KR200336937Y1 - Waste gas scrubber integral with vaccum pump - Google Patents

Abstract

The present invention is to provide a waste gas treatment apparatus that can collectively process the hazardous waste gas generated during the semiconductor process or the LCD manufacturing process,

A gas introduction part which delivers gas to the gas treatment part to treat the exhaust gases used in the semiconductor manufacturing process, provides separation N ₂ for preventing the mixing of inappropriate gases at low temperature, and also supplies air for the oxidation reaction, Pyrolysis and oxidation reaction section for oxidative reaction or pyrolysis treatment of exhaust gases introduced through the gas introduction section, and hot gas exhausted after the pyrolysis and oxidation reaction treatment in the pyrolysis and oxidation reaction section proceeds to the next step. A cooling unit which rapidly cools the gas, a gas and by-product moving path unit for moving the by-product generated by the pyrolysis and oxidation reaction treatment and treating the by-products, and a gas moved through the moving path unit, Water-soluble gas as main wet scrubber for treating untreated by-products And a by-product processing unit, a water removing unit for removing moisture before introducing the gas treated in the main wet cleaning unit into the main duct, and an electric control unit for controlling the apparatus of the present invention.

Description

Waste gas treatment system integrated with vacuum pump {WASTE GAS SCRUBBER INTEGRAL WITH VACCUM PUMP}

The present invention relates to a gas scrubber for treating hazardous waste gas generated during a semiconductor process, and more particularly, to a vacuum pump-integrated waste gas treating apparatus integrated with a vacuum pump and configured to simultaneously perform dry and wet treatment. . In such a waste gas treatment apparatus, by performing a dry treatment requiring combustion and a wet treatment requiring water treatment with one apparatus, more reliable treatment of waste gas can be achieved and the efficiency of treatment is increased.

Gas emissions as a by-product of the manufacture of semiconductor materials, devices, products and memories generate a wide range of chemical species from process facilities, including arsine (AsH3; arsenic hydride), phosphine (PH3), and diborane (B2H6). And, waste gas containing gaseous toxic substances represented by monosilane (SiH 4) is generated at various stages in the semiconductor manufacturing process. These species include decomposition products of organic and inorganic compounds, photosensitizers and other reactants, and a wide variety of other gases that need to be removed from the waste gas stream before it is released into the atmosphere from the process equipment.

As described above, various treatment techniques are applied to purify the waste gas component to be removed. As one example, there are three methods for treating harmful gases emitted during a semiconductor device manufacturing process. First, there is a burning method of decomposing, reacting or combusting a ignitable gas mainly containing a hydrogen group at a high temperature of about 500 ° C to 800 ° C in a combustion chamber. Second, wetting is a method of dissolving and dissolving a water-soluble gas in water while passing water stored in a tank. Third, there is an adsorption method for purifying by physical or chemical adsorption to the adsorbent while the harmful gas which does not ignite or is insoluble in water passes through the adsorbent.

The exhaust gas treatment here includes, for example, scrubbing to remove acidic gas components and / or particles from the exhaust gas stream. The gas may be subjected to thermal oxidation to remove organic and other oxidative compounds by mixing the effluent with an oxidant such as high purity oxygen, air or nitrous oxide and flowing the resulting gas mixture through a thermal oxidation reaction chamber.

In particular, in such a waste gas treatment system, halogen components such as fluorine (F2) and fluorinated compounds are to be removed more than any other components. Not only does this material remain in the atmosphere for a long time, but it is also recognized as a major culprit of warming. Perfluorides (PFCs) used in the electronics industry are compounds used in wafer processing equipment to remove residues from film formation and etch thin films, and are recognized as a major component of global warming. Is working to reduce emissions of these gases.

The waste gas treatment in the semiconductor manufacturing process as described above is performed separately according to the characteristics of the waste gas, that is, a wet treatment apparatus for the treatment of water-soluble waste gas and a waste gas treatment to be treated by pyrolysis. Since the pyrolysis treatment unit is installed and used separately, the number of devices increases and the area of the place occupied by the device is also excessive, making it difficult to maintain the device and increasing the operating cost of the device by using a large place. There is a disadvantage.

Therefore, maintenance costs can be reduced and maintenance can be further simplified if a device is provided that can process waste gas consistently regardless of the type of gas.

Accordingly, it is an object of the present invention to provide a waste gas treatment apparatus capable of collectively treating the waste gas which is individually made according to the characteristics of the current gas.

For this purpose of the present invention, to lead the gas to the gas treatment unit for treating the exhaust gases used in the semiconductor manufacturing process, supply a separation N ₂ for preventing the mixing of inappropriate gases at low temperature and also O for oxidation reaction A gas induction unit for supplying ₂ and an exhaust gas used in the process and introduced into the gas introduction unit through pyrolysis and oxidation reaction for oxidation reaction or pyrolysis treatment, and after pyrolysis and oxidation treatment in the pyrolysis and oxidation reaction section A cooling unit which rapidly cools the exhausted hot gas before proceeding to the next step, and a gas and by-product movement path unit which moves the by-product generated by the pyrolysis and oxidation reaction treatment and processes the by-products. , The main processing of the untreated by-products and the gas moved through the moving path portion It is composed of a water-soluble gas and by-product processing unit as a wet cleaning unit, a water removing unit for removing moisture before introducing the gas treated in the main wet cleaning unit into the main duct, and an electric control unit for controlling the device of the present invention.

1 is a view showing a schematic configuration of a vacuum pump integrated waste gas treatment apparatus of the present invention.

Figure 2 is a view showing the detailed configuration of the pyrolysis and oxidation reaction treatment unit in the vacuum pump integrated waste gas treatment apparatus of the present invention.

3 is an enlarged view of a portion A of FIG. 2 showing the details of the porous reactor 30 of the pyrolysis and oxidation treatment.

4 is a view showing a cooling unit for cooling the hot gas from the pyrolysis and oxidation treatment.

5 is a view showing a gas and by-product movement path leading the gas and by-products cooled through the cooling unit to the next treatment apparatus.

6 is a view showing a main wet cleaning unit in which a main wet cleaning process of gas is performed.

7 is a view showing a water removal unit for removing water in the gas discharged from the main wet cleaning unit and also treating untreated by-products.

1 is a view schematically showing a vacuum pump integrated waste gas treatment apparatus 1000 of the present invention. Reference numeral VP denotes a vacuum pump as a means for introducing waste gas into the treatment apparatus, and reference numeral 200 denotes a gas introduction for treating a gas capable of pyrolysis and oxidation reaction in the waste gas by introducing waste gas delivered through the vacuum pump. And a pyrolysis and oxidation treatment unit, reference numeral 300 denotes a cooling unit for primarily cooling the hot gas passed through the pyrolysis and oxidation treatment unit, and reference numeral 400 denotes a cooling unit for cooling to the next step. A gas and by-product moving path part which moves and also removes by-products generated from the pyrolysis and oxidation reaction part, and reference numeral 500 denotes a main wet type that processes untreated by-products and gas moved through the moving path part. Water-soluble gas and by-product processing unit as the government, and reference numeral 600 denotes the main wet cleaning. It is a water removal unit that removes water before introducing the gas treated in the unit into the main duct. In addition, p1 in the figure is a control system for adjusting the pressure of the gas to be introduced, p2 is a pressure control system for controlling the pressure of the gas discharged by treatment. The pump 1 and the pump 2 are pumps for circulating water for cooling the treated waste gas or for treating the wet process, and the tanks are tanks for storing water supplied and circulated through the pump.

The operation of each part of the present invention will be described with reference to FIG. 1 and other accompanying drawings.

FIG. 2 is a diagram illustrating in detail a gas introduction, pyrolysis, and oxidation treatment unit in which an oxidative waste gas in a semiconductor manufacturing process is introduced and treated first according to an apparatus of the present invention. Gas introduction and pyrolysis and oxidation treatment unit, the waste gas inlet pipe 10 for introducing the waste gas introduced through the vacuum pump (VP) into the pyrolysis and oxidation reaction unit and separation for preventing mixing of inappropriate gases at low temperature N2 inlet 15 for supplying N2, a heat source (heater) 20 composed of a material such as Inconel, and supplying heat for oxidative combustion treatment of waste gas, and an oxidative combustion of waste gas surrounding the outside of the heat source. The porous ceramic reactor 30 in which the reaction takes place, the temperature sensor 40 for measuring the temperature of the reactor to adjust the temperature for the proper oxidative combustion treatment of the waste gas, and is installed on the side of the combustion waste gas processor Oxidation combustion reaction between the air distributor 50 for supplying air for oxidative combustion treatment of the waste gas, and the waste gas injected through the inlet pipe and the air supplied through the air distributor The outer tube 60 of the reactor, the heat insulating material 70 to block the external discharge of the internal heat of the reactor, the air inlet blower 80 for injecting air into the reactor, and the air in the In addition, the particle removal filter 90 for removing fine particles that may damage the reactor, the solenoid valve 100 for controlling the air supplied into the reactor, and to control the pressure of the air supplied to the reactor It consists of a pressure switch 110, and air flowmeters 120 and 130 for checking the amount of air supplied into the reactor.

Most of the conventional combustion waste gas treatment devices are configured to inject air from one side of the waste gas treatment device in one direction, but as shown in FIGS. 1 and 2, waste gas treatment is performed as in a general pyrolysis and waste gas treatment device. In addition to supplying air through the air inlet (I) from the top of the apparatus, an air distributor 50 is installed at the side of the waste gas treatment device to supply air so that complete oxidative combustion treatment of the waste gas can be performed inside the reactor. do.

In addition, the configuration of the reactor in which the oxidative combustion reaction of the waste gas and air in the pyrolysis and oxidation reaction unit 200 of FIG. 2 is typically a heat source (heater) made of inconel and a reactor shell such as Inconel or quartz surrounding the heat source. It consists of. Therefore, when oxidation reaction of waste gas and air occurs, fine particles are generated as by-products depending on the type of waste gas, and they are attached to the reactor endothelium, thereby reducing the efficiency of the reactor. Therefore, there has been a disadvantage in that the reactor endothelium should be cleaned frequently. Accordingly, in the present invention, although air can pass freely, a porous ceramic material having a plurality of spaces through which fine particles, such as submicron, can pass, is used as the shell 40 of the reactor. At the time of operation of the treatment apparatus, the reactor endothelium is introduced because low pressure air introduced into the waste gas treatment apparatus is introduced into the reactor through the pores of the reactor shell and then introduced again through the pores. The fine particles, which are the products of the oxidative combustion reaction of the waste gas and the air, do not adhere. Therefore, compared with the reactor endothelium of the conventional waste gas combustion device, the probability of attachment of fine particles is less, so that the reactor endothelium does not need to be cleaned as often as the conventional technique. This concept is briefly shown in FIG.

As shown in FIG. 3, which is a partial enlarged view of the portion A of FIG. 2, the porous ceramic reactor shell 30 encloses the heat source 20, and on the surface and the inside, numerous fine pores through which fine particles of submicron can pass. Are formed. Since the pores are connected to each other, as shown in the drawing, the air injected into the combustion waste gas treatment apparatus is introduced into the shell through the pores formed in the porous ceramic reactor shell 30, and the introduced air Again through the pores it is released out of the shell, ie outside the reactor shell. As such, since the air can freely move in and out of the reactor envelope through the pores of the porous ceramic reactor shell, it is difficult for the fine particles resulting from the combustion gas of the waste gas and air to adhere to the ceramic reactor shell. The ceramic reactor shell may be made of a commercially available ceramic material such as alumina (Al ₂ O ₃ ) or easily manufactured, and the heat source 20 may be a ceramic heater.

The pyrolytic and oxidation reactive waste gases are treated in the pyrolysis and oxidation reaction unit 200 configured as described above. For example, in the case of SiF4 and C2F6, in which pyrolysis and oxidation occur, in the case of SiF4, first of all, it is converted into Si + 2F2 by pyrolysis, which in turn becomes SiO2 + 2F2. In the case of C2F6, it first becomes 2C + 3F2 by pyrolysis, which in turn becomes 2CO2 + 3F2 by oxidation. SiH4 is not pyrolyzed and becomes SiO2 + 2H2O only by oxidation.

As such, the gases undergoing thermal decomposition and oxidation and by-products generated by the oxidation reaction are transferred to the cooling unit 300. Typically, gases exiting from pyrolysis and oxidation are typically about 600 to 1200 ° C., so they must be cooled rapidly before wet treatment and cleaning. This cooling is made in the cooling unit 300. 4 is a view showing a cooling unit.

As shown in FIG. 1 and FIG. 4, water is supplied from the tank to the cooling unit 300 through the pump 2, and the water supplied to the cooling unit is circulated back to the tank. As such, water is used to cool the gas that has undergone pyrolysis and oxidation, and at the same time, it has a function of primary wet treatment of the gas. In addition, by supplying the circulating water through the pump it is also to prevent the solid by-products generated by the oxidation reaction to adhere to the inner wall.

Gas and solid by-products passed through the cooling unit 300 pass through the gas and by-product moving path 400. FIG. 5 is a view schematically illustrating a gas and a by-product movement path 400.

As shown in FIG. 5, the circulating water is supplied from the tank in the form of a nozzle 410 by spraying the gas and by-products introduced into the path part 400 through the cooling part 300. As such, when the circulating water is supplied to the gas and the by-product passing through the movement path part 400, the gas passes through the cooling part 300 but functions to secondaryly cool the gas which is still at a high temperature. It will have the function of performing low-efficiency wet treatment on by-products of. In addition, by supplying the circulating water, it is possible to prevent the solid by-products produced by the oxidation reaction to settle in the pipeline.

Gas and by-products are separated from each other at the end of the movement path 400. As shown in the figure, by-products are directed downward in the figure and filtered by a strainer shown in a net form at the top of the tank of FIG. 1, and water soluble gas is directed upward in the figure to the main wet cleaner 500. Will be supplied.

The gas and the untreated by-products passing through the movement path part 400 are supplied to and treated by the main wet cleaning part 500 which is a water-soluble gas and by-product treating part.

6 is a view briefly showing the main wet cleaning unit. The main wet cleaning unit 500 includes an adsorbent 510 capable of adsorbing gas and by-products, a circulating water supply unit 520 for supplying circulating water for treating a water-soluble gas, and a circulating water in which a water-soluble gas is dissolved. It consists of a pure water supply unit 530 for supplying pure water (or general tap water) for treating the water-soluble gases that are not dissolved through. In such a configuration, the gas and the untreated by-products passing through the movement path part 400 are adsorbed to the adsorbent while passing through the adsorbent 510, and at the same time, by the circulating water sprayed in the spray form from above the adsorbent 510. Aqueous gases are dissolved into the circulating water. In addition, the minute amount of gas remaining without being dissolved by the circulating water is dissolved by water sprayed by the pure water supply unit 530 above the circulating water supply unit in the form of a spray. As such, the toxic gases are all treated by the adsorbent, the circulating water, and the pure water (general tap water), and the non-toxic gases are discharged through the washing unit 500. Acid and basic wastewater with toxic gases dissolves into the circulating water tank along with the byproducts, which are filtered out by the strainer in the tank.

As such, the gases processed in the main wet cleaning unit are discharged to the main duct through the water removing unit 600 as shown in FIG. 7. As shown in the figure, the non-toxic gases processed in the main wet cleaning unit is supplied from the top of the water removing unit 600 to the bottom, while the water contained in the wet cleaning unit is removed, the water is removed It is exhausted to the outside through a duct 610 connected to an external main duct (not shown). In addition, the water removal unit not only treats wastewater treated with moisture in the non-toxic gas supplied from the main wet scrubbing unit, but also sends a small amount of residual by-products left untreated by the main wet scrubbing unit to be treated.

Gases that have been processed through all the processes described above are completely non-toxic pure gas without harm to the human body.

As described above, the pyrolysis and oxidation treatment apparatus and the wet treatment apparatus for individually treating each kind of waste gas generated during the semiconductor manufacturing process are integrally formed, and the introduction of the waste gas is performed by a vacuum pump, The small size of the device facilitates maintenance and facilitates the introduction of waste gas. In addition, since the size of the device is smaller, the installation area is smaller, and the use of workplace space is increased, resulting in economic benefits.

In addition, gas and by-products from the pyrolysis and oxidation reaction treatment are primarily wet-cleaned in the cooling section for cooling, and water is sprayed using the circulating water in the moving path section for moving the gas through the cooling section to the main wet cleaning unit. The secondary wet cleaning is performed by spraying in the form, and the main wet cleaning is performed in the main wet cleaning unit, so that there is an effect of allowing complete treatment of the water-soluble waste gas in the waste gas.

In addition, since the water is sprayed in the form of a spray using the circulating water in the gas and the by-product moving path portion, there is an effect that can prevent the by-products are caught in the pipeline.

In addition, in the water removal unit, by treating not only the water in the treated gas, but also untreated by-products, the gas is completely clean before being exhausted to the outside, and also by completely treating the by-products that may be harmful, There is also the effect of more advanced waste gas treatment than equipment.

Claims (4)

A vacuum pump integrated waste gas treatment apparatus for treating waste gas containing toxic gas generated during a semiconductor process and an LCD manufacturing process, A vacuum pump (VP) for smoothly supplying waste gas generated in the semiconductor processing apparatus to the waste gas treating apparatus; An inlet (10) receiving waste gas for pyrolysis and oxidation reaction from the vacuum pump (VP), an N2 supply pipe (15) for supplying separation N2 for preventing mixing of inappropriate gases at low temperature, and waste gas A heater 20 generating heat required for pyrolysis and oxidation reaction, a porous reactor 30 surrounding the heater and undergoing pyrolysis and oxidation of waste gas, and a temperature measuring temperature for temperature control of the reactor Sensor 40, air inlet tube I and air distributor 50 for adequately supplying air for oxidation reaction of the waste gas, outer tube 60 of the pyrolysis and oxidation reaction treatment unit, and internal heat of the treatment apparatus. A heat insulating material (70) for blocking the discharge to the outside, an air inlet blower (80) for introducing air necessary for the oxidation reaction of the waste gas, a filter (90) for removing impurity particles in the air, Air The solenoid valve 100 to control the mouth, the pressure switch 100 for controlling the pressure of the incoming air, and the air flow meter (120, 130) for measuring the amount of air to control the amount of the incoming air And, the pyrolysis and oxidation reaction processing unit 200 for processing the waste gas introduced through the vacuum pump (VP); Cooling unit 300 for cooling the high-temperature waste gas treated in the pyrolysis and oxidation reaction treatment unit 200 with circulating water; By cooling the gas cooled in the cooling unit 300 again using the nozzle 410 for spraying the circulating water in a spray form, and also generated as a result of the oxidation reaction in the pyrolysis and oxidation treatment unit 200. A gas and by-product moving path unit 400 which separates the by-product and the gas to lead the gas to the next processing unit; From the bottom, the adsorbent 510, the circulating water spray nozzle 520, and the pure water spray nozzle 530 are sequentially configured to spray the circulating water and the pure water from the upper side of the adsorbent to the gas and the by-product moving path part 400. A main wet cleaning unit 500 for wet treating the gas supplied through the same and treating and removing byproducts; Moisture removal unit 600 is installed, the moisture removal unit 600 to process the moisture in the gas before discharged to the main main duct discharged from the main wet cleaning unit, and to capture and remove the untreated by-products in the process 600 )Wow; A tank for storing circulating water; A vacuum pump, characterized in that consisting of the pump (pump 1 and pump 2) for providing the circulating water to the cooling unit 300, the gas and by-product movement path 400 and the main wet cleaning unit 500. Integrated waste gas treatment device. The apparatus of claim 1, wherein the porous reactor (30) of the pyrolysis and oxidation reaction treatment unit (200) is made of a ceramic material such as alumina in which a plurality of fine pores are formed. According to claim 1, The cooling unit 300, vacuum pump-integrated waste gas treatment apparatus, characterized in that the first wet cleaning of the water-soluble gas in the gas from the pyrolysis and oxidation reaction treatment unit 200 is performed. According to claim 1, By using the circulating water spray nozzle 410 in the gas and the by-product moving path 400 sprays the circulating water in the spray form, not only cooling the gas from the cooling unit 300 again In addition, the vacuum pump-integrated waste gas treatment apparatus, characterized in that the secondary wet cleaning treatment of the water-soluble gas in the gas and to prevent by-products from being caught in the pipeline.