KR20030064018A - Apparatus for inspecting lead frame - Google Patents

Apparatus for inspecting lead frame Download PDF

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Publication number
KR20030064018A
KR20030064018A KR1020020004422A KR20020004422A KR20030064018A KR 20030064018 A KR20030064018 A KR 20030064018A KR 1020020004422 A KR1020020004422 A KR 1020020004422A KR 20020004422 A KR20020004422 A KR 20020004422A KR 20030064018 A KR20030064018 A KR 20030064018A
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South Korea
Prior art keywords
lead frame
pulley
guide rails
moving
frame
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KR1020020004422A
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Korean (ko)
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KR100763968B1 (en
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우석하
조한석
지제연
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삼성테크윈 주식회사
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67288Monitoring of warpage, curvature, damage, defects or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE: An apparatus for inspecting a leadframe is provided to more rapidly inspect the leadframe by inspecting two leadframes at a time, and to eliminate the necessity of transferring a camera frequently even in a case of a matrix-type leadframe by transferring a camera lens part in an X-Y direction. CONSTITUTION: A fixing frame(10) is positioned at a side part of a transfer rail. The first and second guide rails(20,22) extending in a direction parallel with the transfer rail are formed in a coaxial line of the fixing frame. The first and second transfer frames(12,14) are supported by each guide rail, capable of sliding, horizontally extending in a direction perpendicular to the transfer rail over a leadframe transfer rail. The third and fourth guide rails(36,38) are formed along the extension direction of the first and second transfer frames. The first and second transfer holders(24,26) are capable of sliding along the third and fourth guide rails, positioned right over a leadframe transfer path. A cylindrical camera lens part takes a picture of the quality state of the leadframe right over the leadframe, supported by each transfer holder.

Description

리드프레임 검사장치{Apparatus for inspecting lead frame}Lead frame inspection device {Apparatus for inspecting lead frame}

본 발명은 리드프레임 검사장치에 관한 것이다.The present invention relates to a lead frame inspection apparatus.

리드프레임(lead frame)은 반도체 칩(chip)과 함께 반도체 패키지를 이루는 핵심 구성요소의 하나이다. 이는 반도체 패키지의 내부와 외부를 연결해주는 도선(lead) 역할과 반도체 칩을 지지해 주는 지지체(frame) 역할을 겸하는 것으로서 반도체 칩의 고밀도화 고집적화 및 부품실장 방법 등에 따라 다양한 형상으로 변형 제작될 수 있다.A lead frame is one of the key components of a semiconductor package together with a semiconductor chip. This serves as a lead that connects the inside and the outside of the semiconductor package and a frame that supports the semiconductor chip, and may be deformed into various shapes according to high density, high integration, and component mounting methods of the semiconductor chip.

리드프레임은 통상적으로 기억소자인 반도체 칩을 탑재하여 정적인 상태로 유지하여 주는 패드(pad)와, 반도체 칩과 와이어 본딩에 의해 연결되는 내부 리이드(internal lead) 및 외부 회로와의 연결을 위한 외부 리이드(external lead)를 포함하는 구조로 이루어진다.The lead frame typically includes a pad for mounting a semiconductor chip, which is a memory device, to maintain a static state, an internal lead connected to the semiconductor chip by wire bonding, and an external connection for an external circuit. It consists of a structure including an external lead.

이와 같은 구조를 가지는 리드프레임은 통상 스탬핑(stamping) 공정 또는 에칭(etching) 공정에 의해 그 형상이 제작된다. 즉, 스탬핑 공정은 순차적으로 이송되는 프레스 금형장치를 이용하여 리드프레임의 박판소재를 소정 형상으로 타발함으로써 리드프레임을 제조하는 방법으로서 대량 생산에 적합하며, 에칭 공정은 화학 약품을 이용하여 리드프레임의 박판소재의 국소 부위를 부식시킴으로써 리드프레임의 형상을 완성하는 화학적 식각방법으로서 소량 생산에 주로 적용되고 있는 방법이다.The lead frame having such a structure is usually manufactured in a shape by a stamping process or an etching process. In other words, the stamping process is a method of manufacturing a lead frame by punching the thin plate material of the lead frame into a predetermined shape by using a press mold device which is sequentially transferred, and the etching process is suitable for mass production of the lead frame using chemicals. It is a chemical etching method that completes the shape of lead frame by corroding local parts of thin plate material. It is mainly applied to small quantity production.

한편, 상기 리드프레임은 그 자체의 정밀도가 매우 높은 것으로서 생산공정을 통해 제작된 리드프레임은 리드프레임 검사장치를 통해 검사를 수행한다.On the other hand, the lead frame itself is very high precision, the lead frame produced through the production process performs the inspection through the lead frame inspection apparatus.

보통 리드프레임 검사장치는, 검사대상인 리드프레임이 탑재되어 이송되는 이송레일과, 상기 이송레일을 따라 이송되는 리드프레임의 이송 경로상에 설치되어 리드프레임의 품질상태를 촬영하는 검사카메라를 포함한다.Usually, the lead frame inspection apparatus includes a transport rail on which a lead frame to be inspected is mounted and transported, and an inspection camera installed on a transport path of the lead frame transported along the transport rail to photograph a quality state of the lead frame.

공지의 사실과 같이 상기 리드프레임 제작방법에 의해 제작된 리드프레임은, 얇고 긴 금속띠에 리드프레임이 한 줄로 배열되어 있는 스트립타입과 두 줄로 배열된 매트릭스타입이 있으며, 종래의 검사장치는 상기 금속띠를 한 피치씩 이송시키며 각 리드프레임을 검사카메라의 연직하부에 위치시켜 품질검사를 하도록 구성되어 있다.As known in the art, a lead frame manufactured by the method of manufacturing the lead frame includes a strip type in which a lead frame is arranged in one row and a matrix type in two rows in a thin and long metal strip. It moves the pitch by one pitch, and each lead frame is positioned under the vertical position of the inspection camera for quality inspection.

그러나 상기 종래의 검사장치는 한 개의 검사카메라로 한 개씩의 리드프레임을 검사 하므로 그만큼 검사시간이 오래 걸린다는 문제가 있었고 특히 매트릭스타입의 리드프레임을 검사하기 위해서는 카메라를 자주 이동시켜야 하므로 그만큼 작업이 번거롭고 카메라의 위치를 정확히 선정하기 위한 별도의 장치가 필요하다는 문제가 있었다.However, the conventional inspection apparatus has a problem that it takes a long time to inspect the lead frame by one inspection camera, and in particular, the inspection of the matrix type lead frame requires moving the camera frequently. There was a problem that a separate device is needed to accurately select the position of the camera.

본 발명은 상기 문제점을 해소하고자 창출한 것으로서, 한 번에 두 개씩의리드프레임을 동시에 검사할 수 있어 그만큼 검사속도가 빠르며 특히 카메라렌즈부를 X-Y방향으로 이동시킬 수 있어 매트릭스타입의 리드프레임의 경우라 하더라도 카메라를 정확한 위치에 한 번 세팅하여 계속 사용하므로 카메라를 번번이 이동시킬 필요가 없으므로 그만큼 정확한 검사를 할 수 있도록 구성된 리드프레임 검사장치를 제공함에 목적이 있다.The present invention was created in order to solve the above problems, and it is possible to inspect two lead frames at a time at the same time, so that the inspection speed is high. In particular, the camera lens unit can be moved in the XY direction. Even if the camera is set to the correct position once and continue to use, there is no need to move the camera once and for all, the object of the present invention is to provide a lead frame inspection apparatus configured to perform the accurate inspection.

도 1은 본 발명의 일 실시예에 따른 리드프레임 검사장치를 개략적으로 도시한 도면.1 is a view schematically showing a lead frame inspection apparatus according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 리드프레임 검사장치의 정면도.Figure 2 is a front view of the lead frame inspection apparatus according to an embodiment of the present invention.

도 3 및 도 4는 본 발명의 일 실시예에 따른 리드프레임의 동작을 설명하기 위하여 도시한 도면.3 and 4 are diagrams for explaining the operation of the lead frame according to an embodiment of the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10:고정프레임 12:제 1이동프레임10: fixed frame 12: first moving frame

14:제 2이동프레임 16:제 1핸들14: 2nd moving frame 16: 1st handle

18:제 2핸들 20:제 1가이드레일18: 2nd handle 20: 1st guide rail

22:제 2가이드레일 24:제 1이동홀더22: 2nd guide rail 24: 1st moving holder

26:제 2이동홀더 28:제 3핸들26: 2nd movement holder 28: 3rd handle

30:제 1연결풀리 32:연결풀리30: first connection pulley 32: connection pulley

34,54:벨트 36:제 3가이드레일34, 54: Belt 36: 3rd guide rail

38:제 4가이드레일 40:제 4핸들38: fourth guide rail 40: fourth handle

42,44:회전각조절풀리 46:제 1리이드스크류42, 44: rotating angle adjusting pulley 46: the first lead screw

48:제 2리이드스크류 50,52:카메라렌즈부48: second lead screw 50, 52: camera lens unit

56:렌즈풀리 58,60:풀리지지프레임56: lens pulley 58, 60: unzipping frame

62:풀리회전핸들 64:제 3리이드스크류62: pulley swivel handle 64: third lead screw

65:제 4리이드스크류65: fourth lead screw

상기 목적을 달성하기 위하여 본 발명은, 검사대상인 리드프레임이 탑재되어 이송되는 이송레일의 이송경로상에 설치되어 이송레일을 따라 이송되는 리드프레임의 품질상태를 검사하는 것으로서, 상기 이송레일의 측부에 위치하며 그 일측면에는 상기 이송레일과 평행한 방향으로 연장된 제 1,2가이드레일이 동축선상에 구비되어 있는 고정프레임과; 상기 각 가이드레일에 지지되어 슬라이딩 가능하고 리드프레임 이송레일의 상부에 이송레일과 직교하는 방향으로 수평 연장되며 연장방향을 따라 제 3,4가이드레일이 각각 구비되어 있는 제 1,2이동프레임과; 상기 제 3,4가이드레일을 따라 슬라이딩 가능하고 리드프레임 이송경로의 연직상부에 위치하는 제 1,2이동홀더와; 상기 각 이동홀더에 지지되며 리드프레임의 연직 상부에서 리드프레임의 품질상태를 촬영하는 원통형 카메라렌즈부를 포함하는 것을 특징으로 한다.In order to achieve the above object, the present invention is to be installed on the transport path of the transport rail to be mounted and transported the lead frame to be inspected to inspect the quality of the lead frame transported along the transport rail, on the side of the transport rail A fixed frame having a coaxial line with the first and second guide rails positioned in one side thereof and extending in a direction parallel to the transfer rail; First and second movable frames supported by the guide rails and slidable and extending horizontally in a direction orthogonal to the conveying rails on the upper part of the lead frame conveying rails and having third and fourth guide rails along the extending direction; First and second moving holders slidable along the third and fourth guide rails and positioned vertically above the lead frame feed path; It is characterized in that it comprises a cylindrical camera lens unit which is supported by each of the moving holder and photographs the quality state of the lead frame from the vertical upper portion of the lead frame.

또한, 상기 각 카메라렌즈부를 회전시켜 초점을 맞추도록 각 카메라렌즈부의 외주에는 벨트가 걸치는 렌즈풀리가 마련되어 있고, 상기 제 1,2이동홀더에는 하부로 연장되며 그 하단에는 상기 렌즈풀리에 대응하는 회전각조절풀리가 각각 구비된풀리지지프레임이 구비되고, 상기 각 렌즈풀리와 회전각조절풀리는 벨트에 의해 연결된 것을 특징으로 한다.In addition, a lens pulley is provided on the outer periphery of each camera lens unit so as to focus by rotating the respective camera lens units, and the first and second moving holders extend downward and rotate at a lower end corresponding to the lens pulley. Each of the pulley frame is provided with an angle control pulley, each of the lens pulley and the rotation angle adjustment pulley is characterized in that connected by a belt.

아울러, 상기 각 풀리지지프레임의 하단에는 상기 회전각조절풀리를 회전시키는 회전수단이 구비되고, 상기 고정프레임에는 상기 제 1,2가이드레일과 평행하며 제 1,2이동프레임을 이송시키는 리이드스크류가 구비되고, 상기 제 1,2이동프레임에는 상기 제 3,4가이드레일과 평행하며, 제 1,2이동홀더를 이송시키는 제 3,4리이드스크류가 구비된 것을 특징으로 한다.In addition, the lower end of each pulley frame is provided with a rotating means for rotating the rotation angle control pulley, the fixed frame is a lead screw parallel to the first and second guide rails and conveys the first and second moving frames The first and second moving frames may include third and fourth lead screws that are parallel to the third and fourth guide rails and transfer the first and second moving holders.

이하, 본 발명의 일 실시예에 따른 하나의 실시예를 첨부된 도면을 참조하여 보다 상세히 설명하기로 한다.Hereinafter, one embodiment according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 리드프레임 검사장치를 개략적으로 도시한 평면도이다.1 is a plan view schematically showing a lead frame inspection apparatus according to an embodiment of the present invention.

도시한 바와같이, 본 실시예에 따른 리드프레임 검사장치는, 검사할 리드프레임의 이송을 가이드하는 레일(R)의 상부에 위치하여, 상기 레일을 따라 이송되는 리드프레임을 촬영하기 위한 구성을 갖는다.As shown, the lead frame inspection apparatus according to the present embodiment is positioned on the upper portion of the rail (R) for guiding the transfer of the lead frame to be inspected, and has a configuration for photographing the lead frame transferred along the rail. .

상기 리드프레임 검사장치는, 레일(R)의 측부에 위치하며 레일을 향하는 일측면에 제 1,2가이드레일(20,22)이 마련되어 있는 고정프레임(10)과, 상기 제 1,2가이드레일(20,22)에 지지된 상태로 가이드되어 X방향 이동이 가능한 제 1,2이동프레임(12,14)과, 상기 제 1,2이동프레임(12,14)에 지지되며 Y방향 이동이 가능하고 하부에는 카메라렌즈부(도 2의 50,52)를 갖는 제 1,2이동홀더(24,26)를 포함하여 구성된다.The lead frame inspection apparatus, the fixed frame 10 and the first and second guide rails 20 and 22 are provided on one side of the rail (R) facing the rail, and the first and second guide rails The first and second moving frames 12 and 14 which are guided while being supported by (20, 22) and are movable in the X direction, and are supported by the first and second moving frames 12 and 14, which are movable in the Y direction. And the first and second moving holders 24 and 26 having camera lens portions 50 and 52 in the lower portion thereof.

상기 제 1가이드레일(20) 및 제 2가이드레일(22)은 도 2에 도시한 바와 같이 동축상에 위치하며 위 아래에 하나씩 구비되어 있다. 상기 제 1가이드레일(20)은 제 1이동프레임(12)의 X방향 슬라이딩운동을, 제 2가이드레일(22)은 제 2이동프레임(14)의 X방향 슬라이딩운동을 가이드 하는 것이다.The first guide rails 20 and the second guide rails 22 are coaxially positioned as shown in FIG. 2 and are provided one above and one below. The first guide rail 20 guides the X-direction sliding motion of the first moving frame 12, and the second guide rail 22 guides the X-direction sliding motion of the second moving frame 14.

상기 두 개의 제 1가이드레일(20) 사이에는 제 1리이드스크류(도 2의 46)가 설치되어 있고, 제 2가이드레일(22) 사이에도 제 2리이드스크류(도 2의 48)가 구비되어 있다. 상기 제 1,2리이드스크류(46,48)는 공지의 리이드스크류(lead screw)로서 제 1,2이동프레임(12,14)을 상기한 X방향으로 이동시킨다.A first guide screw (46 in FIG. 2) is provided between the two first guide rails 20, and a second guide screw (48 in FIG. 2) is also provided between the second guide rails 22. FIG. . The first and second lead screws 46 and 48 move the first and second moving frames 12 and 14 in the X direction as known lead screws.

즉, 제 1,2이동프레임(12,14)은 상기 제 1,2리이드스크류(46,48)에 연결되어 리이드스크류의 축회전에 의해 화살표 X방향으로 이동가능하다. 상기와 같은 제 1,2이동프레임(12,14)의 이동을 위해서 리드스크류에 고정된 제 1,2핸들(16,18)이 구비된다.That is, the first and second moving frames 12 and 14 are connected to the first and second lead screws 46 and 48 and are movable in the arrow X direction by the axial rotation of the lead screw. First and second handles 16 and 18 fixed to the lead screw are provided to move the first and second moving frames 12 and 14 as described above.

상기 제 1핸들(16)은 제 1리이드스크류(46)를 축회전시키는 것이고, 제 2핸들(18)은 제 2리이드스크류(48)를 축회전시키는 것으로서, 결국 상기 제 1,2이동프레임(12,14)의 X방향 이동은 상기 제 1,2핸들(16,18)에 의해 이루어진다. 실시예에 따라서 상기 제 1,2핸들(16,18)에 모터를 연결하여 상기 제 1,2이동프레임(12,14)의 이동을 전기신호로 제어할 수 도 있음은 물론이다.The first handle 16 axially rotates the first lead screw 46, and the second handle 18 axially rotates the second lead screw 48. As a result, the first and second moving frames ( X-direction movement of 12 and 14 is performed by the first and second handles 16 and 18. In some embodiments, a motor may be connected to the first and second handles 16 and 18 to control the movement of the first and second moving frames 12 and 14 using an electric signal.

한편, 상기 제 1,2이동프레임(12,14)은 상기 레일(R)의 상부에서 레일과 직교하는 방향으로 수평연장된 것으로서 각각의 대향면에는 제 3,4가이드레일(36,38)이 마련되어 있다.Meanwhile, the first and second moving frames 12 and 14 are horizontally extended in a direction orthogonal to the rail at the top of the rail R, and the third and fourth guide rails 36 and 38 are formed on the opposite surfaces thereof. It is prepared.

상기 제 1이동프레임(12)에도 도 2에 도시한 바와같이 두 개의 제 3가이드레일(36)이 설치되어 제 1이동홀더(24)의 Y방향 슬라이딩운동을 가이드한다. 상기 제 3가이드레일(36)은 두 개가 상호 평행하게 위치되어 있음은 물론이다.As shown in FIG. 2, two third guide rails 36 are installed in the first moving frame 12 to guide the Y-direction sliding movement of the first moving holder 24. Of course, the third guide rails 36 are positioned in parallel with each other.

또한 상기 제 3가이드레일(36)의 중앙에는 제 3리이드스크류(도2의 64)가 구비되어 있다. 상기 제 3리이드스크류(64)는 제 3가이드레일(36)과 평행하며 그 끝단부에는 제 1연결풀리(30)가 고정되어 있다. 상기 제 1연결풀리(30)는 제 3리이드스크류(64)를 회전시킴으로써 제 1이동홀더(24)를 Y방향으로 이동시킨다.In addition, a third guide screw (64 in FIG. 2) is provided at the center of the third guide rail 36. The third guide screw 64 is parallel to the third guide rail 36 and a first connection pulley 30 is fixed to an end thereof. The first connecting pulley 30 moves the first moving holder 24 in the Y direction by rotating the third lead screw 64.

또한 상기 제 1연결풀리(30)의 측부에는 제 2연결풀리(32)가 구비된다. 상기 제 2연결풀리(32)는 제 1이동프레임(12)에 지지되며 제 1연결풀리(30)와 벨트(34)연결되어 있다. 아울러 상기 제 2연결풀리(32)에는 제 3핸들(28)이 고정되어 있다.In addition, a second connection pulley 32 is provided at the side of the first connection pulley 30. The second connection pulley 32 is supported by the first moving frame 12 and is connected to the first connection pulley 30 and the belt 34. In addition, a third handle 28 is fixed to the second connection pulley 32.

따라서 상기 제 3핸들(28)을 회전시키면 상기 제 2연결풀리(32)의 회전력은 벨트(34)를 통해 제 1연결풀리(30)에 전달되고 리이드스크류(64)를 축회전시킬 수 있는 것이다. 결국, 제 3핸들(28)을 좌우로 회전시킴으로서 제 1이동홀더(24)의 Y방향 위치를 조절할 수 있는 것이다.Therefore, when the third handle 28 is rotated, the rotational force of the second connection pulley 32 is transmitted to the first connection pulley 30 through the belt 34 to rotate the lead screw 64. . As a result, the position of the first moving holder 24 in the Y direction can be adjusted by rotating the third handle 28 to the left and right.

상기 제 2이동프레임(14)에도 제 1이동프레임(12)과 마찬가지로 두 개의 평행한 제 4가이드레일(38)과 4리이드스크류(65)가 구비되어 있다. 아울러 상기 제 4리이드스크류(65)의 끝단부에는 제 4핸들(40)이 고정되어 있다. 상기 제 4핸들(40)을 좌우로 회전시킴으로서 제 2이동프레임(14)에 대한 제 2이동홀더(26)의 Y방향 이동을 조절할 수 있음은 물론이다.Like the first moving frame 12, the second moving frame 14 is provided with two parallel fourth guide rails 38 and four lead screws 65. In addition, a fourth handle 40 is fixed to an end of the fourth lead screw 65. By rotating the fourth handle 40 to the left and right, it is a matter of course that the movement of the second moving holder 26 in the Y direction relative to the second moving frame 14 can be controlled.

결국 상기 제 1,2핸들(16,18)과 제 3,4핸들(28,30)을 좌우로 회전시킴으로써제 1,2이동홀더(24,26)를 X-Y방향으로 이동시킬 수 있는 것이다.As a result, the first and second movement holders 24 and 26 may be moved in the X-Y direction by rotating the first and second handles 16 and 18 and the third and fourth handles 28 and 30 from side to side.

도 2는 본 발명의 일 실시예에 따른 리드프레임 검사장치의 정면도이다.Figure 2 is a front view of the lead frame inspection apparatus according to an embodiment of the present invention.

상기한 도면부호와 동일한 도면부호는 동일한 기능의 동일한 부재를 가리킨다.The same reference numerals as the above reference numerals denote the same members having the same function.

도시한 바와같이, 고정프레임(10)의 일측면에는 제 1,2가이드레일(20,22)과 제 1,2리이드스크류(46,48)가 구비되어 제 1,2이동홀더(24,26)를 리드스크류의 이송방향으로 이동시킬 수 있다. 또한 제 1,2이동프레임(12,14)에는 제 3,4가이드레일(36,38) 및 제 3,4리이드스크류(64,65)가 각각 설치되어 제 1,2이동홀더(24,26)를 리드프레임 이송방향과 직교하는 방향으로 이송시킬 수 있다.As shown, the first and second guide rails 20 and 22 and the first and second guide screws 46 and 48 are provided at one side of the fixed frame 10 to provide the first and second moving holders 24 and 26. ) Can be moved in the feed direction of the lead screw. In addition, the third and fourth guide rails 36 and 38 and the third and fourth guide screws 64 and 65 are installed in the first and second moving frames 12 and 14, respectively, and the first and second moving holders 24 and 26 are provided. ) Can be transferred in a direction perpendicular to the lead frame transfer direction.

상기 제 1,2이동홀더(24,26)의 하부에는 카메라렌즈부(50,52)가 각각 구비되어 있다. 상기 카메라렌즈부(50,52)는 리드프레임의 연직상부에 위치하여 하부로 통과하는 리드프레임의 상태를 촬영하여 외부로 나타내 보이는 것이다. 상기 각 카메라렌즈부(50,52)의 외주에는 카메라 렌즈부의 외주를 좌우로 회전시켜 초점을 맞추기 위한 렌즈풀리(56)가 고정되어 있다.Camera lens parts 50 and 52 are provided below the first and second moving holders 24 and 26, respectively. The camera lens parts 50 and 52 are positioned on the vertical portion of the lead frame and photographed to show the state of the lead frame passing downward. A lens pulley 56 is fixed to the outer circumference of each of the camera lens parts 50 and 52 to focus by rotating the outer circumference of the camera lens part left and right.

한편, 상기 제 1,2이동홀더(24,26)에는 풀리지지프레임(58,60)이 고정되어 있다. 상기 풀리지지프레임(58,60)은 제 1,2이동홀더(24,26)에 고정된 상태로 하부로 연장된 것으로서 그 하단부에는 회전각조절풀리(42,44)와, 상기 각 회전각조절풀리(42,44)를 회전시키는 풀리회전핸들(62)을 갖는다.Meanwhile, release frames 58 and 60 are fixed to the first and second moving holders 24 and 26. The pulley frames 58 and 60 extend downward while being fixed to the first and second moving holders 24 and 26, and at the lower end thereof, rotation angle adjustment pulleys 42 and 44 and the rotation angle adjustments. It has a pulley rotation handle 62 for rotating the pulleys (42, 44).

상기 회전각조절풀리(42,44)는 각 렌즈풀리(56)에 대응하는 높이에 위치하고 벨트(54)를 통해 렌즈풀리(56)와 연결되어 있다. 따라서 각 풀리회전핸들(62)를 회전시킴으로써 카메라렌즈부(56)를 회전시켜 카메라렌즈의 초점을 정확히 맞출 수 있는 것이다.The rotation angle adjusting pulleys 42 and 44 are located at a height corresponding to each lens pulley 56 and are connected to the lens pulley 56 through the belt 54. Therefore, by rotating the pulley rotation handle 62, the camera lens unit 56 can be rotated to accurately focus the camera lens.

도 3 및 도 4는 본 발명의 일 실시예에 따른 리드프레임의 동작을 설명하기 위하여 도시한 도면으로서 도 3은 스트립타입의 리드프레임을 검사하는 모습을 도시하였고, 도 4는 매트릭스타입의 리드프레임을 검사하는 모습을 도시하였다.3 and 4 are views for explaining the operation of the lead frame according to an embodiment of the present invention, Figure 3 shows a state of inspecting the strip-type lead frame, Figure 4 is a matrix type lead frame Shown to examine the appearance.

도 3을 참조하면, 제 1,2이동홀더(26,28)가 리드프레임(L)의 이송방향을 따라 일직선으로 위치되어 있음을 알 수 있다. 또한 제 1,2이동홀더(26,28) 상호간의 간격도 각 리드프레임의 간격에 대응하는 간격을 유지하고 있다. 상기와 같은 제 1,2이동홀더(26,28)의 위치조절은 제1,2,3,4핸들에 의해 이루어짐은 물론이다.Referring to FIG. 3, it can be seen that the first and second moving holders 26 and 28 are located in a straight line along the feeding direction of the lead frame L. FIG. In addition, the interval between the first and second movement holders 26 and 28 also maintains an interval corresponding to the interval of each lead frame. As described above, the position adjustment of the first and second moving holders 26 and 28 is made by the first, second, third and fourth handles.

여하튼 상기 제 1,2이동홀더(24,26)의 위치가 세팅되었다면 리드프레임(R)을 두 피치씩 이송시킨다. 상기 제 1,2이동홀더(24,26)가 리드프레임의 이송방향으로 위치되어 있으므로 두 피치씩 이송시켜 촬영을 수행할 수 있는 것이다.In any case, if the positions of the first and second moving holders 24 and 26 are set, the lead frame R is transferred by two pitches. Since the first and second moving holders 24 and 26 are positioned in the feeding direction of the lead frame, the first and second moving holders 24 and 26 may be moved by two pitches to perform photographing.

도 4를 참조하면, 레일(R)을 따라 매트릭스타입의 리드프레임(R)이 이송되고 있음을 알 수 있다. 상기 매트릭스타입의 리드프레임을 검사하기 위하여는 예컨데 제 2이동홀더(26)를 화살표 c방향으로 이동시켜 두 줄의 리드프레임을 동시에 촬영할 수 있게 한다. 이 때 리드프레임은 한 피치씩 이송시킨다.Referring to Figure 4, it can be seen that the lead frame (R) of the matrix type is transferred along the rail (R). In order to inspect the lead frame of the matrix type, for example, the second moving holder 26 is moved in the direction of the arrow c so that two rows of lead frames can be simultaneously photographed. At this time, the lead frame is moved by one pitch.

결국 상기와 같이 리드프레임을 두 개씩 동시에 검사하므로 검사속도가 두 배가 빨라질 수 있으며 특히 카메라렌즈부의 위치를 매번 바꿀필요가 없어 작업의 효율이 그만큼 높게 된다.As a result, as described above, the inspection of the two lead frames at the same time can be twice as fast, especially the need to change the position of the camera lens every time, the efficiency of the work is so high.

이상, 본 발명을 구체적인 실시예를 통하여 상세하게 설명하였으나, 본 발명은 상기 실시예에 한정하지 않고, 본 발명의 기술적 사상의 범위내에서 통상의 지식을 가진 자에 의하여 여러 가지 변형이 가능하다.As mentioned above, although this invention was demonstrated in detail through the specific Example, this invention is not limited to the said Example, A various deformation | transformation is possible for a person with ordinary knowledge within the scope of the technical idea of this invention.

상기와 같이 이루어지는 본 발명의 리드프레임 검사장치는, 한 번에 두 개씩의 리드프레임을 동시에 검사할 수 있어 그만큼 검사속도가 빠르며 특히 카메라렌즈부를 X-Y방향으로 이동시킬 수 있어 매트릭스타입의 리드프레임의 경우라 하더라도 카메라를 정확한 위치에 한 번 세팅하여 계속 사용하므로 카메라를 번번이 이동시킬 필요가 없으므로 그만큼 정확한 촬영을 할 수 있다.The lead frame inspection apparatus of the present invention made as described above can inspect two lead frames at a time at the same time, so the inspection speed is high, and in particular, in the case of a matrix type lead frame, the camera lens portion can be moved in the XY direction. Even if the camera is set to the correct position once and continue to use, there is no need to move the camera once and for all, so the accurate shooting can be done.

Claims (3)

검사대상인 리드프레임이 탑재되어 이송되는 이송레일의 이송경로상에 설치되어 이송레일을 따라 이송되는 리드프레임의 품질상태를 검사하는 것으로서,It is installed on the conveying path of the conveying rail which is mounted and conveyed the lead frame to be inspected, and inspects the quality state of the lead frame conveyed along the conveying rail, 상기 이송레일의 측부에 위치하며 그 일측면에는 상기 이송레일과 평행한 방향으로 연장된 제 1,2가이드레일이 동축선상에 구비되어 있는 고정프레임과;A fixed frame having a coaxial line with first and second guide rails extending in a direction parallel to the transport rail and positioned at a side of the transport rail; 상기 각 가이드레일에 지지되어 슬라이딩 가능하고 리드프레임 이송레일의 상부에 이송레일과 직교하는 방향으로 수평 연장되며 연장방향을 따라 제 3,4가이드레일이 각각 구비되어 있는 제 1,2이동프레임과;First and second movable frames supported by the guide rails and slidable and extending horizontally in a direction orthogonal to the conveying rails on the upper part of the lead frame conveying rails and having third and fourth guide rails along the extending direction; 상기 제 3,4가이드레일을 따라 슬라이딩 가능하고 리드프레임 이송경로의 연직상부에 위치하는 제 1,2이동홀더와;First and second moving holders slidable along the third and fourth guide rails and positioned vertically above the lead frame feed path; 상기 각 이동홀더에 지지되며 리드프레임의 연직 상부에서 리드프레임의 품질상태를 촬영하는 원통형 카메라렌즈부를 포함하는 것을 특징으로 하는 리드프레임 검사장치.And a cylindrical camera lens unit which is supported by each of the moving holders and photographs a quality state of the lead frame in the vertical upper portion of the lead frame. 제 1항에 있어서,The method of claim 1, 상기 각 카메라렌즈부를 회전시켜 초점을 맞추도록 각 카메라렌즈부의 외주에는 벨트가 걸치는 렌즈풀리가 마련되어 있고, 상기 제 1,2이동홀더에는 하부로 연장되며 그 하단에는 상기 렌즈풀리에 대응하는 회전각조절풀리가 각각 구비된 풀리지지프레임이 구비되고, 상기 각 렌즈풀리와 회전각조절풀리는 벨트에 의해 연결된 것을 특징으로 하는 리드프레임 검사장치.A lens pulley is provided on the outer periphery of each camera lens unit so as to focus by rotating the respective camera lens units, and the first and second moving holders extend downward, and at the bottom thereof, a rotation angle control corresponding to the lens pulley is provided. And a pulley frame provided with a pulley, respectively, wherein each lens pulley and the rotation angle adjusting pulley are connected by a belt. 제 2항에 있어서,The method of claim 2, 상기 각 풀리지지프레임의 하단에는 상기 회전각조절풀리를 회전시키는 회전수단이 구비되고,The lower end of each pulley frame is provided with a rotating means for rotating the rotation angle control pulley, 상기 고정프레임에는 상기 제 1,2가이드레일과 평행하며 제 1,2이동프레임을 이송시키는 리이드스크류가 구비되고,The fixed frame is provided with a lead screw parallel to the first and second guide rails to convey the first and second moving frames, 상기 제 1,2이동프레임에는 상기 제 3,4가이드레일과 평행하며, 제 1,2이동홀더를 이송시키는 제 3,4리이드스크류가 구비된 것을 특징으로 하는 리드프레임 검사장치.The first and second moving frames are parallel to the third and fourth guide rails, and lead frame inspection apparatus, characterized in that provided with a third, fourth lead screw for conveying the first and second moving holders.
KR1020020004422A 2002-01-25 2002-01-25 Apparatus for inspecting lead frame KR100763968B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116626063A (en) * 2023-05-30 2023-08-22 东莞平晶微电子科技有限公司 Lead frame orthopedic detection device for TOLL packaging processing

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* Cited by examiner, † Cited by third party
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JPH06241747A (en) * 1993-02-23 1994-09-02 Toshiba Corp Lead frame conveying device
JP3590162B2 (en) * 1995-10-16 2004-11-17 アピックヤマダ株式会社 Lead frame inspection equipment
KR19990027831A (en) * 1997-09-30 1999-04-15 이해규 Lead frame inspection device
JPH11168166A (en) * 1997-12-05 1999-06-22 Kobe Steel Ltd Lead frame inspection device and inspection system provided with device thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116626063A (en) * 2023-05-30 2023-08-22 东莞平晶微电子科技有限公司 Lead frame orthopedic detection device for TOLL packaging processing
CN116626063B (en) * 2023-05-30 2024-01-19 东莞平晶微电子科技有限公司 Lead frame orthopedic detection device for TOLL packaging processing

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