KR20030087285A - Ring type boat top cover for equipment of semiconductor process - Google Patents

Ring type boat top cover for equipment of semiconductor process Download PDF

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Publication number
KR20030087285A
KR20030087285A KR1020020025282A KR20020025282A KR20030087285A KR 20030087285 A KR20030087285 A KR 20030087285A KR 1020020025282 A KR1020020025282 A KR 1020020025282A KR 20020025282 A KR20020025282 A KR 20020025282A KR 20030087285 A KR20030087285 A KR 20030087285A
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South Korea
Prior art keywords
top cover
boat
ring type
boat top
cover
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KR1020020025282A
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Korean (ko)
Inventor
김태환
이덕기
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동부전자 주식회사
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Priority to KR1020020025282A priority Critical patent/KR20030087285A/en
Publication of KR20030087285A publication Critical patent/KR20030087285A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A ring type boat top cover of semiconductor processing equipment is provided to be capable of reducing a thin film melted to the ring type boat top cover when carrying out a poly process for minimizing the generation of particles due to the increase of the thin film accumulated at the ring type boat top cover. CONSTITUTION: A ring type cover(20) is installed at the upper portion of a boat, wherein the boat is used for stably loading a wafer. Preferably, the ring type boat top cover is capable of minimizing the generation of particles by reducing the size of a thin film melted on the ring type boat top cover when carrying out a poly process. At this time, the boat is made of quartz.

Description

반도체 공정 장비의 링형 보트 탑 커버{RING TYPE BOAT TOP COVER FOR EQUIPMENT OF SEMICONDUCTOR PROCESS}RING TYPE BOAT TOP COVER FOR EQUIPMENT OF SEMICONDUCTOR PROCESS}

본 발명은 반도체 공정 장비의 링형 보트 탑 커버(Ring Type Boat Top cover)에 관한 것으로, 특히 폴리(poly) 공정시 플레이트에서 막이 떨어져 파티클(particle)이 생기는 경우를 최소화시킨 반도체 공정 장비의 링형 보트 탑 커버에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ring type boat top cover of semiconductor processing equipment, and in particular, a ring type boat top of semiconductor processing equipment which minimizes the occurrence of particles due to the film falling off the plate during the poly process. It is about a cover.

도 1a 및 도 1b는 종래 기술에 따른 반도체 공정 장비의 보트 탑 커버의 단면 및 평면을 나타낸 도면이다. 도시된 바와 같이, 종래의 보트 탑 커버(2)는 웨이퍼를 안착하기 위한 보트(1)의 상부에 플레이트 형상으로 구성되어 있다.1A and 1B are cross-sectional and plan views of a boat top cover of a semiconductor processing apparatus according to the prior art. As shown, the conventional boat top cover 2 is configured in the shape of a plate on top of the boat 1 for seating the wafer.

일반적으로, 반도체 공정의 노(furnace) 공정은 석영(quartz)으로 제작된 보트(boat: 1)에 웨이퍼를 차지(charge)시켜 프로세스를 진행한다. 보트(1)는 공정별로 그 모양과 크기가 다르다. 그 중 폴리(poly) 공정의 경우 프로세스 진행 후 박막이 다른 공정에 비해 석영에 견고히 융착되게 된다. 특히, 일정시간 사용 후에는 이 막이 두꺼워지게 되며, 이 막이 조금씩 떨어져 나가 파티클(particle) 소스(source)가 된다. 이럴 경우 프로세스에 심각한 영향을 끼치게 되며 P.M으로 인해 장시간 동안 장비를 다운(down)시켜야 하는 경우가 발생된다. 이로 인해, 가동율 및 생산율에 막대한 영향을 끼친다. 특히, 파티클 소스는 보트의 탑(top)측에 있는 플레이트(plate)에서 막이 떨어지는 경우가 많이 발생한다.In general, the furnace process of the semiconductor process proceeds by charging the wafer in a boat 1 made of quartz. The boat 1 differs in shape and size by process. Among them, in the case of poly process, the thin film is firmly fused to quartz after the process. In particular, after a certain time of use, the film becomes thick, and the film falls off little by little to become a particle source. This will seriously affect the process and the P.M will cause the equipment to be down for a long time. This greatly affects the utilization and production rates. In particular, the particle source is often a film fall off the plate on the top side of the boat.

이와 같이, 종래의 폴리 공정의 보트 탑 커버는 원형 플레이트로 제작되어 있기 때문에 많은 면적을 가지고 있다. 이러한 구조를 갖는 종래의 보트 탑 커버를 장시간 사용할 경우 플레이트 소스를 유발할 뿐만 아니라 리페어(repair)를 하여도 그 효과가 미미하여 일정 시간 사용 후에는 보트를 폐기시켜야만 했다. 이로 인해, 반도체 제조 비용을 상승시키는 요인이 되었다.Thus, the boat top cover of the conventional poly process has a large area because it is made of a circular plate. When using a conventional boat top cover having such a structure for a long time, not only causes the plate source, but also the repair (repair) effect is insignificant, the boat had to be discarded after a certain time. For this reason, it became a factor which raises the semiconductor manufacturing cost.

따라서, 본 발명은 상기 문제점을 해결하기 위하여 이루어진 것으로, 본 발명의 목적은 종래의 플레이트(plate) 형상을 갖는 보트 탑 커버를 면적이 적은 원형 링(ring) 형태로 제작 사용함으로써, 폴리(poly) 공정시 플레이트에서 막이 떨어져 파티클(particle)이 생기는 경우를 최소화시킨 반도체 공정 장비의 링형 보트 탑 커버를 제공하는데 있다.Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to manufacture a boat top cover having a conventional plate shape in the form of a circular ring having a small area. The present invention provides a ring-shaped boat top cover of semiconductor processing equipment which minimizes the occurrence of particles from falling off the plate during the process.

도 1a 및 도 1b는 종래 기술에 따른 보트 탑 커버의 단면 및 평면도1A and 1B are cross-sectional and top views of a boat top cover according to the prior art

도 2a 및 도 2b는 본 발명에 의한 보트 탑 커버의 단면 및 평면도2a and 2b is a cross-sectional view and a plan view of the boat top cover according to the present invention

(도면의 주요 부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)

10 : 보트20 : 커버10 boat 20 cover

상기 목적을 달성하기 위한 본 발명에 의한 반도체 공정 장비의 링형 보트 탑 커버는,Ring-shaped boat top cover of the semiconductor processing equipment according to the present invention for achieving the above object,

반도체 공정 장비의 링형 보트 탑 커버에 있어서,In the ring boat top cover of semiconductor processing equipment,

웨이퍼를 안착하기 위한 보트의 상부에 원형의 링(Ring) 형상을 갖는 커버를 구비한 것을 특징으로 한다.A cover having a circular ring shape is provided on an upper portion of a boat for seating a wafer.

상기 링형 보트 탑 커버는 폴리(poly) 공정시 박막이 커버에 융착되는 면적을 줄여 파티클(particle)을 최소화시키도록 구성된 것을 특징으로 한다.The ring-shaped boat top cover may be configured to minimize particles by reducing an area in which a thin film is fused to the cover during a poly process.

이하, 본 발명의 실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

도 2a 및 도 2b는 본 발명에 의한 링형 보트 탑 커버(20)의 단면 및 평면도이다.2A and 2B are a cross-sectional view and a plan view of the ring boat top cover 20 according to the present invention.

도시된 바와 같이, 본 발명에 의한 보트 탑 커버(20)는 웨이퍼를 안착하기 위한 보트(10)의 상부에 원형의 링(Ring) 형상으로 형성된다. 상기 보트(10)는 석영(quartz)으로 제작되며, 웨이퍼를 안착하여 프로세스를 진행한다. 이때, 보트(10)는 공정별로 그 모양과 크기가 다르다.As shown, the boat top cover 20 according to the present invention is formed in a circular ring shape on top of the boat 10 for seating the wafer. The boat 10 is made of quartz, and processes the process by seating a wafer. At this time, the boat 10 is different in shape and size for each process.

그 중 폴리(poly) 공정의 경우 프로세스 진행 후 박막이 다른 공정에 비해 석영에 견고히 융착되게 된다. 특히, 일정시간 사용 후에는 이 막이 두꺼워지게 되며, 이 막이 조금씩 떨어져 나가 파티클(particle) 소스(source)가 된다. 이럴 경우 프로세스에 심각한 영향을 끼치게 되며 P.M으로 인해 장시간 동안 장비를 다운(down)시켜야 하는 경우가 발생된다. 이로 인해, 가동율 및 생산율에 막대한 영향을 끼친다. 특히, 파티클 소스는 보트의 탑(top)측에 있는 플레이트(plate)에서막이 떨어지는 경우가 많이 발생한다.Among them, in the case of poly process, the thin film is firmly fused to quartz after the process. In particular, after a certain time of use, the film becomes thick, and the film falls off little by little to become a particle source. This will seriously affect the process and the P.M will cause the equipment to be down for a long time. This greatly affects the utilization and production rates. In particular, the particle source is often a film fall off the plate on the top side of the boat.

본 발명의 링형 보트 탑 커버(20)는 종래의 플레이트(plate) 형상을 갖는 보트 탑 커버(2) 보다 면적이 적은 원형의 링(ring) 형태를 가짐으로써, 폴리(poly) 공정시 커버에 융착되는 박막을 줄일 수 있다. 따라서, 커버에 쌓이는 두꺼운 박막으로 인해 파티클(particle)이 생기는 경우를 종래에 비해 최소화시킬 수 있다.The ring-shaped boat top cover 20 of the present invention has a circular ring shape having a smaller area than the boat top cover 2 having a plate shape in the related art, and thus is fused to the cover during the poly process. The thin film can be reduced. Therefore, it is possible to minimize the occurrence of particles (particles) due to the thick thin film accumulated on the cover compared to the conventional.

이상에서 설명한 바와 같이, 본 발명에 의한 반도체 공정 장비의 링형 보트 탑 커버에 의하면, 종래의 플레이트(plate) 형상을 갖는 보트 탑 커버를 면적이 적은 원형 링(ring) 형태로 제작 사용함으로써, 폴리(poly) 공정시 플레이트에서 막이 떨어져 파티클(particle)이 생기는 경우를 최소화시킬 수 있는 효과가 있다.As described above, according to the ring-shaped boat top cover of the semiconductor processing equipment according to the present invention, a boat top cover having a conventional plate shape is manufactured and used in the form of a circular ring having a small area. In the poly process, there is an effect of minimizing the occurrence of particles due to the film falling off the plate.

아울러 본 발명의 바람직한 실시예들은 예시의 목적을 위해 개시된 것이며, 당업자라면 본 발명의 사상과 범위 안에서 다양한 수정, 변경, 부가등이 가능할 것이며, 이러한 수정 변경등은 이하의 특허청구범위에 속하는 것으로 보아야 할 것이다.In addition, preferred embodiments of the present invention are disclosed for the purpose of illustration, those skilled in the art will be able to various modifications, changes, additions, etc. within the spirit and scope of the present invention, these modifications and changes should be seen as belonging to the following claims. something to do.

Claims (2)

반도체 공정 장비의 링형 보트 탑 커버에 있어서,In the ring boat top cover of semiconductor processing equipment, 웨이퍼를 안착하기 위한 보트의 상부에 원형의 링(Ring) 형상을 갖는 커버를 구비한 것을 특징으로 하는 반도체 공정 장비의 링형 보트 탑 커버.A ring-shaped boat top cover of semiconductor processing equipment, comprising a cover having a circular ring shape on top of a boat for seating a wafer. 제 1 항에 있어서,The method of claim 1, 상기 링형 보트 탑 커버는 폴리(poly) 공정시 박막이 커버에 융착되는 면적을 줄여 파티클(particle)을 최소화시키도록 구성된 것을 특징으로 하는 반도체 공정 장비의 링형 보트 탑 커버.The ring-shaped boat top cover of the semiconductor processing equipment, characterized in that configured to minimize the particles (particle) by reducing the area of the thin film fused to the cover during the poly (poly) process.
KR1020020025282A 2002-05-08 2002-05-08 Ring type boat top cover for equipment of semiconductor process KR20030087285A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100474735B1 (en) * 2002-06-29 2005-03-10 동부아남반도체 주식회사 Boat covering cap on the top/bottom
KR101036269B1 (en) * 2009-04-22 2011-05-23 변재삼 Airless type cosmetics vessel with a side discharging passage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213647A (en) * 1996-02-06 1997-08-15 Tokyo Electron Ltd Wafer boat
JPH09237781A (en) * 1996-02-29 1997-09-09 Tokyo Electron Ltd Heat treatment boat
JPH09293685A (en) * 1996-02-28 1997-11-11 Asahi Glass Co Ltd Vertical wafer boat

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213647A (en) * 1996-02-06 1997-08-15 Tokyo Electron Ltd Wafer boat
JPH09293685A (en) * 1996-02-28 1997-11-11 Asahi Glass Co Ltd Vertical wafer boat
JPH09237781A (en) * 1996-02-29 1997-09-09 Tokyo Electron Ltd Heat treatment boat

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100474735B1 (en) * 2002-06-29 2005-03-10 동부아남반도체 주식회사 Boat covering cap on the top/bottom
KR101036269B1 (en) * 2009-04-22 2011-05-23 변재삼 Airless type cosmetics vessel with a side discharging passage

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