KR20030038143A - Manufacturing method of E0 grade Melamine-Urea-Formaldehyde Resin(MUF) and adhesive for medium density fiber board by use of MDF Resin - Google Patents
Manufacturing method of E0 grade Melamine-Urea-Formaldehyde Resin(MUF) and adhesive for medium density fiber board by use of MDF Resin Download PDFInfo
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- KR20030038143A KR20030038143A KR1020010069570A KR20010069570A KR20030038143A KR 20030038143 A KR20030038143 A KR 20030038143A KR 1020010069570 A KR1020010069570 A KR 1020010069570A KR 20010069570 A KR20010069570 A KR 20010069570A KR 20030038143 A KR20030038143 A KR 20030038143A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G12/00—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08G12/02—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes
- C08G12/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08G12/34—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds and acyclic or carbocyclic compounds
- C08G12/36—Ureas; Thioureas
- C08G12/38—Ureas; Thioureas and melamines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
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Abstract
Description
본 발명은 멜라민-요소-포름알데히드 수지의 제조방법과 이를 이용한 중밀도 섬유판용 접착제에 관한 것으로서, 더욱 상세하게는 포름알데히드와 요소를 다단계 중합공정에 의해 축중합할 때 각 중합공정에서 포름알데히드/(아미노기)의 몰비를 특정범위로 한정하고 숙성공정을 거쳐 멜라민-요소-포름알데히드 수지를 제조함으로써 수지내 미반응 포름알데히드의 양을 획기적으로 낮추고, 중밀도 섬유판(Medium density fiberboard, MDF) 제조시 접착제로 상기 수지와 EMDI(Emulsifiable methylen diphenyl diisocyanate) 및 이형제를 적정량 혼합 사용함으로써 제조된 MDF의 포름알데히드 방출량을 현저히 감소시키고, MDF의 물리적 성질 또한 우수하게 개선시킨 중밀도 섬유판용 접착제에 관한 것이다.The present invention relates to a method for preparing melamine-urea-formaldehyde resin, and an adhesive for medium-density fiberboard using the same, and more particularly, to formaldehyde / urea in each polymerization step when condensation of formaldehyde and urea by a multi-step polymerization step. By limiting the molar ratio of (amino group) to a specific range and producing a melamine-urea-formaldehyde resin through a aging process, the amount of unreacted formaldehyde in the resin is drastically reduced, and during the manufacture of medium density fiberboard (MDF) The present invention relates to an adhesive for medium-density fiberboard which significantly reduces the formaldehyde emission of the MDF prepared by using an appropriate amount of the resin, EMDI (Emulsifiable methylen diphenyl diisocyanate) and a release agent as an adhesive, and also improves the physical properties of the MDF.
중밀도 섬유판(medium density fiberboard)은 목질재료를 주원료로 하여 고온에서 해섬하여 얻은 목섬유(Wood Fiber)를 합성수지 접착제로 결합시켜 성형, 열압하여 만든 밀도 0.4 ∼ 0.8 g/cm3의 목질판상 제품이며 3.0 mm에서 30 mm 두께까지 생산이 가능하다. 전 두께에 걸쳐 섬유분배가 균일하고 조직이 치밀하여 복잡한 기계가공작업을 면이나 측면의 파열없이 수행할 수 있다. 따라서 MDF는 측면 모울딩이나 표면가공을 하는 테이블 상판, 문짝, 서랍정면 등에 사용된다. 또한 면이 평활하고 견고하며 장식용필름이나 베니어 등을 오버레이 하거나 페인팅 하는데에도 매우 적합하다. 뛰어난 안정성과 기계가공성, 높은 강도 때문에 서랍측면이나 케비넷레일, 거울틀, 모울딩 등에 일반목재 대신 사용할 수 있다.Medium density fiberboard is a wood plate product with a density of 0.4 ~ 0.8 g / cm 3 made by combining and molding the wood fiber obtained by dissolving at high temperature with wood as the main raw material with a synthetic resin adhesive. Production from mm to 30 mm thick is possible. Uniform fiber distribution and dense texture over the entire thickness allows complex machining operations to be performed without rupture of the face or sides. MDF is therefore used for table tops, doors, and drawer fronts with side moldings or surface finishes. It is also smooth and firm on the surface and is ideal for overlaying or painting decorative films or veneers. Its excellent stability, machinability and high strength make it an alternative to ordinary wood for drawers, cabinet rails, mirror frames and moldings.
이러한 MDF 제조에 사용하는 접착제로는 요소-포름알데히드 수지(urea-formaldehyde resin) 또는 멜라민-요소-포름알데히드 수지(urea-melamine-formaldehyde resin) 등이 널리 사용되고 있다. 그러나 상기 접착제로 MDF를 생산시 열압공정에서 수지가 경화될 때 포름알데히드가 발생하며, 이 포름알데히드 가스는 환경 및 인체에 유해하며, 특히 인체의 눈과 점막에 심한 자극을 준다.As the adhesive for use in manufacturing MDF, urea-formaldehyde resin or melamine-urea-formaldehyde resin is widely used. However, formaldehyde is generated when the resin is cured in the thermocompression process when producing the MDF with the adhesive, and the formaldehyde gas is harmful to the environment and the human body, and in particular, severely irritates the eyes and mucous membranes of the human body.
따라서, 이러한 포름알데히드 방출량을 줄이기 위해 목재패널업계에서 현재까지 많은 노력이 있어왔으며, 이런 포름알데히드 방출량을 줄이기 위한 공지된 기술로는 미국특허 제 4,997,905호가 있다. 상기 미국특허 제 4,997,905호에서는 멜라민-요소-포름알데히드 수지의 제조시 멜라민 투입량을 2 ∼ 6% 정도로 수지를 제조하여 저포름알데히드 보드를 생산할 수 있도록 되어 있으나 축합반응 이후의 요소 후첨량이 과도하여 보드의 물성이 현저히 떨어지고 박판의 경우 수포 및 생산성 저하를 유발하여 제조공정에서는 경제성이 떨어져 사용하기가 어려운 문제가 있다.Thus, much effort has been made in the wood panel industry to date to reduce such formaldehyde emissions, and US Pat. No. 4,997,905 is a known technique for reducing such formaldehyde emissions. The U.S. Patent No. 4,997,905 describes the production of melamine-urea-formaldehyde resin by producing melamine in an amount of about 2 to 6% to produce a low formaldehyde board, but the amount of urea post-condensation after condensation reaction is excessive. There is a problem that the physical properties are remarkably inferior and in the case of a thin plate causes blistering and productivity decrease, so it is difficult to use economically in the manufacturing process.
또한 상기와 같은 접착제를 사용하여 E1급(포름알데히드 방출량: 1.5 mg/l 미만) MDF를 생산하였으나 아직도 포름알데히드가 발생하는 문제가 있고, 상기 접착제를 사용하여 E0급(포름알데히드 방출량: 0.5 mg/l 미만) MDF 생산에 이용하면 보드 물성 저하 및 공정 이상이 발생하는 문제점이 있어왔다.In addition, E1 grade (formaldehyde emission amount: less than 1.5 mg / l) MDF was produced using the above adhesive, but there is still a problem that formaldehyde occurs, using the adhesive E0 (formaldehyde emission amount: 0.5 mg / Less than l) When used in the production of MDF has been a problem that the board properties are degraded and process abnormalities occur.
이에, 본 발명자들은 상기와 같은 문제점을 해결하기 위하여 포름알데히드와 요소를 다단계 중합공정에 의해 축중합할 때 각 중합공정에서 포름알데히드/(아미노기)의 몰비를 특정범위로 한정하고 숙성공정을 거쳐 멜라민-요소-포름알데히드 수지를 제조함으로써 수지내 미반응 포름알데히드의 양을 획기적으로 낮추고, 중밀도 섬유판(Medium density fiberboard, MDF) 제조시 접착제로 상기 수지와 EMDI(Emulsifiable methylen diphenyl diisocyanate) 및 이형제를 적정량 혼합 사용함으로써 본 발명을 완성하였다.Thus, the present inventors condensed formaldehyde and urea in a multistage polymerization process in order to solve the above problems, by limiting the molar ratio of formaldehyde / (amino group) to a specific range in each polymerization process and through the aging process melamine Significantly lowered the amount of unreacted formaldehyde in the resin by preparing urea-formaldehyde resin, and an appropriate amount of the resin, emulsifiable methylen diphenyl diisocyanate (EMDI), and a release agent as an adhesive when preparing a medium density fiberboard (MDF). By using the mixture, the present invention has been completed.
따라서 본 발명은 MDF의 포름알데히드 방출량을 현저히 감소시키고, MDF의 물리적 성질 또한 우수하게 개선시킨 멜라민-요소-포름알데히드 수지의 제조방법과 이를 이용한 중밀도 섬유판용 접착제를 제공하는데 그 목적이 있다.Accordingly, an object of the present invention is to provide a method for preparing melamine-urea-formaldehyde resin which significantly reduces the formaldehyde emission of MDF and excellently improves the physical properties of MDF, and an adhesive for medium density fiberboard using the same.
본 발명은 멜라민, 요소 및 포름알데히드 단량체를 축중합하여 멜라민-요소-포름알데히드 수지를 제조하는 방법에 있어서,The present invention provides a method for producing a melamine-urea-formaldehyde resin by polycondensing melamine, urea and formaldehyde monomers,
1) pH 7.3 ∼ 9.0에서 포름알데히드/(아미노기)의 몰비 1.3 ∼ 2.2, 멜라민 0 ∼ 10 중량%을 각각 투입한 다음 80 ∼ 95 ℃에서 축중합하는 공정;1) a step in which a molar ratio of formaldehyde / (amino group) of 1.3 to 2.2 and melamine 0 to 10 wt% are added at pH 7.3 to 9.0, followed by condensation polymerization at 80 to 95 ° C;
2) 상기 반응물에 포름알데히드/(아미노기)의 몰비 0.75 ∼ 0.9로 요소를 첨가하여 pH 6.6 ∼ 7.8, 중합온도 80 ∼ 95 ℃에서 축중합하는 공정;2) condensation polymerization of the reaction product at a molar ratio of formaldehyde / (amino group) at 0.75 to 0.9 with urea at a pH of 6.6 to 7.8 and a polymerization temperature of 80 to 95 ° C;
3) 상기 반응물에 산성촉매를 첨가하여 pH 4.0 ∼ 6.8로 산반응시키는 공정;3) adding an acid catalyst to the reactants to acid reaction at pH 4.0 to 6.8;
4) 상기 반응물에 알카리 촉매를 첨가하여 pH 6.0 ∼ 8.0으로 중화시키는 공정;4) adding an alkali catalyst to the reaction to neutralize to pH 6.0 ~ 8.0;
5) 상기 반응물에 포름알데히드/(아미노기)의 몰비 0.53 ∼ 0.62로 요소를 첨가하여 축중합하는 공정;5) condensation-polymerizing by adding urea at a molar ratio of formaldehyde / (amino group) of 0.53 to 0.62 to the reactant;
6) 상기 반응물에 포름알데히드/(아미노기)의 몰비 0.38 ∼ 0.46로 요소를 첨가하여 축중합시킨 후 1 ∼ 6시간 숙성시키는 공정;6) a step of condensation polymerization of urea at a molar ratio of 0.38 to 0.46 of formaldehyde / (amino group) to the reaction product followed by aging for 1 to 6 hours;
으로 이루어진 멜라민-요소-포름알데히드 수지의 제조방법을 그 특징으로 한다.It characterized by a method for producing a melamine-urea-formaldehyde resin consisting of.
본 발명은 상기 방법에 따른 멜라민-요소-포름알데히드 수지 70 ∼ 99 중량%, EMDI 1 ∼ 20 중량% 및 이형제 0 ∼ 10 중량%가 포함된 중밀도 섬유판용 접착제를 또 다른 특징으로 한다.The present invention is further characterized by an adhesive for medium density fiberboard comprising 70 to 99% by weight of melamine-urea-formaldehyde resin, 1 to 20% by weight of EMDI and 0 to 10% by weight of release agent.
이와같은 본 발명을 더욱 상세히 설명하면 다음과 같다.Referring to the present invention in more detail as follows.
본 발명은 MDF 제조시 접착제로 사용하는 멜라민-요소-포름알데히드 수지내 미반응 포름알데히드 잔량을 최소화하기 위하여 F/(NH2)의 몰비를 1:0.38 ∼ 0.46로낮추어 E0급 MDF용 수지를 제조하고, 이를 이용하여 중밀도 섬유판(Medium density fiberboard, MDF)을 제조시 접착제로 상기 수지와 EMDI(Emulsifiable methylen diphenyl diisocyanate) 및 이형제를 적정량 혼합사용함으로써 제조된 MDF의 포름알데히드 방출량을 현저히 감소시키고, MDF의 물리적 성질 또한 우수하게 개선시킨 중밀도 섬유판용 접착제에 관한 것이다.In order to minimize the amount of unreacted formaldehyde in the melamine-urea-formaldehyde resin used as an adhesive in the manufacture of MDF, the present invention reduces the molar ratio of F / (NH 2 ) from 1: 0.38 to 0.46 to produce an E0 grade MDF resin. When using this, a medium density fiberboard (MDF) is produced by using an appropriate amount of the resin, EMDI (Emulsifiable methylen diphenyl diisocyanate) and a release agent mixed with an appropriate amount of adhesive to significantly reduce the formaldehyde emission of the prepared MDF, MDF It also relates to an adhesive for medium density fiber boards with excellent physical properties.
본 발명에 따른 E0급 멜라민-요소-포름알데히드 수지의 제조방법을 각 공정별로 보다 상세히 설명하면 다음과 같다.The preparation method of the E0 melamine-urea-formaldehyde resin according to the present invention will be described in more detail for each process as follows.
우선, 제 1 공정은 pH 7.3 ∼ 9.0에서 포름알데히드/(아미노기)의 몰비 1.3 ∼ 2.2, 멜라민 0 ∼ 10 중량%을 각각 투입한 다음 80 ∼ 95 ℃에서 축중합하는 공정으로, 50 ∼ 70분 동안 반응을 시키고, pH 조정제로 NaOH, KOH, Na2CO₃등을 사용한다. 상기 포름알데히드/(아미노기)의 몰비가 1.3 미만이면 멜라민, 요소와 포름알데히드의 메틸올 반응에서 반응성이 떨어지는 모노메틸올 요소(monomethylol urea, 이하 MMU라 한다)가 주로 생성되어 몰비 1.3 이상에서 생성되는 다이메틸올 요소(dimethylol urea, 이하 DMU라 한다)가 소량 생성됨으로 인하여 수지의 반응성이 전반적으로 떨어져 저포름알데히드 수지의 특징인 경화시간 지연 현상으로 인하여 제품의 생산성이 떨어지는 문제가 있고, 2.2를 초과하면 포름알데히드기와 반응 할 수 있는 아미노기의 농도가 적어 반응에 참여하는 포름알데히드가 충분한 반응을 하지 못하는 문제가 있다. 또한, pH가 7.3 미만이면 반응중 발생하는 수소이온에 의해 pH값이 감소하여 메틸올 반응과 메틸렌 반응이 동시에 진행되어 반응의조절이 어렵게 되는 문제가 있고, pH가 9.0을 초과하면 축중합반응이 어렵게 되어 수지가 제대로 생성되지 못하는 문제가 있다.First, the first step is a step of adding a formaldehyde / (amino group) molar ratio of 1.3 to 2.2 and melamine 0 to 10% by weight at pH 7.3 to 9.0 and then polycondensation at 80 to 95 ℃, for 50 to 70 minutes The reaction is carried out using NaOH, KOH, Na 2 CO₃ and the like as the pH adjuster. When the molar ratio of formaldehyde / (amino group) is less than 1.3, monomethylol urea (monomethylol urea, hereinafter referred to as MMU) which is less reactive in the methylol reaction of melamine, urea and formaldehyde is mainly produced, resulting in a molar ratio of 1.3 or higher. Due to the small amount of dimethylol urea (hereinafter referred to as DMU), the productivity of the product decreases due to the delay in curing time, which is a characteristic of low formaldehyde resin, due to the low reactivity of the resin. When the concentration of the amino group capable of reacting with the formaldehyde group is small, there is a problem that formaldehyde participating in the reaction does not react sufficiently. In addition, if the pH is less than 7.3, the pH value is reduced by the hydrogen ions generated during the reaction, the methylol reaction and the methylene reaction proceeds at the same time, it is difficult to control the reaction, if the pH exceeds 9.0 condensation polymerization reaction There is a problem that the resin is difficult to produce properly.
제 2 공정은 상기 반응물에 포름알데히드/(아미노기)의 몰비 0.75 ∼ 0.9로 요소를 첨가하여 pH 6.8 ∼ 7.8, 중합온도 80 ∼ 95 ℃에서 축중합하는 공정으로, 수지내 포름알데히드의 잔류량을 감소시기키 위해 요소를 추가적으로 첨가하여 제 1 공정의 축중합반응에 이어서 반응을 계속 수행한다. 만일, 상기 포름알데히드/(아미노기)의 몰비가 0.75 미만이면 제 2 공정의 축중합 반응에서 저분자의 폴리머가 형성되어 보드의 물성이 현저히 떨어지는 문제가 있고, 0.9를 초과하면 반응에 참여 하지 않은 포름알데히드 잔량이 증가하여 보드의 포름알데히드 방출량이 증가되어 E0급 제품을 생산하기가 어렵다. 또한, pH가 6.8 미만이면 반응중 발생하는 수소이온에 의해 pH값이 감소하여 반응공정의 조절이 어렵게 되는 문제가 있고, pH가 7.8을 초과하면 축중합반응이 어렵게 되어 수지가 제대로 생성되지 못하는 문제가 있다.The second step is the step of condensation polymerization at pH 6.8 to 7.8 and polymerization temperature of 80 to 95 ° C by adding urea with a molar ratio of 0.75-0.9 to formaldehyde / (amino group) to the reactant, and reducing the residual amount of formaldehyde in the resin. Additional components of urea are added to continue the reaction following the polycondensation reaction of the first process. If the molar ratio of formaldehyde / (amino group) is less than 0.75, low molecular polymers are formed in the polycondensation reaction of the second step, so that the physical properties of the board are significantly decreased. As the remaining amount increases, formaldehyde emission from board increases, making it difficult to produce E0 products. In addition, when the pH is less than 6.8, there is a problem in that the pH value is reduced by the hydrogen ions generated during the reaction, making it difficult to control the reaction process, and when the pH exceeds 7.8, the polycondensation reaction becomes difficult, so that the resin is not properly produced. There is.
제 3 공정은 상기 반응물에 산성 촉매를 첨가하여 pH 4.0 ∼ 6.8로 산반응시키는 공정으로, 제 2 공정까지 생성된 MMU, DMU를 축중합하여 접착성능을 향상시키기 위한 공정으로, 산성 촉매로 개미산, 인산, 빙초산 등을 사용한다.The third step is to add acidic catalyst to the reactant to acid reaction at pH 4.0 to 6.8, and to improve adhesion performance by condensation of MMU and DMU produced up to the second step, formic acid and phosphoric acid as acidic catalyst. , Glacial acetic acid, and the like.
제 4 공정은 상기 반응물에 알카리 촉매를 첨가하여 pH 6.0 ∼ 8.0으로 중화시키는 공정으로, 축합 반응에서 만들어진 고분자의 지속적인 반응을 중단하여 적절한 분자량을 유지하도록 하기 위한 공정으로, 알카리 촉매로 NaOH, KOH, Na2CO₃등을 사용한다.The fourth step is to add an alkali catalyst to the reactant to neutralize the pH to 6.0 to 8.0. The fourth step is to stop the continuous reaction of the polymer produced in the condensation reaction and to maintain an appropriate molecular weight. The alkali catalyst is NaOH, KOH, Na 2 CO₃ or the like is used.
제 5 공정은 상기 반응물에 포름알데히드/(아미노기)의 몰비 0.53 ∼ 0.62로 요소를 첨가하여 축중합하는 공정으로, 수지내 포름알데히드의 잔류량을 감소시기키 위해 요소를 추가적으로 첨가하여 축중합반응을 계속 수행한다. 만일, 상기 포름알데히드/(아미노기)의 몰비가 0.53 미만이면 요소가 과량으로 존재하게 되고 이로 인하여 산반응후 잔류된 포름알데히드와 반응하지 못하고 남은 요소의 잔량이 증가하고 경화성이 떨어지는 문제가 있고, 0.62를 초과하면 미반응 포름알데히드가 과량 발생하여 보드 제조시 포름알데히드 방출량이 증가하는 경향을 보이는 문제가 있다. 상기 공정에서 수지의 경화시간을 단축하기 위하여 경화촉진제를 첨가할 수도 있다.The fifth step is a step of condensation polymerization of urea by adding formaldehyde / (amino group) at a molar ratio of 0.53 to 0.62 in the reaction product, and further adding urea to reduce the residual amount of formaldehyde in the resin and continuing the condensation polymerization reaction. Perform. If the molar ratio of formaldehyde / (amino group) is less than 0.53, urea is present in excess, which causes a problem that the remaining amount of urea is not reacted with formaldehyde remaining after acid reaction and the curability is inferior. Exceeding the excessive amount of unreacted formaldehyde, there is a problem that tends to increase the amount of formaldehyde emission in the manufacture of the board. In order to shorten the hardening time of resin in the said process, a hardening accelerator may be added.
제 6 공정은 상기 반응물에 포름알데히드/(아미노기)의 몰비 0.38 ∼ 0.46로 요소를 첨가하여 축중합시킨 후 1 ∼ 6시간 숙성시키는 공정으로, 수지내 포름알데히드의 잔류량을 감소시기키 위해 요소를 추가적으로 첨가하여 축중합반응을 계속 수행한다. 만일, 상기 포름알데히드/(아미노기)의 몰비가 0.38 미만이면 잔류 요소의 증가로 수지의 경화성이 떨어져 보드의 물성 저하 및 수포가 발생하는 문제가 있고, 0.46를 초과하면 미반응 포름알데히드의 증가로 E0급 보드를 생산하는데 문제가 있다. 또한, 반응이 끝난 후 숙성공정을 통해 최종 수지내 포름알데히드 잔류량을 0.05% 미만으로 낮추어 E0급 멜라민-요소-포름알데히드 수지를 제조할 수 있다. 상기 공정에서 수지의 저장안정성을 높히고 포름알데히드의 방출량을 감소시키기 위하여 안정제를 첨가할 수도 있다.The sixth step is a step of condensation polymerization of urea at a molar ratio of 0.38 to 0.46 of formaldehyde / (amino group) to the reactant, followed by aging for 1 to 6 hours, and additionally urea is added to reduce the amount of formaldehyde in the resin. Continue to carry out the polycondensation reaction. If the molar ratio of formaldehyde / (amino group) is less than 0.38, there is a problem in that the curability of the resin is reduced due to the increase of residual urea and the properties of the board are lowered and blistering occurs. I'm having trouble producing a class board. In addition, after the reaction is completed through the aging process, the residual amount of formaldehyde in the final resin can be lowered to less than 0.05% to prepare an E0 melamine-urea-formaldehyde resin. In the above process, a stabilizer may be added to increase the storage stability of the resin and to reduce the amount of formaldehyde released.
상기한 본 발명에 따른 멜라민-요소-포름알데히드 수지 제조공정에 사용된 단량체는 멜라민 0 ∼ 10 중량%, 요소 38 ∼46 중량%, 37% 농도의 포름알데히드 52 ∼ 56 중량%로 이루어져 있고, 이들 각각의 단량체 성분은 전체 축중합 공정 중에 적절히 나누어 투입한다.The monomer used in the melamine-urea-formaldehyde resin manufacturing process according to the present invention described above is made up of melamine 0-10% by weight, urea 38-46% by weight, formaldehyde 52-56% by weight at 37% concentration, and these Each monomer component is appropriately divided into the entire condensation polymerization step.
한편, 상기한 본 발명에 따른 멜라민-요소-포름알데히드 수지는 수지내 잔류된 포름알데히드의 양이 0.05% 미만으로 MDF에서 접착제로 사용시 보드의 물성 및 내구성이 일반 E2, E1 보드에 비하여 떨어지는 문제점이 있다. 따라서, 상기한 본 발명에 따른 멜라민-요소-포름알데히드 수지를 중밀도 섬유판의 제조에 접착제로 이용시 보드의 물성저하와 공정상의 문제점을 해결하기 위하여 EMDI와 이형제를 적정량 첨가하여 사용한다.On the other hand, the melamine-urea-formaldehyde resin according to the present invention has a problem that the physical properties and durability of the board when used as an adhesive in the MDF as the amount of formaldehyde remaining in the resin is less than 0.05% compared to the general E2, E1 board have. Therefore, when the melamine-urea-formaldehyde resin according to the present invention is used as an adhesive in the manufacture of medium density fiberboard, an appropriate amount of EMDI and a releasing agent is added and used to solve the problem of the physical properties of the board and the process problems.
따라서, 본 발명은 상기 방법에 따른 멜라민-요소-포름알데히드 수지 70 ∼ 99 중량%, EMDI 1 ∼ 20 중량% 및 이형제 0 ∼ 10 중량%가 포함된 중밀도 섬유판용 접착제를 포함한다.Accordingly, the present invention comprises an adhesive for medium density fiberboard comprising 70 to 99% by weight of melamine-urea-formaldehyde resin, 1 to 20% by weight of EMDI, and 0 to 10% by weight of release agent.
중밀도 섬유판용 접착제에서 가교제 및 경화제의 역할을 하여 MDF의 두께팽창률을 낮추어 내수성 및 보드의 물성을 향상시키는 EMDI는 1 ∼ 20 중량% 함유하는 것이 바람직하며, 만일 그 함유량이 1 중량% 미만이면 보드의 물성이 저하되는 문제가 있고, 20 중량%를 초과하면 도포효율 저하로 인한 보드반점 및 공정 배관에 스틱킹(sticking)이 발생하여 생산성에 심각한 문제가 있다.EMDI, which acts as a crosslinking agent and a hardening agent in the adhesive for medium density fiberboard, lowers the MDF thickness and improves the water resistance and the physical properties of the board, is preferably contained in an amount of 1 to 20% by weight. There is a problem that the physical properties of the deterioration, and if it exceeds 20% by weight, sticking occurs in the board spots and process piping due to the coating efficiency decreases, there is a serious problem in productivity.
상기한 EMDI를 중밀도 섬유판용 접착제에 첨가하면 보드의 물성은 증가하나,스틸 벨트(steel belt)와 보드가 달라붙는 현상(sticking)이 발생하므로, 본 발명에서는 이러한 문제점을 해결하기 위하여 이형제를 0 ∼ 10 중량% 함유하는 것이 바람직하며, 이형제 함유량은 EMDI의 투입량에 50%를 기준으로 사용하는 것이 좋다. 만일, 이형제의 함유량이 10 중량%를 초과하면 경제성이 떨어지고 보드의 두께팽창률이 나빠지는 문제가 있다. 상기 이형제는 내부 이형제와 외부이형제가 있으며, 내부이형제로는 징크스테아레이트(Zn-Stearate)와 파라핀 왁스의 혼합물을 0 ∼ 10 중량%로 사용할 수 있으며, 외부이형제로는 폴리에틸렌 노닐페놀(Polyethylene Nonylphenol)용액을 0.5 ∼ 1.0 kg/min의 속도의 스틸 벨트 표면에 스프레이법으로 사용할 수 있다.When the EMDI is added to the adhesive for the medium density fiberboard, the physical properties of the board are increased, but sticking occurs between the steel belt and the board. It is preferable to contain-10 weight%, and it is good to use a mold release agent content on the basis of 50% in EMDI injection amount. If the content of the releasing agent exceeds 10% by weight, there is a problem in that the economy is inferior and the thickness expansion coefficient of the board is worsened. The release agent includes an internal mold release agent and an external mold release agent, and an internal mold release agent may use a mixture of zinc stearate (Zn-Stearate) and paraffin wax in an amount of 0 to 10% by weight, and an external mold release agent may be polyethylene nonylphenol. The solution can be used by the spray method on the surface of the steel belt at a speed of 0.5 to 1.0 kg / min.
이와같이, 본 발명의 방법에 따른 멜라민-요소-포름알데히드 수지는 수지내 포름알데히드 방출량을 E0급으로 낮추었으며, 상기 수지를 사용하여 MDF 제조시 EMDI와 이형제를 적정량 첨가함으로써 열압공정시 경화시간을 단축하고, 저장 안정성을 확보하여 보드 물성을 향상시키고 제조공정상의 스틱킹(sticking) 현상, 수포 등의 문제점도 해결하였다.As such, the melamine-urea-formaldehyde resin according to the method of the present invention lowers the amount of formaldehyde emission in the resin to E0 grade, and shortens the curing time during the thermopressing process by adding an appropriate amount of EMDI and a release agent when preparing MDF using the resin. In addition, by securing the storage stability to improve the physical properties of the board (sticking) in the manufacturing process, problems such as blisters were also solved.
이와 같은 본 발명을 실시예에 의거하여 상세하게 설명하겠는 바, 본 발명이 실시예에 한정되는 것은 아니다.Although this invention is demonstrated in detail based on an Example, this invention is not limited to an Example.
실시예 1. 멜라민-요소-포름알데히드 수지의 제조Example 1 Preparation of Melamine-Urea-Formaldehyde Resin
37% 포르말린 6000 중량부, 멜라민 250 중량부, 요소 1000 중량부 및 가성소다 4.5 중량부를 반응기에 투입하여 교반을 하면서 80 ±5 ℃로 승온하였다. 충분히 반응이 되면 2차 요소를 1400 중량부 투입하여 pH 7.2 ±0.3에서 반응온도 85 ±5 ℃를 유지하면서 반응시켰다. 알칼리에서의 메틸올(methylol) 반응이 충분이 된 다음 개미산을 투입하여 pH 5.5 ±0.5로 조정하여 산반응을 시키고 운점(Cloudy Point)을 확인한 후에 3차 요소를 투입하였다. 3차는 요소 750 중량부, 경화촉진제 300 중량부를 투입하고 중화시키기 위하여 가성소다 7.5 중량부를 투입하여 pH 7.0 ±0.5로 조정하였다. 반응이 충분히 이루어지면 4차 요소 1100 중량부 투입하여 약 2 ±0.5시간 정도 숙성시킨 후, 마지막으로 요소 700 중량부, 안정제 33 중량부를 투입하여 냉각시켜 반응을 종결시켰다. 반응이 종결된 수지를 저장 탱크로 이송하여 2 ±1일 동안 숙성시켰다.6000 parts by weight of 37% formalin, 250 parts by weight of melamine, 1000 parts by weight of urea and 4.5 parts by weight of caustic soda were added to the reactor, and the temperature was raised to 80 ± 5 ° C while stirring. When enough reaction, 1400 parts by weight of the secondary urea was added and reacted while maintaining the reaction temperature of 85 ± 5 ℃ at pH 7.2 ± 0.3. After the methylol reaction in alkali was sufficient, formic acid was added to adjust the pH to 5.5 ± 0.5, followed by acid reaction, and after confirming the cloudy point, a third element was added. The third step was adjusted to pH 7.0 ± 0.5 by adding 750 parts by weight of urea, 300 parts by weight of curing accelerator and 7.5 parts by weight of caustic soda to neutralize. When the reaction was sufficient, 1100 parts by weight of the fourth urea was added to mature for about 2 ± 0.5 hours. Finally, 700 parts by weight of urea and 33 parts by weight of stabilizer were added to cool the solution. The completed resin was transferred to a storage tank and aged for 2 ± 1 days.
실시예 2. 멜라민-요소-포름알데히드 수지의 제조Example 2. Preparation of Melamine-Urea-Formaldehyde Resin
37% 포르말린 6000 중량부, 멜라민 500 중량부, 요소 1200 중량부, 가성소다 6 중량부를 반응기에 투입하여 교반을 하면서 85 ±5 ℃로 승온하였다. 2차 요소를 1200 중량부 투입하여 pH 7.5 ±0.5로 조정하여 반응온도를 85 ±5 ℃를 유지하면서 반응을 시켰다. 충분한 반응이 되면 개미산을 투입하여 pH 5.0 ±0.5로 조정하여 산반응을 시키면서 반응이 충분이 되면 가성소다를 사용하여 중화시키고, 3차 요소를 1200 중량부, 경화촉진제 100 중량부를 투입하여 20 ±10분 동안 반응시키고 4차 요소 1100 중량부 투입하여 반응을 시킨 후에 냉각시켜 약 1.5 ±0.5 시간 정도 숙성 후에 안정제 33 중량부를 투입하여 반응을 종결시켰다. 반응이종결된 수지를 저장 탱크로 이송하여 2 ±1일 동안 숙성시켰다.37% formalin 6000 parts by weight, melamine 500 parts by weight, urea 1200 parts by weight, caustic soda 6 parts by weight was added to the reactor and heated to 85 ± 5 ℃ while stirring. 1200 parts by weight of the secondary urea was adjusted to pH 7.5 ± 0.5 to react with maintaining the reaction temperature of 85 ± 5 ℃. When sufficient reaction is performed, formic acid is added to adjust pH to 5.0 ± 0.5. When acid reaction is sufficient while the reaction is sufficient, neutralize with caustic soda, add 1200 parts by weight of tertiary urea and 100 parts by weight of curing accelerator to add 20 ± 10 After reacting for 1 minute, 1100 parts by weight of the fourth urea was reacted, cooled, and aged for about 1.5 ± 0.5 hours, 33 parts by weight of the stabilizer was added to terminate the reaction. The completed resin was transferred to a storage tank and aged for 2 ± 1 days.
실시예 3. 멜라민-요소-포름알데히드 수지의 제조Example 3 Preparation of Melamine-Urea-Formaldehyde Resin
37% 포르말린 6000 중량부, 멜라민 650 중량부, 요소 1200 중량부, 전분 100 중량부, 가성소다 7 중량부를 반응기에 투입하여 교반을 하면서 85 ±5 ℃로 승온시켰다. 2차 요소 1100 중량부를 투입하여 pH 7.5 ±0.5로 조정하여 반응온도 85 ±5 ℃를 유지하면서 반응을 시켰다. 충분한 반응이 되면 개미산을 투입하여 pH 5.5 ±0.5로 조정하여 산반응을 시키면서 반응이 충분히 되면 가성소다를 사용하여 중화시키고 3차 요소를 1300 중량부, 경화촉진제 150 중량부를 투입하여 20 ±10분 동안 반응시키고 4차 요소를 1100 중량부 투입하여 반응을 시킨 후에 냉각시켜 약 2 ±1시간정도 숙성 후에 안정제를 60 중량부 투입하여 반응을 종결시켰다. 반응이 종결된 수지를 저장 탱크로 이송하여 2 ±1일 동안 숙성시켰다.37% formalin 6000 parts by weight, melamine 650 parts by weight, 1200 parts by weight of urea, 100 parts by weight of starch, 7 parts by weight of caustic soda was added to the reactor and heated to 85 ± 5 ℃ while stirring. 1100 parts by weight of the secondary urea was adjusted to pH 7.5 ± 0.5 to maintain the reaction temperature of 85 ± 5 ° C. When sufficient reaction is performed, formic acid is added to adjust pH to 5.5 ± 0.5. When the reaction is sufficient, neutralize with caustic soda and add 1300 parts by weight of tertiary urea and 150 parts by weight of curing accelerator for 20 ± 10 minutes. After the reaction, the reaction was carried out by adding 1100 parts by weight of the quaternary urea, followed by cooling. After aging for about 2 ± 1 hour, 60 parts by weight of the stabilizer was added to terminate the reaction. The completed resin was transferred to a storage tank and aged for 2 ± 1 days.
실시예 4.Example 4.
상기 실시예 1에서 얻은 멜라민-요소-포름알데히드 수지 96 중량%와 EMDI 4 중량% 및 내부이형제 0 중량%, 외부이형제 0 중량%를 접착제로 사용하여 MDF를 제조하였다. MDF 제조 조건은 190 ℃에서 20초간 30 kgf/cm2의 압력으로 열압하였고, 이와같이 제조된 MDF의 물성치는 다음 표 1에 나타내었다.MDF was prepared using 96% by weight of the melamine-urea-formaldehyde resin obtained in Example 1, 4% by weight of EMDI, 0% by weight of an internal release agent, and 0% by weight of an external release agent as an adhesive. MDF production conditions were hot pressed at 190 ℃ for 30 seconds at a pressure of 30 kg f / cm 2 , the physical properties of the MDF thus prepared are shown in Table 1 below.
실시예 5.Example 5.
상기 실시예 2에서 얻은 멜라민-요소-포름알데히드 수지 70 중량%와 EMDI 20 중량% 및 내부이형제 9 중량%, 외부이형제 1 중량%를 접착제로 사용하여 MDF를 제조하였다. MDF 제조 조건은 190 ℃에서 20초간 30 kgf/cm2의 압력으로 열압하였고, 이와같이 제조된 MDF의 물성치는 다음 표 1에 나타내었다.MDF was prepared by using 70% by weight of the melamine-urea-formaldehyde resin obtained in Example 2, 20% by weight of EMDI, 9% by weight of an internal release agent, and 1% by weight of an external release agent as an adhesive. MDF production conditions were hot pressed at 190 ℃ for 30 seconds at a pressure of 30 kg f / cm 2 , the physical properties of the MDF thus prepared are shown in Table 1 below.
실시예 6.Example 6.
상기 실시예 3에서 얻은 멜라민-요소-포름알데히드 수지 96 중량%와 EMDI 4 중량% 및 내부이형제 0 중량%, 외부이형제 0 중량%를 접착제로 사용하여 MDF를 제조하였다. MDF 제조 조건은 190 ℃에서 20초간 30 kgf/cm2의 압력으로 열압하였고, 이와같이 제조된 MDF의 물성치는 다음 표 1에 나타내었다.MDF was prepared using 96% by weight of the melamine-urea-formaldehyde resin obtained in Example 3, 4% by weight of EMDI, 0% by weight of an internal release agent, and 0% by weight of an external release agent as an adhesive. MDF production conditions were hot pressed at 190 ℃ for 30 seconds at a pressure of 30 kg f / cm 2 , the physical properties of the MDF thus prepared are shown in Table 1 below.
비교예 1.Comparative Example 1.
종래의 MDF용 멜라민-요소-포름알데히드 수지를 사용하여 통상의 방법으로 MDF를 제조하였고, 제조된 MDF의 물성치는 다음 표 1에 나타내었다.MDF was prepared by a conventional method using a conventional melamine-urea-formaldehyde resin for MDF, and the physical properties of the prepared MDF are shown in Table 1 below.
상기 표 1에 나타난 바와 같이, 본 발명에 따른 실시예 4 ∼ 6의 MDF는 포름알데히드 방출량이 0.5 mg/l 미만인 E0급 MDF 보드를 제조할 수 있고, 동시에 제조된 MDF의 두께팽창률을 낮추어 내수성 및 보드의 물성이 향상되었음을 확인할 수 있었다. 반면, 종래의 멜라민-요소-포름알데히드 수지를 접착제로 사용하여 제조한 MDF는 포름알데히드의 방출량이 2.2 mg/l로 높음을 확인할 수 있었다.As shown in Table 1, the MDF of Examples 4 to 6 according to the present invention can produce an E0 MDF board having a formaldehyde emission amount of less than 0.5 mg / l, and at the same time lowering the thickness expansion rate of the prepared MDF to improve water resistance and It was confirmed that the physical properties of the board was improved. On the other hand, MDF prepared using the conventional melamine-urea-formaldehyde resin as an adhesive was confirmed that the release of formaldehyde as high as 2.2 mg / l.
상술한 바와 같이, 본 발명의 방법에 따른 멜라민-요소-포름알데히드 수지는 수지내의 잔류 포름알데히드의 양을 획기적으로 낮추므로, 상기 수지와 EMDI(Emulsifiable methylen diphenyl diisocyanate) 및 이형제를 적정량 혼합사용하여 중밀도 섬유판(Medium density fiberboard, MDF) 제조시 접착제로 사용하면 제조된 MDF의 포름알데히드 방출량이 현저히 감소되고, MDF의 물리적 성질 또한 우수하게 개선되므로 MDF 제조시 접착제로 유용하게 사용할 수 있다.As described above, since the melamine-urea-formaldehyde resin according to the method of the present invention significantly lowers the amount of residual formaldehyde in the resin, an appropriate amount of the resin, EMDI (Emulsifiable methylen diphenyl diisocyanate) and a release agent is mixed and used. When used as an adhesive for manufacturing a medium density fiberboard (MDF), the amount of formaldehyde emission of the prepared MDF is significantly reduced, and the physical properties of the MDF are also improved, so that it can be usefully used as an adhesive for manufacturing MDF.
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GR1005045B (en) * | 2004-11-15 | 2005-11-16 | Chimar (Hellas) Α.Ε. | Thermosetting polymer compositions |
WO2006051339A1 (en) * | 2004-11-15 | 2006-05-18 | Chimar Hellas Sa | Thermosetting polymer compositions |
KR100707038B1 (en) * | 2003-09-25 | 2007-04-13 | 한 정임 | A process for the preparation of amino thermosetting resin |
KR100741365B1 (en) * | 2006-07-04 | 2007-07-27 | 대한민국 | Preparation of formaldehyde scavenger |
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KR100984800B1 (en) * | 2008-12-26 | 2010-10-04 | 동화그린켐 주식회사 | Urea formaldehyde resin type hardener |
KR102287820B1 (en) * | 2021-05-18 | 2021-08-10 | 주식회사 유니드 | Flooring material combined with plywood and high-density fiberboard and manufacturing method thereof |
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US3891590A (en) * | 1971-12-20 | 1975-06-24 | Allied Chem | Curable amino resins |
JPS5476695A (en) * | 1977-11-30 | 1979-06-19 | Matsushita Electric Works Ltd | Preparation of solid urea resin |
JPS54123194A (en) * | 1978-03-17 | 1979-09-25 | Matsushita Electric Works Ltd | Production of solid urea resin |
KR870001260A (en) * | 1985-07-08 | 1987-03-12 | 박상천 | Manufacturing method of urea melamine resin foam |
KR0174330B1 (en) * | 1996-05-29 | 1999-04-01 | 구형우 | Method for producing melamine-urea-formaldehyde resin |
KR100243066B1 (en) * | 1997-12-31 | 2000-02-01 | 차동천 | Process for preparing melamine-urea-formaldehyde resin |
KR20000047320A (en) * | 1998-12-31 | 2000-07-25 | 차동천 | Production process of amino class thermosetting resin for high water-proofing board |
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KR100707038B1 (en) * | 2003-09-25 | 2007-04-13 | 한 정임 | A process for the preparation of amino thermosetting resin |
GR1005045B (en) * | 2004-11-15 | 2005-11-16 | Chimar (Hellas) Α.Ε. | Thermosetting polymer compositions |
WO2006051339A1 (en) * | 2004-11-15 | 2006-05-18 | Chimar Hellas Sa | Thermosetting polymer compositions |
KR100741365B1 (en) * | 2006-07-04 | 2007-07-27 | 대한민국 | Preparation of formaldehyde scavenger |
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