된 리드를 도금하는 공정이 진행되며, 통상적으로 디프레쉬 공정과 도금 공정은 주석 도금 설비에서 진행된다.On the surface of the lead frame where the molding process is completed, impurities such as residues and dust of molding resin exist, and to remove them, the deflash process is protruded on the outside of the package body after the cleaning process is performed. The process of plating the prepared lead is performed, and typically, the defresh process and the plating process are performed in a tin plating facility.
일반적으로, 제조된 반도체 칩 패키지의 외부리드는 납땜 접속에 필요한 납 접속 신뢰성(Solderability)을 확보하기 위해 주석-납(Sn-Pb)을 이용한 전해 도금 방법으로 표면처리를 하게된다. 이러한 공정은 벨트에 리드 프레임이 장착된 상태에서 벨트가 체결된 터닝 휠의 회전에 의해 이동하며 진행된다.In general, the outer lead of the manufactured semiconductor chip package is subjected to surface treatment by an electroplating method using tin-lead (Sn-Pb) in order to secure solderability required for solder connection. This process is carried out by the rotation of the turning wheel to which the belt is fastened while the lead frame is mounted on the belt.
도 1a는 종래 스프로켓 휠(201)의 사시도이고, 도 1b는 종래 스프로켓 휠(201)의 측 단면도이다. 커버(202)에는 샤프트 홀(102)이 구비된 부싱(Bushing, 204)이 결합되는데, 부싱(204)은 샤프트(도시안됨)와 스프로켓 휠(201) 사이의 마찰을 줄이는 기능을 수행한다. 스프로켓 휠(201)은 바디(203)의 상부와 하부에 커버(202)가 부착되고, 상부 및 하부 커버(202)와 바디(203)의 연결 부위에 핀(211)이 결합된다. 핀(211)에는 홈(230)이 구비되어 핀(211)을 교체할때에는 커버(202)와 바디(203)를 분리하여야 한다. 커버(202)와 바디(203)는 탭가공되어 있어 볼트(101)에 의해서 결합된다.1A is a perspective view of a conventional sprocket wheel 201, and FIG. 1B is a side cross-sectional view of a conventional sprocket wheel 201. FIG. The cover 202 is coupled with a bushing 204 with a shaft hole 102, which serves to reduce friction between the shaft (not shown) and the sprocket wheel 201. Sprocket wheel 201 is a cover 202 is attached to the upper and lower parts of the body 203, the pin 211 is coupled to the connection portion of the upper and lower cover 202 and the body 203. The pin 211 is provided with a groove 230 to replace the cover 202 and the body 203 when replacing the pin 211. The cover 202 and the body 203 are tabbed and joined by bolts 101.
운전중 핀(211)이 마모되거나 주석 도금 설비의 정비시에 스프로켓 휠(201)을 분해하여야 하는데, 통상 스프로켓 휠(201)은 태프론과 같은 합성수지로 제작되어 잦은 분해/결합으로 인한 나사선이 마모되어 분해/결합에 어려움이 있으며, 또한 분해/결합에 많은 시간을 요하였다. 또한 태프론 표면에 직접 나사선을 가공하였으므로 나사선이 쉽게 마모되어 내구성이 떨어지고, 나사선이 마모된 스프로켓휠(201)은 교체하여야 하므로 비 경제적이었다.During operation, the pin 211 is worn out or the sprocket wheel 201 must be disassembled during the maintenance of the tin plating facility. The sprocket wheel 201 is usually made of synthetic resin such as teflon, which causes wear and tear of threads due to frequent disassembly / combination. As a result, it is difficult to decompose / bond, and also requires a lot of time to decompose / bond. In addition, since the thread is directly processed on the surface of the teflon, the thread is easily worn and the durability is reduced, and the sprocket wheel 201 with the thread worn is uneconomical.
따라서 본 발명은 스프로켓 휠의 분해/결합을 용이하고 신속하게 하고, 동일한 태프론 재질로 스프로켓 휠을 제작하여도 보다 내구성이 강하도록 하여 장시간 스프로켓 휠을 사용할 수 있도록 하여 비용을 절감함에 그 목적이 있다.Therefore, the present invention has an object of easy and quick disassembly / coupling of the sprocket wheel, and to make the sprocket wheel made of the same teflon material to be more durable so that the sprocket wheel can be used for a long time to reduce costs. .
도 1a는 종래 스프로켓 휠의 사시도이고,Figure 1a is a perspective view of a conventional sprocket wheel,
도 1b는 종래 스프로켓 휠의 측 단면도이고,Figure 1b is a side cross-sectional view of a conventional sprocket wheel,
도 2는 스프로켓 휠의 동작예를 도시한 측면도이고,2 is a side view showing an example of the operation of the sprocket wheel,
도 3a는 본 발명에 의한 스프로켓 휠의 사시도이고,3a is a perspective view of a sprocket wheel according to the invention,
도 3b는 본 발명에 의한 스프로켓 휠의 측 단면도이고,Figure 3b is a side cross-sectional view of the sprocket wheel according to the present invention,
도 3c는 본 발명에 의한 스프로켓 휠의 저면도이다.3c is a bottom view of the sprocket wheel according to the invention.
※ 도면의 주요 부분에 대한 간단한 설명 ※※ Brief description of the main parts of the drawing ※
101: 볼트 102: 샤프트 홀101: bolt 102: shaft hole
201: 스프로켓 휠 202: 커버201: Sprocket Wheel 202: Cover
203: 바디 204: 부싱203: body 204: bushing
205: 샤프트 206: 벨트205: shaft 206: belt
207: 프레셔 롤러 208: 오링207: pressure roller 208: O-ring
209: 핑거 210: 리드 프레임209: finger 210: lead frame
211: 핀 310: 홀211: pin 310: hole
301: 볼트 302: 너트301: bolt 302: nut
311: 볼트 머리 홈 312: 너트 홈311: bolt head groove 312: nut groove
이러한 목적을 달성하기 위한 본 발명에 의한 스프로켓 휠은, 원통형 바디와, 바디의 상부와 하부를 덮는 상부 커버 및 하부 커버, 및 바디와 상부 커버 및 하부 커버의 결합부위에서 상기 원통형 바디의 측면을 따라 구비된 홈에 결합된 핀을 포함하고, 상부 커버와 상기 바디와 상기 하부 커버를 관통하는 홀이 구비되고 홀의 양단인 상부 커버에는 볼트 머리 홈이 형성되고 하부 커버에는 너트 홈이 형성되어 상부 커버, 바디 및 하부 커버는 볼트와 너트에 의해 체결된 것을 특징으로 한다.Sprocket wheel according to the present invention for achieving this object, along the side of the cylindrical body, the upper cover and the lower cover covering the upper and lower parts of the body, and the coupling portion of the body and the upper cover and the lower cover A pin coupled to the provided groove, the upper cover and a hole passing through the body and the lower cover are provided, and an upper cover formed at both ends of the hole is formed with a bolt head groove, and a lower groove is formed with a nut groove at the upper cover, The body and the lower cover are fastened by bolts and nuts.
또한 본 발명에 의한 반도체 주석 도금 설비는 본 발명에 의한 스프로켓 휠을 장착한다.In addition, the semiconductor tin plating facility according to the present invention is equipped with the sprocket wheel according to the present invention.
이하, 도면을 중심으로 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the drawings.
도 2는 스프로켓 휠(201)의 동작예를 도시한 측면도이다. 주석 도금 설비에서 리드 프레임(210)은 핑거(209)에 의해 벨트(206)에 고정되어 이송된다. 스프로켓 휠(201)은 핀(211)이 결합되어 벨트(206)의 홈(도시안됨)에 삽입되어, 벨트(206)의 진행시 벨트(206)를 가이드한다.2 is a side view illustrating an operation example of the sprocket wheel 201. In the tin plating facility, the lead frame 210 is fixedly conveyed to the belt 206 by fingers 209. Sprocket wheel 201 is coupled to the pin (211) is inserted into the groove (not shown) of the belt 206, to guide the belt 206 as the belt 206 proceeds.
스프로켓 휠(201)의 커버(202)에는 부싱(204)이 삽입되어 샤프트(205)와의 마찰을 완화시킨다. 샤프트(205)는 회전하는 것이 아니고 고정되어 있으며 단지 스프로켓 휠(201)을 지지할뿐이다. 즉 벨트의 진행은 스프로켓 휠(201)에 의한 것이 아니고 주석 도금 설비의 터닝 휠(도시안됨)에 의한것이고 스프로켓 휠(201)은 단지 벨트의 진행을 가이드 한다.A bushing 204 is inserted into the cover 202 of the sprocket wheel 201 to mitigate friction with the shaft 205. The shaft 205 is not rotating but fixed and merely supports the sprocket wheel 201. That is, the progress of the belt is not by the sprocket wheel 201 but by the turning wheel (not shown) of the tin plating facility and the sprocket wheel 201 merely guides the progress of the belt.
프레셔 롤러(Pressure Roller, 207)에는 고무재질의 오링(O-ring)이 결합되어 있으며, 벨트(206)를 스프로켓 휠(201) 방향으로 밀착시켜 벨트(206)의 홀(도시안됨)에 스프로켓 휠(201)의 핀(211)이 삽입될 수 있도록 한다.The O-ring made of rubber material is coupled to the pressure roller 207, and the belt 206 is brought into close contact with the sprocket wheel 201 in the direction of the sprocket wheel 201 to the hole (not shown) of the belt 206. The pin 211 of the 201 can be inserted.
도 3a, 3b 및 3c는 각각 본 발명에 의한 스프로켓 휠(201)의 사시도, 측 단면도 및 저면도이다.3A, 3B and 3C are a perspective view, a side sectional view and a bottom view, respectively, of a sprocket wheel 201 according to the present invention.
원통형 바디(203)의 상부와 하부에 커버(202)가 연결되는데 상부와 하부에 위치한 커버(202)와 바디(203)에는 이들을 관통하는 홀(310)이 구비되는데, 이 홀(310)은 탭가공이 되어 있지 않다.The cover 202 is connected to the upper and lower portions of the cylindrical body 203, and the cover 202 and the body 203 located at the upper and lower portions are provided with holes 310 penetrating them, which are tabs. It is not processed.
또한 홀의 양 단부인 볼트 머리 홈(311)과 너트 홈(312)은 각각 바디(203) 상부의 커버(202a)와 바디(203) 하부의 커버(202b)에 형성되는데, 볼트 머리 홈(311)과 너트 홈(312)의 모양은 도 3a와 도 3c에서 볼 수 있는 바와 같이, 서로상이하다. 즉 볼트 머리 홈(311)은 볼트(301)의 머리가 회전 할 수 있도록 원형으로 형성된 반면, 너트 홈(312)의 모양은 다각형으로 형성되어 다각형의 너트(302)가 너트 홈(312)에 고정되어 회전할 수 없도록 하기 위함이다.In addition, the bolt head grooves 311 and the nut grooves 312, which are both ends of the hole, are formed in the cover 202a of the upper portion of the body 203 and the cover 202b of the lower portion of the body 203, respectively. The shape of the and nut grooves 312 are different from each other, as can be seen in FIGS. 3A and 3C. That is, while the bolt head groove 311 is formed in a circular shape so that the head of the bolt 301 can rotate, the shape of the nut groove 312 is formed in a polygonal shape so that the nut 302 of the polygon is fixed to the nut groove 312 This is to prevent the rotation.
볼트(301)에는 너트(302)와 결합 부위에만 나사선이 구비되어 있다.The bolt 301 is provided with a thread only at the engagement portion with the nut 302.
이렇게 결합된 바디(203)와 상부 및 하부 커버(202a, 202b)는 그 결합이 금속 재질의 볼트(301)과 너트(302)의 결합에 의존하므로, 수회 분리/결합을 수행하여도 나사선이 마모가 현저히 덜하며 따라서 분리/결합이 용이하다. 또한 나사선이 마모된 경우에도 너트(302)의 교체만을 요하므로 스프로켓 휠(201) 전체를 교체할 필요가 없게 된다.Since the body 203 and the upper and lower covers 202a and 202b thus joined are dependent on the coupling of the bolt 301 and the nut 302 made of metal, the thread is worn even after several times of separation / combination. Is significantly less and thus easier to separate / combine. In addition, even when the thread is worn, it is not necessary to replace the entire sprocket wheel 201 because only the nut 302 needs to be replaced.
한편, 본 명세서와 도면에 개시된 발명의 실시예는 이해를 돕기 위해 특정 예를 예시한 것에 지나지 않으며, 본 발명의 범위를 한정하고자 하는 것이 아니다. 여기에 개시된 실시예 이외에도 본 발명의 기술적 사상에 바탕을 둔 다른 변화예들이 실시 가능하다는 것은, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 자명한 것이다. 또한 본 발명은 주석 도금 설비에 한정하였으나, 벨트와 스프로켓 휠을 장착한 다른 설비에 적용 가능함은 당연하다.On the other hand, the embodiments of the invention disclosed in the specification and drawings are merely illustrative of specific examples for the purpose of understanding and are not intended to limit the scope of the invention. It is apparent to those skilled in the art that other variations based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein. In addition, the present invention is limited to the tin plating equipment, it is obvious that it is applicable to other equipment equipped with a belt and a sprocket wheel.
본 발명에 의한 스프로켓 휠은 분해/결합이 용이하여 분해/결합에 요하는 시간을 단축시키고, 내구성이 강하므로 스프로켓 휠의 교체 주기를 증가시켜 경제성이 증가하는 효과가 있다.The sprocket wheel according to the present invention has an effect of increasing economical efficiency by increasing the replacement cycle of the sprocket wheel because the sprocket wheel is easy to disassemble / join to shorten the time required for disassembly / coupling and the durability is strong.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020051107A KR20040019534A (en) | 2002-08-28 | 2002-08-28 | Belt Transferring Sprocket Wheel and Semiconductor Tin Plating System Having The Same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020051107A KR20040019534A (en) | 2002-08-28 | 2002-08-28 | Belt Transferring Sprocket Wheel and Semiconductor Tin Plating System Having The Same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040019534A true KR20040019534A (en) | 2004-03-06 |
Family
ID=37324318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020051107A KR20040019534A (en) | 2002-08-28 | 2002-08-28 | Belt Transferring Sprocket Wheel and Semiconductor Tin Plating System Having The Same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20040019534A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102502168A (en) * | 2011-10-14 | 2012-06-20 | 安徽佰瑞特日用品有限公司 | Transmission device for testing heat-insulating property of heat-insulating bottle liner |
| CN102963681A (en) * | 2012-12-10 | 2013-03-13 | 淮北重科矿山机器有限公司 | Combined type chain wheel head wheel set |
| CN105083868A (en) * | 2014-05-21 | 2015-11-25 | 中煤张家口煤矿机械有限责任公司 | Assembled type chain wheel of scraper conveyer for coal mine and manufacturing technology of assembled type chain wheel |
-
2002
- 2002-08-28 KR KR1020020051107A patent/KR20040019534A/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102502168A (en) * | 2011-10-14 | 2012-06-20 | 安徽佰瑞特日用品有限公司 | Transmission device for testing heat-insulating property of heat-insulating bottle liner |
| CN102502168B (en) * | 2011-10-14 | 2013-12-11 | 孟钧 | Transmission device for testing heat-insulating property of heat-insulating bottle liner |
| CN102963681A (en) * | 2012-12-10 | 2013-03-13 | 淮北重科矿山机器有限公司 | Combined type chain wheel head wheel set |
| CN105083868A (en) * | 2014-05-21 | 2015-11-25 | 中煤张家口煤矿机械有限责任公司 | Assembled type chain wheel of scraper conveyer for coal mine and manufacturing technology of assembled type chain wheel |
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