KR200308004Y1 - combi type dual interface chip card - Google Patents

Abstract

The present invention relates to a combination type dual interface chip card having a structure capable of easily and accurately mounting the chip base on the card stack, the inlay layer having a coil-type loop antenna attached to one side, and the upper and lower surfaces of the inlay layer Each of the upper and lower layers, a seating groove formed on an outer surface of the upper layer, a chip receiving groove formed at the center of the seating groove, and the chip receiving groove independently of the chip receiving groove so that both ends of the loop antenna are exposed. A card stack comprising a pair of terminal grooves formed in the card stack; A chip base formed on one surface and a pair of terminals inserted into the terminal groove and protruding to be in contact with an end of the loop antenna, the chip base mounted on the seating groove; Provided is a combination type dual interface chip card including an IC chip mounted on the chip base to be electrically connected to the circuit and the terminal, the IC base accommodated in the chip receiving groove when the chip base is mounted in the seating groove.

The present invention can accurately and easily mount the chip base to the card stack, there is an effect that can prevent the short-circuit and failure of the circuit due to the spread and flow of the conductive adhesive when the chip base is mounted.

Description

Combi type dual interface chip card

The present invention relates to a smart card, and more particularly, a combination type dual interface chip card having a structure capable of easily and accurately mounting a chip base on which an IC chip is mounted on a card stack in which an inlay layer, an upper layer, and a lower layer are stacked. It is about.

A smart card is a plastic card in which a microprocessor (CPU) or a memory is embedded to store and process information. Such smart cards are divided into two types, contact and contactless, according to a communication method with an external (card reader). Here, an integrated circuit chip (IC) is embedded in the contact card, and the card is activated by contacting the contact when inserted into the card reader. In addition, an RF chip and a coil-type loop antenna are embedded inside the contactless card, and when the proximity card reader is approached, induced electromotive force is generated to activate the card by driving the card.

Smart cards do not have a built-in battery, and power is provided from the outside by a card reader. The memory uses an electrically erasable programmable read only memory (EEPROM) that can retain its contents even when no voltage is provided. The memory card does not include a microprocessor and includes only memory. In the strict sense, the memory card is not a smart card, but may be included in a broad sense.

In addition to the above-described contact card and contactless card, such a smart card is collectively further included a combination card and a hybrid card in which a contact / contactless card is combined in one card. In this case, the combination card is a chemically coupled card that shares parts that can be shared by a contact / contactless card, and has an IC chip and a loop antenna built therein. In addition, a hybrid card has a physical contact card and a non-contact card in an independent form in a single card, and an IC chip, an RF chip, and a loop antenna are built therein.

1 is a perspective view showing the structure of a general combination card among the four types of smart cards described above, with reference to this will be described in detail the configuration of the combination card.

The combination card includes a card stack 10 having a loop antenna 14 embedded therein, a chip base 20, and an IC chip 30.

The card stack 10 includes an inlay layer 11, and an upper layer 12 and a lower layer 13 stacked on upper and lower surfaces of the inlay layer 11, respectively. The coiled loop antenna 14 is formed on one surface of the inlay layer 11, for example, the surface bonded to the upper layer 12.

The mounting groove 15 is cut on one surface of the card stack 10, for example, the upper layer 12, by a cutting tool such as an end mill, and is recessed. Here, the mounting groove 15 is formed so that both ends 14a of the loop antenna 14 may be sufficiently exposed as shown in FIGS. 1 and 2. And the chip receiving groove 16 is formed in the center of the bottom surface of the mounting groove (15).

The chip base 20 is formed in the same shape as the mounting groove 15 so that the chip base 20 can be inserted into the mounting groove 15, and a circuit (not shown) is printed on one surface thereof, for example, a lower surface thereof. In the circuit, a pair of terminals 21 are formed in contact with both ends 14a of the loop antenna 14 when mounted in the seating groove 15.

The IC chip 30 is mounted on the chip base 20 to be electrically connected to the circuit and the terminal 21.

When manufacturing the combination card configured as described above, as shown in FIG. 2, the chip base 20 on which the IC chip 30 is mounted is mounted in the seating groove 15 and then fixed by bonding with a conductive adhesive. In this case, the conductive adhesive is interposed between the both ends 14a of the loop antenna 14 and the terminals 21 of the chip base 20. As such, when the chip base 20 is mounted in the state where the conductive adhesive is interposed, the IC chip 30 is inserted into the chip receiving groove 16 and the chip base 20 is seated in the seating groove 15. Mounting is complete.

However, in the combination card having the above structure, defects due to the flow of the conductive adhesive often occur when the chip base 20 is mounted. That is, the conductive adhesive is interposed between the end portions 14a of the loop antenna 14 and the terminals 21 of the chip base 20, and the conductive adhesive spreads to the side when the chip base 20 is mounted. If the amount of the conductive adhesive interposed therebetween is introduced to the chip receiving groove 16 side. The conductive adhesive spreading to the side or introduced to the chip receiving groove 16 side short-circuits the circuit printed on the chip base 20 and the IC chip 30 to cause a defect.

On the other hand, in the combination card having the above-described structure is not provided at all the structure that guides the correct mounting point when mounting the chip base 20, the chip base 20 is mounted in a position outside the error range also causes a failure Often occurs.

The present invention has been made to solve the above problems, and its object is to provide a combination type dual interface chip card having a structure capable of mounting the chip base on which the IC chip is mounted at the correct mounting position of the card stack. .

Another object of the present invention, when the chip base is mounted on the card stack, and the terminal of the chip base and the end of the loop antenna to be fixed by a conductive adhesive, the short circuit and defect caused by the spread and flow of the conductive adhesive, etc. To provide a combination type dual interface chip card having a structure that can effectively prevent the.

1 is an exploded perspective view showing a general combination card structure

2 is a cross-sectional view showing the mounting structure of the chip base in a general combination card

Figure 3 is an exploded perspective view showing the structure of one embodiment of the present invention

Figure 4 is a cross-sectional view showing the mounting structure of the chip base in one embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: card stack 110: inlay layer

120: upper layer 130: lower layer

140: loop antenna 141: end

150: seating groove 160: chip receiving groove

170: terminal groove 200: chip base

210: terminal 300: IC chip

The present invention for achieving the above object, the coil antenna loop inlay layer attached to one side, the upper and lower layers are respectively laminated on the upper and lower surfaces of the inlay layer, the seating groove formed on the outer surface of the upper layer, and A card stack including a chip receiving groove formed at the center of the seating groove and a pair of terminal grooves formed in the seating groove independently of the chip receiving groove so that both ends of the loop antenna are exposed; A chip base formed on one surface and a pair of terminals inserted into the terminal groove and protruding to be in contact with an end of the loop antenna, the chip base mounted on the seating groove; Provided is a combination type dual interface chip card including an IC chip mounted on the chip base to be electrically connected to the circuit and the terminal, the IC base accommodated in the chip receiving groove when the chip base is mounted in the seating groove.

Detailed features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. In describing the embodiments of the present invention with reference to the drawings, the same components and the same reference numerals are given, additional description thereof will be omitted below.

3 illustrates the structure of one embodiment of the present invention. Hereinafter, as an embodiment of the present invention will be described with a combination type dual interface chip card shown in FIG. However, it is noted that the present invention is not limited to the combination type card first.

Referring to FIG. 3, the combination type dual interface chip card according to the present invention includes a card stack 100, a chip base 200, and an IC chip 300.

The card laminate 100 is made of synthetic resin of an insulating material, and the upper layer 120 and the lower layer 130 are laminated on the upper and lower surfaces of the inlay layer 110, respectively. The card stack 100 formed as described above includes a loop antenna 140, which is attached to one surface of the inlay layer 110, for example, a surface bonded to the upper layer 120. However, the loop antenna 140 does not necessarily need to be formed on the surface bonded to the upper layer 120, and may be formed on the surface bonded to the lower layer 130 as necessary. The loop antenna 140 is formed in a coil shape along the circumferential surface of the inlay layer 110 as shown in FIG. 3, and both ends 141 are disposed to face each other.

The card stack 100 formed as described above is provided with a seating groove 150, a chip receiving groove 160, and a terminal groove 170.

The mounting groove 150 is formed on one surface of the card stack 100, for example, the outer surface of the upper layer 120. Here, the mounting groove 150 is formed to include the upper side in the vertical direction of the point where both ends 141 of the loop antenna 140 as shown in FIG. At this time, both ends 141 of the loop antenna 140 should not be exposed to the outside by the mounting groove 150, unlike the conventional structure.

The chip receiving groove 160 is formed concave in one side, for example, a central portion of the bottom surface of the seating groove 150. In FIG. 4, the bottom surface of the chip receiving groove 160 is illustrated to be formed at the boundary between the inlay layer 110 and the lower layer 130. However, this is merely illustrative, and the depth of the chip receiving groove 160 is limited in the present invention. no. That is, since the chip receiving groove 160 is formed to accommodate the IC chip 300, the chip receiving groove 160 is formed to the middle depth of the inlay layer 110 or the middle depth of the lower layer 130 according to the specification of the IC chip 300. It can be.

As shown in FIGS. 3 and 4, a pair of terminal grooves 170 are formed on a bottom surface of the mounting groove 150 so that the end 141 of the loop antenna 140 is exposed to the outside. The terminal groove 170 formed as described above is independently formed so as not to communicate with the chip receiving groove 160, as shown in FIG. 4, and the end 141 of the loop antenna 140 is exposed on the bottom surface thereof.

On the other hand, the chip base 200 is formed in a shape corresponding to the mounting groove 150 to be inserted into the mounting groove 150 of the card stack 100, the circuit (not shown) is printed on the bottom The upper surface is plated with a conductive metal such as gold. The gold plated upper surface thus forms a contact that communicates with the card reader when the combination card is inserted into an external card reader. On the other hand, the terminal 210 is formed on the lower surface of the chip base 200, the terminal 210 is inserted into the terminal groove 170 of the card laminated body 100, unlike the conventional structure that was formed flat in the present invention To protrude convexly in the form of a column so as to be in contact with the end 141 of the loop antenna 140.

The IC chip 300 is mounted on the printed surface of the chip base 200 while being electrically connected to the circuit and the terminal 210.

When manufacturing the Combi-type dual interface chip card according to the present invention formed in the above structure as shown in Figure 4 mounted on the seating groove 150, the chip base 200 is mounted IC chip 300 After the adhesive is fixed by the adhesive. In this case, the conductive adhesive is interposed between the end portions 141 of the loop antenna 140 and the terminal 210 of the chip base 200, that is, the bottom surface of the terminal groove 170. When the chip base 200 is mounted in the state where the conductive adhesive is provided on the bottom surface of the terminal flaw 170, the IC chip 300 is inserted into the chip receiving groove 160, and the terminal 210 is connected to the terminal groove ( Inserted into the 170, the mounting is completed in an electrically connected state with the end 141 of the loop antenna 140. Of course, the chip base 200 is completely inserted into the mounting groove 150 is mounted.

When the chip base 200 is mounted on the card stack 100 with the above structure, short circuits and defects caused by spreading and flow of the conductive adhesive are prevented. That is, since the conductive adhesive is interposed on the bottom surface of the terminal groove 170, in the combination card according to the present invention, the intervening conductive adhesive does not spread to the circuit side formed on the bottom surface of the chip base 200, thereby preventing a short circuit. In addition, since the terminal groove 170 is formed independently of the chip receiving groove 160, there is no fear that the conductive adhesive interposed on the bottom surface of the terminal groove 170 flows to the chip receiving groove 160 side.

Meanwhile, in the combination type dual interface chip card according to the present invention, the terminal 210 protruding from the chip base 200 and the terminal 210 are inserted when the chip base 200 is mounted on the card stack 100. Since the terminal groove 170 is formed to be concave in the card stack 100 to determine the exact mounting position of the chip base 200, it is possible to prevent the bad mounting out of the error range in advance.

On the other hand, although several embodiments have been described above, it is apparent to those skilled in the art that the present invention can be embodied in many other forms without departing from the spirit and scope thereof.

For example, if an RF chip is used instead of an IC chip and the chip base mounting structure according to the present invention is applied identically, the present invention is equally applicable to other types of smart cards such as a contactless card, that is, an RF card, not a combination card. Could be.

Accordingly, the above-described embodiments should be considered as illustrative and not restrictive, and all embodiments within the scope of the appended claims and their equivalents are included within the scope of the present invention.

According to the present invention, the chip base can be accurately and easily mounted on the card stack, and when the chip base is mounted, there is an effect of preventing short circuits and defects from occurring due to spreading and flow of the conductive adhesive. .

Claims (1)

An inlay layer having a coil-shaped loop antenna attached to one surface, an upper layer and a lower layer respectively stacked on upper and lower surfaces of the inlay layer, a seating groove formed on an outer surface of the upper layer, and a chip receiving groove formed at the center of the seating groove; A card stack including a pair of terminal grooves formed in the seating groove independently of the chip receiving groove such that both ends of the loop antenna are exposed; A chip base formed on one surface and a pair of terminals inserted into the terminal groove and protruding to be in contact with an end of the loop antenna, the chip base mounted on the seating groove; And a IC type mounted on the chip base to be electrically connected to the circuit and the terminal, the IC chip being accommodated in the chip receiving groove when the chip base is mounted in the seating groove.