KR20030065764A - Pattern forming mehtod and device of floor covered - Google Patents

Pattern forming mehtod and device of floor covered Download PDF

Info

Publication number
KR20030065764A
KR20030065764A KR1020020005531A KR20020005531A KR20030065764A KR 20030065764 A KR20030065764 A KR 20030065764A KR 1020020005531 A KR1020020005531 A KR 1020020005531A KR 20020005531 A KR20020005531 A KR 20020005531A KR 20030065764 A KR20030065764 A KR 20030065764A
Authority
KR
South Korea
Prior art keywords
flooring
fabric
pattern forming
chips
pattern
Prior art date
Application number
KR1020020005531A
Other languages
Korean (ko)
Inventor
김희연
Original Assignee
김희연
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김희연 filed Critical 김희연
Priority to KR1020020005531A priority Critical patent/KR20030065764A/en
Publication of KR20030065764A publication Critical patent/KR20030065764A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/005Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037Other properties
    • B29K2995/0072Roughness, e.g. anti-slip
    • B29K2995/0074Roughness, e.g. anti-slip patterned, grained
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/732Floor coverings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Floor Finish (AREA)

Abstract

PURPOSE: A method and apparatus for forming patterns of floor material is provided to improve the aesthetic design of the floor material and satisfy the user. CONSTITUTION: A winding roller(14) winds floor raw material(P) having a certain length to supply the material at a certain velocity. An adhesive is applied on the surface of the floor raw material to form an adhesive layer. Chips from a hopper(32) are distributed over the adhesive layer formed on the floor raw material. The uneven chips are removed to displace the chips on the adhesive layer of the floor raw material in an even manner. The distributed chips on the floor raw material are melted to have the various patterns by driving a pattern forming member in right or left direction. A presser(70) presses the floor raw material having the various patterns.

Description

바닥재의 무늬 성형방법 및 장치{PATTERN FORMING MEHTOD AND DEVICE OF FLOOR COVERED}PATTERN FORMING MEHTOD AND DEVICE OF FLOOR COVERED}

본 발명은 바닥재의 무늬 성형방법 및 장치에 관한 것으로서, 보다 상세하게는 PVC 및 플라스틱 소재로 이루어진 바닥재를 성형함에 있어, 외관의 미려한 연출을 위해 다양한 무늬를 표출시키기 위한 무늬 성형방법 및 장치로써, 연속 성형되는 무늬를 동일·반복됨 없이 전혀 다른 무늬로 성형·표출되도록 하여 다양한 무늬를 자유롭게 표출할 수 있도록 한 바닥재 무늬 성형방법 및 장치에 관한 것이다.The present invention relates to a pattern forming method and apparatus of a flooring material, and more particularly in molding a flooring material made of PVC and plastic materials, as a pattern forming method and apparatus for expressing a variety of patterns for a beautiful appearance of the continuous, The present invention relates to a flooring pattern forming method and apparatus for freely expressing various patterns by molding and expressing a completely different pattern without the same or repeated pattern.

일반적으로, 바닥재[주로, 장판(壯版)이라고 칭함)라 함은 주택을 신축함에 있어, 거실, 주방, 침실 등과 같이 건물의 실내에는 쾌적함과 안락함을 위해 설치되는 것으로서, 각각의 재질 및 제조방법에 따라 다양한 형태로 이루어진다.In general, flooring materials (mainly called floorboards) are installed in a building such as a living room, kitchen, bedroom, etc. for comfort and comfort in building a house. Depending on the various forms.

현재, 가장 많이 사용되고 있는 바닥재로는 PVC재질이나 플라스틱 재질로 이루어진 바닥재가 사용되고 있으며, 이러한, 바닥재는 사용자의 개성 및 취양에 맞게 다양한 색상 및 무늬를 갖게 된다.Currently, the most used flooring material is a flooring made of PVC or plastic materials, such flooring will have a variety of colors and patterns to suit the user's personality and taste.

한편, 바닥재를 제조함에 있어, 바닥재의 상품가치를 높이고 사용자의 취양 및 외관의 미려함을 향상시키기 위해 다양한 색상과 무늬가 성형되고 있으며, 특히, 종래 바닥재의 무늬성형 방법은 다음과 같은 공정으로 이루어진다.On the other hand, in manufacturing the flooring, various colors and patterns are molded in order to increase the product value of the flooring material and improve the beauty and appearance of the user, in particular, the conventional flooring pattern forming method is made of the following process.

종래 바닥재의 무늬성형을 위한 공정은 일정한 길이를 갖는 바닥재 원단(PVC 또는 플라스틱 재질로 이루어진 원단)을 권취로울러에 감아 일정하게 공급하는 공정과, 이송수단(컨베이어에 의해 이송)에 의해 이송·공급되는 바닥재 원단의 일측표면(상면)에 일정량의 접착제를 도포하여 접착층을 형성하는 공정과, 다량의 칩(알갱이 형태로 다양한 색상을 가지며 바닥재 원단보다 용융점이 낮은 소재로 이루어짐)이 투입된 호퍼로부터 공급로울러에 의해 일정량의 칩이 바닥재 원단에 형성된 접착층에 산포되는 공정과, 바닥재 원단의 접착층에 산포된 칩을 전면에 고르게 위치되도록 분산시키거나 중복·적층된 칩을 선별하여 제거·낙하시키는 칩선별공정과, 바닥재 원단에 산포된 칩을 용융시키는 가열공정과, 용융된 칩을 압착·분포시켜 소정형태의 무늬를 성형하는 공정으로 이루어진다.Conventionally, the process for molding the flooring material is a process of winding a flooring material (a fabric made of PVC or a plastic material) having a constant length to a winding roller and supplying it constantly, and being transported and supplied by a conveying means (conveying by a conveyor). A process of forming an adhesive layer by applying a certain amount of adhesive to one surface (upper surface) of the flooring fabric, and a large amount of chips (various colors in the form of granules and consisting of a material having a lower melting point than the flooring fabric) from the hopper to the supply roller. A process in which a predetermined amount of chips are scattered on the adhesive layer formed on the flooring fabric, and a chip selection process of dispersing the chips scattered on the adhesive layer of the flooring fabric so as to be evenly disposed on the front surface, or selecting and removing and dropping the stacked and stacked chips; The heating process of melting the chips scattered on the flooring fabric, and crimping and distributing the molten chips to produce It consists of a process of molding the jaws

상기와 같은 공정에 의해 종래의 바닥재에 무늬가 성형되는 것이다.The pattern is molded to the conventional flooring material by the above process.

그러나, 상기와 같이, 종래의 바닥재에 무늬를 성형함에 있어서는 바닥재 원단에 형성된 접착층에 산포되고 가열·용융된 칩이 로울러에 의해 압착되면서 칩이 분포됨에 의해 무늬가 성형되므로 성형되는 무늬가 항상 동일·반복되어 다양한 무늬의 표출이 불가능하여 외관이 단조롭고 미려하지 못하며, 또한 바닥재를 구입함에 있어, 사용자의 취양이나 개성에 맞는 욕구를 충족시킬 수 없는 폐단을 안고 있다.As described above, however, in forming a pattern on a conventional flooring material, the pattern is formed by distributing the chip while the chips dispersed and heated and melted by the roller are pressed onto the adhesive layer formed on the flooring fabric, so that the pattern is always the same. Repeated appearance of various patterns is impossible to be monotonous and not beautiful, and also in purchasing the flooring, there is a closure that can not meet the needs of the user's taste or personality.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위한 것으로서, 그 목적은 바닥재의 무늬를 성형함에 있어, 바닥재에 접착·산포되고 가열·용융된 칩이 좌·우측방향 및 상·하방향으로 유동되는 무늬 성형부재에 의해 다양한 무늬를 갖도록 성형됨에 따라, 바닥재에 성형되는 무늬를 항상 다른 무늬를 갖도록 연속·표출할수 있도록 하여 소제 특성에 한정되지 않고 다양한 무늬를 표출할 수 있도록 된 새로운 형태의 바닥재의 무늬 성형방법 및 장치를 제공하고자 하는 것이다.The present invention is to solve the conventional problems as described above, the purpose of forming the pattern of the flooring material, the chip bonded and scattered on the flooring material is heated and melted flows in the left, right direction and up and down direction As it is molded to have various patterns by the pattern forming member, the pattern formed on the flooring material can be continuously and expressed to have a different pattern at all times, so that the pattern of the new type flooring material can express various patterns without being limited to the characteristics of the material. It is to provide a molding method and apparatus.

이와 같은 목적을 달성하기 위하여, 본 발명은 바닥재에 무늬를 성형함에 있어서, 일정한 길이를 갖는 바닥재 원단(PVC 또는 플라스틱 재질로 이루어진 원단)을 권취로울러에 감아 일정하게 공급하는 공정과, 이송수단(컨베이어에 의해 이송)에 의해 이송·공급되는 바닥재 원단의 일측표면(상면)에 일정량의 접착제를 도포하여 접착층을 형성하는 공정과, 다량의 칩(알갱이 형태로 다양한 색상을 가지며 바닥재 원단보다 용융점이 낮은 소재로 이루어짐)이 투입된 호퍼로부터 공급로울러에 의해 일정량의 칩이 바닥재 원단에 형성된 접착층에 산포되는 공정과, 바닥재 원단의 접착층에 산포된 칩을 전면에 고르게 위치되도록 분산시키거나 중복·적층된 칩을 선별하여 제거·낙하시키는 칩선별공정과, 바닥재 원단에 산포된 칩을 용융시키는 가열공정과, 바닥재 원단 표면에 용융된 칩을 무늬 성형부재를 이용하여 다양한 무늬를 갖도록 성형하는 공정과, 무늬 성형부재에 의해 다양한 무늬가 성형된 용융상태의 칩을 압착·분포시키는 공정으로 이루어진 특징을 갖는다.In order to achieve the above object, the present invention in the process of molding the pattern on the flooring, the process of winding the flooring material (PVC or plastic material made of a plastic material) having a constant length to the winding roller to supply a constant, conveying means (conveyor) A process of forming an adhesive layer by applying a certain amount of adhesive to one surface (upper surface) of the flooring fabric to be transported and supplied by a) and a large amount of chips (various colors in the form of granules and having a lower melting point than the flooring fabric) The chip is dispersed in the adhesive layer formed on the fabric of the flooring material by the supply roller, and the chips scattered on the adhesive layer of the fabric of the flooring material are distributed evenly on the front surface, or the overlapped and stacked chips are selected. A chip selection process for removing and dropping the particles, a heating process for melting chips scattered on the flooring fabric, It characterized comprising the molten chips dakjae the fabric surface as the step of the step of molding so as to have a variety of patterns by using a pattern-forming member, a variety of patterns of the compression-molded by a molten chip pattern-forming member, the distribution.

이와 같은 본 발명에서, 바닥재의 무늬 성형장치는 지지브라켓에 의해 설치되는 권취로울러에 바닥재 원단이 감겨진 원단공급기와, 일정량의 접착제가 담겨진 접착제통과 구동축에 의해 공급되는 바닥재의 상면에 일정량의 접착제가 도포하는 접착제 도포기와, 상방에는 일정량의 칩이 저장·공급되는 호퍼가 설치되고 상기 호퍼의 하단부에는 방사상으로 요홈부가 형성된 공급로울러가 칩을 바닥재의 접착층에 산포되도록 설치되며 하방에는 산포된 칩의 잔량을 회수하기 위한 회수통이설치된 칩산포기와, 고정다이에 의해 프레임에 설치되고 전동모우터에 의해 회전되는 회전축과 회전판 및 타격봉으로 이루어진 칩선별기와, 일측표면에 접착층이 형성되고 일정량의 칩이 산포된 바닥재 원단을 이송·공급하기 위한 컨베이어가 지지프레임에 의해 일정한 길이를 갖도록 설치되고 다수개의 히터코일을 갖는 히터로 이루어진 가열기와, 하방에 전동모우터가 설치되고 상방에는 동력전달수단(체인이나 벨트 등)에 의해 외주면이 근접된 상태를 이루도록 제 1, 2로울러가 회동·설치되고 상기 제 1, 2로울러의 외주면이 근접되는 부위의 일측 상방에는 브라켓에 의해 설치된 정·역구동 모우터의 로드에 커플링으로 스크류가 회전·결합되고 상기 스크류에는 하방으로 다수개의 무늬 성형부재가 등간격을 이루며 결합된 지지틀이 가이드봉에 축설된 무늬성형기와, 전동모우터에 의해 회전되도록 상·하부 압착로울러로 이루어진 압착기로 이루어진 특징을 갖는다.In the present invention, the pattern forming apparatus of the flooring material has a predetermined amount of adhesive on the upper surface of the flooring material supplied by the drive shaft and the adhesive supply container and the drive shaft containing the flooring fabric is wound on the winding roller installed by the support bracket An adhesive applicator to be applied and a hopper for storing and supplying a predetermined amount of chips are installed on the upper side, and a supply roller having a recess in the bottom of the hopper is installed so that the chips are scattered on the adhesive layer of the flooring material. A chip spreader equipped with a collecting container for collecting water, a chip selector comprising a rotating shaft, a rotating plate, and a striking rod installed on a frame by a fixed die and rotated by an electric motor, and an adhesive layer is formed on one surface thereof, Conveyor for transporting and supplying scattered flooring fabric by supporting frame Heaters composed of heaters having a predetermined length and having a plurality of heater coils, and electric motors are installed on the lower side, and the outer circumferential surface is approached by power transmission means (chain or belt, etc.) in the first and second directions. A screw is rotated and coupled by a coupling to a rod of a forward / reverse drive motor installed by a bracket on the upper side of a part where the roller is rotated and installed and the outer circumferential surfaces of the first and second rollers are close to each other. It is characterized in that the pattern forming member is formed at equal intervals and the support frame coupled to the pattern forming member is formed on the guide rod, and the pressing machine consisting of the upper and lower compression rollers to be rotated by the electric motor.

도 1은 본 발명에 따른 바닥재의 무늬 성형장치를 나타내는 측면 개략도,1 is a side schematic view showing a pattern forming apparatus of a flooring according to the present invention;

도 2는 도 1의 A부에 대한 확대 사시도,2 is an enlarged perspective view of a portion A of FIG. 1;

도 3은 본 발명에 따른 무늬 성형장치의 무늬 성형기를 나타내는 정면도,3 is a front view showing a pattern forming machine of the pattern forming apparatus according to the present invention;

도 4는 본 발명에 따른 바닥재의 무늬 성형방법을 설명하기 위한 공정도,4 is a process chart for explaining a pattern forming method of the flooring according to the present invention;

도 5는 본 발명에 따른 바닥재의 무늬 성형장치의 다른 실시예를 나타내는 측면 개략도이다.Figure 5 is a side schematic view showing another embodiment of the pattern forming apparatus of the flooring according to the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

1:무늬 성형장치 10:원단공급기1: pattern forming apparatus 10: fabric feeder

20:접착제 도포기 30:칩산포기20: adhesive applicator 30: chip spreader

40:칩선별기 50:가열기40: chip selector 50: heater

60:무늬성형기 61:하우징60: pattern molding machine 61: housing

62:제 1로울러 63:제 2로울러62: first roller 63: second roller

64:로드 65:커플링64: rod 65: coupling

66:스크류 67:무늬 성형부재66: screw 67: pattern molding member

68:지지틀 69:가이드봉68: support frame 69: guide rod

70:압착기 80:권취부70: presser 80: winding part

이하, 본 발명을 첨부된 도면에 의해 보다 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

도 1 내지 도 3에 도시된 바와 같이, 본 발명에 따른 바닥재의 무늬 성형장치(1)의 원단공급기(10)는 지지브라켓(12)에 의해 설치되고 바닥재 원단이 롤형태로 감겨진 권취로울러(14)로 이루어지고, 접착제 도포기(20)는 일정량의 접착제가 담겨진 접착제통(22)과 공급되는 바닥재의 상면에 일정량의 접착제를 도포하기 위한 구동축(24)으로 이루어지며, 칩산포기(30)는 상방에 호퍼(32)가 설치되어 일정량의 칩이 저장·공급되고 호퍼(32)의 하단부에는 방사상으로 요홈부가 형성된 공급로울러(34)가 회동되도록 설치되며 하방에는 회수통(36)이 설치되어 산포된 칩의잔량을 회수하게 되고, 칩선별기(40)는 고정다이(42)에 의해 프레임(44)에 설치되고 전동모우터(M1)에 의해 회전되는 회전축(46)과 회전판(48) 및 타격봉(49)으로 이루어진 것이다.As shown in Figures 1 to 3, the fabric feeder 10 of the pattern forming apparatus 1 of the flooring material according to the present invention is installed by a support bracket 12 and the winding material of the flooring material wound in rolls ( 14), the adhesive applicator 20 is composed of an adhesive container 22 containing a certain amount of adhesive and a drive shaft 24 for applying a certain amount of adhesive to the upper surface of the flooring material to be supplied, the chip spreader 30 The hopper 32 is installed above the predetermined amount of chips are stored and supplied, the lower end of the hopper 32 is installed so that the supply roller 34 is formed with a radial groove is rotated and the recovery container 36 is installed below The remaining amount of the dispersed chip is recovered, and the chip selector 40 is installed on the frame 44 by the fixed die 42 and rotates by the electric motor M1 and the rotary shaft 46 and the rotating plate 48. It is made of a striking rod (49).

또한, 가열기(50)는 컨베이어(C)에 의해 바닥재 원단 즉, 상기 원단공급기(10), 접착제 도포기(20), 칩산포기(30), 칩선별기(40)에 의해 일측표면에 접착층이 형성되고 일정량의 칩이 산포된 바닥재 원단(P)이 이송·공급되고 상방에 설치된 다수개의 히터(52)에 의해 칩이 용융되며, 무늬성형기(60)는 하방에 설치된 전동모우터(M2)와 제 1, 2로울러(62, 63)가 동력전달수단(도면에 도시되지 않음, 체인이나 벨트 등)에 의해 회전(상호간에 반대방향으로 회전)되도록 설치되되, 외주면이 근접된 상태를 이루도록 설치되고 그 외주면이 근접되는 부위의 일측 상방에는 브라켓()에 의해 설치된 정·역구동 모우터(M3)가 설치되며, 상기 정·역구동 모우터(M3)의 로드(64)에는 커플링(65)으로 스크류(66)가 회전·결합되되, 상기 스크류(66)에는 하방으로 다수개의 무늬 성형부재(67)가 등간격을 이루며 결합된 지지틀(68)이 가이드봉(69)에 축설되고, 압착기(70)는 전동모우터(M4)에 의해 회전되는 상·하부 압착로울러(72, 74)로 이루어진 것을 나타내는 것이다.In addition, the heater 50 is formed by the conveyor (C) on the bottom surface fabric, that is, the adhesive layer is formed on one surface by the fabric feeder 10, adhesive applicator 20, chip spreader 30, chip selector 40. And the flooring fabric (P) spreading a predetermined amount of chips is transferred and supplied, and the chips are melted by a plurality of heaters 52 installed upwards, and the pattern molding machine 60 is made of an electric motor M2 installed below. 1, 2 rollers 62, 63 are installed so as to rotate (rotate in opposite directions between each other) by a power transmission means (not shown in the figure, chain or belt), the outer peripheral surface is installed to achieve a state A forward and reverse drive motor M3 installed by a bracket is installed above one side of the portion where the outer circumferential surface is adjacent, and a coupling 65 is provided on the rod 64 of the forward and reverse drive motor M3. Screw 66 is rotated and coupled, the screw 66 is a plurality of pattern forming member 67 downwards The support frame 68 coupled at equal intervals is constructed on the guide rod 69, and the presser 70 is composed of upper and lower compression rollers 72 and 74 rotated by the electric motor M4. To indicate.

이때, 상기 무늬 성형부재(67)는 핀이나 철판의 단부를 쐐기형태(사용자가 임의로 가공하여 다양한 형태를 갖도록 할 수 있음)로 가공모양을 갖도록 가공로 가공하여 사용하거나 또는 금속재로 이루어진 브러쉬 등으로 이루어진다.At this time, the pattern forming member 67 is used to process the end of the pin or iron plate in the wedge shape (the user can be arbitrarily processed to have a variety of forms) to have a processing shape or a brush made of a metal material or the like. Is done.

도 4는 본 발명에 따른 바닥재의 무늬 성형방법을 설명하기 위한 공정도로서, 바닥재에 무늬를 성형함에 있어서, 원단공급기(10)에 의해 일정한 길이를 갖는바닥재 원단(P, PVC 또는 플라스틱 재질로 이루어진 원단)을 권취로울러(14)에 감아 일정하게 공급하는 공정(S10)과; 접착제 도포기(20)를 이용하여 이송수단(컨베이어에 의해 이송)에 의해 이송·공급되는 바닥재 원단(P)의 일측표면(상면)에 일정량의 접착제를 도포하여 접착층을 형성하는 공정(S20)과; 칩산포기(30)에 의해 다량의 칩(알갱이 형태로 다양한 색상을 가지며 바닥재 원단보다 용융점이 낮은 소재로 이루어짐)이 투입된 호퍼(32)로부터 공급로울러(34)에 의해 일정량의 칩이 바닥재 원단(P)에 형성된 접착층에 산포되는 공정(S30)과; 칩선별기(40)를 이용하여 바닥재 원단(P)의 접착층에 산포된 칩을 전면에 고르게 위치되도록 분산시키거나 중복·적층된 칩을 선별하는 공정(S40)과; 가열기(50)를 이용하여 바닥재 원단(P)에 산포된 칩을 용융시키는 공정(S50)과; 무늬성형기(60)를 이용하여 바닥재 원단 표면에 용융된 칩을 정·역구동 모우터(M3)에 의해 좌·우방향으로 구동되는 무늬 성형부재(67)를 이용하여 다양한 무늬를 갖도록 성형하는 공정(S60)과; 압착기(70)를 이용하여 무늬 성형부재(67)에 의해 다양한 무늬가 성형된 용융상태의 칩을 압착·분포시키는 공정(S70)에 의해 바닥재 원단(P)에 다양한 무늬가 성형되는 것을 나타내는 것이다.Figure 4 is a process diagram for explaining the pattern forming method of the flooring according to the present invention, in molding the pattern on the flooring, the flooring fabric having a predetermined length by the fabric feeder 10 (P, PVC or a fabric made of plastic material ) Is wound around the winding roller (14), the step of supplying constantly (S10); A step (S20) of forming an adhesive layer by applying a predetermined amount of adhesive to one surface (upper surface) of the flooring fabric P transferred and supplied by a conveying means (transfer by conveyor) using the adhesive applicator 20; ; A certain amount of chips are supplied by the supply roller 34 from the hopper 32 into which a large amount of chips (made of a material having various colors in the form of granules and having a melting point lower than that of the flooring fabric) are introduced by the chip spreader 30. (S30) and is dispersed in the adhesive layer formed on the); Dispersing the chips dispersed in the adhesive layer of the flooring fabric P using the chip selector 40 so as to be evenly positioned on the front surface or selecting the overlapped and stacked chips (S40); Melting the chips scattered on the flooring fabric P using the heater 50 (S50); A process of molding chips melted on the surface of the flooring material using the pattern molding machine 60 to have various patterns by using the pattern forming member 67 driven in the left and right directions by the forward and reverse driving motor M3. (S60); It shows that various patterns are formed on the flooring fabric P by the step S70 of pressing and distributing the chips in the molten state in which various patterns are formed by the pattern forming member 67 using the presser 70.

도 5는 본 발명에 따른 바닥재의 무늬 성형장치의 다른 실시예를 나타내는 측면 개략도로서, 스크류(66)에 의해 무늬 성형부재(67)가 좌·우방향으로 구동되도록 설치된 하우징(61)에 고정편(92)이 고정되고 힌지(94)에 의해 유압실린더(96)가 결합됨에 따라, 상기 무늬 성형부재(67)가 스크류(66)에 의해 좌·우방향으로 구동됨은 물론, 유압실린더(96)에 의해 상·하방향으로 구동되도록 설치된 무늬성형기(60)를 나타내는 것이다.Figure 5 is a side schematic view showing another embodiment of the pattern forming apparatus of the flooring according to the present invention, the fixing piece in the housing 61 is installed so that the pattern forming member 67 is driven left and right by a screw 66 As the 92 is fixed and the hydraulic cylinder 96 is coupled by the hinge 94, the pattern forming member 67 is driven left and right by the screw 66, as well as the hydraulic cylinder 96. Shows the pattern molding machine 60 installed to be driven in the up and down directions.

이러한, 유압실린더(96)에 의해 무늬 성형부재(67)가 상·하방향으로 구동되는 공정(S80)에 의해 다양한 무늬가 성형된다.Various patterns are molded by the step S80 in which the pattern forming member 67 is driven in the up and down directions by the hydraulic cylinder 96.

여기에서, 바닥재의 무늬 성형장치의 전기적인 연결방식과 동력전달방식 및 유압장치는 일반적인 방식이므로 자세한 설명 및 도면 표기는 생략한다.Here, since the electrical connection method and the power transmission method and the hydraulic device of the pattern forming apparatus of the flooring material is a general method, detailed descriptions and drawings are omitted.

이와 같은 본 발명에 따른 바닥재의 무늬 성형장치의 사용상태를 설명하면 다음과 같다.Referring to the state of use of the pattern forming apparatus of the flooring material according to the present invention as follows.

도 1 내지 도 3에 도시된 바와 같이, 무늬 성형장치(1)를 이용하여 바닥재 원단(P)에 다양한 형태의 무늬를 성형하려면, 먼저, 롤형태로 감겨진 바닥재 원단을 공급기(10)의 권취롤(14)에 장착시킨 후, 접착제 도포기(20)를 거쳐 칩산포기(30)와 칩선별기(40)를 통해 가열기(50)로 공급되도록 한 다음, 계속하여 무늬성형기(60)와 압착기(70)를 거쳐 권취부(80)에 의해 감겨지도록 설치한다.As shown in Figures 1 to 3, to mold the pattern of the various forms on the flooring fabric (P) by using the pattern forming apparatus 1, first, winding the flooring fabric wound in the form of a roll of the feeder (10) After mounting on the roll 14, it is supplied to the heater 50 through the chip spreader 30 and the chip selector 40 via the adhesive applicator 20, and then the pattern molding machine 60 and the pressing machine ( It is installed so as to be wound by the winding-up part 80 via 70).

이와 같이하여, 바닥재 원단이 설치된 상태에서, 무늬성형장치(1)를 구동시키게 되면, 접착제 도포기(20)에 의해 원단(P)의 일표면에 접착제통(22)으로부터 일정량의 접착제가 유입되어 접착층이 형성되고, 접착층이 형성된 원단(P)이 칩산포기(30)로 유입되어 일정량의 칩이 원단(P)의 일표면 즉, 접착층에 산포된 다음, 칩선별기(40)를 거치면서 칩이 산포됨에 있어 일부위에 과다하게 산포되거나 칩과 칩이 적층되어 필요이상으로 산포된 칩이 선별·제거되는 것으로서, 이때, 원단(P)의 접착층에 산포되지 않은 칩은 첨부 도면 도 2에 도시된 바와 같이, 전동모우터(M1)에 의해 회전되는 타격봉(49)에 의해 원단에 충격(작은 하중)이 가해지게 되므로 칩이 원단으로부터 탈리·낙하되어 하방으로 회수되는 것이다.In this manner, when the pattern forming apparatus 1 is driven while the flooring fabric is installed, a certain amount of adhesive is introduced into the one surface of the fabric P from the adhesive container 22 by the adhesive applicator 20. An adhesive layer is formed, and the fabric P having the adhesive layer is introduced into the chip spreader 30 so that a predetermined amount of chips are scattered on one surface of the fabric P, that is, the adhesive layer, and then the chips are passed through the chip selector 40. In spreading, the chips scattered excessively over a part or scattered more than necessary by stacking chips and chips are selected and removed, wherein the chips not scattered on the adhesive layer of the fabric P are shown in FIG. 2. Similarly, since the impact (small load) is applied to the fabric by the striking rod 49 rotated by the electric motor M1, the chip is detached from the fabric and dropped, and is recovered downward.

계속하여, 접착층에 일정량의 칩이 산포된 원단이 컨베이어(C)를 따라 가열기(50)로 유입되면서, 히터(52)에 의해 칩이 용융되며, 칩이 용융된 상태의 원단(P)이 무늬 성형장기(60)로 유입되면, 전동모우터(M3)에 의해 회전되는 제 1, 2로울러(62, 63)를 통해 원단이 공급되되, 정·역구동 모우터(M3)에 의해 회전되는 스크류(66)에 의해 무늬 성형부재(67)가 좌·우방향으로 왕복구동됨에 따라, 원단에 용융된 상태의 칩이 좌·우로 흩어지듯 분산되면서 다양한 형태의 무늬를 이루게 된다.Subsequently, the fabric in which a predetermined amount of chips are scattered in the adhesive layer is introduced into the heater 50 along the conveyor C, and the chips are melted by the heater 52, and the fabric P in the molten state of the chips is patterned. When introduced into the molding machine 60, the raw material is supplied through the first and second rollers 62 and 63 rotated by the electric motor M3, and the screw rotated by the forward and reverse driving motor M3. As the pattern forming member 67 is reciprocated in the left and right directions by the 66, the chips melted in the fabric are dispersed like left and right to form various patterns.

이때, 상기 무늬성형기(60)의 무늬 성형부재(67)는 지지틀(68)의 양측방에 해당하는 위치에 설치된 리밋스위치(RS1)에 의해 좌·우방향이 자동 조절되고, 다양한 무늬 성형을 위해 2단, 3단 등의 다단형태로 이루어지도록 할 수 있음은 물론이다.At this time, the pattern forming member 67 of the pattern molding machine 60 is automatically adjusted to the left and right directions by the limit switch RS1 installed at positions corresponding to both sides of the support frame 68, and various pattern molding is performed. Of course, it can be made in a multi-stage form, such as two stages, three stages.

이와 같이, 상기 무늬성형기(60)에 의해 다양한 형태의 무늬가 성형된 원단이 압착기(70)에 의해 압착·분산되면서 무늬가 성형된 상태로 권취부(80)에 감겨지게 되는 것이다.As described above, the fabric in which various patterns are formed by the pattern molding machine 60 is pressed and dispersed by the presser 70 to be wound around the winding unit 80 in a patterned state.

한편, 첨부 도면 도 5에 도시된 바와 같이, 무늬성형기(60)의 하우징(61)에 고정편(92)이 고정되고 힌지(94)에 의해 유압실린더(96)가 결합됨에 따라, 상기 무늬 성형부재(67)가 스크류(66)에 의해 좌·우방향으로 구동됨과 동시에 상기 유압실린더(96)에 의해 상·하방향으로 구동되므로써, 무늬 성형부재(67)에 의해 성형되는 무늬를 보다 더 다양한 형태를 갖도록 할 수 있으며, 또한, 도면에는 도시되지 않았으나, 상기 무늬성형기(60)의 또 다른 실시예로서는 횡방향으로 설치되는 가이드레일(도면에 도시되지 않음)을 따라 유압실린더에 의해 무늬 성형부재(67)가 설치된 하우징(61)이 전·후진 이동되도록 설치하여 무늬성형을 위한 무늬 성형부재(67)가 좌·우, 상·하, 좌·우로 구동되면서 다양한 무늬를 성형할 수 있음은 물론이다.Meanwhile, as shown in FIG. 5, as the fixing piece 92 is fixed to the housing 61 of the pattern forming machine 60 and the hydraulic cylinder 96 is coupled by the hinge 94, the pattern forming is performed. Since the member 67 is driven left and right by the screw 66 and is driven up and down by the hydraulic cylinder 96, the pattern formed by the pattern forming member 67 can be varied. Although not shown in the drawings, as another embodiment of the pattern molding machine 60, a pattern forming member (not shown) is formed by a hydraulic cylinder along a guide rail (not shown) installed in a transverse direction. 67) is installed so that the housing 61 is moved forward, backward, so that the pattern forming member 67 for pattern molding is driven left, right, up, down, left, right, of course, it can be molded a variety of patterns. .

이와 같이, 바닥재에 무늬를 성형함에 있어, 본 발명에 따른 무늬 성형방법 및 장치를 이용함에 따라, 바닥재에 성형되는 무늬를 연속적으로 불규칙적이면서 다양한 무늬 및 색상이 표출되도록 성형할 수 있고, 이에 따라, 바닥재의 미려함을 향상시켜 사용자로하여금 제품에 대한 만족도와 취양 및 개성에 대한 욕구를 충족시킬 수 있을 뿐만 아니라, 품질을 높여 제품의 고급화를 실현할 수 있는 효과가 있다.As such, in forming the pattern on the flooring, by using the pattern forming method and apparatus according to the present invention, the pattern formed on the flooring can be molded so that various irregularities and colors can be expressed continuously and thus, By improving the beauty of the flooring, users can meet the satisfaction of the product and the desire for appetite and personality, as well as improve the quality of the product has the effect of realizing the quality of the product.

Claims (4)

바닥재에 무늬를 성형함에 있어서,In molding the pattern on the flooring, 일정한 길이를 갖는 바닥재 원단(P, PVC 또는 플라스틱 재질로 이루어진 원단)을 권취로울러(14)에 감아 일정하게 공급하는 공정(S10)과;A step (S10) of uniformly winding the flooring fabric having a predetermined length (fabric made of P, PVC, or plastic material) to the winding roller 14; 이송·공급되는 바닥재 원단(P)의 일측표면(상면)에 일정량의 접착제를 도포하여 접착층을 형성하는 공정(S20)과;Forming an adhesive layer by applying a predetermined amount of adhesive to one surface (upper surface) of the flooring fabric P being transferred and supplied (S20); 다량의 칩(알갱이 형태로 다양한 색상을 가지며 바닥재 원단보다 용융점이 낮은 소재로 이루어짐)이 투입된 호퍼(32)로부터 공급로울러(34)에 의해 일정량의 칩이 바닥재 원단(P)에 형성된 접착층에 산포되는 공정(S30)과;A certain amount of chips are scattered on the adhesive layer formed on the flooring fabric P by the supply roller 34 from a hopper 32 into which a large amount of chips (having various colors in the form of granules and made of a material having a lower melting point than the flooring fabric) are introduced. Step (S30); 바닥재 원단(P)의 접착층에 산포된 칩을 전면에 고르게 위치되도록 분산시키거나 중복·적층된 칩을 선별하여 제거·낙하시키는 공정(S40)과;Dispersing the chips dispersed in the adhesive layer of the flooring fabric P so as to be evenly positioned on the front surface, or selecting and removing and dropping the stacked and stacked chips (S40); 바닥재 원단(P)에 산포된 칩을 가열·용융시키는 공정(S50)과;Heating and melting the chips scattered on the flooring fabric P (S50); 바닥재 원단(P) 표면에 용융된 칩을 무늬 성형부재(67)를 좌·우방향으로 구동시켜 다양한 무늬를 갖도록 성형하는 공정(S60)과;Forming a chip melted on the surface of the flooring fabric P by driving the pattern forming member 67 in a left and right direction to have various patterns (S60); 상기 무늬 성형부재(67)에 의해 다양한 무늬가 성형되고 원단(P)을 압착·분포시키는 공정(S70)으로 이루어진 것을 특징으로 하는 바닥재의 무늬 성형방법.Various patterns are molded by the pattern forming member 67, and the pattern forming method of the flooring material comprising a step (S70) of pressing and distributing the fabric (P). 제 1항에 있어서,The method of claim 1, 상기 바닥재 원단(P)에 무늬를 성형하는 무늬 성형부재(67)를유압실린더(96)를 이용하여 상·하방향으로 구동되도록 하는 공정(S80)에 의해 다양한 무늬가 성형되는 것을 특징으로 하는 바닥재의 무늬 성형방법.Floor pattern, characterized in that a variety of patterns are molded by the step (S80) to drive the pattern forming member 67 for forming a pattern on the flooring fabric (P) up and down using a hydraulic cylinder (96). Pattern forming method. 지지브라켓(12)에 의해 설치되는 권취로울러(14)에 바닥재 원단(P)이 감겨진 원단공급기(10)와, 일정량의 접착제가 담겨진 접착제통(22)과 구동축(24)에 의해 공급되는 바닥재 원단의 상면에 일정량의 접착제가 도포하는 접착제 도포기(20)와, 상방에는 일정량의 칩이 저장·공급되는 호퍼(32)가 설치되고 상기 호퍼(32)의 하단부에는 방사상으로 요홈부가 형성된 공급로울러(34)가 칩을 바닥재 원단(P)의 접착층에 산포되도록 설치되며 하방에는 산포된 칩의 잔량을 회수하기 위한 회수통(36)이 설치된 칩산포기(30)와, 고정다이(42)에 의해 프레임(44)에 설치되고 전동모우터(M1)에 의해 회전되는 회전축(46)과 회전판(48) 및 타격봉(49)으로 이루어진 칩선별기(40)와, 일측표면에 접착층이 형성되고 일정량의 칩이 산포된 바닥재 원단(P)을 이송·공급하기 위한 컨베이어(C)가 일정한 길이를 갖도록 설치되고 다수개의 히터(52)로 이루어진 가열기(50)와, 전동모우터(M3)에 의해 회전되는 상·하부 압착로울러(72, 74)가 설치된 압착기(70)로 이루어진 바닥재의 무늬 성형장치에 있어서,The flooring material supplied by the fabric feeder 10 in which the flooring material P is wound on the winding roller 14 installed by the support bracket 12, and the adhesive container 22 and the driving shaft 24 in which a certain amount of adhesive is contained. An adhesive applicator 20 to which a predetermined amount of adhesive is applied on the upper surface of the fabric, and a hopper 32 in which a predetermined amount of chips are stored and supplied are installed, and a supply roller in which a recess is radially formed at a lower end of the hopper 32. The chip spreader 30 and the fixing die 42 are installed so that the 34 is dispersed in the adhesive layer of the flooring fabric P, and the collecting container 36 is installed below to recover the remaining amount of the chip. A chip selector 40 formed of a rotating shaft 46, a rotating plate 48, and a striking rod 49, which is installed on the frame 44 and rotated by the electric motor M1, and an adhesive layer is formed on one surface thereof, Conveyor (C) for transporting and supplying flooring fabric (P) with chips scattered Is installed to have a constant length and the flooring material consisting of a heater (50) consisting of a plurality of heaters (52), and a presser (70) provided with upper and lower compression rollers (72, 74) rotated by an electric motor (M3). In the pattern molding apparatus of 하방에 전동모우터(M2)가 설치되고 상방에는 동력전달수단(체인이나 벨트 등)에 의해 외주면이 근접된 상태를 이루도록 하우징(61)에 제 1, 2로울러(62, 63)가 회동·설치되고,The first and second rollers 62 and 63 are rotated and installed in the housing 61 so that the electric motor M2 is installed at the lower side and the outer circumferential surface is adjacent by the power transmission means (chain or belt) at the upper side. Become, 상기 제 1, 2로울러(62, 63)의 외주면이 근접되는 부위의 일측 상방에는 정·역구동 모우터(M3)의 로드(64)에 커플링(65)으로 스크류(66)가 회전·결합되며,The screw 66 is rotated and coupled to the rod 64 of the forward / reverse drive motor M3 by the coupling 65 above one side of the portion where the outer circumferential surfaces of the first and second rollers 62 and 63 are close to each other. , 상기 스크류(66)에는 하방으로 다수개의 무늬 성형부재(67)가 등간격을 이루며 결합된 지지틀(68)이 가이드봉(69)에 축설된 무늬성형기(60)가 구비된 것을 특징으로 하는 바닥재의 무늬 성형장치.Flooring, characterized in that the screw 66 is provided with a pattern molding machine 60 in which a plurality of pattern forming members 67 are formed at equal intervals and the support frame 68 coupled to the guide rod 69 is formed downward. Pattern forming apparatus. 제 3항에 있어서,The method of claim 3, wherein 상기 무늬성형기(60)의 하우징(61)에는 고정편(92)이 고정되고 힌지(94)에 의해 유압실린더(96)가 결합됨에 따라, 무늬 성형부재(67)가 스크류(66)에 의해 좌·우방향으로 구동되고 유압실린더(96)에 의해 상·하방향으로 구동되도록 설치된 것을 특징으로 하는 바닥재의 무늬 성형장치.As the fixing piece 92 is fixed to the housing 61 of the pattern forming machine 60 and the hydraulic cylinder 96 is coupled by the hinge 94, the pattern forming member 67 is left by the screw 66. A pattern forming apparatus for a flooring material, characterized in that it is driven to a right direction and installed to be driven up and down by a hydraulic cylinder (96).
KR1020020005531A 2002-01-31 2002-01-31 Pattern forming mehtod and device of floor covered KR20030065764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020020005531A KR20030065764A (en) 2002-01-31 2002-01-31 Pattern forming mehtod and device of floor covered

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020020005531A KR20030065764A (en) 2002-01-31 2002-01-31 Pattern forming mehtod and device of floor covered

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2020020003150U Division KR200273727Y1 (en) 2002-01-31 2002-01-31 Pattern forming device of floor covered

Publications (1)

Publication Number Publication Date
KR20030065764A true KR20030065764A (en) 2003-08-09

Family

ID=32219998

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020005531A KR20030065764A (en) 2002-01-31 2002-01-31 Pattern forming mehtod and device of floor covered

Country Status (1)

Country Link
KR (1) KR20030065764A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790033B1 (en) * 2007-07-04 2008-01-02 정해균 An apparatus for patterning on panel
KR101029203B1 (en) * 2010-10-18 2011-04-13 백수안 Apparatus to pattern on pannel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920007777A (en) * 1990-10-11 1992-05-27 최근선 Floor decoration material with three-dimensional pattern (Inlaid) effect and manufacturing method thereof
JPH05259613A (en) * 1992-03-09 1993-10-08 Hitachi Electron Eng Co Ltd Device for correcting wiring pattern defect
KR950000342A (en) * 1993-06-04 1995-01-03 박원배 Manufacturing method of flooring material and apparatus
KR200251893Y1 (en) * 2001-07-12 2001-11-17 정병조 A pattern shape construct of file cloth

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920007777A (en) * 1990-10-11 1992-05-27 최근선 Floor decoration material with three-dimensional pattern (Inlaid) effect and manufacturing method thereof
JPH05259613A (en) * 1992-03-09 1993-10-08 Hitachi Electron Eng Co Ltd Device for correcting wiring pattern defect
KR950000342A (en) * 1993-06-04 1995-01-03 박원배 Manufacturing method of flooring material and apparatus
KR200251893Y1 (en) * 2001-07-12 2001-11-17 정병조 A pattern shape construct of file cloth

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790033B1 (en) * 2007-07-04 2008-01-02 정해균 An apparatus for patterning on panel
KR101029203B1 (en) * 2010-10-18 2011-04-13 백수안 Apparatus to pattern on pannel

Similar Documents

Publication Publication Date Title
CN110281332B (en) Wicker peeling equipment for wickerwork
CN106760431A (en) The construction and decoration U.S. seam glue constructing device of combined type
KR101533211B1 (en) Surface molding apparatus of clay brick and molding method
CN207711411U (en) A kind of pattern pressing type porcelain tendre product line
CN1333128A (en) Ester moulding products and method and apparatus for making same
CN205409956U (en) End device is pasted in shoemaking
KR20030065764A (en) Pattern forming mehtod and device of floor covered
WO2020103850A1 (en) Method for forming three-dimensional texture on plastic floor
KR200273727Y1 (en) Pattern forming device of floor covered
CN211918001U (en) Compounding machine for producing ground protection film
KR100665792B1 (en) Apparatus for surface treatment of wood fiber plastic composite interior and exterior decorative material
TWI267359B (en) Shoe outsole manufacturing methods
CN103691614B (en) Automatic cementing machine
CN206528167U (en) A kind of cushion class product production equipment
KR101671238B1 (en) Packaging and decorative material production apparatus and method
CN211368060U (en) Carpet brushing machine
CN210058765U (en) Glue brushing device for producing even adhesive film paper
CN209284403U (en) The trimming mechanism and its port treasured automatic moulding assembly line of port treasured automatic moulding assembly line
JP3472195B2 (en) Shade ball forming machine
CN202185964U (en) Wallboard flattening machine
KR100411241B1 (en) Solid pattern forming device for textiles
KR100733542B1 (en) The on-line Splice Method of Film onto Plastic Sheet
KR100298267B1 (en) Mat for sliding prevention and manufacturing method thereof
CN104669912A (en) Novel artistic relief producing equipment
CN220904413U (en) Gift box printing is with coating machine of precoating

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee