KR20030060472A - Apparatus and method for attaching heat spreader on frame of semiconductor package - Google Patents

Abstract

PURPOSE: An apparatus and a method for adhering a heat sink for semiconductor package are provided to improve the productivity by automatizing a process for adhering a radiative fin on a frame. CONSTITUTION: An apparatus for adhering a heat sink for semiconductor package includes a frame supply portion(110), a rail portion(150), a gripper portion(170), a cover separation portion(200), a heat sink supply portion(300), an adhesion portion(250), a thermal press portion(350), and a frame collection portion(380). The frame supply portion supplies frames for semiconductor package, respectively. The rail portion is extended to one direction in order to move the supplied frames for semiconductor package. The gripper portion includes one or more gripper to transfer the frames along the rail portion. The cover separation portion separates a cover of a both-sided tape from the frame. The heat sink supply portion supplied radiative fins on the frame, respectively. The adhesion portion adheres the radiative fin to the frame and presses the radiative fin and the frame by using a roller. The thermal press portion presses the frames by using the heat. The frame collection portion collects the pressed frames.

Description

[0001] Apparatus and method for attaching a heat sink to a frame for a semiconductor package [0002]

The present invention relates to an apparatus and method for attaching a heat sink to a frame for a semiconductor package, and more particularly to an apparatus and method for automatically attaching a heat sink to a frame laminated with a double-sided adhesive tape.

BACKGROUND OF THE INVENTION [0002] Tibie semiconductor packages are known in the field of semiconductor packages. This is because a tape (hereinafter referred to as a "circuit tape") made of a material such as polyimide on which a predetermined circuit pattern is formed is adhered to a metal frame and the circuit pattern is electrically connected to the semiconductor chip of the semiconductor package through wire bonding . Such a TJ semiconductor package can be used for customized products such as computer graphics cards, game cards, etc., because it can accommodate high-density circuits, has excellent electrical characteristics, and has high heat release properties.

Typically, a semiconductor package is a one-piece type in which a circuit tape is directly attached to a heat-radiating plate that radiates heat, a plurality of frames called a "stiffener" serving as a support and a heat spreader And can be classified into a two-piece type attached on a frame.

In order to manufacture the two-piece type semiconductor package, a process of bonding the frame and the heat sink to each other is required.

Thus, there is a problem that fatigue phenomenon of the worker frequently occurs, and in particular, error in position alignment is increased and productivity is reduced.

An apparatus such as that disclosed in Korean Patent Application No. 10-1998-0056169, which is an apparatus of a neighboring field, is a process of aligning an adherend on an adhesive tape and then simply pressing the adhesive onto a mold, thereby forming an air layer on the adhesive surface And thus the adhesive force is weakened.

It is an object of the present invention to provide an automated heat sink attaching apparatus in which a frame and a heat sink are stacked together and a frame is stacked and bonded together.

It is another object of the present invention to provide a heat sink attaching apparatus which can suppress the formation of an air layer on an adhesive surface between an adhesive tape and a heat sink when bonding the frame and the heat sink, thereby enhancing the adhesive force.

It is also an object of the present invention to provide a method of attaching a heat sink to a frame for a semiconductor package through a heat sink attachment device.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view for explaining the concept of operation performed by a heat sink attaching apparatus according to the present invention; FIG.

2 is a schematic plan view of a heat sink attachment apparatus according to the present invention;

3 is a schematic cross-sectional view of a frame supply part of a heat sink attachment device according to the present invention.

4 is a schematic cross-sectional view of a cover peeling portion of a heat sink attachment device according to the present invention;

FIG. 5 is a perspective view schematically showing a guide block, which is a component of a heat radiating plate supplying unit of the heat sink attaching apparatus according to the present invention. FIG.

6 is a plan view schematically showing a frame positioning means of a bonding portion of a heat sink attaching apparatus according to the present invention.

7 is a cross-sectional view schematically showing a roller means which is one component of a bonding portion of a heat sink attaching apparatus according to the present invention.

8 is a schematic cross-sectional view of the thermocompression bonding portion of the heat sink attachment device according to the present invention.

9 is a flow chart schematically illustrating a method of attaching a heat sink according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

10 ... frame for semiconductor package 20 ... double-sided adhesive tape

30 ... Heat sink 100 ... Heat sink attachment

110 ... frame supply part 150 ... rail part

170 ... Gripper part 200 ... Cover peeling part

250 ... Adhesive part 300 ... Heat sink plate supply part

350 ... thermocompression bonding portion 380 ... frame take-

According to an aspect of the present invention, there is provided an apparatus for attaching a heat sink to a frame for a semiconductor package, comprising: a frame supply unit for supplying a semiconductor package frame laminated with a double-sided adhesive tape, A rail extending in one direction so that the supplied frame moves along it, and a sequential series of operations is possible; A gripper portion having a plurality of grippers for transporting the frame along the rail portion; A cover peeling portion located adjacent to the frame feeding portion along the rail portion by peeling the cover of the double-sided adhesive tape in the frame; A heat radiating plate supply unit for aligning the heat radiating plates on the frame on which the cover is peeled and supplying the heat radiating plates one by one; A bonding portion positioned adjacent to the cover peeling portion along the rail portion by aligning the frame and the heat sink with each other and pressing them with a roller; A thermocompression bonding part thermocompression-bonding the frame pressed by the roller with a mold having a heater, the thermocompression bonding part being positioned adjacent to the bonding part along the rail part; And a frame collecting unit for collecting and stacking the thermocompressed frames.

In the heat sink attaching apparatus of the present invention, it is preferable that the gripper for transferring the frame from the cover peeling portion to the adhering portion and from the adhering portion to the thermocompression portion is a pin gripper.

The cover releasing portion of the heat sink attaching device of the present invention includes a conveyor for supplying the frame, a viscous tape attached to the adhesive tape cover of the frame to peel the cover from the frame, A viscous tape supply reel and a retracting reel, and a cylinder means for making the viscous tape come into contact with the cover.

In the heat sink attaching apparatus of the present invention, a heater is embedded in the roller of the adhering section.

The adhesive portion may further comprise frame positioning means configured to include a reference block to which the frame is closely attached and a pusher for pushing the frame with the reference block.

According to an aspect of the present invention, there is provided a method of attaching a heat sink to a frame for a semiconductor package according to the present invention, comprising the steps of: feeding a frame for a semiconductor package laminated with a double-sided adhesive tape whose top surface is covered with a cover; Peeling the cover of the double-faced adhesive tape in the frame; Aligning the heat-radiating plate with the peeled frame so that the cover adheres and presses the heat-radiating plate with the roller; Thermally bonding the rolled bonded frame to a mold having a built-in heater; And a step of stacking the thermocompressed frame.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view for explaining the concept of the operation performed by a device for attaching a heat sink to a frame for a semiconductor package according to the present invention (hereinafter referred to as a 'heat sink attaching device').

Referring to the drawings, a semiconductor package frame 10 used in the present embodiment is a strip of a metal material in which four unit frames 11 are formed in a row. A cavity 12 in which a semiconductor chip (not shown) is mounted is formed in a central portion of each unit frame 11. Four guide holes (13) for alignment with the heat sink (30) are formed at four corners of the strip-shaped frame (10).

The frame 10 is fed into the apparatus of the present invention with the double-sided adhesive tape 20 laminated on its upper surface. The upper surface of the double-stick adhesive tape 20 is covered with the cover 21 until it is adhered to the portion to be adhered to the heat sink 30 in the present invention apparatus.

The heat dissipation plate 30 is in the form of a strip of a metal material in which four unit heat dissipation plates 31 are formed in a row in correspondence with the frame 10. Guide holes 32 corresponding to the guide holes 13 of the frame are formed at four corners of the strip-shaped heat sink 30 so that the heat sink 30 and the frame 10 can be accurately overlapped and attached . Details of the attachment process will be described later.

2 is a schematic plan view of a heat sink attaching apparatus according to the present invention.

Referring to the drawings, the apparatus of the present invention includes a frame supply part 110 to which a frame for a semiconductor package laminated with a double-sided adhesive tape for work is fed, a rail part 150, A gripper part 170 for removing the cover of the double-sided adhesive tape, a cover peeling part 200 for removing the cover of the double-sided adhesive tape, and a heat sink supply part 300 for supplying the heat sink. A bonding part 250 for aligning and bonding the frame and the heat sink by rolling, a thermocompression part 350 for thermocompression bonding the frame, and a frame collecting part 380 for collecting and stacking the thermocompressed frame.

The frame feeder 110 and the frame collecting unit 380 are provided with a cassette for starting work or for loading a frame in which work has been completed. Three frames of cassettes are provided in the frame feeder 110. Two of the cassettes 111 and 112 are loaded with frames waiting for work and the other frame is transferred to the cassette 113 to the rail 150 The interleaving between the remaining frames is transferred and loaded. The frame recovery unit 380 is further provided with two cassettes 381 and 382 on which the finished frames are loaded as well as one cassette 383 on which the sheets are stacked so that the cassettes 383 Ensure that the sheet to be transferred is intervened.

The heat radiating plate supply unit 300 is also provided with two cassettes 301 and 302 for supplying heat radiating plates and one cassette 303 for recovering the lancet.

The frame feeding unit 110 and the collecting unit 380 are provided with frame moving means 130 and 400 for moving frames one by one between the rail part 150 and the cassettes 111 to 113 and 381 to 383, respectively. The frame moving means 130 and 400 are respectively provided with servomotors 131 and 401, timing belts 132 and 402 for transmitting the driving force thereof, ball screws 133 and 403 rotatable therewith and a nut Axis direction perpendicular to the rail part 150 extending in the X-axis direction by a mechanism including a pair of guide rails 135,

The heat radiating plate supplying unit 300 includes first heat radiating plate moving means 310 for moving the heat radiating plate one by one between the cassettes 301 to 303 and the guide block 345 and a second heat sink moving means 310 for moving the heat radiating plate between the guide block 345 and the adhering unit 250 The second heat sink moving means 330 is provided. The frames 310 and 330 are driven by a mechanism including the servo motors 311 and 331, the timing belts 312 and 333, the ball screws 313 and 333 and the bodies 314 and 334 as described in the frame moving means 130 and 400, .

3 is a schematic cross-sectional view of a frame supply unit of the heat sink attachment apparatus according to the present invention.

Referring to the drawing, the cassette 111 of the frame feeder is opened upward and supports the stacked double-sided adhesive tape laminated frame (hereinafter, referred to as 'frames 10 and 20' And a shaft 122 for moving the plate 121 upward and downward. The shaft 122 can be lowered or raised in stages by the driving of the linear motor 123 so that the frames 10 and 20 and the separator 50 are stacked or removed. Although only one cassette 111 is shown in the figure, it will be easily understood that the other cassettes 112 and 113 have the same structure.

The frame loader, which is the frame moving means 130, is equipped with a vacuum adsorption nozzle 140. This ensures that the frames 10 and 20 can be moved to the loader 130 without damaging them. The loader 130 is capable of moving in the Y-axis direction by a driving mechanism including the cylinder 136.

2 and 3, the loader 130 firstly performs a linear movement in the Z-axis direction from the initial position to the position of the cassette 111 on which the frames 10 and 20 are loaded And performs linear motion in the Y-axis direction so as to be close to the frame (10.20). In this state, the vacuum adsorption nozzle 140 operates and the frames 10 and 20 located at the uppermost position of the cassette 111 are attached to the loader 130 without damage. The loader 130 with the frames 10 and 20 is moved closer to the reamer 150 through a series of rectilinear movements and by the operation stop of the vacuum adsorption nozzle 140, Lt; RTI ID = 0.0 > 150 < / RTI > The loader 130 can load the interleaving paper 50 interposed between the frames 10 and 20 in a separate cassette 113 by the same series of operations.

Although not shown in FIG. 3, the cassettes 381 to 383 of the frame recovery unit 380, the unloader 400 as the frame moving means, and the cassettes 301 to 303 of the heat sink supply unit 300, It will be easily understood that the moving means 310 and 330 are also structured as shown in FIG. The frame retrieving unit 380 performs a process of interposing the interleaving between the frames in order to protect the frames completed in response to the operation of the frame supplying unit 110. [

Referring to FIG. 2, the rail part 150 includes a pair of rails extending in the X-axis direction. Since only the edges of the frame contact the rail and are moved to the respective operation parts, damage to the unit frame is prevented .

The frames that are seated on the rail part (150) move between the work parts by the gripper part (170). 2 shows only the first and second pin grippers 171 and 181 for transferring the frame from the cover peeling unit 200 to the bonding unit 250 and from the bonding unit 250 to the thermocompression unit 350. The L-shaped gripper bars 172 and 182 of the pin grippers 171 and 181 push the frame along the rail part 150 in contact with the edge of the frame. Like the loader 130, the pin grippers 171 and 181 include servo motors 175 and 186, timing belts 176 and 186, ball screws 177 and 187 connected thereto, and a nut engaged with the ball screw, And is linearly movable in the X-axis direction along the rail part 150 by a mechanism constituted by a plurality of guide rails. Further, although not shown, it is possible to move up and down in the Y-axis direction (a direction perpendicular to the X-axis and the Z-axis) by a mechanism having a cylinder.

It is preferable that a pin gripper is applied so as to prevent marks on the adhesive surface of the double-sided adhesive tape (20 in Fig. 1) in a state in which the cover (21 in Fig. 1) is peeled off. Therefore, from the point on the rail where the frame is seated by the loader 130 to the cover peeling portion 200, and up to the point on the rail where the frame is attracted by the unloader 400 at the thermocompression portion 350, (Not shown) may be applied.

4 is a schematic cross-sectional view illustrating a cover peeling unit of the heat sink attachment apparatus according to the present invention.

Referring to the drawings, a cover peeling unit 200 includes a viscous tape 201 for contacting a cover 21 of a laminated frame 10, 20 and releasing it from the frames 10, 20, And a supply reel 202 and a recovery reel 203 for continuously supplying and recovering the viscous tape 201 in a reel to reel form. The viscous tape 201 travels along the circumferential surface of the roller 205 which is movable in the Y-axis direction by driving the cylinder 204, and contacts the cover 21. The cover 21, which is in contact with the viscous tape 201, is attached to the viscous tape 201 and wound together with the collecting reel 203 as shown in the figure. The lowering force of the cylinder 204 is adjusted by the micrometer 206 and the lower force is regulated by a regulator (not shown), so that the viscosity of the viscous The tape 201 can be brought into contact with the cover 21.

The frames 10 and 20 are transported in the negative direction of the X axis by a conveyor 240 having a conveyor belt 241 and a plurality of belt conveying rollers 242. The conveyor belt 240 is conveyed in the direction of X-

Tension adjusting means 230 for adjusting the tension of the viscous tape 201 is provided on the supply reel 202 side. The tension adjusting means 230 includes an LM guide 231, a weight block 232 coupled to the LM guide 231 so as to be able to move up and down along the LM guide 231, And a spring 234 connected to the other end of the weight block 232 for balance. When the viscous tape 201 traveling along the circumferential surface of the roller 233 is loosened, the roller 233 descends. On the contrary, when the viscous tape 201 becomes too tight, the roller 233 So that the viscous tape 201 can maintain an appropriate tension.

It is preferable that the cover peeling unit 200 is provided with the roll feeders 210 and 220 on the viscous tape supply reel 202 side and the viscous tape reel 203 side respectively. The roll feeders 210 and 220 are driven by idler rollers 213 and 223 for pressing the viscous tape 201 by driving the cylinders 211 and 221 and driving rollers 213 and 223 rotated by the rotational force of a servo motor 201 in a mutually opposed manner, which facilitates smooth transport of the viscous tape 201. [

It is preferable that the rollers of the cover peeling portion 200 include a silicon-coated circumferential surface including a series of traveling rollers 245 to 248 for deflecting the running direction of the viscous tape 201. [ So that the viscous tape 201 can run smoothly without sticking to the rollers.

The viscous tape 201 continuously supplied from the supply reel 202 is brought into contact with the frames 10 and 20 continuously transported by the conveyor 240. The cover 21 is detached from the frames 10 and 20 and attached to the viscous tape 201 and the viscous tape 201 to which the cover 21 is attached is wound and collected on the collecting reel 203 .

FIG. 5 is a perspective view schematically showing a guide block, which is a component of a heat radiating plate supplying unit of the heat sink attaching apparatus according to the present invention. The guide block serves to initially align the heat sink to be attached to the frame.

Referring to the drawing, the guide block 345 includes a flat base 346 substantially coinciding with the area of the heat sink, and side walls 347 extending in the Y axis direction at the four side edges of the base 346, Respectively. The side wall 347 has an inclined surface 348 inclined toward the base 346 and a stepped surface 349 is formed between the base 346 and the inclined surface 348.

The heat sink 30 is moved above the guide block 345 by the first heat sink moving means 310 of FIG. 2, and the operation of the vacuum suction nozzle (not shown) and falls freely by the off-off. The freely falling heat sink 30 is guided by the inclined surface 348 and slides on the base 346. The area of the base 346 is substantially equal to the area of the heat dissipating plate 30 and the step difference surface 349 is formed between the base 346 and the inclined surface 348 so that the heat dissipating plate 30 can not move, Can be suppressed.

The heat sink 30 aligned by the guide block 345 is transferred to the adhering portion 250 by the second heat sink moving means 330 (FIG. 2). A plurality of guide pins (not shown) corresponding to the guide holes 32 of the heat sink are formed in the second heat sink moving means. The guide hole 32 is penetrated by the guide pin (not shown) during the transportation of the heat sink 30 by the second heat sink moving means, so that the misalignment of the heat sink 30 can be suppressed.

6 is a plan view schematically showing a frame positioning means of a bonding portion of a heat sink attaching apparatus according to the present invention.

Referring to the drawings, the frame positioning means 260 includes a die 261 for supporting the frames 10 and 20, a frame 26 fixed to one side of the frames 10 and 20, A reference block 270 and a pusher 262 pushing the frame 10,20 by driving the cylinder 263 so that the frame 10,20 is in close contact with the reference block. The stopper 271 supporting the side of the die 261 and the precise angle adjustment of the reference block 270 so that the reference block 270 is not pushed in the Z axis direction when the pusher 262 pushes the frame 10, (Not shown).

The frames 10 and 20 are moved in the negative direction of the X axis by the pin gripper 171 in Fig. 2 and stop at a predetermined position on the die 261, , 20 are aligned in the X-axis direction. The stationary frames 10 and 20 are brought into close contact with the reference block 270 in which the pusher 262 driven by the cylinder 263 is pushed and stopped to complete the alignment in the Z axis direction.

The second heat sink moving means (not shown) that transfers the heat sink (30 in FIG. 5) from the frame (10, 20) to a position spaced apart from the frame (10, 20) And the guide pins (not shown) of the second heat sink moving means pass through the guide holes 13 of the frames 10 and 20. When the vacuum adsorption nozzle (not shown) of the second heat sink moving means is turned off in this state, the heat radiating plate 30 (see FIG. 5) (Not shown) to be precisely superimposed on the frames 10 and 20 and adhered to the double-sided adhesive tape 20. When the second heat sink moving means (not shown) is moved toward the guide block (345 in FIG. 5) for transfer of the next heat sink, a 'frame with heat sinks overlapping' (hereinafter referred to as 'frames 10, 20 and 30' Is left in a state waiting for rolling to be described later.

7 is a cross-sectional view schematically showing a roller means, which is one component of a bonding portion of a heat sink attaching apparatus according to the present invention. The roller means is provided as means for pressurizing and rolling the bonded frames (10, 20, 30).

Referring to the drawings, the roller unit 280 includes a roller 281 and a roller housing 282 that are raised and lowered by a cylinder (not shown) to roll the frames 10, 20 and 30, And a micrometer 283 for fine adjustment of the lifting height of the wafer W. A heater (not shown) is built in the roller 281 to help adhesion of the frames 10, 20 and 30 by rolling. 2, the roller 281 includes a servo motor 291, a timing belt 292 for transmitting the driving force thereof, a ball screw 293 rotatable therewith, and a nut (not shown) And a housing 282 having an opening (not shown).

The generation of an air layer between the adhesive surface of the double-sided adhesive tape 20 and the heat sink 30 can be suppressed by the roller 281 pressing the heat sink 30 of the frames 10, 20 and 30, Can be strengthened.

8 is a schematic cross-sectional view of the thermocompression bonding portion of the heat sink attachment device according to the present invention.

Referring to the drawings, the thermocompression bonding part 350 includes upper and lower molds 351 and 360 for pressing the frames 10, 20 and 30. The molds 351 and 360 can be lifted and lowered in the Y-axis direction by the cylinders 353 and 363, respectively, and a heater (not shown) is embedded in at least the lower mold 360 to firmly adhere the frames 10, 20 and 30 Help. The press surface of the upper mold 351 is formed with an elastic material layer, preferably a silicone rubber layer 352 to prevent the frames 10, 20, 30 from coming into contact with and damaging the upper mold 351.

After the heat sink 30 is adhered, the rolled frames 10, 20 and 30 enter the thermocompression bonding part 350 by the pin gripper 181 of FIG. The frames 351 and 360 of the thermocompression bonding unit 350 are lowered and raised, respectively, by thermocompression, thereby completing the frame in which the heat sink is firmly attached. These frames 10, 20, and 30 are retrieved by the above-described frame retrieval unit (380 in FIG. 2) and are stacked with interleaving between them.

9 is a schematic flow diagram of a method of attaching a heat sink to a frame for a semiconductor package according to the present invention. This method can be performed using the apparatus of the present invention described in Figs. 2-8.

The method includes the steps of supplying a frame laminated with a double-sided adhesive tape one by one (S110), peeling the cover of the double-sided adhesive tape (S120), aligning the frame and the heat sink (S140) of thermocompression bonding the rolled bonded frame with a mold having a heater (S140), and stacking the thermocompressed frame on a cassette (S150) . The heat sinks are positioned one by one and supplied for adhesion to the frame (S210).

2, step S110 of feeding the frame is performed by the frame feeder 110 of the apparatus of the present invention, and step S120 of peeling the cover of the double-sided adhesive tape is performed by the cover peeling unit 200 Step S140 of bonding and rolling the heat radiating plate and the frame together with the adhesive bonding portion 250 and step S140 of thermocompressing the frame are carried out by the thermocompression bonding portion 350, (S210) by the frame recovery unit 380 and aligning the heat sinks by aligning them may be performed by the heat sink supplier 300, respectively. A detailed description of each step is omitted since it has already been described in detail in FIGS. 2 to 8. FIG.

According to the apparatus and method for attaching a heat sink according to the present invention described above, it is possible to firmly attach the heat sink to a frame by an automated process, thereby preventing occurrence of defects due to fatigue of the operator and improving productivity.

Also, by applying a pressing process by rolling, the formation of an air layer on the bonding surface between the double-sided adhesive tape and the heat sink can be suppressed, so that the adhesive force between the frame and the heat sink can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (6)

A frame feeder for feeding a semiconductor package frame laminated with a double-sided adhesive tape whose top surface is covered with a cover into the apparatus one by one; A rail extending in one direction so that the supplied frame moves along it, and a sequential series of operations is possible; A gripper portion having at least one gripper for transporting the frame along the rail portion; A cover peeling portion located adjacent to the frame feeding portion along the rail portion by peeling the cover of the double-sided adhesive tape in the frame; A heat radiating plate supply unit for aligning the heat radiating plates on the frame on which the cover is peeled and supplying the heat radiating plates one by one; A bonding portion positioned adjacent to the cover peeling portion along the rail portion by aligning the frame and the heat sink with each other and pressing them with a roller; A thermocompression bonding portion positioned adjacent to the bonding portion by thermocompression bonding the frame pressed by the roller; And And a frame collecting unit for collecting and stacking the thermocompressed frame. The method according to claim 1, Wherein the gripper for transferring the frame from the cover peeling portion to the bonding portion and from the bonding portion to the thermocompression bonding portion is a pin gripper. The method according to claim 1, The cover peeling unit includes a conveyor for feeding the frame, A viscous tape attached to the adhesive tape cover of the frame to peel the cover from the frame, A viscous tape supply reel and a recovery reel for allowing the viscous tape to be continuously supplied and recovered, And a cylinder means for moving the viscous tape so as to come into contact with the cover. The method according to claim 1, Wherein a heater is embedded in the roller of the bonding portion. The method according to claim 1 or 4, Wherein the bonding portion further comprises a frame positioning unit configured to include a reference block to which the frame is closely attached and a pusher to push the frame to the reference block. Providing a frame for a semiconductor package laminated with a double-sided adhesive tape whose top surface is covered with a cover; Peeling the cover of the double-faced adhesive tape in the frame; Aligning the heat-radiating plate with the peeled frame so that the cover adheres and presses the heat-radiating plate with the roller; Thermally bonding the rolled bonded frame to a mold having a built-in heater; And And mounting the thermo-compression bonded frame on the frame.