KR20030086659A - Cleaning apparatus for semiconductor equipment and thereof cleaning method - Google Patents

Cleaning apparatus for semiconductor equipment and thereof cleaning method Download PDF

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Publication number
KR20030086659A
KR20030086659A KR1020020024765A KR20020024765A KR20030086659A KR 20030086659 A KR20030086659 A KR 20030086659A KR 1020020024765 A KR1020020024765 A KR 1020020024765A KR 20020024765 A KR20020024765 A KR 20020024765A KR 20030086659 A KR20030086659 A KR 20030086659A
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South Korea
Prior art keywords
cleaning
concentration value
concentration
tank
cleaning liquid
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KR1020020024765A
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Korean (ko)
Inventor
송윤석
박준식
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삼성전자주식회사
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Priority to KR1020020024765A priority Critical patent/KR20030086659A/en
Publication of KR20030086659A publication Critical patent/KR20030086659A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking

Abstract

PURPOSE: A cleaning apparatus for semiconductor equipment is provided to supply a cleaning solution of high density or delay an interval of cleaning time by checking the density value of the cleaning solution in each tank in which a cleaning solution like chemical, hydrofluoric acid or deionized water is stored and by comparing the checked density value with a predetermined density value. CONSTITUTION: Cleaning processes are performed by respective cleaning solution through a plurality of tanks(10) that store a predetermined quantity of chemical, hydrofluoric acid or deionized water. A detection unit is installed in the tank to detect the density of the cleaning solution stored inside the tank. The density value of the cleaning solution detected by the detection unit is compared with a predetermined density value inputted into a controller(32) so that an automatic uniform cleaning process is performed through the controller.

Description

반도체 장비용 세척장치 및 그에따른 세척방법{Cleaning apparatus for semiconductor equipment and thereof cleaning method}Cleaning apparatus for semiconductor equipment and cleaning method according to

본 발명은 반도체 장비용 세척장치 및 그에따른 세척방법에 관한 것으로서,보다 상세하게는 세정액의 농도를 자동으로 조정하므로서 균일한 세정 효율을 제공하게 되는 반도체 장비용 세척장치 및 그에 따른 세척방법에 관한 것이다.The present invention relates to a cleaning apparatus for semiconductor equipment and a cleaning method thereof, and more particularly, to a cleaning apparatus for semiconductor equipment and a cleaning method according to the same, which provides uniform cleaning efficiency by automatically adjusting the concentration of the cleaning liquid. .

일반적으로 반도체를 제조하는 공정에서 웨이퍼 자체를 가공하면서 세정을 하게 되나 이에 못지않게 중요한 것이 웨이퍼를 가공하는 가공장비의 세정이다.Generally, cleaning is performed while processing the wafer itself in the process of manufacturing a semiconductor, but equally important is the cleaning of processing equipment that processes the wafer.

즉 웨이퍼를 가공하면서 장비의 내부는 가공시에 사용되는 가스 및 캐미컬들이 주면에 흡착되고, 이러한 흡착물들은 결국 웨이퍼 가공에 파티클로 작용하면서 제품 불량을 초래하게 되는 단점이 있다.That is, while processing the wafer, the inside of the equipment is adsorbed on the main surface of the gas and chemicals used in the processing, these adsorbates have a disadvantage in that the product will eventually work as a particle in the wafer processing.

따라서 웨이퍼 뿐만 아니라 웨이퍼를 가공하는 반도체 장비 또한 정기적으로 또는 일정한 웨이퍼 가공 횟수에 따라 적절히 세정시켜 주어야만 한다.Therefore, not only the wafer, but also the semiconductor equipment for processing the wafer must be properly cleaned regularly or according to a certain number of wafer processing times.

반도체 장비의 세정시 통상적으로 사용하는 것이 세정액에 직접 반도체 장비를 담가두는 습식 세정 방식이다.A common cleaning method for cleaning semiconductor equipment is a wet cleaning method in which semiconductor equipment is directly immersed in a cleaning liquid.

도 1은 종형의 확산 설비를 세정하는 세척장치를 도시한 것으로서, 주로 쿼츠 재질인 이너 튜브와 아우터 튜브를 에칭에 의해 세정하게 되는 구성을 나타낸 것이다.1 is a view illustrating a washing apparatus for cleaning a vertical diffusion apparatus, and illustrates a configuration in which an inner tube and an outer tube, which are mainly quartz, are cleaned by etching.

세정액은 막질의 종류에 따라서 각각 다른 케미컬을 사용하며, 세척장치에는 내부로 통상 3개의 탱크(11)(12)(13)가 구비되어 순차적으로 공정을 수행하게 되고, 로봇 아암(20)에 의해서는 상하전후로 이송이 가능하도록 하고 있다.The cleaning liquid uses different chemicals according to the type of membrane, and the washing apparatus is generally provided with three tanks 11, 12, 13, and performs the process sequentially, and by the robot arm 20 Is able to transfer up and down.

이들 탱크에는 통상 케미컬과 5% 불산 그리고 순수가 각각 채워지도록 하고 있어 이들을 순차적으로 거치면서 세정하게 되는바 특히 세정시키고자 하는 막질의 종류에 따라 최초에 거치게 되는 케미컬은 바뀌게 된다.These tanks are usually filled with chemicals, 5% hydrofluoric acid, and pure water, so that they are cleaned sequentially. These chemicals are changed first depending on the type of membrane to be cleaned.

그리고 탱크(10)에는 각 탱크의 내용물을 공급하는 공급 라인(14)과 함께 내용물 교체시 배출시키는 드레인 라인(15)이 각각 구비되며, 케미컬의 교체 시기는 통상 세정 횟수에 의해 결정되고, 이는 제어계통에 의해 제어된다.In addition, the tank 10 is provided with a supply line 14 for supplying the contents of each tank, and a drain line 15 for discharging when the contents are replaced, and the replacement time of the chemical is usually determined by the number of cleaning, which is controlled. Controlled by the system.

그러나 세정을 하다보면 세정액은 세정되는 횟수에 따라 점차 오염도가 심해지기도 하고, 장시간 오픈된 상태에서 세정액을 저장하고 있다보면 외부로부터의 오염도가 심해지면서 세정액의 농도가 낮아지게 되는 폐단이 있다.However, when the cleaning solution is washed, the contamination gradually increases depending on the number of times of cleaning, and when the cleaning solution is stored in the open state for a long time, the contamination from the outside becomes severe, and the concentration of the cleaning solution becomes low.

세정액의 농도가 낮아지게 되면 세정시 세정효율이 점차 불량해지면서 세정액의 교체 직전과 직후의 효율에 큰 격차가 발생되어 신뢰성 상실이 초래되고 있다.When the concentration of the cleaning liquid is lowered, the cleaning efficiency gradually becomes poor at the time of cleaning, and a large gap occurs in the efficiency immediately before and after the replacement of the cleaning liquid, resulting in loss of reliability.

특히 나중에 세정하게 되는 반도체 장비는 세정작업을 재수행하여야야 하는 번거로움이 있으며, 따라서 세정액의 잦은 교체에 따른 세정액의 과다한 소모가 초래되는 문제가 있다.In particular, the semiconductor equipment to be cleaned later has a problem of having to perform the cleaning operation again, and thus there is a problem that excessive consumption of the cleaning solution is caused by frequent replacement of the cleaning solution.

따라서 본 발명은 상술한 종래 기술의 문제점들을 해결하기 위하여 발명된 것으로서, 본 발명의 주된 목적은 탱크내의 세정액 농도를 자동으로 정밀 체크하고, 이를 기준으로 균일한 세정 효율이 발휘될 수 있도록 하는데 있다.Therefore, the present invention has been invented to solve the above-mentioned problems of the prior art, and the main object of the present invention is to automatically check the concentration of the cleaning liquid in the tank, and to make uniform cleaning efficiency based on this.

또한 본 발명은 탱크내의 세정액 농도를 적시에 자동으로 조정되게 하므로서 불필요한 세정액 소모를 방지하도록 하는데 다른 목적이 있다.In addition, the present invention has another object to prevent unnecessary consumption of the cleaning liquid by allowing the tank to automatically adjust the concentration of the cleaning liquid in a timely manner.

도 1은 종래 반도체 장비를 세정하는 탱크의 구성을 도시한 정면도,1 is a front view showing the configuration of a tank for cleaning conventional semiconductor equipment;

도 2는 본 발명에 따른 구성을 개력적으로 도시한 측면도,Figure 2 is a side view showing the configuration according to the present invention,

도 3은 본 발명에 따른 일실시예 세정 과정을 도시한 플로우챠트,3 is a flowchart illustrating an exemplary cleaning process according to the present invention;

도 4는 본 발명에 따른 다른 실시예 세정 과정을 도시한 플로우챠트.4 is a flow chart illustrating another embodiment cleaning process in accordance with the present invention.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : 탱크 14 : 세정액 공급 라인10 tank 14 washing liquid supply line

15 : 드레인 라인 16 : 세정액 공급 펌프15 drain line 16 cleaning liquid supply pump

20 : 로봇 아암 31 : 농도 감지부재20: robot arm 31: concentration sensing member

32 : 컨트롤러32: controller

이와 같은 목적을 달성하기 위하여 본 발명은 캐미컬 또는 불산 또는 순수를 일정량 저장하는 복수의 탱크를 순차적으로 통과하면서 각 세정액에 의해 세정을 수행하게 되는 반도체 장비용 세척장치에 있어서, 상기 탱크에는 내부에 저장된 세정액의 농도를 감지하는 감지수단이 구비되도록 하고, 상기 감지수단에 의해 감지된 세정액의 농도값과 컨트롤러에 입력된 기준농도값과의 비교에 의해 컨트롤러에 의해서 자동으로 균일한 세정이 이루어지도록 하는데 특징이 있다.In order to achieve the above object, the present invention provides a cleaning device for a semiconductor device to perform cleaning by each cleaning liquid while sequentially passing through a plurality of tanks for storing a certain amount of chemical or hydrofluoric acid or pure water, the tank inside Sensing means for sensing the concentration of the stored cleaning solution is provided, and by the controller by comparing the concentration value of the cleaning solution detected by the sensing means with the reference concentration value input to the controller to automatically perform a uniform cleaning There is a characteristic.

이를 위해서 본 발명은 정량의 세정액이 저장되는 탱크에서 세정액의 농도를 검출하는 단계와; 검출된 농도값을 컨트롤러에 입력된 기준농도값과 비교하는 단계와; 상기의 단계에서 검출된 농도값이 기준농도값보다 같거나 높으면 탱크내 세정액의 농도를 검출하는 단계로 리턴하고, 검출된 농도값이 기준농도값보다 낮으면 공급 라인을 통해 새로운 세정액을 공급하는 단계와: 상기 탱크내에서의 세정액 농도가 기준농도값과 같거나 보다 크면 세정 횟수가 설정된 횟수에 도달하였는지를 체크하는 단계와; 세정 횟수가 설정 횟수에 도달하지 않았으면 상기 탱크에서의 세정액 농도를 검출하는 단계로 리턴하고, 설정 횟수에 도달하였으면 세정을 완료하는 단계와; 드레인 라인을 통해 사용한 세정액을 배출하고, 공급 라인을 통해 새로운 세정액을 공급하는 단계로서 수행되도록 하는 것이다.To this end, the present invention comprises the steps of detecting the concentration of the cleaning liquid in the tank in which the quantity of the cleaning liquid is stored; Comparing the detected concentration value with a reference concentration value input to the controller; If the concentration value detected in the above step is equal to or higher than the reference concentration value, returning to the step of detecting the concentration of the washing liquid in the tank; and if the detected concentration value is lower than the reference concentration value, supplying a new washing liquid through the supply line. And: checking if the number of washings reaches a set number of times when the concentration of the washing liquid in the tank is equal to or greater than a reference concentration value; If the number of cleaning cycles has not reached the set number of times, returning to the step of detecting the concentration of the cleaning liquid in the tank; The used cleaning liquid is discharged through the drain line, and the fresh cleaning liquid is supplied through the supply line.

또한 본 발명은 정량의 세정액이 저장되는 탱크에서 세정액의 농도를 검출하는 단계와; 검출된 농도값을 컨트롤러에 입력된 기준농도값과 비교하는 단계와; 상기의 단계에서 검출된 농도값이 기준농도값보다 같거나 높으면 탱크내 세정액의 농도를 검출하는 단계로 리턴하고, 검출된 농도값이 기준농도값보다 낮으면 이들 농도값 차에 비례하여 세정 시간을 검출하는 단계와; 검출된 세정 시간만큼 세정을 수행하는 단계로서 수행되게 할 수도 있다.In another aspect, the present invention comprises the steps of detecting the concentration of the cleaning liquid in the tank in which the quantitative cleaning liquid is stored; Comparing the detected concentration value with a reference concentration value input to the controller; If the concentration value detected in the above step is equal to or higher than the reference concentration value, the flow returns to the step of detecting the concentration of the washing liquid in the tank. If the detected concentration value is lower than the reference concentration value, the cleaning time is proportional to the difference between these concentration values. Detecting; It may be performed as a step of performing the cleaning by the detected cleaning time.

이하 본 발명의 바람직한 실시예를 첨부된 도면에 의하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 개략적인 구성을 도시한 측면도로서, 본 발명은 탱크(10)에 장착시킨 감지수단(31)에 의해 탱크(10)내 세정액의 농도를 측정하도록 한다.2 is a side view showing a schematic configuration according to the present invention, the present invention is to measure the concentration of the cleaning liquid in the tank 10 by the sensing means 31 mounted on the tank 10.

감지수단(31)에서 측정되는 세정액 농도는 컨트롤러(32)에 체크되고, 컨트롤러(32)에서는 미리 일정한 농도값을 기준농도값으로 입력되어 있도록 한다.The concentration of the cleaning liquid measured by the sensing means 31 is checked by the controller 32, and the controller 32 allows a predetermined concentration value to be input as a reference concentration value in advance.

따라서 컨트롤러(32)에서 감지수단(31)으로부터 체크되는 세정액 농도값과 기입력된 기준농도값과를 비교하여 세정액의 농도를 자동으로 제어하도록 한다.Therefore, the controller 32 compares the cleaning liquid concentration value checked from the sensing means 31 with the reference concentration value previously input to automatically control the concentration of the cleaning liquid.

한편 탱크(10)에는 세정액이 공급되는 공급 라인(14)과 공정이 수행되고 난 직후 오염된 세정액을 배출시키는 드레인 라인(15)이 구비되며, 공급 라인(14)에는 컨트롤러(32)에 의해 구동이 제어되는 구동 펌프(16)가 연결된다.On the other hand, the tank 10 is provided with a supply line 14 for supplying the cleaning liquid and a drain line 15 for discharging the contaminated cleaning liquid immediately after the process is performed, and the supply line 14 is driven by the controller 32. This controlled drive pump 16 is connected.

상기한 구성에 따라 컨트롤러(32)에 의해서는 구동 펌프(16)의 구동 또는 세정 시간을 조절하여 공정 수행시 항상 균일한 세정이 이루어질 수 있도록 하는 것이다.According to the above configuration, the controller 32 controls the driving or cleaning time of the driving pump 16 so that uniform cleaning can be always performed during the process.

도 3은 본 발명에 따른 세정 방법의 일례를 도시한 플로우챠트로서, 본 실시예는 탱크(10)에 새로운 세정액을 추가 공급하므로서 기사용된 세정액의 농도가 높아지게 하여 탱크(10)내 세정액을 항상 일정한 농도로서 유지되도록 하는데 가장 두드러진 특징이 있다.3 is a flowchart showing an example of a cleaning method according to the present invention. In this embodiment, the cleaning liquid in the tank 10 is always supplied by adding a new cleaning liquid to the tank 10 so as to increase the concentration of the cleaning liquid for the technician. The most prominent feature is that it is maintained at a constant concentration.

즉 본 실시예에서 탱크(10)의 내부에는 세정액을 검출하는 감지수단(31)이 구비되게 하므로서 이 감지수단(31)으로부터 세정액의 농도를 지속적으로 검출한다.(제1단계)That is, in the present embodiment, the detection means 31 for detecting the cleaning liquid is provided in the tank 10 to continuously detect the concentration of the cleaning liquid from the detecting means 31. (First Step)

감지수단을 통해 검출되는 신호값은 컨트롤러(32)에 전달되어 이 컨트롤러(32)에 기입력되어 있는 기준 농도값과 비교된다.(제2단계)The signal value detected through the sensing means is transmitted to the controller 32 and compared with the reference concentration value previously input to the controller 32. (Second step)

농도값간 비교에 의해 검출 농도값이 기준 농도값보다 크거나 같으면 계속해서 제1단계에서의 세정액 농도를 검출하는 단계를 반복하도록 하고, 만일 검출 농도값이 기준 농도값보다 작다고 판단되면 탱크에는 공급 라인을 통해 새로운 세정액이 공급되도록 한다.(제3단계)If the detected concentration value is greater than or equal to the reference concentration value by comparison between the concentration values, the step of detecting the cleaning liquid concentration in the first step is repeated. If it is determined that the detected concentration value is smaller than the reference concentration value, the tank is supplied with a supply line. Fresh cleaning solution is supplied through (Step 3).

새로운 세정액이 공급되면서 탱크(10)의 내부에 저장되는 세정액은 그 농도가 점차 높아지게 된다.As the new cleaning solution is supplied, the concentration of the cleaning solution stored in the tank 10 is gradually increased.

이렇게 높아지는 세정액의 농도가 컨트롤러(32)에 입력된 기준 농도값과 비교하여(제4단계) 농도값이 일치하지 않으면 계속해서 전단계의 세정액 공급 단계를 수행하고, 만일 동일한 세정값이 체크되면 세정이 수행되도록 한다.(제5단계)If the concentration of the cleaning liquid thus increased is compared with the reference concentration value input to the controller 32 (step 4), if the concentration value does not match, the cleaning liquid supply step of the previous stage is continuously performed, and if the same cleaning value is checked, the cleaning is performed. To be performed (step 5).

그리고 도 4는 본 발명에 따른 세정 방법의 다른예를 도시한 플로우챠트로서, 본 실시예에서는 전술한 실시예와는 달리 세정 시간의 제어에 의해서 항상 균일한 세정이 수행될 수 있도록 하는 것이다.4 is a flowchart showing another example of the cleaning method according to the present invention. In the present embodiment, unlike the above-described embodiment, uniform cleaning can be always performed by controlling the cleaning time.

즉 전술한 실시예에서는 탱크(10)의 감지부재(31)를 통해 체크되는 세정액의농도를 새로운 세정액을 지속적으로 공급하므로서 세정 효율이 안정되게 수행될 수 있도록 하는 것이나 본 실시예에서는 세정 시간이 조절되도록 하는 것이다.That is, in the above-described embodiment, the cleaning efficiency is stably performed by continuously supplying the new cleaning liquid to the concentration of the cleaning liquid checked through the sensing member 31 of the tank 10, but in this embodiment, the cleaning time is controlled. To make it possible.

이를 위하여 본 실시예에서는 감지수단(31)에 의해 탱크(10) 내부에 채워진 세정액의 농도값을 검출하고(제6단계), 이때의 농도값을 컨트롤러(32)가 체크하여 기입력된 기준농도값과 비교하는(제7단계) 과정까지는 전술한 실시예와 동일하다.To this end, in the present embodiment, the detection means 31 detects the concentration value of the cleaning liquid filled in the tank 10 (sixth step), and the controller 32 checks the concentration value at this time, and then inputs the reference concentration. The process of comparing with the value (seventh step) is the same as the above-described embodiment.

다만 본 실시예에서는 농도값간 비교에 의해 탱크(10)로부터 검출한 농도값이 기입력된 기준농도값보다 크거나 같으면 전단계인 탱크(10)로부터 농도값을 재검출하는 과정을 반복하고, 만일 기준농도값보다 작다고 판단되면 기준농도값과 검출농도값과의 농도차를 검출한다.(제8단계)However, in the present embodiment, if the concentration value detected from the tank 10 by comparison between concentration values is greater than or equal to the previously input reference concentration value, the process of re-detecting the concentration value from the tank 10 as a previous step is repeated, and if If it is determined that the concentration value is smaller than the concentration value, the concentration difference between the reference concentration value and the detected concentration value is detected.

상기의 단계에서 검출한 농도값 차이에 의해 컨트롤러(32)에 미리 테이블값으로 연산된 세정 시간을 검출한다.(제9단계)The washing time calculated in advance as a table value is detected by the controller 32 by the difference in concentration values detected in the above step.

즉 세정 농도가 낮아지게 되면 그 낮아진 만큼 세정 시간을 연장해서 수행하게 되면 균일한 세정 효과를 얻을 수가 있으므로 세정 농도의 차이에 따른 세정 시간의 연장 시간을 미리 테이블값으로 입력시켜두고 검출된 농도차에 따라 세정 시간을 검출하도록 하는 것이다.In other words, if the cleaning concentration is lowered, the cleaning time can be extended as much as it is lowered to obtain a uniform cleaning effect. Therefore, the extension time of the cleaning time according to the difference of the cleaning concentrations is input to the table value beforehand. Therefore, the cleaning time is detected.

검출된 세정 시간만큼 보다 지연시켜 세정을 수행하게 되면(제10단계), 양호한 농도에서의 세정시와 동일한 세정 효율이 기대되는 것이다.If the cleaning is delayed by the detected cleaning time (step 10), the same cleaning efficiency is expected as the cleaning at a good concentration.

한편 각 실시예를 통해 세정하게 되는 세정액은 일정 세정 횟수 이상이 되면 반드시 완전히 교체해주도록 하는 것이 가장 바람직하다.On the other hand, the cleaning solution to be washed through each embodiment is most preferably to be completely replaced when a predetermined number of times of cleaning.

그리고 상기와 같은 공정은 케미컬에 의한 세정시나 불산에 의한 세정시나순수에 의한 세정시 공히 동일한 방식으로 수행하며, 로봇 아암(20)에 의해 장비(E)를 이송시키면서 순차적으로 수행되도록 한다.The above process is performed in the same manner as in the cleaning by chemical, the cleaning by hydrofluoric acid, or the cleaning by pure water, and is sequentially performed while transferring the equipment E by the robot arm 20.

따라서 세정액이 케미컬일 때와 불산일 때와 순수일 때가 각각 별도로 제어되도록 한다.Therefore, when the cleaning liquid is chemical, hydrofluoric acid and pure water are controlled separately.

한편 상기한 설명에서 많은 사항이 구체적으로 기재되어 있으나, 그들은 발명의 범위를 한정하는 것이라기보다는 바람직한 실시예의 예시로서 해석되어야 한다.On the other hand, while many matters have been described in detail in the above description, they should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention.

따라서 본 발명의 범위는 설명된 실시예에 의하여 정하여 질 것이 아니고 특허 청구범위에 기재된 기술적 사상에 의해 정하여져야 한다.Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

상술한 바와 같이 본 발명에 의하면 본 발명은 케미컬이나 불산 또는 순수와 같은 세정액이 저장되는 각 탱크(10)에서 세정액의 농도값을 체크하여 이를 기입력되어 있는 기준농도값과의 비교에 의해 탱크(10)내 세정액 농도가 지나치게 저감되어 있으면 고농도의 세정액을 공급하거나 세정 시간을 지연시켜 항상 균일한 세정이 이루어질 수 있도록 하는 것이다.As described above, according to the present invention, the tank according to the present invention checks the concentration value of the cleaning liquid in each tank 10 in which the cleaning liquid such as chemical, hydrofluoric acid, or pure water is stored, and compares it with the reference concentration value which is inputted. 10) If the concentration of the cleaning liquid is too low, supply a high concentration of the cleaning liquid or delay the cleaning time to ensure a uniform cleaning at all times.

이는 세정액의 교체시 농도의 급격한 차이로 인한 교체 직전의 세정액에 의해 세정하게 되는 장비는 반드시 재세정을 해야 하는 번거로움을 제거하게 되므로서 세정의 편의를 제공하게 됨은 물론 주기적으로 세정액 전체를 교체하는데 따른 세정액의 지나친 소모를 방지하여 보다 경제적인 세정액 관리 및 공정 수행에 따른비용의 절감을 제공하게 되는 유익한 효과가 있다.This means that the equipment cleaned by the cleaning liquid immediately before the replacement due to the sharp difference in concentration during the replacement of the cleaning liquid eliminates the trouble of having to be rewashed, thereby providing convenience of cleaning and periodically replacing the cleaning liquid. Preventing excessive consumption of the cleaning solution has a beneficial effect to provide a more economical cleaning solution management and cost reduction according to the performance of the process.

Claims (8)

캐미컬 또는 불산 또는 순수를 일정량 저장하는 복수의 탱크를 순차적으로 통과하면서 각 세정액에 의해 세정을 수행하게 되는 반도체 장비용 세척장치에 있어서,In the cleaning device for semiconductor equipment to perform cleaning by each cleaning liquid while sequentially passing through a plurality of tanks for storing a certain amount of chemical or hydrofluoric acid or pure water, 상기 탱크에는 내부에 저장된 세정액의 농도를 감지하는 감지수단이 구비되도록 하고, 상기 감지수단에 의해 감지된 세정액의 농도값과 컨트롤러에 입력된 기준농도값과의 비교에 의해 상기 컨트롤러에 의해서 자동으로 균일한 세정이 이루어지도록 하는 반도체 장비용 세척장치.The tank is provided with a sensing means for sensing the concentration of the cleaning liquid stored therein, and is automatically uniformed by the controller by comparing the concentration value of the cleaning liquid detected by the sensing means with a reference concentration value input to the controller. Cleaning device for semiconductor equipment to perform a cleaning. 정량의 세정액이 저장되는 탱크에서 세정액의 농도를 검출하는 단계와;Detecting the concentration of the cleaning liquid in a tank in which a fixed amount of the cleaning liquid is stored; 검출된 농도값을 컨트롤러에 입력된 기준농도값과 비교하는 단계와;Comparing the detected concentration value with a reference concentration value input to the controller; 상기의 단계에서 검출된 농도값이 기준농도값보다 같거나 높으면 탱크내 세정액의 농도를 검출하는 단계로 리턴하고, 검출된 농도값이 기준농도값보다 낮으면 공급 라인을 통해 새로운 세정액을 공급하는 단계와:If the concentration value detected in the above step is equal to or higher than the reference concentration value, returning to the step of detecting the concentration of the washing liquid in the tank; and if the detected concentration value is lower than the reference concentration value, supplying a new washing liquid through the supply line. Wow: 상기 탱크내에서의 세정액 농도가 기준농도값과 같은지를 판단하여 같지 않으면 지속적으로 세정액을 공급하고, 같으면 장비를 세정하는 단계:Determining whether the concentration of the cleaning liquid in the tank is equal to the reference concentration value and continuously supplying the cleaning liquid if it is not the same; 로서 수행되는 반도체 장비용 세척방법.Method for cleaning semiconductor equipment performed as. 제 2 항에 있어서, 새로운 세정액을 공급시 탱크로부터는 드레인 라인을 통해 기사용한 세정액이 배출되도록 하는 반도체 장비용 세척방법.The cleaning method according to claim 2, wherein a fresh cleaning solution is discharged from the tank through a drain line when fresh cleaning solution is supplied. 제 2 항에 있어서, 상기 세정액 농도 검출 단계는 세정 공정의 수행 직전에 수행되는 반도체 장비용 세척방법.The method of claim 2, wherein the detecting of the concentration of the cleaning liquid is performed immediately before performing the cleaning process. 제 2 항에 있어서, 상기 세정액 농도 검출 단계는 세정 공정의 수행 중에 수행되는 반도체 장비용 세척방법.The method of claim 2, wherein the detecting of the cleaning solution concentration is performed during the cleaning process. 제 2 항에 있어서, 세정액을 추가로 공급하면서 세정액의 농도를 검출시 농도값이 기입력된 기준농도값과 같으면 세정 횟수가 설정된 횟수에 도달하였는지를 체크하는 단계와 세정 횟수가 설정 횟수에 도달하지 않았으면 상기 탱크에서의 세정액 농도를 검출하는 단계로 리턴하고, 설정 횟수에 도달하였으면 세정을 완료하는 단계를 수행하는 반도체 장비용 세척방법.The method according to claim 2, wherein when the concentration of the cleaning liquid is detected while additionally supplying the cleaning liquid, the step of checking whether the number of times of cleaning has reached the set number of times and the number of times of cleaning have not reached the set number of times when the concentration value is equal to the preset reference concentration value If it returns to the step of detecting the concentration of the cleaning liquid in the tank, and if the set number of times is reached, the cleaning method for the semiconductor equipment. 정량의 세정액이 저장되는 탱크에서 세정액의 농도를 검출하는 단계와;Detecting the concentration of the cleaning liquid in a tank in which a fixed amount of the cleaning liquid is stored; 검출된 농도값을 컨트롤러에 입력된 기준농도값과 비교하는 단계와;Comparing the detected concentration value with a reference concentration value input to the controller; 상기의 단계에서 검출된 농도값이 기준농도값보다 같거나 높으면 탱크내 세정액의 농도를 검출하는 단계로 리턴하고, 검출된 농도값이 기준농도값보다 낮으면 이들 농도값 차에 비례하여 세정 시간을 검출하는 단계와;If the concentration value detected in the above step is equal to or higher than the reference concentration value, the flow returns to the step of detecting the concentration of the washing liquid in the tank. If the detected concentration value is lower than the reference concentration value, the cleaning time is proportional to the difference between these concentration values. Detecting; 검출된 세정 시간만큼 세정을 수행하는 단계:Performing the cleaning by the detected cleaning time: 로서 수행되는 반도체 장비용 세척방법.Method for cleaning semiconductor equipment performed as. 제 7 항에 있어서, 상기 기준농도값과 검출되는 농도값간의 차에 비례하여 세정할 시간이 연산되어 테이블값으로 입력되도록 하는 반도체 장비용 세척방법.8. The method of claim 7, wherein a time for cleaning is calculated in proportion to the difference between the reference concentration value and the detected concentration value and input as a table value.
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KR100706665B1 (en) * 2005-11-23 2007-04-12 세메스 주식회사 System and method for supplying functional water
US7617836B2 (en) 2005-03-18 2009-11-17 Semes Co., Ltd. System and method for supplying functional water

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US7617836B2 (en) 2005-03-18 2009-11-17 Semes Co., Ltd. System and method for supplying functional water
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