KR20030090994A - METHOD FOR MANUFACTURING MULTILAYERED CLAD PALATE INCLUDING A Cu PLATE - Google Patents

METHOD FOR MANUFACTURING MULTILAYERED CLAD PALATE INCLUDING A Cu PLATE Download PDF

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KR20030090994A
KR20030090994A KR1020020028903A KR20020028903A KR20030090994A KR 20030090994 A KR20030090994 A KR 20030090994A KR 1020020028903 A KR1020020028903 A KR 1020020028903A KR 20020028903 A KR20020028903 A KR 20020028903A KR 20030090994 A KR20030090994 A KR 20030090994A
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plate
manufacturing
clad
film
sts
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홍유표
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홍유표
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE: A method of manufacturing a multi-clad panel having at least a copper(Cu) plate is provided, which has good interlayer adhesion by preventing a surface of the Cu plate from being oxidized even if it is heated at a high temperature during pressure bonding. CONSTITUTION: The method of manufacturing a multi-clad panel having at least a Cu plate(1) comprises: sequentially applying nickel(Ni) and chromium(Cr) on both surfaces of the Cu plate(1) to form anti-oxidative layers(2-1,2-2); superposing an aluminum(Al) plate(3) and a stainless steel plate(4) on both surfaces of the Cu plate(1) having the anti-oxidative layers(2-1,2-2) and heating the resultant structure at 200-350deg.C; and pressure-bonding the superposed plates at 200-350deg.C.

Description

Ｃｕ판을 포함하는 다층의 클래드 판재 제조 방법{METHOD FOR MANUFACTURING MULTILAYERED CLAD PALATE INCLUDING A Cu PLATE}METHOD FOR MANUFACTURING MULTILAYERED CLAD PALATE INCLUDING A Cu PLATE}

본 발명은 서로 다른 금속층이 다층으로 적층된 클래드 판재를 제조하는 방법에 관한 것으로, 보다 상세하게는 Cu판을 포함하는 클래드 판재에 대한 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a clad plate material having different metal layers laminated in multiple layers, and more particularly, to a method for manufacturing a clad plate material including a Cu plate.

클래드 판재는 이종(異種)의 금속을 일체로 접합한 판재로서, 단일 소재 금속들의 장점을 취하는 한편 단점을 보완하여 판재의 물성을 향상시킨 것이다. 현재 클래드 판재 중에 가장 많이 사용되고 있는 것은 알루미늄(Al)과 스텐레스 강(STS)이 적층된 Al/STS 클래드 판재이다. 이는 가볍고, 열전도성이 우수한 알루미늄과, 내식성과 강도가 좋은 스텐레스의 장점을 취함으로써 주방용품은 물론 화학용기 등에 널리 쓰이고 있다. 이러한 Al/STS 클래드 판재는 Al 합금과 STS 판재를 200℃ 이상의 온도에서 소정의 압하율로 가압접합(이하, 압접이라고 함)하여 제작된다.Clad plate is a plate material in which heterogeneous metals are integrally bonded to each other, taking advantage of single material metals and supplementing the disadvantages to improve physical properties of the plate. Currently, the most commonly used clad plate is Al / STS clad plate in which aluminum (Al) and stainless steel (STS) are laminated. It is widely used in kitchenware as well as chemical containers by taking advantage of light, excellent thermal conductivity of aluminum and stainless steel with good corrosion resistance and strength. The Al / STS clad plate is produced by press-bonding (hereinafter referred to as pressure welding) an Al alloy and an STS plate at a predetermined reduction ratio at a temperature of 200 ° C. or higher.

최근에는 Al/STS의 층간에 Cu 판을 개재하여 접합한, STS/Al/Cu/Al/STS 구조의 클래드 판재가 주방용품에서 크게 각광을 받고 있다. Cu가 Al(Al 3003 기준) 보다 강도가 2배 이상 높을 뿐 아니라, 열전도성이 3배 이상으로 내용물의 온도를 빠르게 또한 균일하게 상승시키기 때문이다.Recently, clad plate materials of the STS / Al / Cu / Al / STS structure, which are bonded to each other via Al / STS layers through Cu plates, have gained much attention in kitchen appliances. This is because Cu not only has two times higher strength than Al (based on Al 3003), but also increases the temperature of the contents rapidly and uniformly by three times or more.

그러나 이와 같은 STS/Al/Cu/Al/STS 클래드 판재는 그 제작이 용이하지 않다는 문제점이 있다. 이는 클래딩을 위한 압연 과정 중에 발생하는 Cu의 산화에 기인한다. 클래딩을 위한 압연은 충분한 층간 접합력을 얻기 위해 대개 200℃ 이상의 온도에서 행해지는데, Cu의 경우 200℃에서 대기에 노출되면 쉽게 산화되어 접합이 거의 불가능하거나, 차후 딥드로잉(deep drawing) 등의 가공 중에 쉽게 박리가 일어날 정도로 약하게 접합되기 때문이다.However, such a STS / Al / Cu / Al / STS clad plate material has a problem that the production is not easy. This is due to the oxidation of Cu, which occurs during the rolling process for the cladding. Rolling for cladding is usually carried out at temperatures above 200 ° C in order to obtain sufficient interlaminar bonding. In case of Cu, exposure to air at 200 ° C is easily oxidized and almost impossible to join, or during subsequent deep drawing processes. This is because the bonding is weak enough that peeling easily occurs.

상술한 바와 같은 Cu의 산화를 막기 위해 Al 및 STS만 가열하는 한편 Cu를 가열하지 않는 방법이 시도되고 있으나, 이 경우는 접합력이 매우 미약할 수밖에 없고, 그에 따라 성형 등의 후속 공정에서 쉽게 박리가 일어나게 된다.In order to prevent the oxidation of Cu as described above, a method of heating only Al and STS while not heating Cu has been attempted, but in this case, the bonding force is very weak, and thus peeling is easily performed in a subsequent process such as molding. Get up.

본 발명은 상술한 문제점을 해결하기 위해 안출된 것으로, 층간 접합을 위한 압접 공정 중에 충분히 가열되어도 Cu층의 표면이 산화되지 않도록 함으로써, 우수한 층간 접합력을 얻을 수 있는 클래드 판재 제조방법을 제공하는 목적을 갖는다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a clad plate, which is capable of obtaining excellent interlayer bonding strength by preventing the surface of the Cu layer from being oxidized even when heated sufficiently during the pressure welding process for interlayer bonding. Have

도 1a 내지 도 1c는 본 발명의 바람직한 일실시예에 따른 다층의 클래드 판재의 제조 공정 플로우를 개략적으로 나타낸 도면.1A to 1C are schematic views illustrating a manufacturing process flow of a multi-layer clad plate according to a preferred embodiment of the present invention.

상술한 목적을 달성하기 위한 본 발명은 적어도 Cu판을 포함하는, 다층의 클래드 판재를 제조하는 방법으로서:The present invention for achieving the above object is a method for producing a multi-layer clad plate material comprising at least a Cu plate:

(가) 상기 Cu판의 양쪽 표면에 Ni과 Cr을 순차로 도금하여 산화방지막을 형성하는 단계; 및(A) forming an antioxidant film by sequentially plating Ni and Cr on both surfaces of the Cu plate; And

(나) 상기 산화방지막이 형성된 Cu판의 양면에 Al판과 스텐레스판을 중첩시키고 200 내지 350℃로 가열하는 단계; 및(B) overlapping the Al plate and the stainless plate on both surfaces of the Cu plate on which the antioxidant film is formed and heating them to 200 to 350 ° C; And

(다) 상기 중첩된 판을 상기 가열 온도에서 압접시키는 단계를 포함한다.(C) contacting the superimposed plates at the heating temperature.

이경우, 바람직하게는 25 내지 35%의 압하율로 행한다.In this case, Preferably it is carried out at a reduction ratio of 25 to 35%.

또한, 바람직하기로는 (다) 단계 후에 상기 접합된 판을 250 내지 350℃에서 재가열하는 단계를 더 포함한다.Also preferably, the method further comprises the step of reheating the bonded plate at 250 to 350 ° C. after step (c).

이하, 첨부한 도면을 참조하여 본 발명의 바람직한 일실시예를 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

도 1a 내지 도 1c는 본 발명의 바람직한 일실시예에 따른 다층의 클래드 판재에 대한 제조 공정 플로우를 개략적으로 도시한 도면이다.1A to 1C schematically illustrate a manufacturing process flow for a multi-layer clad plate according to a preferred embodiment of the present invention.

우선, 도 1a에 도시한 바와 같이, Cu판(1)의 양 표면에 Ni막(2-1)을 먼저 도금한 다음 그 위에 Cr막(2-2)을 도금하여 적층된 산화방지막(2)을 형성한다.First, as shown in FIG. 1A, the Ni film 2-1 is first plated on both surfaces of the Cu plate 1, and then the antioxidant film 2 laminated by plating the Cr film 2-2 thereon. To form.

Ni막(2-1)의 도금에 적용될 수 있는 도금 방법으로는 전기도금이나 화학도금을 들 수 있다. 예를 들어 전기도금은 황산니켈 ·염화암모늄 ·붕산용액, 또는 염화니켈을 첨가한 용액을 사용하여 니켈을 양극으로 하고 금속을 음극으로 해서 전류를 흐르게 하는 것과 같은 일반적인 방법으로 행할 수 있다. 또한 예를 들어 화학도금은 하이포인산염(次亞燐酸鹽)의 존재하에서 니켈이온을 화학적으로 환원해서 도금하는 일반적인 방법으로 행할 수 있다.Examples of the plating method that can be applied to the plating of the Ni film 2-1 include electroplating and chemical plating. For example, electroplating can be carried out by a general method such as using nickel sulfate, ammonium chloride, boric acid solution, or a solution in which nickel chloride is added, so that a current flows using nickel as an anode and a metal as a cathode. For example, chemical plating can be performed by the general method of chemically reducing and plating nickel ion in the presence of hypophosphate.

또한, Cr막(2-2)의 도금은 보통 크롬산에 황산근(黃酸根)과 같은 산근을 가한 용액을 사용하여 전기도금으로 행할 수 있는데, 양극에는 크롬의 금속은 사용하지 않고 납과 같이 황산에 침해되지 않는 것을 사용하며 액 중의 크롬의 감소분은 크롬산으로 보충하여 전착(電着)을 계속하는 식으로 행할 수 있다.In addition, plating of the Cr film 2-2 can be performed by electroplating using a solution in which acidic roots such as sulfuric acid roots are added to chromic acid. The reduction of chromium in the liquid may be used by supplementing with chromic acid to continue electrodeposition.

Cr막(2-2)을 도금하기 전에 Ni막(2-1)을 도금하는 것은 Cr이 Cu에 잘 도금되지 않기 때문이며, 이와 같이 하면 내산화성이 우수한 Cr막(2-2)으로 Cu판(1)의 표면을 덮을 수 있게 된다.The plating of the Ni film 2-1 before the Cr film 2-2 is plated is because the Cr is not plated well on Cu. In this case, the Cu film (2-2) having excellent oxidation resistance is used. The surface of 1) can be covered.

이어, 도 1b에 도시한 바와 같이, 표면에 산화방지막(2)이 형성된 Cu판(1)의 양면에 Al판(3)과 스텐레스판(4)을 순차로 중첩시킨다음, 대략 200 내지 350℃의 온도로 가열한다. 이와 같이 가열한 상태에서 중첩된 판을 압연하여 접합시킨다.Subsequently, as shown in FIG. 1B, the Al plate 3 and the stainless plate 4 are sequentially stacked on both surfaces of the Cu plate 1 on which the anti-oxidation film 2 is formed on the surface, and then approximately 200 to 350 ° C. Heated to a temperature of. In this state of heating, the superimposed plates are rolled and joined.

이때, 압하율은 바람직하게는 25 내지 35%의 압하율로 행하며, 여기서 압하율은 (t1 - t2)/t1 × 100%로서 t1 및 t2는 각각 압연 전, 후의 두께를 의미한다.At this time, the reduction ratio is preferably performed at a reduction ratio of 25 to 35%, wherein the reduction ratio is (t1-t2) / t1 x 100%, where t1 and t2 mean thicknesses before and after rolling, respectively.

계속하여, 바람직하게는 상기 압전된 판재를 250 내지 350℃로 재가열하여 결합력을 향상시킨다.Subsequently, the piezoelectric sheet is preferably reheated to 250 to 350 ° C. to improve the bonding force.

결과적으로 도 1c와 같이 Ni막(2-1)과 Cr막(2-2)으로 이루어진 Cu판(1)의 산화방지막을 포함하는 STS/Al/Cu/Al/STS의 클래드 판재를 형성하게 된다.As a result, as shown in FIG. 1C, a clad plate of STS / Al / Cu / Al / STS including an antioxidant film of the Cu plate 1 composed of the Ni film 2-1 and the Cr film 2-2 is formed. .

본 발명에 따른 클래드 판재 제조방법은, Cu판 표면에 미리 Ni과 Cr으로 이루어진 산화방지막을 도금함으로써, Cu판의 표면이 노출되는 사전에 방지하고, 그에 따라 압접시 Cu의 산화를 원천적으로 막게 된다. 또한, 먼저 Ni막을 형성한 후Cr막을 그 위에 형성함으로써 효과적으로 내산화성이 좋은 Cr막을 적용할 수 있게 된다. 결국 본 발명의 방법은 판재간 접합력이 본질적으로 우수한 클래드 판재를 얻을 수 있게 된다.In the clad plate manufacturing method according to the present invention, by plating an oxide film made of Ni and Cr on the Cu plate surface in advance, the surface of the Cu plate is exposed in advance, thereby preventing the oxidation of Cu at the time of pressure welding. . Further, by first forming a Ni film and then forming a Cr film thereon, a Cr film having good oxidation resistance can be effectively applied. As a result, the method of the present invention enables to obtain a clad plate that is essentially excellent in bonding strength between the plates.

Claims (3)

적어도 Cu판을 포함하는, 다층의 클래드 판재를 제조하는 방법으로서:As a method of producing a multilayer clad plate material comprising at least a Cu plate: (가) 상기 Cu판의 양쪽 표면에 Ni과 Cr을 순차로 도금하여 산화방지막을 형성하는 단계; 및(A) forming an antioxidant film by sequentially plating Ni and Cr on both surfaces of the Cu plate; And (나) 상기 산화방지막이 형성된 Cu판의 양면에 Al판과 스텐레스판을 중첩시키고 200 내지 350℃로 가열하는 단계; 및(B) overlapping the Al plate and the stainless plate on both surfaces of the Cu plate on which the antioxidant film is formed and heating them to 200 to 350 ° C; And (다) 상기 중첩된 판을 상기 가열 온도에서 압접시키는 단계를 포함하는 클래드 판재 제조방법.(C) a cladding plate manufacturing method comprising the step of pressing the overlapping plate at the heating temperature. 제 1항에 있어서, 상기 (다) 단계 후에 상기 접합된 판을 250 내지 350℃에서 재가열하는 단계를 더 포함하는 클래드 판재 제조방법.The method of claim 1, further comprising reheating the joined plate at 250 to 350 ° C. after the step (c). 제 1항 또는 제 2항에 있어서, 상기 (다) 단계에서의 압접은 25 내지 35%의 압하율로 행하는 클래드 판재 제조방법.The method for manufacturing a clad plate according to claim 1 or 2, wherein the pressure welding in the step (c) is performed at a reduction ratio of 25 to 35%.
KR1020020028903A 2002-05-24 2002-05-24 METHOD FOR MANUFACTURING MULTILAYERED CLAD PALATE INCLUDING A Cu PLATE KR20030090994A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5985391A (en) * 1982-11-05 1984-05-17 Nippon Gakki Seizo Kk Production of composite material for spectacle frame
JP2000178787A (en) * 1998-12-14 2000-06-27 Nikko Materials Co Ltd Copper foil excellent in oxidation resistance in lustrous face and its production
KR100269824B1 (en) * 1992-06-29 2000-11-01 Sumitomo Electric Industries Process for producing composite material , and for producing composite material molding
US6329074B1 (en) * 1998-11-30 2001-12-11 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5985391A (en) * 1982-11-05 1984-05-17 Nippon Gakki Seizo Kk Production of composite material for spectacle frame
KR100269824B1 (en) * 1992-06-29 2000-11-01 Sumitomo Electric Industries Process for producing composite material , and for producing composite material molding
US6329074B1 (en) * 1998-11-30 2001-12-11 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP2000178787A (en) * 1998-12-14 2000-06-27 Nikko Materials Co Ltd Copper foil excellent in oxidation resistance in lustrous face and its production

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