KR20030049800A - A polishing method and device - Google Patents

Abstract

PURPOSE: A polishing method and device is provided to prevent the non-equal polishing of workpieces and the ununiformity of magnetic field having an effect on the affectivity of a polishing region. CONSTITUTION: A surface polishing system is composed of a polishing material and at least one magnetic device plasticizing the polishing material and contacting with the polishing material to use the plasticized material for polishing the surface of workpiece(113). The polishing material contacts intermittently and repeatedly to the surface to polish the surface. In addition, a magnetizing device intermittently magnetizes the magnetic device, and the magnetic device is a permanent magnet(116) alternatively positioned. The magnetizing device is a shuttle(130) intermittently acting on at least one magnetic device, and magnetic field(118) is formed when the magnetic device acts.

Description

Polishing method and apparatus {A POLISHING METHOD AND DEVICE}

In the known art there is a system for polishing an optical lens. Some of these systems use magnetorheological abrasive materials known as polishing slurries. Typically the slurry is a mixture of self flowable composite with abrasive particles and stabilizer.

When no magnetic force is applied, the slurry is usually in a liquid state. However, when the magnetic force is applied, the slurry becomes very high in viscosity and pushes the abrasive particles to the liquid surface. Then, this high viscosity slurry having an abrasive projecting from the surface is used as a polishing mechanism for polishing the workpiece surface. US Pat. Nos. 5,577,948 and 5,449,313 to Kardonsky et al. Disclose such a system.

For the most efficient self-flowing-polishing apparatus when used as a polishing apparatus, the apparatus should be hard enough to apply sufficient force to securely press the abrasive particles onto the surface of the workpiece. Polishing apparatus used in the prior art obtains almost plasticized properties, with a viscosity known as Bingham property under the influence of magnetic force. In this regard, the apparatus must be robust enough to be used as a polishing mechanism. However, the prior art device only reaches a fully implemented ice state only once when initiating the polishing movement.

As a result, once the workpiece begins to move relative to the slurry, the slurry no longer retains glazing properties, and the slurry loses its plasticized properties. Therefore, even if the slurry becomes more viscous, it will ultimately remain liquid. Thus, liquids often do not have sufficient force to reliably push submerged abrasive particles against the polishing surface, which in turn prevents the abrasive from effectively polishing the workpiece.

Moreover, the polishing of the workpiece is performed step by step. At any given time, a small surface area is polished. This area is defined as the size of the zone known as the grinding zone, which is small relative to the size of the workpiece. The workpiece is then polished from zone to zone. This approach hinders the achievement of uniform polishing across the entire surface of the workpiece. Non-uniform workpieces, such as silicon wafers, represent a potential problem in devices such as semiconductors.

An additional problem is the non-uniformity of the magnetic field, which affects the affine of the polishing zone. The magnetic field of the magnet edge is almost orders of magnitude larger than that of the magnet center. Therefore, the viscosity-plastic property of the slurry in the polishing zone is non-uniform, causing non-uniform polishing of the surface.

It is an object of the present invention to provide a polishing method and apparatus that solve the above problems.

The subject matter of the present invention is pointed out at the conclusion of the specification and is clearly claimed. However, both the organization and the method of operation together with the objects, forms and advantages of the present invention can be best understood with reference to the following detailed description when read in conjunction with the accompanying drawings.

1 is a schematic diagram of a polishing system according to an embodiment of the present invention;

FIG. 2 is a schematic illustration of certain alternative embodiments of the polishing system shown in FIG. 1;

3 is a side view of a polishing system according to an embodiment of the present invention;

FIG. 4A is a schematic diagram showing some alternative embodiment of the polishing system shown in FIG. 3;

4b shows a detail of a part of the system shown in FIG. 4a;

5 is a schematic representation of an embodiment of the polishing system shown in FIG. 3;

FIG. 6 is a schematic representation of an embodiment of the polishing system shown in FIG. 3;

FIG. 7A is a characteristic diagram of the viscosity profile of two rheological fluids, Newton and ideal Bingham, FIG.

7B is a characteristic diagram of the apparent viscosity of the ice-cold magnetic polishing fluid in the treatment of the present invention,

8A is a schematic view of a retaining plate according to an embodiment of the present invention;

8b is a schematic illustration of a workpiece according to an embodiment of the invention,

8C is a view schematically showing a holding plate according to an embodiment of the present invention;

8D is a schematic representation of a workpiece in accordance with certain embodiments of the present invention.

For simplicity and clarity of the drawings, the elements shown in the drawings are not necessarily to scale. For example, the dimensions of some devices may be emphasized over other devices for clarity. Moreover, reference numerals may be repeated in the figures to properly point to corresponding or similar elements.

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it is understood by those skilled in the art that the present invention may be practiced without these specific details. Known methods, processes, components, and circuits have not been described unless the invention is unclear.

Certain embodiments of the present invention use magnetic polishing fluid (MPF) in a novel polishing system. These embodiments provide for the use of self-flowing suspensions (MRS: magnetorheological suspension), ferrofluid (FF), abrasive powders as well as chemical corrosives, stabilizers, pH control chemicals and By combining other additives, the hardness and flexibility provided are utilized.

Referring to FIG. 1, a system 100 for polishing a planar surface, such as a silicon wafer for an ultra high density integrated circuit (ULSI) constructed and operated in accordance with certain embodiments of the present invention, is depicted.

System 100 may polish the surface of workpiece 113 via a series of intermittent impacts from plasticized pseudo-solid magnetic polishing fluid 112 (MPF). Under the influence of magnetic force, the MPF 112 acquires ice properties and thus operates in plasticized areas, rather than Newtonan areas as is done in the prior art. The tissue obtained by the MPF 112 in the plasticized area is stiff than the tissue obtained in the liquid area, and therefore the MPF 112 becomes more effective as a polishing device when plasticized). In some cases workpiece 113 may be planar, curved, or etched.

Certain embodiments of the present invention provide a higher rate of debris removal from the surface of the workpiece 113, and thus the system 100 can provide a faster polishing system than known systems. Moreover, certain embodiments of the present invention teach full planar magnetization, as compared to systems that induce point magnetization, which would require extensive repetitive cycling to sweep the entire workpiece. Therefore, in certain embodiments, the system 100 sweeps the workpiece in one cycle. The number of cycles is governed by the type or thickness of material to be removed, regardless of the size of the area to be polished, thus ensuring better surface uniformity.

System 100 may be configured with a matrix of permanent magnetic dipoles 116 that are grouped in a predetermined pattern to produce smooth flat surface A and opposing surface B. FIG. The area of the surface A may be larger than the protruding area of the workpiece 113. The flatness of the surface A may be achieved by assembly techniques and / or post assembly surface machining and lapping. Can be. The size of the matrix can be 1000x400 mm, for current size silicon wafers on the market.

The faces of the magnets 116 can be arranged in alternating directions, for example, opposite polarities (north, south, north, south, etc.) as they form the surface A. The size of each of the magnets 116 may be 20 × 20 mm, and the spacing 110 between them may be up to 5 mm, for example 0.1-0.5 mm. Magnet 116 provides a magnetic field 118 that acts on the MPF 112.

The soft iron shuttle 130 may slide across the surface B. As shown in FIG. Shuttle 130 may have a minimum width equal to the width of gap 110 plus twice the thickness of single magnet 116. The length of shuttle 130 may be equal to the longest dimension of surface B. The iron shuttle 130 slides over the surface B to suitably short or connect adjacent poles 116. A series of shorts or connections change the strength and geometry of the magnetic field 118. The steel shuttle 130 may not only move in the x or y-axis direction in the combination direction of these directions, but also alternately move in the rotation direction. The rate of change of the magnetic field 118 properties is proportional to the speed of transition of the shuttle 130.

The MPF 112 is arranged to cover the top of the surface A. Due to the magnetic field 118, the MPF 112 may acquire some specific mechanical properties. As defined by the geometry and arrangement of the magnetic field 118, the MPF 112 may have a convex staggered pattern.

MPF 112, as described in US patent application Ser. No. 09 / 563,917, has a magnetorheological substance (MRS), a ferrofluid (FF), an abrasive 119, and a stabilized etch rate and pH. It can be a combination of components for control. This combination makes it possible to obtain glacial properties under the influence of an applied magnetic field 118.

The change in intensity of the field 118 changes the state of the MPF 112 from the New Uton state to the ice state or vice versa. When MPF 112 is in an ice state, it forms a rigid porous matrix with trapped abrasive particles 119 that are pushed to the surface.

The ferrofluid is pushed through the porous rheological media due to capillary forces and concentrated in the shallow of the top surface of the MPF 112 to smooth and smooth the polishing surface. The ferrofluid exhibits a rheological behavior under the influence of the inclination of the intestine, although at a substantially lower degree than the other flowable components of the MPF 112. This slope pushes the abrasive towards the top surface of the ferrofluid.

The planar workpiece 113 may be held in a horizontal position by a rotation holder 114 (chuck) having a retaining plate 111. The retaining plate 111 may have a flat or concave surface. Holder 114 may be rotated about axis 125 in a plane parallel to surface A, as indicated by arrow 124. The holder 114, which can also move vertically, lowers the workpiece 113 to the surface of the MPF 112, thereby bringing the workpiece 113 into contact with the abrasive particles 119.

Particles 119 held at the surface of MPF 112 by the application of magnetic field 118 impact the workpiece 113, shaving off the fragments of the workpiece. The distance between the MPF 112 and the workpiece 113 surface can be adjusted by the coaxial movement of the axis 121. Thus, the workpiece is immersed in the MPF 112 or in contact with the surface of the MPF to achieve various levels of polishing parameters.

When the workpiece 113 contacts the MPF 112, the MPF loses its ice properties and liquefies. However, due to the movement of the iron shuttle 130, the magnet 116 is intermittently short-circuited, the magnetic field 118 is intermittently applied again. Then, depending on each of the reapplication of the magnetic field 118, the MPF 112 is re-plasticized and impacts the work 113 again, repeatedly cutting the planar surface of the work 113 intermittently.

The physical explanation of this phenomenon is as follows. When magnetic field 118 is applied to MPF 112, MPF 112 acquires the properties of a plasticized solid whose yield point depends on the strength of field 118. In this plasticized state, the abrasive particles 119 are effectively held on the surface of the MPF 112. However, depending on the impact applied to the workpiece 113, the shear stress of the MPF 112 exceeds the yield point and the MPF 112 liquefies. At this point the abrasive 119 is suspended in a liquid matrix with a Newton-like fluid.

Therefore, in order to provide an effective polishing treatment, the MPF 112 can be prevented from permanently crossing the yield point into a liquid state. Thus, certain embodiments of the present invention teach repetitive application of magnetic field 118. Therefore, when the plasticized ice state of the MPF collapses, the magnetic field 118 is applied again and the ice properties are restored, causing the MPF 112 to regain plasticity. Therefore, the MPF 112 obtains the hard property, and the polishing treatment becomes similar to the continuous impact of the hard mechanism on the workpiece 113 surface.

The constant regeneration of the magnetic field 118 as taught herein is compared to the continuous magnetic field application methods known in the art. In a known method, the MPF 112 acquires plasticized properties only at the beginning of the polishing cycle and returns to the liquid state and remains in accordance with the first impact applied to the workpiece 113. Therefore, the polishing treatment is a continuous mass in which the abrasive 119 is continuously submerged in a semi-liquid state.

As necessary to compensate for the projected loss of the MPF 112, the alignment of the tube 115 supplies the MPF 112, the abrasive material 119, and the chemical to the surface A. Additionally, feed tube 115 may transport chemicals to control polishing parameters (eg, removal rate, surface passivation, etc.).

In an alternative embodiment of the invention (not shown), the orientation of the magnetic dipole 116 may be unified to the North Pole, for example, with a polarity on the side facing the surface A. Then, the magnetic field slope becomes stronger, and the cutting / grinding force of the ferrofluid component of the MPF 112 depending on the workpiece 113 becomes larger. In addition, the force of the component of the main fluidity is lower. There are materials that can benefit from this polishing regime.

In addition, the steel shuttle 130 may be of various cross-sections, the distance between the shuttle 113 and the plane (B) may also be changed. Meanwhile, shuttle 130 may be a grid of pieces of paramagnetic material in a shape and arrangement similar to dipole 116.

The holder 114 may be constructed with ferromagnetic and / or paramagnetic materials to enhance magnetic field strength, thereby increasing the removal rate of fragments from the exposed surface of the workpiece 113. For example, the holding plate 111 may be a carbon-steel plate. The holder 114 may be constructed to have a permanent magnet pole or electromagnet that can be located in the holding plate 111 or alternatively can be located on the holding plate 111. As described above with respect to the magnet 116, the magnets may be positioned in alternating or consistent directions.

See FIGS. 8A-8D. 8A and 8C show an exploded view of a retainer plate according to some embodiments of the inventions. 8B and 8D show exploded views of a workpiece in accordance with certain embodiments of the present invention. The retaining plate 111 may be configured with a surface 80 that can be connected to the workpiece 113. As shown in FIG. 8A, the surface 80 may have a preset etched pattern 82. During polishing, the surface 80 may abut the workpiece 113, and a matching embossed pattern 84 may be created on the polished surface of the workpiece 113 as shown in FIG. 8B.

On the other hand, as shown in FIG. 8C, the holding plate 111 is configured with a surface 86 having a preset embossed pattern 88. In this case, as shown in FIG. 8D, a matching engraved pattern 90 can be created on the polished surface of the workpiece 113 during polishing.

In certain embodiments of the invention, the retainer plate 111 may be configured with a surface having a preset inlaid pattern. When the magnetic permeability of the inlaid material is higher than the magnetic permeability of the remaining surface, a matching carved pattern is created on the exposed surface of the workpiece 113 during polishing. When the magnetic permeability of the inlaid material is lower than the magnetic permeability of the remaining surface, a matching embossed pattern is created on the exposed surface of the workpiece 113 during polishing.

The physical explanation of this phenomenon is as follows. In areas with low magnetic permeability, such as engraved area 82, the local magnetic field strength is lower than the local magnetic field strength around the surface. As a result, less abrasive particles of the MPE 112 are pushed up to the area just below the engraved area 82, so that the MPF softens. Therefore, less material can be removed from the workpiece 113 during polishing to create an embossed pattern.

In regions with higher magnetic permeability, such as embossed region 88, the local magnetic field strength becomes higher than the local magnetic field strength around the surface. As a result, more particles of the MPF 112 are pushed up to the area just below the engraved area 82, and the MPF becomes harder. Therefore, more material can be removed from the workpiece 113 during polishing, resulting in a carved pattern.

2, a polishing system 200 is shown in accordance with certain embodiments of the present invention. The same reference numerals are given to the same parts as the elements depicted in Fig. 1, and the description is omitted.

Similar to system 100 where magnetic force 118 is supplied by magnet 116, the force in system 200 may be supplied by a matrix of electromagnets 216. The pulse generation unit 230 may supply an intermittent current to the electromagnet 216. Pulse train sequence, duty cycle, amplitude and polarity can be controlled. The current may be a pulse between a predetermined two values, preferably between a small "hold current" value of ˜0.2 A and a peak value. The pulse of current for a given magnet 116 in turn generates a pulse in the magnetic field 118 and transitions the MPF 112 from the liquid state to the ice state as described above.

The ferromagnetic component of the MPF 112 may be injected during the “off” portion of the pulse train via the tube 115 as described above.

In order to compensate for heat radiation resulting in copper loss, a matrix of electromagnets 216 is immersed in a transformer oil that "prises" heat primarily through a liquid coolant, such as a heat exchanger (not shown).

In this embodiment, and in comparison with the system 100, the direction of the magnetic dipole 116 is not fixed and thus mediates the pulse generation unit 230 which can be controlled by the polar field of the same or alternating directional pattern. Can be obtained as This makes it possible to tolerate a strong magnetic field that enhances the polishing force or a weak magnetic field that allows more accurate use of the polishing process, or both at various locations.

In all embodiments described with reference to FIGS. 1 and 2, the reciprocating motion of plane A is made possible in addition to or in place of the motion of workpiece 113.

3, a polishing system 300 is shown in accordance with certain embodiments of the present invention. In the same elements, the same reference numerals are given, and the description thereof is omitted.

System 300 may be configured with a cylinder 310 having a plurality of elongated magnets 316 embedded along its outer periphery. The cylinder 310 preferably has a radius R, rotates along its longitudinal axis, and is longer than the working dimension of the workpiece 113.

The magnet 316 is flush with the outer surface of the cylinder 310 or alternatively protrudes from the surface of the cylinder 310. In addition, the magnets 316 are magnetized in the radial direction and arranged in the same pole with respect to the outer side, or alternatively are arranged with poles alternate with respect to the outer side.

The cylinder 310 is lowered horizontally into a container (not shown) so that the cylinder 310 contacts the MPF 112. The cylinder 310 is located adjacent to the trimmer 311 which is a trimming device by mechanical means provided for their relative controllable position. Trimmer 311 controls the MPF thickness on the magnetic pole by cutting off excess or refilling the depleted amount. The rotary chuck 114 holds the workpiece 113 at a distance E on the surface of the cylinder 310.

Magnet 316 generates magnetic field 118, which acts on MPF 112 to shape and solidify MPF 112 into a plasticized system of periodic ridges or valleys. Mockup is higher than distance (E). Plasticization of the MPF 112 pushes abrasive particles around the outside of the MPF 112 to cover the valleys as well as the ridges.

The cylinder 310 is rotated with respect to the workpiece 113, causing a semi-solid gyrus of the MPF 112 with abrasive particles covered thereon, causing a periodic impact on the workpiece 113 surface. With each impact, the chip of the workpiece 113 is shaved, whereby a polishing action is performed. The removal rate of material from the workpiece 113 can be controlled by controlling the rotational speed and distance E for the given properties of the MPF 112 and the magnet 316.

Note that at each time the semi-solid MPF 112 impinges on the surface of the workpiece 113 to liquefy the MPF 112. By the way, in general, in the instantaneous impact, the stress is removed by contact loss, and the MPF 112 is plasticized again and ready for another impact on the workpiece 113.

4A and 4B illustrate alternative cylinders 410 and 510 that can be used in the polishing system 300. Elements similar to those depicted in the figures are given the same reference numerals, and detailed description thereof will be omitted.

Cylinder 410 is configured with an alignment of tubes 411 positioned between dipoles 316. Tube 411 includes the supply of MPF 112 and is hidden from the outer surface of the cylinder as needed. On the other hand, the tube 411 may also include the supply of chemical and abrasive components.

The cylinder 510 is configured with a magnetic dipole 516 located along the longitudinal axis of the cylinder 510. Magnetic dipole 516 is in a spiral pattern. In addition, the magnet may protrude from the surface of the cylinder.

In alternative cylinders (not shown), each dipole 316 may be constructed with thin, long magnetic masses in alternating polar arrangements. These poles of the combined magnets can be grouped in a cassette inserted into the cylinder as interchangeable units. On the other hand, the cylinder surface (including the pole of the magnet) is covered with a wire mesh of fine gauge wire of 0.1 mm to 0.5 mm thickness, or preferably a thin laminated metal of 0.5 mm to 1 mm thickness. Can be covered with a wool blanket (not shown). Wire mesh or metal-wool blankets can be made of ferromagnetic material. Moreover, the cylinder surface may be covered with mesh-wires, laminated or porous non-metallic materials. The cylinder outer surface may be shaped or profiled.

With reference to FIG. 5, an alternative cylinder 610 that is operated and constructed in accordance with certain embodiments of the present invention is shown. Like elements depicted in the figures are denoted by like reference numerals and description thereof will be omitted.

The cylinder 610 has a ferromagnetic mandrel 550 (mendrel) coaxially injected into the center of the cylinder 610. The outer diameter of the mandrel 550 is in contact with the embedded pole of the magnet 316. The magnet 316 passes over the ferromagnetic portion of the mandrel 550, causing a change in magnetic field strength therein, and enhancing the phenomenon of magnetic-fluidity in the applicable position.

With reference to FIG. 6, another cylinder according to an embodiment of the invention is shown. Similar elements depicted in the figures are given the same reference numerals and detailed descriptions are omitted.

The polishing cylinder 710 is configured with an alignment of the electromagnets 611, which is very similar to the rotor of the electric DC motor.

The current is supplied through the rotor 613 by the brush 614, or preferably through the rotor 613 by a brushless arrangement, such as an alternator of an automobile. The power source unit 631 supplies a current to the rotor 613 through an electromagnet to be supplied and a current control unit 632 that selects sequence amplitude and polarity.

This arrangement allows for the control of the polishing force, for example the direction of the magnetic dipole 611, and a weak magnetic field that allows for a more accurate use of the polishing process or a strong magnetic field that enhances the polishing force as described with reference to FIG. 2 above. Allow.

This arrangement also provides for enhanced magnetic phenomena of the MPF 112 at applicable locations and simultaneously provides for removal of the MPF 112 from other locations for recycling, cleaning, or remixing. Can be. Often, it is necessary to remove the MPF 112 frequently to replace the MPF for other types of fluids more suitable for the task, to clean the pawls and cylinders for maintenance, or for other reasons. In addition, it is sometimes desirable to change the chemical / physical properties of the MPF 112 by being mixed again in a mixer with other additives, and again being applied to the cylinder. Removal is difficult due to the magnetic force acting. The electrical coil can be switched off, so that the MPF can be easily removed by removing the magnetic pushing force on the MPF. There is no advantage in permanent magnets.

Referring to FIG. 7A, the characteristic curves of the viscosity of the two fluids, the non-flowable with the Newtonian profile and the flowable with the ice profile, are shown. The mathematical model of the two fluids is as follows:

New Uton:

Ice box plastic:

here, = Shear stress,

= Static yield value of shear stress,

= Shear rate,

= Viscosity constant,

= Coefficient of viscosity beyond the yield point.

Shear stress is the force required to move a unit region of fluid and maintain unit flow. Shear stress is measured in N / m ² . The shear rate is the speed of movement of the fluid in a given plane relative to the reference plane divided by the distance between the fluids. The unit of shear rate is (m / sec) / m or SEC ⁻¹ . Viscosity is the ratio of shear stress to shear rate. As a result, the CGS unit is (N × sec) / m ² or poise (dyne-sec / centimeter).

For most fluids, the viscosity is not constant and varies with shear rate. This fluid depends on the shear rate. In certain systems, shear rate and shear stress are directly proportional. Such fluids have a constant viscosity and are called Newtonian fluids. Water and oil are examples of Newtonian fluids.

Some fluids have some critical shear stress that must be overcome before flow can begin. This critical shear stress is called the "yield value". After crossing the yield value, if the fluid exhibits the flow characteristics of Newton, the fluid is called "Bingham Plastic fluid".

In view of the above definition, the viscosity (as depicted in FIG. 7A) is represented by the slope angle of the curve. Newton's curve, indicated by reference numeral 702, is straight, thereby maintaining a constant viscosity at all temperatures and pressures.

The ideal ice plastic fluid curve, indicated at 704, shows two consecutive portions, the vertical line (pointed at 706) from the axis at which the shear stress axis begins, to the yield value, and Newton's curve 702. It is made up of similar diagonal lines (indicated by reference numeral 708).

Vertical portion 706 represents a high viscosity value or a solid-like state of material to infinity of the fluid. Applying a force to cross the yield value results in a significant drop in viscosity (diagonal portion 708) to the area of Newton's fluid. In the polishing process using MPF, it is highly desirable to stay in the region of infinite viscosity (vertical portion 706) as much as possible, as it ensures very high removal rate and uniformity.

The shear rate caused by the polishing process shifts the ice fluid into the low viscosity region (part 708). In the present invention, when this occurs, by removing the working magnetic field or temporarily removing the fluid from the polishing process, the portion of the fluid undergoing this transition is prevented from being exposed at the shear rate of polishing. Then, due to the recovery of the magnetic field, the fluid regains its very high viscosity and is applied again to the polishing treatment.

The apparent viscosity of the glazing magnetic polishing fluid in the treatment is shown in FIG. 7B. At each time point 711 the viscosity is high so the magnetic field is applied again or the shear stress is removed, and at each time point 712 the shear stress crosses the yield value and the viscosity drops.

Although certain aspects of the present invention have been described herein, those skilled in the art can create various modifications, substitutions, changes, and equivalent configurations. Therefore, it is to be understood that the appended claims cover all such modifications and variations without departing from the true spirit of the invention.

As described above, according to the present invention, there is an effect that a polishing method and an apparatus are obtained.

Claims (55)

With abrasive materials, And at least one magnetic means in contact with the abrasive material to actuate and plasticize the abrasive material so that the plasticized material is used to polish the surface. The surface polishing system of claim 1, wherein the abrasive material is in intermittent repeated contact with the surface for polishing. The surface polishing system of claim 1, comprising means for intermittently magnetizing the one or more magnetic means. The surface polishing system of claim 1, wherein the at least one magnetic means is at least one permanent magnet. 5. A surface polishing system according to claim 4, wherein the permanent magnets are positioned in alternating directions. 4. A surface polishing system according to claim 3, wherein the means for intermittently magnetizing are shuttles intermittently acting on the at least one magnetic means and providing a magnetic field when the magnetic means acts. The surface polishing system according to claim 1, wherein said at least one magnetic means is at least one electromagnet. 8. A surface polishing system according to claim 7, wherein said at least one electromagnet is driven by alternating current (AC). Further comprising a cylinder, wherein the one or more magnetic means are placed along the longitudinal axis of the cylinder such that the cylinder can be rotated along the longitudinal axis, wherein the plasticized material covers the cylinder. Surface polishing system, characterized in that. 10. The surface polishing system as recited in claim 9, wherein said at least one magnetic means is flush with the outer surface of said cylinder. 10. The surface polishing system as recited in claim 9, wherein said at least one magnetic means protrudes from an outer surface of said cylinder. 10. The surface polishing system as recited in claim 9, wherein said at least one magnetic means is recessed at an outer surface of said cylinder. 10. The surface polishing system of claim 9, further comprising a container holding a pool of abrasive material, the bottom of the cylinder seated in the pool. 10. The surface polishing system of claim 9, further comprising an alignment of the tube comprising a supply of the abrasive material to hide the alignment of the tube onto the outer surface of the cylinder. 10. The surface polishing system according to claim 9, further comprising a trimmer. 10. The surface polishing system as recited in claim 9, wherein said magnetic means has a swirl pattern. The surface polishing system according to claim 9, further comprising a wire mesh covering the cylinder. 10. The surface polishing system of claim 9, further comprising a metal-wool blanket covering the cylinder. 19. The surface polishing system as recited in claim 18, wherein said blanket comprises a ferromagnetic material. 19. The surface polishing system as recited in claim 18, wherein said blanket comprises a non-metallic material. 10. The cylinder of claim 9, wherein the cylinder further comprises a ferromagnetic mandrel inserted coaxially into the center of the cylinder, the outer surface of the mandrel being in contact with the magnetic means such that the magnetic means is in accordance with the contact. Surface polishing system, characterized in that to provide. The surface polishing system of claim 1, wherein the surface is a silicon wafer. The surface polishing system of claim 1, wherein the surface is a planar surface. The surface polishing system of claim 1, wherein the surface is a curved surface. 10. The surface polishing system according to claim 9, wherein the cylinder is configured with an alignment of the electromagnets. Plasticizing the abrasive material by bringing magnetic means into contact with the abrasive material; Contacting a surface with said plasticized abrasive material, Liquefying the plasticized abrasive material in accordance with the contact with the surface, After completion of said contact with said surface, plasticizing said liquefied abrasive material again; And repeating all the steps a plurality of times until the surface is polished. 27. The method of claim 26, wherein plasticizing comprises making the abrasive material obtain ice properties. 27. The method of claim 26, wherein the liquefaction comprises making the abrasive material obtain the properties of Newton. Bringing the magnetic means into contact with the abrasive material, Intermittently magnetizing the magnetizing means such that the abrasive material is plasticized; And repeating the step of intermittently magnetizing the magnetizing means several times until the surface is polished. 30. The method of claim 29, wherein said step of intermittently magnetizing said magnetic means comprises moving a steel shuttle adjacent said magnetic means. 30. The method of claim 29, wherein said step of intermittently magnetizing said magnetic means comprises providing an intermittent current to said means. With abrasive materials, One or more magnetic units capable of generating a magnetic field that causes the abrasive material to be plasticized, and which enables the plasticized material to polish the surface of the workpiece, and And a holder with a retaining plate capable of holding the other surface of the workpiece. 33. The polishing system of claim 32, wherein said holder comprises a ferromagnetic material. 33. The polishing system of claim 32, wherein said holder is comprised of a paramagnetic material. 33. The polishing system of claim 32, wherein one or more magnets are located in the retaining plate. 36. The polishing system of claim 35, wherein said magnets are positioned in alternating directions. 33. The polishing system of claim 32, further comprising one or more magnets positioned over the retaining plate. 38. The polishing system of claim 37, wherein said magnets are positioned in alternating directions. 33. The polishing system of claim 32, wherein the surface of the retaining plate is configured with a predetermined etched pattern such that a matching embossed pattern is created on the surface of the workpiece during polishing. 33. The polishing system of claim 32, wherein the surface of the retaining plate is configured with a preset embossed pattern such that a matching carved pattern is created on the surface of the workpiece during polishing. 33. The polishing system of claim 32, wherein the surface of the retaining plate is configured with a preset inlaid pattern such that a matching pattern is generated on the surface of the workpiece during polishing. 42. The method of claim 41, wherein the surface of the retaining plate is configured with a first material having a first magnetic permeability, and wherein the wound pattern comprises a second material with a second magnetic permeability. Polishing system. 43. The polishing system according to claim 42, wherein the second magnetic permeability is higher than the first magnetic permeability so that the matching pattern is a carved pattern. 43. The polishing system according to claim 42, wherein the second magnetic permeability is lower than the first magnetic permeability so that the matching pattern is an embossed pattern. 33. The polishing system of claim 32, wherein the abrasive material is in intermittent repeated contact with the surface of the workpiece for polishing. 33. The polishing system of claim 32, comprising means for intermittently magnetizing said at least one magnetic unit. 33. The polishing system of claim 32, wherein said workpiece is a silicon wafer. 33. The polishing system of claim 32, wherein said surface of said workpiece is planar. 33. The polishing system of claim 32, wherein the surface of the workpiece is curved. During the self-flowing polishing of the surface, engraving a predefined pattern of the surface. Embossing a predefined pattern of the surface during self-flowing polishing of the surface. Generating a magnetic field sufficient to plasticize the liquefied abrasive material, Polishing the surface of the workpiece with the plasticized abrasive material, thereby liquefying the plasticized abrasive material; And repeating the above steps. 53. The method of claim 52, wherein generating the magnetic field comprises providing an intermittent or alternating current through one or more electromagnets. 53. The method of claim 52, wherein generating the magnetic field comprises moving a ferromagnetic shuttle under one or more magnets. 53. The method of claim 52, wherein generating the magnetic field comprises moving a discontinuous array of permanent magnets with respect to the workpiece.