KR200318488Y1 - Protected vacuum cap for small connector - Google Patents

Abstract

The present invention relates to a vacuum suction cap for protecting a very small connector that is used to protect the contacts of the very small connector and indirectly secures the suction surface of the vacuum connector during vacuum adsorption, capping the miniature connector (30) Covered with 40 to conceal the contact 32 in the miniature connector 30, and fix the cap 40 to the microminiature connector 30 by means of fastening means, and the upper surface of the cap 40 is vacuumed. The vacuum suction surface 42 for vacuum suction from the nozzle 60 is formed.

Therefore, the present invention is designed to protect the miniature connector by capping, so it protects the contacts of the miniature connector from scattering of lead balls or fluxes that may occur in the soldering process, and vacuum adsorption by the vacuum nozzle. Since the surface is formed on the upper surface of the cap, it is possible to eliminate the suction space and the suction surface when designing and manufacturing the microminiature connector, thereby minimizing the miniaturized connector.

Description

Protected vacuum cap for small connector

The present invention relates to a vacuum connector cap for protecting a micro connector, which is used to protect the contacts of the micro connector and to indirectly secure the vacuum suction surface during the vacuum adsorption, and more particularly, to the micro connector. By covering and protecting the contacts from the scattering of lead balls or fluxes that may occur in the soldering process, and by providing a vacuum suction surface for vacuum nozzle adsorption, the micro-connector of the micro connector is removed without securing the suction space and the suction surface. The present invention relates to a vacuum adsorption cap for protecting a miniature connector that enables miniaturization of a miniature connector by enabling design and manufacture.

Printed circuit board mounting connectors are widely used to connect boards and boards in a layer, to connect flat cables, to slot-type boards, and to connect female and female connectors. A small connector is needed.

On the other hand, printed circuit boards are mounted on the surface of the board by automatic insertion in order to ensure assembly productivity and reliability, such automatic insertion machine and vacuum suction nozzle (Vacumm Nozzle) for adsorbing electronic components from the component supply magazine It consists of a positioning mechanism for transferring the absorbed electronic parts from the magazine to the pattern of the printed circuit board. Especially, when the micro connector is automatically inserted by vacuum adsorption, the adsorption space and the adsorption surface for the vacuum nozzle are inserted into the micro connector. There was a limit to reducing the size because it must be secured.

That is, as shown in FIG. 1, the conventional microminiature connector 20 has a connection port 22 having a predetermined width W in the center thereof, and the outer wall surface is formed from the inner wall surface of the central connector 22. It was a structure in which a plurality of contacts 24 and leads are formed on the lower side of the ride. In order to secure an adsorption space and an adsorption surface for the vacuum nozzle 26 with the conventional microminiature connector 20, a central connector 22 ) The width (W) must be at least the width (for example, 1.15mm) that the vacuum nozzle 26 can enter and exit, so that the suction by the vacuum nozzle 26 is possible, so there is a limit to miniaturization of the miniature connector. there was.

In addition, since the contact 24 provided in the microminiature connector 20 has been exposed to the outside, short-circuit at the contact point 24 due to scattering of lead balls and fluxes that may occur during soldering operations. There was a problem that mass production, and because the connection port 22 was exposed to the outside can not block the inflow of foreign matters from the outside during transportation or handling, there is a problem that the reliability of the product is deteriorated due to a large amount of connection failure caused by the foreign matter introduced there was.

The present invention has been made to solve the above problems, the object of which is to minimize the size of the micro-connector can be further miniaturized by designing and manufacturing the micro-connector in the state excluding the securing of the vacuum suction surface for vacuum adsorption. By concealing the contacts of the microminiature connector, it protects the contacts from the scattering of lead balls and fluxes that may occur during soldering operations, and prevents foreign substances from entering the microminiature connector during transportation and handling. It is to provide a vacuum suction cap for miniature connector protection to ensure the reliability of the connection.

In order to achieve the object of the present invention, the micro connector is covered with a cap to conceal the contacts in the micro connector, and the cap is fixed to the micro connector by fixing means, and the vacuum from the vacuum nozzle is placed on the upper surface of the cap. A vacuum suction cap for protecting a very small connector is provided by forming a vacuum suction surface for adsorption.

1 is a perspective view showing an example of a conventional microminiature connector

Figure 2 is a perspective view showing the structure of the vacuum suction cap for miniature connector protection according to the present invention

Figure 3 is an exploded perspective view showing the structure of the ultra-small connector protection vacuum adsorption cap according to the present invention

* Explanation of Signs of Major Parts of Drawings *

30: micro connector 32: contact

40: cap 42: vacuum suction surface

44,46: side wall 47,49: hook portion

60: vacuum nozzle

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 and 3 are a perspective view and an exploded perspective view showing the structure of the vacuum suction cap for protecting the miniature connector according to the present invention, as shown therein to cover the miniature connector 30 with the cap 40, The contact 32 in the connector 30 is concealed, and the cap 40 is fixed to the micro connector 30 by fixing means, and the vacuum suction from the vacuum nozzle 60 is attached to the upper surface of the cap 40. It was configured by forming a vacuum adsorption surface 42 for.

Here, the fixing means vertically forms sidewalls 44 and 46 that are elastically downward from the left and right ends of the cap 40 so that the micro connector 30 is interposed between the side walls 44 and 46. It can be configured to.

Although not shown in the drawings, the coupling relationship between the cap 40 and the miniature connector 30 is not limited to the interference fit and may include both a hook coupling method or a similar locking coupling method.

In addition, hook portions 47 and 49 were formed at the front and rear ends of the cap 40 so that the cap 40 could be easily held by a finger or a forefinger when the cap 40 was separated from the micro connector 30.

That is, the cap 40 and the side walls 44 and 46 are integrally molded, and the cross-sectional shape is, for example, a door structure.

Hereinafter, the operation according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 2 and 3, when the contact 32 installed in the micro connector 30 is exposed to the outside, the cap 40 is covered to protect it. The cap 40 and the micro connector 30 are sandwiched between the side walls 44 and 46 formed on the left and right sides of the 40 by the elastic force of the side walls 44 and 46. Will remain coupled.

In the above state, the upper surface of the contact 32 installed in the micro connector 30 is concealed by the cap 40, and the contact 32 passing through the side surface of the micro connector 30 is the cap 40. It is protected by the side walls 44 and 46 which are formed in it.

Meanwhile, when soldering the microminiature connector 30 with the cap 40 to the printed circuit board 70, the vacuum nozzle 60 is positioned on the microminiature connector 30 to the upper surface of the capped cap 40. When the negative pressure is applied to the vacuum nozzle 60 and lowered toward the upper surface of the cap 40, the cap is instantaneously brought into close contact with the vacuum suction surface 42 formed on the upper surface of the cap 40. 40 is attracted to the vacuum nozzle 60 by the negative pressure.

Then, when the vacuum nozzle 60 is lifted by the positioning mechanism (not shown) and moved over the pattern of the printed circuit board 70, the micro connector 30 and the cap 40 are held by the fixing means. Therefore, the cap 40 and the miniature connector 30 are moved in accordance with the movement of the vacuum nozzle 60. At this time, if the micro connector 30 is removed after the negative pressure is removed, the miniature connector ( 30 and the cap 40 remain on the printed circuit board 70, and only the vacuum nozzle 60 can be returned.

When heat is applied to the lead of the microminiature connector 30 in the above state, the lead ball on the pattern 72 of the printed circuit board 70 is melted and the microminiature connector 30 is soldered to the printed circuit board 70. Is fixed.

At this time, a part of the lead ball and the flux is scattered in all directions in the process of heating and melting the lead ball, because the upper and side surfaces of the microminiature connector 30 are protected by the caps 40 and the side walls 44 and 46. Lead is blocked by the cap 40 and the side walls 44 and 46 to prevent the internal contacts 32 from sticking.

Then, when connecting another male or female connector or a flat cable to the micro connector 30, the cap 40 should be removed from the micro connector 30. At this time, the hook portion formed at the front and rear ends of the cap 40 (47) (49) When held by hand or pulled up using a forceps, the cap 40 is separated from the micro connector 30.

If the cap 40 is separated into another new microminiature connector 30 and then the previous process is repeated, the cap 40 can be reused several times.

The present invention as described above does not need to place the suction space for the vacuum nozzle in the miniature connector, it becomes possible to further miniaturize the miniature connector, there is an effect of miniaturizing electronic products using the same. In case of soldering work, the contact part is protected by the cap, so the short defective rate due to lead ball and flux scattering can be significantly reduced, and the connection defect can be prevented by preventing the inflow of foreign substances from the outside.

Claims (3)

The micro connector 30 is covered with the cap 40 to conceal the contact 32 in the micro connector 30, and the cap 40 is fixed to the micro connector 30 by fixing means. The upper surface of the cap 40 is formed by forming a vacuum suction surface 42 for vacuum suction from the vacuum nozzle 60, characterized in that the miniature connector protection vacuum suction cap. The microminiature connector according to claim 1, wherein the fixing means vertically forms elastic sidewalls (44) and (46) downward from left and right ends of the cap (40). 30) Miniature connector protection vacuum adsorption cap, characterized in that it is configured to fit. The vacuum suction cap for protecting a miniature connector according to claim 1 or 2, further comprising hook portions (47) (49) formed at front and rear ends of the cap (40).