KR20030077793A - Apparatus for treating hazardous gas using plasma - Google Patents

Abstract

PURPOSE: Provided is a hazardous gas treatment apparatus using high temperature zone of plasma. CONSTITUTION: The apparatus comprises an anode member(70) having a reaction room therein, in which at least 1000°C of plasma is generated and hazardous gas is treated by the plasma, a cathode assembly(20) having an upper end outside of the reaction room and a lower end inside of the reaction room, wherein plasma is generated by direct current arc discharge between the lower end of the cathode assembly(20) and the anode member(70), a gas guide unit(40,50,60) surrounding a lower portion of the cathode assembly(20), and an upper portion and outer side surface of the anode member(70) and having a gas distributing room therein for distributing harmful gas around the anode member(70) before the hazardous gas is introduced into the reaction room, wherein the gas guide unit(40,50,60) has at least one plasma gas passage way, and the anode member(70) has a hazardous gas passage for introducing hazardous gas to the reaction room therethrough, a treated gas passage for exhausting treated gas, and a cooling water passage.

Description

Apparatus for treating hazardous gas using plasma}

The present invention relates to an apparatus for treating noxious gas, and more particularly, to an apparatus for treating noxious gas using plasma.

In general, methods for generating plasma used to treat harmful gases such as perfluoro compounds, chlorofluoro carbons, and dioxins such as dioxins include shock and spark discharges. spark discharges, nuclear reactions, and arc discharges as in the present invention. Such arc discharge can be generated by applying a high voltage direct current arc between two electrodes. The gas is ionized by passing a gas capable of forming a plasma, such as nitrogen, between these arcs and heating it to a very high temperature. The plasma is formed by generating various kinds of reactive particles by this method. The temperature of this plasma is at least 1000 ° C. The harmful gas is injected into the plasma generated above 1000 ° C. to decompose it.

Conventionally, in the apparatus for treating noxious gas using plasma, the apparatus for generating plasma and the apparatus for disintegrating and injecting noxious gas into the plasma generated as described above have been separated from each other. Therefore, in such a structure, the high temperature region of the plasma cannot be efficiently used, which causes a large loss in energy efficiency.

In addition, in the conventional harmful gas treatment apparatus using a plasma, there is a certain limit to the decomposition efficiency of the harmful gas because the mixing of the plasma and the harmful gas is not made sufficiently.

Moreover, in the conventional apparatus, there is a problem that the lifetime of the electrode is shortened by applying a high voltage direct current between the two electrodes.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an apparatus for treating noxious gas using plasma which can efficiently use a high temperature region of the plasma.

Another object of the present invention is to provide an apparatus for treating noxious gas using plasma which is sufficiently mixed with plasma and noxious gas.

Still another object of the present invention is to provide an apparatus for treating noxious gas using a plasma which can reduce wear of two electrodes generating a direct current arc discharge to form a plasma.

Still another object of the present invention is to provide an apparatus for treating noxious gas using plasma, in which a gas forming plasma can be smoothly injected between two electrodes in which a direct current arc discharge is generated.

It is still another object of the present invention to provide a noxious gas treatment apparatus using plasma having a simple structure capable of efficiently cooling a reaction apparatus in which noxious gas is decomposed.

Still another object of the present invention is to provide an apparatus for treating harmful gas using plasma which can improve decomposition efficiency by uniformly and smoothly injecting harmful gas to be treated into a reaction apparatus.

Still another object of the present invention is to provide a novel structured apparatus using plasma capable of treating harmful gases generated in a liquid crystal manufacturing process as well as a semiconductor process.

1 is a partial cross-sectional view of the apparatus for treating harmful gas using plasma according to the present invention.

2A and 2C are perspective views illustrating a negative electrode assembly of the present invention.

3 is a perspective view showing an insulator of the present invention;

4A to 4C are perspective views respectively showing upper, middle and lower gas guiding means of the present invention.

5 is a perspective view showing the positive electrode member of the present invention.

6 is a sectional view taken along section 6-6 of FIG.

7 is a sectional view taken along line 7-7 of FIG.

8 is a sectional view taken along line 8-8 of FIG.

Figure 9 is a perspective view of the flange of the present invention.

<Brief description of symbols for the main parts of the drawings>

10: hazardous gas treatment device using plasma

20: negative electrode assembly 30: insulator

40: upper gas guiding means 50: intermediate gas guiding means

60: lower gas guide means 70: anode member

79: magnetic generating means 80: flange

90 housing

In order to achieve the above object, the harmful gas treatment apparatus using the plasma according to an aspect of the present invention, the anode member having a reaction chamber for processing the harmful gas by the plasma formed at least 1000 ℃ formed in this way And a cathode assembly and an anode, one end of which is located outside the reaction chamber and the other end of which is located in the reaction chamber, which forms the plasma by direct current arc discharge between the end of the reaction chamber and the anode member. It is provided with a gas inducing means surrounding the upper and outer surfaces of the member and the negative electrode assembly penetrates, and has a harmful gas dispersing chamber for dispersing the harmful gas introduced from the outside around the positive electrode member in advance. At least one gas inducing means is passed through the gas forming the plasma; It further has a plasma forming gas passage, wherein the anode member is at least one harmful gas passage through which harmful gas flowing into the reaction chamber passes, and at least one treatment passing through the harmful gas treated in the reaction chamber to be discharged to the outside. And a gas discharge passage and at least one coolant flow passage through which the coolant flows.

The cathode assembly preferably includes a cathode body having a passage through which cooling water flows, and a cathode coupled to the cathode body and positioned in the reaction chamber to generate a DC arc discharge with the anode member.

The material of the cathode is preferably hafnium or tungsten to which thorium or yttrium is added.

The negative electrode is preferably coupled to the negative electrode body so as to be exchangeable.

The cathode flow path of the cathode body includes an inner passage and an outer passage surrounding the inner passage, and the coolant flows into one of the inner passage and the outer passage and the coolant flows into the other passage.

Preferably, the cooling water flow passage of the negative electrode body extends to the inside of the negative electrode.

The coolant flow passage of the cathode body is preferably connected to the coolant flow passage of the cathode member.

The outlet of the plasma forming gas passage is preferably formed at a position opposite to the cathode assembly.

The plasma forming gas passage may preferably include a portion inclined at a predetermined angle in the transverse direction or parallel to the radial direction of the axis of the cathode assembly.

The plasma forming gas passage preferably includes a portion inclined at a predetermined angle in the longitudinal direction with respect to the radial direction of the axis of the negative electrode assembly.

The outlet of the noxious gas passage is preferably formed in a portion of the reaction chamber opposite to the region where the plasma is formed.

Preferably, the noxious gas passage includes a portion inclined at a predetermined angle in the transverse direction or parallel to the radial direction of the axis of the anode member.

Preferably, the noxious gas passage includes a portion inclined at a predetermined angle in the longitudinal direction with respect to the radial direction of the axis of the anode member.

The effective diameter of the harmful gas passage is preferably 0.1mm to 50mm.

Preferably, the cooling water flow passage of the positive electrode member is formed to penetrate the positive electrode member in a longitudinal direction parallel to the axis of the positive electrode member.

Preferably, the coolant flow passage of the positive electrode member is formed at a position on the circumferential direction of the positive electrode member without being in communication with the noxious gas passage.

The lower portion of the gas inducing means or the upper portion of the anode member adjacent thereto is preferably formed with a cooling water reservoir communicating with the cooling water flow passage of the anode member and temporarily storing the cooling water.

The gas guiding means is an intermediate gas guiding means disposed between the upper and lower gas guiding means having an upper gas guiding means covering an upper portion of the anode member, a lower gas guiding means surrounding a lower portion of the anode member and a noxious gas distribution chamber. It is preferable that it is made.

It is preferable that the anode member further has a reactive gas passage through which the reactive gas flowing in to promote the treatment of the noxious gas in the reaction chamber.

Preferably, the anode member further includes means for generating magnetism in the reaction chamber.

The magnetic generating means is preferably located between the anode member and the gas inducing means.

Preferably, the cathode assembly is further provided with a housing penetrating and covering the outside of the gas inducing means.

It is preferable that a flange for supporting the anode member and the gas inducing means is further provided.

According to another aspect of the present invention, an apparatus for treating harmful gases using plasma includes: an anode member having a reaction chamber therein at least 1000 ° C. in which plasma is formed and treating the harmful gas by the plasma formed therein; and an exterior of the reaction chamber. One end is located at the other end and the other end is located in the reaction chamber, the cathode assembly for forming the plasma by the direct current arc discharge between the end in the reaction chamber and the anode member, and the upper and outer surfaces of the anode member Surrounds the cathode assembly and has a gas inducing means having a noxious gas dispersing chamber for dispersing the noxious gas introduced from the outside around the positive electrode member in advance, and the positive electrode member has a plasma; At least one plasma forming gas passage through which a gas forming the gas passes; At least one harmful gas passage through which harmful gas flows into the at least one passage, at least one treatment gas discharge passage through which the harmful gas treated at the reaction chamber is discharged to the outside, and at least one cooling water flow passage through which cooling water flows; It is characterized by having.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing an apparatus for treating a noxious gas using plasma according to an exemplary embodiment of the present invention, and FIGS. 2 to 9 are views illustrating respective components of the apparatus for treating a noxious gas shown in FIG. 1.

Referring to the drawings, in the noxious gas treatment apparatus 10 using the plasma according to an embodiment of the present invention, at least 1000 ℃ plasma is formed and the reaction chamber 75 for processing the noxious gas by the plasma formed as described above A cathode member 70 having an inner portion thereof, and one end portion located outside the reaction chamber 75 and the other end portion located in the reaction chamber 75, and an end portion of the reaction chamber 75 and the anode member ( And a cathode assembly 20 which forms the plasma by direct current arc discharge therebetween.

In addition, the present embodiment surrounds the outer surface of the anode member 70, and the harmful gas introduced from the outside beforehand to the reaction chamber 75 before dispersing the harmful gas around the anode member 70 Gas guide means (40) (50) (60) having a dispersion chamber (51) is provided.

The gas guiding means 40, 50, 60 have at least one plasma forming gas passage 42 into which gas which is ionized in the reaction chamber 75 to form plasma is introduced, and the anode member 70 is provided. At least one harmful gas passage 72 through which the harmful gas is introduced, at least one treatment gas discharge passage 76 discharged to the outside after the harmful gas is processed and at least one cooling water flow passage through which the coolant flows ( 71).

Here, the negative electrode assembly 20, as shown in Figure 2a and 2b, is composed of a negative electrode body 20, a negative electrode 23 and the connecting member 22.

It is preferable that a passage 24 through which cooling water flows is formed inside the cathode body 20. Furthermore, the cooling water flow passage 24 of the negative electrode body 20 extends to the negative electrode 23 to efficiently cool the high temperature negative electrode 23 during operation of the negative electrode assembly 20. It is preferable because it can prevent abrasion.

In this embodiment, the cooling water flow passage 24 of the negative electrode body 21 is a single passage. However, the present invention is not limited thereto. For example, as illustrated in FIG. 2C, the cooling water flow passage of the negative electrode body 21 includes an inner passage 26 and an outer passage including the inner passage 26. It has a double passage consisting of (27), the cooling water flows into any one of the inner passage 26 and the outer passage 27, for example, the inner passage 26 and the cooling water flows into the outer passage 27 May be In this case, the inner passage 26 preferably extends to the cathode 23.

Although the coolant flow passage 24 of the negative electrode body 21 is not shown in the drawing, it is preferable that the coolant flow passage 24 be connected to the coolant flow passage 71 of the positive electrode member 70 in order to increase the efficiency of using the coolant.

The material of the cathode 23 is preferably hafnium or tungsten to which thorium or yttrium is added.

When the negative electrode 23 is interchangeably coupled to the negative electrode body 21 when it is necessary to replace it due to abrasion of the negative electrode 23 due to long-term use of the negative electrode assembly 20, it is easy, simple and inexpensive. It is desirable to be able to replace it. For example, in the present embodiment, the cathode 23 is bonded to one end of the connecting member 22 made of copper by a method such as brazing, and the other end of the connecting member 22 is screwed to the cathode body 21. The negative electrode 23 may be coupled to the negative electrode body 21 so as to be exchangeable. At this time, it is preferable that the cooling water flow passage 25 is formed in the connection member 22.

The negative electrode assembly 20 is coupled to the positive electrode member 70 such that one end of the negative electrode body 21 is located outside the positive electrode member 70 and the other end is positioned inside the positive electrode member 70.

It is preferable that an insulator 30 as shown in FIG. 3 is interposed between the negative electrode assembly 20 and the positive electrode member 70.

The insulator 30 has a passage 31 through which the cathode assembly 20 penetrates, and has an inlet 32 through which gas for forming plasma flows.

In this embodiment, a separate insulator 30 is interposed between the negative electrode assembly 20 and the positive electrode member 70, but the present invention is not limited thereto. It includes a structure in which the insulator 30 is integrally coupled to the upper portion of the gas induction means 40, 50, 60 installed on the outside, such a structure is preferable for the process simplification and simplification of the structure.

As shown in FIGS. 4A to 4C, the gas guiding means 40, 50 and 60 are upper gas guiding means 40 and the anode member 70 covering the upper portion of the anode member 70. An intermediate gas guiding means (50) having a lower gas guiding means (60) and a harmful gas dispersing chamber (51) surrounding the lower portion of the upper and lower gas guiding means (40, 60).

In the present embodiment, the gas induction means 40, 50, 60 are separated into three parts, but the present invention is not limited thereto, and the gas induction means 40 is integrally formed. It may be.

As illustrated in FIG. 4A, the upper gas guide means 40 communicates with the first passage 43 through which the insulator 30 penetrates in the center and the reaction chamber 75 of the anode member 70. It has two passages 44 and a plasma forming gas passage 42 through which a gas for forming plasma passes around the first passage 43. In addition, the upper gas guide means 40 has a flange portion 48 coupled with the intermediate gas guide means 50 is coupled to the intermediate gas guide means 50 by a screw 45 or the like.

The outlet 46 of the plasma forming gas passage 42 is formed at a position opposite to the negative electrode assembly 20, specifically, the connecting member 22 or the negative electrode 23. It is preferable because it can pass between two electrodes 23 and 70 which are regions where arc discharge is generated.

In addition, the plasma forming gas passage 42 may be inclined in a range of a predetermined angle, for example, 0 ° to 89 °, in parallel or in the transverse direction with respect to the radial direction of the axis z of the cathode assembly 20 ( 47 may include a gas to form a plasma introduced around the connecting member 22 or the cathode 23 to flow toward the cathode 23 while rotating around the cathode assembly 20 to contribute to plasma formation. It is preferable to be able.

Further, the plasma forming gas passage 42 includes a portion 47 inclined at a predetermined angle in the longitudinal direction with respect to the radial direction of the axis z of the cathode assembly 20. It is preferable to induce gas to form a plasma introduced into the cathode 23 so as to easily proceed toward the cathode 23.

The upper gas guide means 40 also has a coolant flow passage 41 connected to the coolant flow passage 75 of the anode member 70.

The lower portion of the upper gas guide means 40 or the upper portion of the anode member 70 adjacent thereto, as shown in FIG. 5, is in communication with the coolant flow passage 75 of the anode member 70 and the coolant It is preferable that a coolant reservoir 78 is temporarily stored. The coolant reservoir 78 functions to appropriately adjust the amount of coolant communicated in the coolant flow passage 75 of the positive electrode member 70 according to the material so that the coolant flows smoothly.

The intermediate gas guide means 50, as shown in Figure 4b, has a passage 52 through which the anode member 70 penetrates in the central portion, and the harmful gas inlet 53 through which harmful gas flows into the side surface thereof. Have The diameter of the passage 52 through which the anode member 70 penetrates is larger than the outer diameter of the anode member 70, so that the anode member 70 is disposed between the anode member 70 and the intermediate gas guiding means 50. A space surrounding the periphery 70 is formed. This space is a noxious gas dispersing chamber 51 for dispersing the noxious gas introduced into the noxious gas inlet 53 to the periphery of the positive electrode member 70 before entering the reaction chamber 75 of the positive electrode member 70. The harmful gas is induced to be uniformly introduced into the reaction chamber 75 in the radial direction.

As shown in FIG. 4C, the lower gas guide means 60 has a passage 63 through which the anode member 70 penetrates a central portion thereof, and a plurality of grooves 62 are provided on an inner side surface of the passage 63. This groove 62 serves to fix the magnetic generating means 79, as shown in Figure 8, which is installed on the outer surface of the anode member 70.

In addition, the lower gas guide means 60 further has a reactive gas flow path 61 into which a reactive gas for promoting decomposition of harmful gases is introduced into the reaction chamber 75 of the anode member 70. desirable. The reactive gas flow path 61 communicates with the reactive gas passage 73 of the anode member 70.

On the inner side surface of the inner passage 63 of the lower gas guide means 60 before the reactive gas introduced through the reactive gas path 61 is introduced into the reaction chamber 75 of the anode member 70 A reactive gas dispersing groove 64 is formed to disperse the reactive gas so as to be distributed around the anode member 70. The reactive gas is dispersed in the surroundings of the anode member 70 through the reactive gas dispersion groove 64 formed as described above, and then flows into the reaction chamber 75 so that the reactive gas is evenly dispersed in the reaction chamber 75 to decompose harmful gas. Treatment reactions can be further accelerated.

The lower gas guide means 60 is screwed with the intermediate gas guide means 50, or is coupled by an adhesive or the like.

As shown in FIG. 5, the anode member 70 has a reaction chamber 75 in which plasma formation and decomposition of noxious gas occur in the center, and the anode member 70 around the reaction chamber 75. At least one harmful gas passage 72 penetrating the anode member 70 laterally so as to communicate with the reaction chamber 75, and having at least one cooling water flow passage 71 passing through the longitudinal direction; Each has at least one reactive gas passage 73.

In addition, the outer surface of the anode member 70 is formed with a groove 74 in which at least one magnetic generating means 79 such as a permanent magnet or an electromagnet for generating magnetism is provided in the reaction chamber 75.

The reaction chamber 75 may be formed in a cylindrical shape or the like, and the effective diameter of the reaction chamber 75 may be easily formed between the anode member 70 and the cathode 23 while the DC arc discharge may be easily formed. It is desirable to have an appropriate value that minimizes wear of (70) (23).

6 and 7, the coolant flow passage 71 of the anode member 70 is formed so as not to communicate with the harmful gas passage 72 and the reactive gas passage 73 of the anode member 70. It is.

The plurality of coolant flow passages 71 of the anode member 70 are preferably arranged at uniform intervals on the circumference of the reaction chamber 75. In this way, evenly harmful gases can be injected into the reaction chamber 75, so that the mixing of the plasma and the harmful gases is efficiently performed, and the time for which the harmful gases stay in the reaction chamber 75 is increased, thereby improving decomposition rate and Decomposition treatment is possible.

The diameter of the coolant flow passage 71 of the positive electrode member 70 can be appropriately selected by those skilled in the art within a range that can match the cooling function and structural strength. By adjusting the number and the cross-sectional area of the cooling water flow passage 71 it can form an optimal reaction temperature range.

As illustrated in FIG. 5, the outlet 72 ′ of the noxious gas passage 72 is a portion facing the region where the plasma is formed in the reaction chamber 75, for example, the portion facing the cathode 23. Alternatively, it is preferable to form the lower portion thereof so that harmful gas can be introduced directly into the plasma formed near the cathode 23 to improve the decomposition efficiency.

As illustrated in FIG. 6, the noxious gas passage 72 has a portion 72 ″ inclined at a predetermined angle in the transverse direction or parallel to the radial direction of the axis z of the anode member 70. In this case, the noxious gas passage 72 can maintain an angle of 0 ° to 89 ° with respect to the radial direction of the axis z of the anode member 70. When the gas flows into the reaction chamber 75, the gas is rotated and mixed to facilitate the mixing with the plasma, and the residence time of the noxious gas in the reaction chamber 75 can be increased, thereby improving the decomposition efficiency. Therefore, a large amount of processing can be performed.

The noxious gas passage 72 also includes a portion 72 "inclined at a predetermined angle in the longitudinal direction with respect to the radial direction of the axis z of the anode member 70 at the desired location of the reaction chamber 75. It is preferable to inject harmful gas into the mixture so that mixing and the like can occur smoothly.

The cross section of the noxious gas passage 72 is preferably circular, but is not necessarily limited thereto, and may be rectangular or hexagonal, and in this case, the effective diameter is preferably 0.1 mm to 50 mm. Here, the effective diameter refers to the average diameter of the shape formed by the cross section of the noxious gas passage (72).

As shown in FIG. 5, the harmful gas passages 72 are arranged in circumferentially uniform intervals around the reaction chamber 75 and are arranged in a plurality of rows in the longitudinal direction. It is preferable because the gas can be injected uniformly into the reaction chamber 75.

As shown in FIG. 7, the reactive gas passage 73 does not communicate with the coolant flow passage 71 of the anode member 70, and the reactive gas distribution groove 64 of the lower gas guide means 60 does not communicate with the reactive gas passage 73. ) And the reaction chamber 75. The plurality of reactive gas passages 73 are preferably formed to be uniformly arranged circumferentially around the reaction chamber 75.

The reactive gas passage 73 may be formed at a position above or below the hazardous gas passage 72.

The positive electrode member 70 has a replaceable structure, so that only the positive electrode member 70 can be replaced when there is a need to replace the positive electrode due to long-term use.

Outside the anode member 70, as shown in FIG. 8, magnetic generating means 79 such as permanent magnets or electromagnets for generating magnetism are provided in the reaction chamber 75. As shown in FIG. By installing the self-generating means 79 can maximize the rotation of the mixture gas of the plasma and harmful gas in the reaction chamber 75 to increase the residence time of the harmful gas can be smoothly mixed to improve the decomposition efficiency and durability Can be.

Although the magnetic generating means 79 is disposed to be interposed between the anode member 70 and the lower gas guide means 60, it is advantageous to generate magnetism in the reaction chamber 75, but in the present invention The present invention is not necessarily limited thereto, and may be provided at a position capable of generating magnetism in the reaction chamber 75, for example, outside the lower gas guide means 60 or in the reaction chamber 75. In addition, the magnetic generating means 79 is preferably arranged to be spaced apart at regular intervals on the circumference around the anode member (70).

The magnetic generating means 79 is suitable for generating at least one gauss of magnetism to cause rotation of the plasma.

A harmful gas discharge passage 76 through which the gas decomposed in the reaction chamber 75 is discharged is formed below the anode member 70.

A lower portion of the anode member 70 is also provided with a coolant reservoir 85 in communication with the coolant flow passage 71 to temporarily store the coolant. This coolant reservoir 85 is also in communication with the coolant flow passage 82 of the flange 80 as shown in FIG.

The cathode assembly 20 penetrates to the outside of the gas inducing means 40, 50 and 60, and a housing 90 is further provided to cover the outside of the gas inducing means 40, 50 and 60. It is preferable. This housing 90 functions to protect the components therein.

A flange 80 supporting them may be further added to the lower portion of the anode member 70 and the lower portion of the lower gas guide means 60.

As shown in FIG. 9, the flange 80 has a passage 83 facing the harmful gas discharge passage 76 of the anode member 70 at the center thereof, and cooling water around the passage 83. Has a passage 82 through which the gas flows, and a reactive gas inflow passage 81 in communication with the reactive gas passage 61 of the lower gas guide means 60.

The cooling water flow passage 82 of the flange 80 is preferably in communication with the cooling water flow passage 24 of the negative electrode assembly 20 because it can increase the efficiency of use of the cooling water.

The apparatus for treating harmful gases using plasma according to another embodiment of the present invention is identical in configuration to the above-described embodiment except for the following points.

That is, in the embodiment described above, the plasma forming gas passage 42 is formed in the upper gas guiding means 40, whereas in the present embodiment, the plasma forming gas passage 42 is formed in the anode member. have.

In this way, the structure of the gas inducing means can be simplified, and the effect of injecting the gas to form the plasma closer to the arc discharge region can be achieved.

In the present invention, the plasma forming gas may be at least one selected from the group consisting of argon, nitrogen, air, hydrogen, oxygen, and a mixture of a plurality of these gases.

In the present invention, the harmful gas is selected from the group consisting of perfluoro compounds, chlorofluoro carbons, dioxin, furan, volatile organic compounds, and a plurality of mixtures thereof. At least one may be selected.

In the present invention, the harmful gas may be a material generated in the liquid crystal manufacturing process as well as the semiconductor process.

In the present invention, the reactive gas may be a substance composed of hydrogen or oxygen, or a substance mixed with hydrogen or oxygen.

In the present invention, the reactive gas may be H20 of steam or fine particles.

Hereinafter, the operation of the noxious gas treatment apparatus using the plasma according to the present invention having the above-described configuration.

An arc discharge is formed between the cathode 23 and the anode member 70 by a high voltage of at least 100 volts (V) applied to the cathode assembly 20, and the plasma forming gas passage 42 is formed in the arc discharge region. Plasma forming gases such as argon and nitrogen introduced through the plasma form. The plasma formed as described above becomes a high temperature thermal plasma of 1000 ° C. or higher, and harmful gases that contaminate the global environment such as perfluoro compounds introduced through the harmful gas passage 72 are decomposed into the high temperature thermal plasma. At this time, the decomposition efficiency is improved by reactive gases such as oxygen and hydrogen introduced through the reactive gas passage 73. In addition, the magnetism generated by the magnetic generating means 79 provided on the outer side of the anode member 70 facilitates mixing of the plasma and the noxious gas, and increases the residence time in the reaction chamber 75, thereby increasing the noxious gas. It is possible to improve the decomposition efficiency of the large-capacity processing. The harmful gas decomposed in this way is discharged to the outside through the process gas discharge passage 76 of the anode member (70).

The invention can be explained in more detail by the following examples.

Example 1

A plasma of at least 1,000 K was generated at a power of 6 kW and a plasma forming gas flow rate of 15 l / min. Nitrogen and CF4 were injected at a flow rate of 100 l / min and 1 l / min, respectively, as a noxious gas. Injecting / min to 6 l / min to determine the decomposition efficiency of CF4. In this case, a decomposition efficiency of 50% to 65% was obtained.

Example 2

Plasma formation and harmful gas injection conditions were the same as in Example 1, and hydrogen was used as the reactive gas. The decomposition efficiency of CF 4 was examined while changing the flow rate of hydrogen from 2 l / min to 8 l / min. In this case, when the flow rate of hydrogen was 8 l / min, decomposition efficiency of 95% or more was obtained. However, because there was no oxygen, carbon elements formed soot on the inner wall of the reaction chamber, which obstructed the fluid flow in the tube.

Example 3

Plasma formation and noxious gas injection conditions were the same as in Example 1, and steamed H2O and oxygen were used as reactive gases. At this time, the decomposition efficiency was examined while changing the flow rate of the reactive gas from 2 l / min to 8 l / min. In this case, the decomposition efficiency was slightly lower than that of using hydrogen as a reactive gas, but the soot in the reaction chamber was completely removed.

Effects of the noxious gas treatment apparatus using the thermal plasma according to the present invention having the configuration as described above are as follows.

First, the apparatus for treating noxious gas using plasma according to the present invention has an integrated type which directly injects noxious gas into the plasma forming region, so that the high temperature region of the plasma can be efficiently used.

Second, the apparatus for treating harmful gases using plasma according to the present invention allows the harmful gas introduced through the harmful gas passage to rotate, and also adds a means for generating magnetism in the reaction chamber, whereby the mixture of the plasma and the harmful gas is sufficiently made. By increasing the residence time, not only can the decomposition efficiency be improved, but also the wear of the electrode can be reduced.

Third, the apparatus for treating harmful gases using plasma according to the present invention can protect the cathode and the anode from high temperature plasma by forming a cooling water flow path in the cathode assembly and the anode member.

Fourth, in the harmful gas treatment apparatus using the plasma according to the present invention by forming the outlet of the plasma forming gas passage to face the cathode assembly, the gas forming the plasma can be smoothly injected between the two electrodes of the DC arc discharge is generated. .

Fifth, the noxious gas treatment apparatus using plasma according to the present invention has a simple structure that can efficiently cool the reaction apparatus in which noxious gas is decomposed by forming the cooling means of the positive electrode member integrally with the positive electrode member. This can be simplified.

Sixth, the apparatus for treating harmful gases using plasma according to the present invention allows the harmful gas passage to be formed at a predetermined angle with respect to the radial direction on the circumference around the reaction chamber of the anode member so that the harmful gases to be treated are uniform in the reaction apparatus. It is possible to improve the decomposition efficiency by injecting smoothly.

Seventh, the apparatus for treating harmful gases using plasma according to the present invention may process harmful gases generated in semiconductor processes and liquid crystal manufacturing processes as well as global pollutants in the gas phase.

Eighth, the harmful gas treatment apparatus using the plasma according to the present invention can greatly improve the harmful gas treatment capacity.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, it is merely an example, and those skilled in the art may realize various modifications and equivalent other embodiments therefrom. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (22)

An anode member in which a plasma of at least 1000 ° C. is formed and has a reaction chamber therein for processing the noxious gas by the plasma thus formed; An anode assembly having one end portion located outside the reaction chamber and the other end portion located at the reaction chamber, and configured to form the plasma by DC arc discharge between the end portion of the reaction chamber and the anode member; And A gas inducing means surrounding the upper and outer surfaces of the anode member and having the harmful gas dispersing chamber thereinto distributed around the anode member in advance before introducing the harmful gas introduced from the outside into the reaction chamber; And The gas guiding means further has at least one plasma forming gas passage through which the gas forming the plasma passes; The anode member includes at least one harmful gas passage through which harmful gas flowing into the reaction chamber passes, and at least one treatment gas discharge passage through which the harmful gas treated in the reaction chamber is discharged to the outside, and at least one cooling gas flowing therethrough. An apparatus for treating harmful gases using plasma, characterized in that it has one cooling water flow passage. The cathode assembly of claim 1, further comprising a cathode body having a passage through which cooling water flows, a cathode coupled to the cathode body and positioned in the reaction chamber to generate a DC arc discharge with the anode member. The cathode is a noxious gas processing device using a plasma, characterized in that coupled to the cathode body so as to be interchangeable. According to claim 2, wherein the cooling water flow passage of the negative electrode body includes an inner passage and an outer passage surrounding the inner passage, the coolant flows into any one of the inner passage and the outer passage and the coolant flows to the other passage Harmful gas treatment apparatus using a plasma, characterized in that. The apparatus of claim 2, wherein the cooling water flow passage of the cathode body is connected to the cooling water flow passage of the anode member. The apparatus of claim 1, wherein the plasma forming gas passage includes a portion inclined at a predetermined angle in parallel or in a transverse direction with respect to the radial direction of the axis of the cathode assembly. The apparatus of claim 1, wherein the outlet of the noxious gas passage is formed at a portion of the reaction chamber that faces the region where the plasma is formed. The apparatus of claim 6, wherein the noxious gas passage includes a portion inclined at a predetermined angle in the transverse direction or parallel to the radial direction of the axis of the anode member. The apparatus of claim 6, wherein the noxious gas passage includes a portion inclined at a predetermined angle in a longitudinal direction with respect to the radial direction of the axis of the anode member. The apparatus of claim 6, wherein the effective diameter of the noxious gas passage is 0.1 mm to 50 mm. The apparatus of claim 1, wherein the cooling water flow passage of the anode member is formed to penetrate the anode member in a longitudinal direction parallel to the axis of the anode member. The apparatus of claim 10, wherein the cooling water flow passage of the anode member is formed at a position on the circumferential direction of the anode member without being in communication with the harmful gas passage. According to claim 1, wherein the lower portion of the gas inducing means or the upper portion of the anode member adjacent to the cooling water flow passage of the anode and the cooling water reservoir, characterized in that the cooling water storage is temporarily stored, characterized in that Hazardous Gas Treatment System. The gas inducing means of claim 1, wherein the gas inducing means has an upper gas inducing means covering an upper portion of the anode member, a lower gas inducing means surrounding a lower portion of the anode member, and a harmful gas dispersing chamber, and is disposed between the upper and lower gas inducing means. Toxic gas treatment apparatus using a plasma, characterized in that consisting of intermediate gas guide means. The apparatus of claim 1, wherein the anode member further has a reactive gas passage through which a reactive gas introduced to promote the treatment of the noxious gas in the reaction chamber. The apparatus of claim 1, wherein the anode member further comprises means for generating magnetism in the reaction chamber. 16. The apparatus of claim 15, wherein the self-generating means is located between the anode member and the gas inducing means. The apparatus of claim 1, further comprising a housing through which the cathode assembly penetrates and covers the outside of the gas inducing means. The apparatus of claim 1, further comprising a flange guide for supporting the anode member and the gas inducing means. An anode member in which a plasma of at least 1000 ° C. is formed and has a reaction chamber therein for processing the noxious gas by the plasma thus formed; An anode assembly having one end portion located outside the reaction chamber and the other end portion located at the reaction chamber, and configured to form the plasma by DC arc discharge between the end portion of the reaction chamber and the anode member; And A gas inducing means surrounding the upper and outer surfaces of the anode member and having the harmful gas dispersing chamber thereinto distributed around the anode member in advance before introducing the harmful gas introduced from the outside into the reaction chamber; And The anode member includes at least one plasma forming gas passage through which a gas forming plasma passes, at least one harmful gas passage through which harmful gas flowing into the reaction chamber passes, and harmful gases processed in the reaction chamber are discharged to the outside. At least one process gas discharge passage passing through the harmful gas treatment apparatus using a plasma, characterized in that it has at least one cooling water flow passage through which the coolant flows. 20. The method according to any one of claims 1 to 19, wherein the noxious gases are perfluoro compounds, chlorofluoro carbons, dioxin, furan, volatile organic compounds. And at least one selected from the group consisting of a mixture of at least two of them. 20. The apparatus of claim 1, wherein the noxious gas is a substance generated in a semiconductor manufacturing process. 20. The apparatus of claim 1, wherein the noxious gas is a substance generated in a liquid crystal manufacturing process.