KR20040005822A - 배치형 이온 주입 시스템에 있어서의 웨이퍼의 배면측가스 냉각용 장치 - Google Patents

배치형 이온 주입 시스템에 있어서의 웨이퍼의 배면측가스 냉각용 장치 Download PDF

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Publication number
KR20040005822A
KR20040005822A KR10-2003-7004031A KR20037004031A KR20040005822A KR 20040005822 A KR20040005822 A KR 20040005822A KR 20037004031 A KR20037004031 A KR 20037004031A KR 20040005822 A KR20040005822 A KR 20040005822A
Authority
KR
South Korea
Prior art keywords
workpiece
sealing
support member
seal
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR10-2003-7004031A
Other languages
English (en)
Korean (ko)
Inventor
칩맨데이비드제임스
라고스브라이언크리스토퍼
미첼로버트존
로젠게리제이
스톤데일케이쓰
Original Assignee
액셀리스 테크놀로지스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 액셀리스 테크놀로지스, 인크. filed Critical 액셀리스 테크놀로지스, 인크.
Publication of KR20040005822A publication Critical patent/KR20040005822A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001—Maintaining constant desired temperature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR10-2003-7004031A 2000-09-26 2001-08-23 배치형 이온 주입 시스템에 있어서의 웨이퍼의 배면측가스 냉각용 장치 Withdrawn KR20040005822A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/670,241 2000-09-26
US09/670,241 US6583428B1 (en) 2000-09-26 2000-09-26 Apparatus for the backside gas cooling of a wafer in a batch ion implantation system
PCT/GB2001/003795 WO2002027754A2 (en) 2000-09-26 2001-08-23 An apparatus for the backside gas cooling of a wafer in a batch ion implantation system

Publications (1)

Publication Number Publication Date
KR20040005822A true KR20040005822A (ko) 2004-01-16

Family

ID=24689580

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7004031A Withdrawn KR20040005822A (ko) 2000-09-26 2001-08-23 배치형 이온 주입 시스템에 있어서의 웨이퍼의 배면측가스 냉각용 장치

Country Status (8)

Country Link
US (1) US6583428B1 (https=)
EP (1) EP1320866A2 (https=)
JP (1) JP2004510306A (https=)
KR (1) KR20040005822A (https=)
CN (1) CN1466770A (https=)
AU (1) AU2001282326A1 (https=)
TW (1) TW504740B (https=)
WO (1) WO2002027754A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220107049A (ko) * 2019-12-06 2022-08-01 어플라이드 머티어리얼스, 인코포레이티드 극저온 열 전달 시스템 및 이온 주입 시스템

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040012671A (ko) 2000-10-17 2004-02-11 네오포토닉스 코포레이션 반응성 증착에 의한 코팅 형성
US7064491B2 (en) * 2000-11-30 2006-06-20 Semequip, Inc. Ion implantation system and control method
US6734439B2 (en) * 2001-10-25 2004-05-11 Allan Weed Wafer pedestal tilt mechanism and cooling system
US6695270B1 (en) * 2002-08-15 2004-02-24 Ole Falk Smed Flat panel display system
JP2006179613A (ja) * 2004-12-21 2006-07-06 Rigaku Corp 半導体ウエハ縦型熱処理装置用磁性流体シールユニット
US7867403B2 (en) * 2006-06-05 2011-01-11 Jason Plumhoff Temperature control method for photolithographic substrate
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
US20080121821A1 (en) * 2006-11-27 2008-05-29 Varian Semiconductor Equipment Associates Inc. Techniques for low-temperature ion implantation
US7528392B2 (en) 2006-11-27 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for low-temperature ion implantation
US7528391B2 (en) * 2006-12-22 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for reducing contamination during ion implantation
US7559557B2 (en) * 2007-08-22 2009-07-14 Varian Semiconductor Equipment Associates, Inc. Sealing between vacuum chambers
US8149256B2 (en) * 2008-06-04 2012-04-03 Varian Semiconductor Equipment Associates, Inc. Techniques for changing temperature of a platen
US20100084117A1 (en) * 2008-10-02 2010-04-08 Fish Roger B Platen cooling mechanism for cryogenic ion implanting
US20100155026A1 (en) * 2008-12-19 2010-06-24 Walther Steven R Condensible gas cooling system
US7977652B2 (en) * 2009-09-29 2011-07-12 Varian Semiconductor Equipment Associates, Inc. Optical heater for cryogenic ion implanter surface regeneration
CN103594553B (zh) * 2013-10-23 2015-10-28 中国电子科技集团公司第四十八研究所 一种阵列式硅片装载靶盘
CN107154346B (zh) * 2017-05-19 2021-03-16 京东方科技集团股份有限公司 一种膜层的掺杂方法、薄膜晶体管及其制作方法
CN109243954B (zh) * 2018-10-12 2023-11-03 江苏晋誉达半导体股份有限公司 一种离子注入机
WO2020124158A1 (en) * 2018-12-21 2020-06-25 Ozone 1 Pty Ltd Improvements in plasma reactors
US12002649B2 (en) 2021-12-10 2024-06-04 Applied Materials, Inc. Spinning disk with electrostatic clamped platens for ion implantation
CN116951003A (zh) * 2022-04-20 2023-10-27 江苏鲁汶仪器股份有限公司 一种磁流体轴

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514636A (en) * 1979-09-14 1985-04-30 Eaton Corporation Ion treatment apparatus
US4419584A (en) 1981-07-14 1983-12-06 Eaton Semi-Conductor Implantation Corporation Treating workpiece with beams
JPS5950275A (ja) 1982-09-16 1984-03-23 Rigaku Keisoku Kk 磁性流体軸封装置
US5389793A (en) 1983-08-15 1995-02-14 Applied Materials, Inc. Apparatus and methods for ion implantation
US4567938A (en) * 1984-05-02 1986-02-04 Varian Associates, Inc. Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system
US4733091A (en) * 1984-09-19 1988-03-22 Applied Materials, Inc. Systems and methods for ion implantation of semiconductor wafers
JPS61264649A (ja) * 1985-05-20 1986-11-22 Ulvac Corp 基板冷却装置
US4899059A (en) 1988-05-18 1990-02-06 Varian Associates, Inc. Disk scanning apparatus for batch ion implanters
US4965862A (en) 1988-05-18 1990-10-23 Varian Associates, Inc. Disk scanning apparatus for batch ion implanters
US5238499A (en) 1990-07-16 1993-08-24 Novellus Systems, Inc. Gas-based substrate protection during processing
US5641969A (en) * 1996-03-28 1997-06-24 Applied Materials, Inc. Ion implantation apparatus
US5954342A (en) 1997-04-25 1999-09-21 Mfs Technology Ltd Magnetic fluid seal apparatus for a rotary shaft
US6222196B1 (en) * 1998-11-19 2001-04-24 Axcelis Technologies, Inc. Rotatable workpiece support including cyclindrical workpiece support surfaces for an ion beam implanter
US6412289B1 (en) 2001-05-15 2002-07-02 General Electric Company Synchronous machine having cryogenic gas transfer coupling to rotor with super-conducting coils

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220107049A (ko) * 2019-12-06 2022-08-01 어플라이드 머티어리얼스, 인코포레이티드 극저온 열 전달 시스템 및 이온 주입 시스템

Also Published As

Publication number Publication date
TW504740B (en) 2002-10-01
CN1466770A (zh) 2004-01-07
AU2001282326A1 (en) 2002-04-08
US6583428B1 (en) 2003-06-24
JP2004510306A (ja) 2004-04-02
EP1320866A2 (en) 2003-06-25
WO2002027754A2 (en) 2002-04-04
WO2002027754A3 (en) 2002-06-13

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000