KR20040008833A - Structure of heat sink - Google Patents

Structure of heat sink Download PDF

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Publication number
KR20040008833A
KR20040008833A KR1020020042552A KR20020042552A KR20040008833A KR 20040008833 A KR20040008833 A KR 20040008833A KR 1020020042552 A KR1020020042552 A KR 1020020042552A KR 20020042552 A KR20020042552 A KR 20020042552A KR 20040008833 A KR20040008833 A KR 20040008833A
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KR
South Korea
Prior art keywords
heat sink
heat
circuit board
printed circuit
heat dissipation
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Application number
KR1020020042552A
Other languages
Korean (ko)
Inventor
이수길
Original Assignee
현대모비스 주식회사
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Application filed by 현대모비스 주식회사 filed Critical 현대모비스 주식회사
Priority to KR1020020042552A priority Critical patent/KR20040008833A/en
Publication of KR20040008833A publication Critical patent/KR20040008833A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Abstract

PURPOSE: A heat sink structure is provided to allow for an automatic soldering, while reducing assembly procedures and reducing manufacturing costs. CONSTITUTION: A heat sink structure comprises a heat sink(31) disposed on the heating component and mounted on a printed circuit board, wherein the heat sink has an outer surface on which a plurality of heat radiation grooves(34) are formed. The heat sink includes a horizontal portion(32) contacting the top surface of the heating component; a side portion(33) bent at both ends of the horizontal portion, and which contacts both side surfaces of the heating component; and a coupling portion(35) arranged at the end of the side portion and inserted into the coupling groove formed on the printed circuit board.

Description

방열판 구조{STRUCTURE OF HEAT SINK}Heat Sink Structure {STRUCTURE OF HEAT SINK}

본 발명은 방열판 구조에 관한 것으로, 좀 더 자세히 설명하면, 자동차의IPS에서 발생하는 열을 신속하게 방출시키기 위해 외주면에 다수의 방열홀을 구비한 방열판을 인쇄회로기판에 삽입 고정시킴으로서, 자동 솔더링이 가능하고 방열효율도 향상시키는 것을 특징으로 한다.The present invention relates to a heat sink structure, and in more detail, in order to quickly dissipate the heat generated from the IPS of the car by inserting and fixing a heat sink having a plurality of heat dissipation holes on the outer peripheral surface to the printed circuit board, automatic soldering is It is possible to improve the heat dissipation efficiency.

일반적으로 전기, 전자제품의 고출력화 및 고실장화, 소음 및 EMI 문제로 인한 제품의 에어 밴트(air vent) 최소화, 제품 디자인의 콤팩트화로 인한 제품 내부의 공간 부족에 따라 히트 싱크(heat sink)의 필요가 대두되고 있다.In general, the need for a heat sink due to the high output and high mounting of electrical and electronic products, the minimization of air vent of the product due to noise and EMI problems, and the lack of space inside the product due to the compact design of the product Is emerging.

히트 싱크란 전자 제품이 작동하면서 발생하는 열을 신속하게 방출시키는 것으로서, 특히 PCB(printed circuit board:인쇄회로기판)상에 장착되는 트랜지스터, 집적회로 등의 발열부품에 장착되어 발열부품에서 발생하는 열을 방열 시켜 줌으로서 발열부품의 오작동을 방지하게 된다.A heat sink is a heat dissipation that is generated quickly when an electronic product is operated. In particular, a heat sink is a heat sink that is mounted on a heating component such as a transistor or an integrated circuit mounted on a printed circuit board (PCB). By dissipating heat, the malfunction of the heating parts is prevented.

한편, 최근에는 자동차도 기계적인 구성요소 외에 전자적인 구성요소가 다수 장착되어 운전의 편의성과 안전성을 도모하게 되는데, 특히, 자동차의 퓨즈(fuse), 릴레이(relay)의 대체용으로 IPS(intelligent power switch)를 PCB에 실장시 열이 많이 발생하였다.On the other hand, in recent years, the automobile is equipped with a number of electronic components in addition to the mechanical components to improve the convenience and safety of driving, in particular, IPS (intelligent power) to replace the fuse (fuse), relay (relay) of the vehicle When the switch is mounted on the PCB, a lot of heat is generated.

이를 해결하기 위해 종래에는 여러 가지 방열 장치가 적용되었는바, 도 1a는 종래 PCB 동판을 이용한 방열 상태를 나타내는 도면이고, 도 1b는 종래 히트 싱크 부착을 통한 방열 상태를 나타내는 도면이다.In order to solve this problem, various heat dissipation devices have been applied in the related art. FIG. 1A is a view showing a heat dissipation state using a conventional PCB copper plate, and FIG. 1B is a view showing a heat dissipation state through a conventional heat sink attachment.

도시된 바와 같이, 도 1은 PCB 동박(11)을 통해 IPS(12)에서 발생하는 열을 방열 시키는 것으로서, IPS 최대 부하시 방열을 위해서는 6cm ×6cm(동박 두께 70㎛, 1층)의 표면적이 필요하므로, 다수의 IPS를 사용하게 되면, PCB의 단면적이 증가하게 되고 결과적으로 단가가 상승하게 되는 문제점이 있었다.As shown, FIG. 1 is a heat dissipation heat generated from the IPS 12 through the PCB copper foil 11, the surface area of 6cm × 6cm (copper thickness 70㎛, 1 layer) for heat dissipation at IPS maximum load Since it is necessary, when using a plurality of IPS, there is a problem that the cross-sectional area of the PCB is increased and as a result the unit price increases.

그리고, 도 2는 PCB(13) 하단부에 히트 싱크(14)를 부착하여 IPS(12)에서 발생하는 열을 방열 시키는 것인데, PCB 하단부에 히트 싱크를 부착하는 방법이 어렵고, 열은 IPS에서 발생하여 상측으로 이동하는데 반해 히트 싱크는 하측에 위치하여 방열효율이 저하되며, 히트 싱크의 케이스 재질을 도체로 사용시 절연 구조로 설계함으로서 구조가 복잡해지고 단가가 상승한다는 문제점이 있었다.And, Figure 2 is a heat sink 14 attached to the lower end of the PCB 13 to dissipate heat generated in the IPS 12, the method of attaching the heat sink to the lower end of the PCB is difficult, the heat is generated in the IPS While the heat sink is located at the lower side, the heat dissipation efficiency is lowered, and when the case material of the heat sink is used as a conductor, the heat sink is designed as an insulating structure, which causes a complicated structure and an increase in unit cost.

이에 본 발명은 상기와 같은 문제점들을 해소하기 위해 안출된 것으로써, 본 발명의 목적은 외주면에 방열홀을 구비하고 인쇄회로기판에 장착하기가 간단한 구조를 갖는 방열판을 통해 자동 솔더링이 가능하고 발열부품의 상하단부에서 발생하는 열을 신속하게 방출하게 하는 것을 특징으로 하는 방열판 구조를 제공하는데 있다.Accordingly, the present invention has been made to solve the above problems, an object of the present invention is to provide a heat dissipation hole on the outer peripheral surface and can be automatically soldered through a heat sink having a structure that is simple to mount on a printed circuit board and heating parts To provide a heat sink structure characterized in that to quickly release the heat generated in the upper and lower ends of the.

도 1은 종래 PCB 동판을 이용한 방열 상태를 나타내는 도면.1 is a view showing a heat dissipation state using a conventional PCB copper plate.

도 2는 종래 히트 싱크 부착을 통한 방열 상태를 나타내는 도면.Figure 2 is a view showing a heat dissipation state through a conventional heat sink attached.

도 3는 본 발명에 따른 방열판 구조를 나타내는 사시도.Figure 3 is a perspective view showing a heat sink structure according to the present invention.

도 4은 본 발명에 따른 방열판의 장착 상태를 나타내는 도면.4 is a view showing a mounting state of the heat sink according to the present invention.

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

31 : 방열판 32 : 수평부31: heat sink 32: horizontal portion

33 : 측면부 34 : 방열홈33: side portion 34: heat dissipation groove

35 : 결합부 41 : 발열부품35: coupling portion 41: heat generating parts

42 : 인쇄회로기판 43 : 결합홈42: printed circuit board 43: coupling groove

상기와 같은 목적을 달성하기 위한 본 발명은 인쇄회로기판에 장착되는 발열부품에서 발생하는 열을 방출시키는 방열판 구조에 있어서,The present invention for achieving the above object in the heat sink structure for dissipating heat generated from the heat generating component mounted on the printed circuit board,

상기 방열판은 발열부품의 상부에 위치하면서 인쇄회로기판에 장착되고, 외주면에는 방열을 위한 다수의 방열홈이 형성되는 것을 특징으로 하는 방열판 구조를 제공한다.The heat sink is mounted on the printed circuit board while positioned above the heat generating component, and provides a heat sink structure in which a plurality of heat dissipation grooves are formed on an outer circumferential surface thereof.

이때, 본 발명에서 상기 방열판은 발열부품의 상측면과 접하는 수평부와; 상기 수평부의 양끝단에서 절곡되어 발열부품의 양측면과 접하는 측면부와; 상기 측면부의 끝단에 형성되어 인쇄회로기판 상에 형성된 결합홈에 끼움 결합하는 결합부로 구성되는 것이 바람직하다.At this time, the heat sink in the present invention and the horizontal portion in contact with the upper surface of the heat generating component; Side portions which are bent at both ends of the horizontal portion to be in contact with both side surfaces of the heating component; Formed at the end of the side portion is preferably composed of a coupling portion to fit into the coupling groove formed on the printed circuit board.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

또한, 본 실시예는 본 발명의 권리범위를 한정하는 것이 아니라 단지 예시로 제시된 것이며, 종래 구성과 동일한 부분은 동일한 부호나 명칭을 사용한다.In addition, this embodiment is not limited to the scope of the present invention but is presented by way of example only, the same parts as the conventional configuration uses the same reference numerals or names.

도 3는 본 발명에 따른 방열판 구조를 나타내는 사시도이고, 도 4은 본 발명에 따른 방열판의 장착 상태를 나타내는 도면이다.Figure 3 is a perspective view showing a heat sink structure according to the present invention, Figure 4 is a view showing a mounting state of the heat sink according to the invention.

도시한 바와 같이, 본 발명에 따른 방열판 구조는 발영부품의 상단에 형성되고 다수의 방열홈을 구비하여 방열효율을 향상시키고 자동 솔더링(auto soldering)이 가능한 것을 특징으로 한다.As shown, the heat sink structure according to the present invention is formed on the top of the light emitting component and has a plurality of heat dissipation grooves to improve the heat dissipation efficiency and is characterized in that the automatic soldering (auto soldering) is possible.

본 발명의 구성을 구체적으로 살펴보면, 인쇄회로기판(42) 상에 발열부품(41)이 장착된 상태에서 방열판(31)이 상기 발열부품(41)의 상부에 위치하여 인쇄회로기판(42)에 고정된다.Looking at the configuration of the present invention in detail, the heat sink 31 is located on the printed circuit board 42 in the heat generating part 41 in the state in which the heating component 41 is mounted on the printed circuit board 42 It is fixed.

즉, 상기 방열판(31)은 발열부품(41)의 상측면과 접하는 수평부(32)와, 상기 수평부(32)의 양끝단에서 절곡되어 발열부품(41)의 양측면과 접하는 측면부(33)로 이루어지고, 상기 방열판(31)의 외주면에는 방열 향상을 위해 다수의 방열홈(34)이 형성된다.That is, the heat dissipation plate 31 is a horizontal portion 32 in contact with the upper surface of the heat generating component 41, and the side portion 33 is bent at both ends of the horizontal portion 32 to be in contact with both side surfaces of the heat generating component 41. Is made of, the outer circumferential surface of the heat sink 31 is formed with a plurality of heat dissipation grooves 34 to improve heat dissipation.

그리고, 상기 측면부((33)의 끝단에는 인쇄회로기판(42) 상에 형성된 다수의결합홈(43)에 끼움 결합이 가능하도록 다수의 결합부(35)가 형성된다.In addition, a plurality of coupling parts 35 are formed at ends of the side parts 33 to be fitted into a plurality of coupling grooves 43 formed on the printed circuit board 42.

이때, 상기 방열판(31)은 열전도성이 뛰어난 재질인 구리가 99.5％로 주를 이루고, 주석으로 도금처리 하는 것이 바람직하다.At this time, the heat dissipation plate 31 is preferably made of copper, a material having excellent thermal conductivity of 99.5%, and plated with tin.

또한, 상기 방열판(31)은 여러 가지 다양한 발열부품(41)에 부착되어 사용할 수 있으나, 본 명세서에서는 자동차의 퓨즈나 릴레이의 대체용으로 사용되는 인텔리전트 파워 스위치(intelligent power switch)에 부착되어 방열시키는 것이 바람직하다.In addition, the heat dissipation plate 31 may be attached to various heat generating parts 41, but in the present specification, the heat dissipation plate 31 may be attached to an intelligent power switch used as a replacement of a fuse or a relay of an automobile to radiate heat. It is preferable.

상기와 같은 구성을 갖는 본 발명에 따른 방열판 구조의 작용 및 효과는 다음과 같다.Actions and effects of the heat sink structure according to the present invention having the configuration as described above are as follows.

인쇄회로기판(42) 상에 발열부품(41)이 부착된 상태에서 방열판(31)의 결합부(35)를 인쇄회로기판(42) 상에 형성된 결합홈(43)에 끼움 결합시킨다.In the state in which the heat generating part 41 is attached to the printed circuit board 42, the coupling part 35 of the heat sink 31 is fitted into the coupling groove 43 formed on the printed circuit board 42.

상기한 상태에서 방열판(31)은 인쇄회로기판(42)의 결합홈(43)에 끼움 고정되어 이탈되지 않기 때문에, 자동 솔더링(auto soldering) 작업을 하게 되면 납땜이 상기 인쇄회로기판(41)과 방열판(31)을 고정시켜 주게 된다.In the above state, since the heat sink 31 is fitted into the coupling groove 43 of the printed circuit board 42 and is not separated, soldering is performed with the printed circuit board 41 when the automatic soldering operation is performed. The heat sink 31 is fixed.

그리고, 이렇게 고정된 상태에서 제품이 작동하게 되어 발열부품(41)에서 열이 발생하게 되는데, 통상 열은 상방으로 이동하는 경향이 있다.In this fixed state, the product is operated to generate heat in the heat generating part 41. Usually, heat tends to move upward.

따라서, 본 발명에 따른 방열판(31)의 구조에 의하면, 발열부품(41)의 상단부에서 발생하는 열은 방열판(31)을 통해, 특히 상기 방열판(31)의 방열홀(34)을 통해 공기와의 접촉면적이 확대됨으로서 신속하게 방열 된다.Therefore, according to the structure of the heat sink 31 according to the present invention, the heat generated from the upper end of the heat generating part 41 through the heat sink 31, in particular through the heat radiation hole 34 of the heat sink 31 The heat dissipation is quickly achieved by increasing the contact area of the.

그리고, 발열부품(41)의 하단부에서 발생하는 열은 방열판(31)의 결합부(35)를 통해 상방으로 전도되어 방열된다.The heat generated at the lower end of the heat generating part 41 is conducted upward through the coupling part 35 of the heat dissipation plate 31 to radiate heat.

상기한 바와 같이 본 발명에 따른 방열판 구조에 의하면, 결합부가 인쇄회로기판에 형성된 결합홈에 삽입되어 고정됨으로써, 자동 솔더링이 가능하여 조립공정이 간단하고 제품 단가도 낮추어주는 효과가 있다.As described above, according to the heat sink structure according to the present invention, the coupling part is inserted into and fixed to the coupling groove formed in the printed circuit board, thereby enabling automatic soldering, thereby simplifying the assembly process and lowering the product cost.

또한, 본 발명의 방열판 외주면에는 다수의 방열홀이 형성되어 발열부품과 공기의 접촉 부분이 많기 때문에, 방열 효과가 뛰어나고 발열부품 하단에서 발생하는 열도 방열판에 의해 상방으로 전도되어 신속하게 방열되는 이점이 있다.In addition, since a plurality of heat dissipation holes are formed on the outer circumferential surface of the heat sink of the present invention, and there are many contact parts between the heat generating parts and the air, the heat dissipation effect is excellent, and heat generated from the bottom of the heat generating parts is also conducted upward by the heat sink, and thus the heat dissipation is quick. have.

Claims (2)

인쇄회로기판에 장착되는 발열부품에서 발생하는 열을 방출시키는 방열판 구조에 있어서,In the heat sink structure for dissipating heat generated from the heat generating parts mounted on the printed circuit board, 상기 방열판은 발열부품의 상부에 위치하면서 인쇄회로기판에 장착되고, 외주면에는 방열을 위한 다수의 방열홈이 형성되는 것을 특징으로 하는 방열판 구조.The heat dissipation plate is mounted on the printed circuit board while being positioned above the heat generating component, the heat dissipation structure, characterized in that a plurality of heat dissipation grooves are formed on the outer circumferential surface. 제 1항에 있어서, 상기 방열판은 발열부품의 상측면과 접하는 수평부와;According to claim 1, wherein the heat sink is a horizontal portion in contact with the upper surface of the heat generating component; 상기 수평부의 양끝단에서 절곡되어 발열부품의 양측면과 접하는 측면부와;Side portions which are bent at both ends of the horizontal portion to be in contact with both side surfaces of the heating component; 상기 측면부의 끝단에 형성되어 인쇄회로기판 상에 형성된 결합홈에 끼움 결합하는 결합부로 구성되는 것을 특징으로 하는 방열판 구조.The heat sink structure, characterized in that formed in the end of the side portion is composed of a coupling portion to be fitted into the coupling groove formed on the printed circuit board.
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WO2013073861A1 (en) * 2011-11-16 2013-05-23 Lg Innotek Co., Ltd. Bent printed circuit board for backlight unit

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JPS57168246U (en) * 1981-04-17 1982-10-23
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JPH03257997A (en) * 1990-03-08 1991-11-18 Matsushita Electric Ind Co Ltd Electromagnetic wave shielding device
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WO2013073861A1 (en) * 2011-11-16 2013-05-23 Lg Innotek Co., Ltd. Bent printed circuit board for backlight unit
KR101330770B1 (en) * 2011-11-16 2013-11-18 엘지이노텍 주식회사 Bent printed circuit board for backlight unit
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