KR200368349Y1 - Cleaning bath for a wafer - Google Patents

Abstract

By providing a built-in member in a cleaning bath including a body, a shower, a discharge part, and a support member, a cleaning tank for a wafer can be prevented from being resorbed to a cleaned wafer during a cleaning operation, thereby improving productivity. The wafer cleaning bath is provided with a body in which a working space is formed and the bottom is inclined toward the center. The shower unit is disposed at the upper part of the workspace, the support member is disposed at the lower part of the shower unit, and the wafer is seated at the upper part. The first discharge portion is connected to the first through hole formed in the bottom surface, and the first support member is coupled to the support member through the first discharge portion. The second discharge portion is connected to a second through hole formed in the bottom surface. The built-in member is coupled to the second support member formed to a predetermined length and spaced apart from the bottom by a predetermined distance, and is spaced apart from the side of the body by a predetermined distance.

Description

Wafer cleaning tank {CLEANING BATH FOR A WAFER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning tank, and more particularly, to a wafer cleaning tank used for cleaning a wafer, a flat panel (FPD), and the like.

4 is a front cross-sectional view of a cleaning bath for a wafer according to the prior art.

Referring to FIG. 4, a wafer cleaning tank according to the related art includes a body 10, a shower 25, a support member 20, and a discharge unit 17.

The body 10 has a work space formed therein, the bottom 11 is formed to be inclined to narrow the cross section toward the center, the shower portion 25 and the support member 20 in the work space inside the body 10 Is placed.

The shower unit 25 is disposed above the work space of the body 10, and the discharge unit 17 is integrally or detachably coupled to the first through hole 16 formed at the center of the bottom surface 11.

Support member 20 is disposed in the working space, the lower end is coupled to the support member 21 is connected through the discharge unit 17.

Referring to the operation and effect of the cleaning bath according to the prior art having the configuration as described above are as follows.

Referring back to FIG. 4, when the wafer is cleaned in the wafer cleaning tank, the wafer W is disposed on the upper end of the support member 20, and the wafer W is disposed from the shower portion 25. Cleaning gas and liquid of the wafer W are injected in the direction. At this time, the cleaning gas and the liquid injected from the shower 25 remove the chemical substances remaining on the wafer W from the wafer W.

On the other hand, the cleaning gas and liquid cleaning the wafer W are mixed while cleaning the chemical substances remaining on the wafer W. The cleaning gas and the liquid are discharged to the outside of the body 10 through the discharge portion 17 connected to the bottom 11 in the state containing the chemical.

By the way, in the prior art wafer cleaning tank, when the cleaning gas and the liquid are discharged to the outside of the body through the discharge portion, the chemical substance remaining in the working space of the body is discharged through the discharge portion. At this time, the chemicals remaining in the workspace are affected by the flow of airflow formed by the discharge exiting the discharge. On the other hand, some of the chemicals are reabsorbed on the wafer, and the cleaning process of the wafer must be repeated. Therefore, there is a problem that the production efficiency of the wafer is lowered and the manufacturing cost of the semiconductor is increased.

The present invention is devised to solve the problems of the prior art as described above, the object of the present invention is to reduce the defect rate of the semiconductor by preventing the impurities and chemicals re-adsorbed on the wafer after the cleaning operation of the wafer is completed. To reduce the manufacturing cost of the semiconductor, and to improve the cleaning effect of the wafer to provide a cleaning tank for the wafer.

1 is a front sectional view of a cleaning bath for a wafer according to a preferred embodiment of the present invention;

2 is a side cross-sectional view of a cleaning bath for a wafer according to a preferred embodiment of the present invention;

3 is an enlarged cross-sectional view of portion “A” of FIG. 2, and

4 is a front sectional view of a cleaning bath for a wafer according to the prior art.

<Explanation of symbols for the main parts of the drawings>

100: body 110: bottom

160: shower unit 170: the first discharge unit

171: first through hole 180: support member

185: first support member 190: second discharge portion

191: second through hole 210: interior member

215: second support member W: wafer

In order to achieve the above object, the present invention includes a body, a shower unit, a first discharge unit, a second discharge unit, a support member, and a built-in member.

The body is formed inside the work space, the bottom surface is formed to be inclined to narrow the cross section toward the center, the shower, the supporting member and the built-in member is disposed in the working space inside the body.

The shower part is disposed above the work space of the body, the first discharge part is integrally or detachably coupled to the first through hole formed at the center of the bottom, and the second discharge part is integrally or separated from the second through hole formed at the bottom of the body. Possibly combined.

The supporting member is disposed inside the work space, and a lower end of the first supporting member coupled to the first discharge part is coupled, and the inner member is disposed at the lower end of the supporting member, and at a lower end of the lower surface and the side of the body by a predetermined distance. A second support member for supporting spaced apart is coupled.

As described above, in the wafer cleaning bath according to the present invention, an interior member is disposed between a bottom surface of the body and a support member, and the interior member is disposed to be separated by a predetermined distance from the side of the body. Due to this structure, the direction of air flow in the working space of the wafer cleaning tank can be changed to prevent the chemicals from being resorbed onto the wafer.

Hereinafter, with reference to the accompanying drawings will be described in more detail with respect to the wafer cleaning bath according to a preferred embodiment of the present invention.

1 is a cross-sectional view of the wafer cleaning tank according to a preferred embodiment of the present invention from the front, and FIG. 2 is a cross-sectional view of the wafer cleaning tank according to a preferred embodiment of the present invention from the side, 3 is an enlarged cross-sectional view of the portion “A” of FIG. 2.

1 and 2, the cleaning tank for a wafer according to a preferred embodiment of the present invention is the body 100, the shower unit 160, the first discharge unit 170, the support member 180, the interior member 210 ) And a second discharge unit 190.

The body 100 has a working space formed therein, and the bottom surface 110 is formed to have a smaller cross section toward the center. At this time, a first through hole 171 is formed at the center of the bottom surface 110.

The shower unit 160 is disposed at the upper portion of the work space, and the support member 180 is disposed at the lower end of the shower unit 160 to penetrate the first discharge unit 170 and the first through hole 171 to the workspace. It is connected to the upper end of the first support member 185 disposed as.

The interior member 210 is coupled to the second support member 215 having a predetermined height and disposed to be separated from the side surface of the bottom surface 110 and the body 100 by a predetermined distance, and the first support member 185 is disposed at the center thereof. Through holes are formed therethrough.

On the other hand, referring to Figure 3, the first discharge portion 170 is integrally or detachably coupled to the first through-hole 171 extends to the outside of the body 100, the second discharge portion 190 is the bottom surface It is integrally or detachably connected to the second through hole 191 formed in the 110 and extends to the outside of the body 100.

The operation and effects of the cleaning bath for a wafer according to the preferred embodiment of the present invention configured as described above will be briefly described.

Referring back to FIGS. 1 and 2, when the wafer is cleaned in the cleaning bath, the shower unit 160 includes a wafer having a cleaning liquid and gas for cleaning the wafer W disposed inside the work space. Spray in the direction indicated. At this time, the wafer W is disposed on the upper end of the support member 180. On the other hand, impurities such as particles PARTICLE adsorbed on the wafer W are released from the wafer W together with the cleaning liquid and gas, and the wafer W is cleaned.

Next, the liquid and gas for cleaning in the state containing impurities flows down between the side of the body 100 and the side of the interior member 210, and then the bottom surface 110 and the interior member (100) of the body 100 formed to be inclined toward the center. It flows between the bottom of 210.

Next, impurities included in the cleaning liquid and gas are discharged to the outside of the body 100 through the first discharge unit 170 coupled to the first through hole 171 formed at the center of the bottom surface 110.

Meanwhile, a second through hole 191 is formed in the bottom surface 110, and a second discharge part 190 is connected to the second through hole 191 so that a part of the cleaning liquid and gas flowing along the bottom surface 110 is formed. To the outside of the cleaning tank. At this time, the cleaning liquid and gas flowing between the side of the body 100 and the interior member 210 in accordance with the flow discharged through the second discharge unit 190 flows close to the side of the body (100).

As described above, in the case of the conventional cleaning chamber for wafers, when the cleaning liquid and gas flow out of the body through the discharge unit after cleaning the wafer, the chemical remaining in the work space by the flow of cleaning liquid and gas discharged is discharged. The material is resorbed onto the wafer, increasing the defect rate of the wafer and reducing productivity. Therefore, the wafer cleaning tank according to the present invention can prevent the chemicals from being resorbed to the wafer by installing a built-in member between the support member and the bottom surface to guide the flowing direction of the cleaning gas and liquid discharged to the side of the body. It can improve productivity.

In the above description with reference to a preferred embodiment of the present invention, the present invention is not limited to these embodiments, and it can be variously modified and changed within the spirit and scope of the present invention shown in the utility model claims below Those skilled in the art will readily understand.

Claims (2)

The work space is formed therein and the bottom surface is inclined to the body 100, the shower unit 160 disposed in the work space of the body 100, connected to the first through-hole 171 formed in the bottom surface 110 In the cleaning tank for a wafer having a first discharge portion 170 and the support member 180 is located close to the bottom surface 110 of the body 100, the wafer W is disposed, A built-in member 210 disposed between the bottom surface 110 of the body 100 and the support member 180; And And a second support member (215) for supporting the internal member (210) on the bottom surface (110) of the body (100). According to claim 1, wherein the second through-hole 191 is formed on the bottom surface 110 of the body 100, the second discharge hole 190 is characterized in that the second discharge portion 190 is coupled to Wafer cleaning tank to perform.