KR101017870B1 - Manufacturing method of melamine-urea-formaldehyde resin adhesive for medium density fiberboards - Google Patents

Manufacturing method of melamine-urea-formaldehyde resin adhesive for medium density fiberboards Download PDF

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KR101017870B1
KR101017870B1 KR1020080122382A KR20080122382A KR101017870B1 KR 101017870 B1 KR101017870 B1 KR 101017870B1 KR 1020080122382 A KR1020080122382 A KR 1020080122382A KR 20080122382 A KR20080122382 A KR 20080122382A KR 101017870 B1 KR101017870 B1 KR 101017870B1
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urea
melamine
formaldehyde
medium density
producing
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KR20100063990A (en
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이상민
박종영
박상범
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대한민국
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/26Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C09J161/28Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/16Halogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/22Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09J161/24Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21JFIBREBOARD; MANUFACTURE OF ARTICLES FROM CELLULOSIC FIBROUS SUSPENSIONS OR FROM PAPIER-MACHE
    • D21J1/00Fibreboard

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법 및 상기 방법에 의해 제조한 접착제를 이용한 중밀도섬유판의 제조방법에 관한 것으로 보다 상세하게는 특정 함량의 멜라민을 첨가하여 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제를 제조하는 한편, 이렇게 제조한 접착제를 이용하여 중밀도 섬유판을 제조하여 섬유판의 물성을 저하시키기 않고, 포름알데히드의 방출량을 KS 규격기준 수퍼 E0급(Super E0)으로 감소시킬 수 있는 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법 및 상기 방법에 의해 제조한 접착제를 이용한 중밀도섬유판의 제조방법에 관한 것이다.The present invention relates to a method for producing a melamine-urea-formaldehyde resin adhesive for producing a medium density fiber board and a method for producing a medium density fiber board using the adhesive prepared by the above method. While manufacturing melamine-urea-formaldehyde resin adhesive for fiber board manufacturing, while producing a medium density fiber board using the adhesive thus prepared, the amount of formaldehyde released is not reduced to KS standard super E0 (Super E0). It relates to a method for producing a melamine-urea-formaldehyde resin adhesive for producing a medium density fiber board which can be reduced to) and a method for producing a medium density fiber board using the adhesive prepared by the above method.

중밀도섬유판, 멜라민-요소-포름알데히드 수지 접착제, 포름알데히드 방출량 Medium Density Fiberboard, Melamine-Urea-Formaldehyde Resin Adhesive, Formaldehyde Release

Description

중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법{Manufacturing method of melamine-urea-formaldehyde resin adhesive for medium density fiberboards}Manufacturing method of melamine-urea-formaldehyde resin adhesive for medium density fiberboards}

본 발명은 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법 및 상기 방법에 의해 제조한 접착제를 이용한 중밀도섬유판의 제조방법에 관한 것으로 보다 상세하게는 특정 함량의 멜라민을 첨가하여 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제를 제조하는 한편, 이렇게 제조한 접착제를 이용하여 중밀도 섬유판을 제조하여 섬유판의 물성을 저하시키기 않고, 포름알데히드의 방출량을 KS 규격기준 수퍼 E0급(Super E0)으로 감소시킬 수 있는 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법 및 상기 방법에 의해 제조한 접착제를 이용한 중밀도섬유판의 제조방법에 관한 것이다.The present invention relates to a method for producing a melamine-urea-formaldehyde resin adhesive for producing a medium density fiber board and a method for producing a medium density fiber board using the adhesive prepared by the above method. While manufacturing melamine-urea-formaldehyde resin adhesive for fiber board manufacturing, while producing a medium density fiber board using the adhesive thus prepared, the amount of formaldehyde released is not reduced to KS standard super E0 (Super E0). It relates to a method for producing a melamine-urea-formaldehyde resin adhesive for producing a medium density fiber board which can be reduced to) and a method for producing a medium density fiber board using the adhesive prepared by the above method.

중밀도섬유판은 목질원료를 고온에서 해섬하여 얻어지는 목섬유에 접착제를 도포하여 성형, 열압을 통해 제조되는 밀도가 0.35∼0.85g/cm3의 목질판상제품이며, 두께는 2.5∼35mm까지 생산이 가능하고, 복잡한 기계가공 등이 가능하여 실내 건축마감용이나 실내에서 사용되는 가구 전 분야에 걸쳐 널리 사용되고 있다.Medium density fiber board has a density which is produced through a molding, hot-press by applying an adhesive to the wood fiber is obtained by fibrillation of wood raw material at a high temperature and the plate-like products of the wood-0.35~0.85g / cm 3, a thickness is capable of producing up to and 2.5~35mm It is widely used in all areas of furniture used for interior construction finishing or indoors because it can be complicated machining.

이러한 중밀도섬유판을 제조할 때는 무색이면서 접착력이 우수하고 가격이 저렴한 요소-포름알데히드 수지 접착제 또는 멜라민-요소-포름알데히드 수지 접착제 등이 널리 사용되고 있으나, 상기의 접착제는 경화된 후에도 공기 중의 수분등과 접촉을 할 경우 포름알데히드가 서서히 방출되어 제품 사용시에 인체에 유해하다고 알려져 있다. When manufacturing such a medium-density fiber board, urea-formaldehyde resin adhesive or melamine-urea-formaldehyde resin adhesive, such as colorless, excellent adhesion and low cost, is widely used. Formaldehyde is slowly released upon contact, which is known to be harmful to humans when using the product.

특히, 중밀도섬유판이 주로 실내에서 사용되므로 중밀도섬유판 제조시 사용되는 접착제에 의해 실내공기질에 영향을 미치게 되어 인간의 건강에 직접적인 영향을 끼친다고 알려져 세계 각국에서는 목질판상제품류의 포름알데히드 방출량을 규제하는 등 각종 법규를 제정하여 시행하고 있으며, 국내에서도 현재 실내공기질관리법이 시행되고 있다.Particularly, since medium density fiberboard is mainly used indoors, it is known that the adhesive used in manufacturing medium density fiberboard affects indoor air quality and directly affects human health. Various laws and regulations have been enacted and enforced, and the Indoor Air Quality Control Act is currently in force in Korea.

따라서, 목질판상제품류의 포름알데히드 방출량을 줄이기 위한 많은 노력 중의 하나로 접착제의 성분이나 첨가제 등을 변화시키는 노력이 계속되고 있다. Therefore, one of many efforts to reduce the amount of formaldehyde emissions of wood-like products is an effort to change the components, additives and the like of the adhesive.

한편 본 발명과 관련된 선행기술로서 미국특허 제4,997,905에서는 접착제 제조 시 멜라민의 함량을 2∼6% 첨가하여 저 포름알데히드 보드를 생산할 수 있었으나 축합반응이 끝난 다음에 첨가하는 요소의 양이 과다하여 보드의 물성이 현저히 낮은 문제가 있다. On the other hand, US Patent No. 4,997,905 in the prior art related to the present invention was able to produce a low formaldehyde board by adding 2 to 6% of the melamine content in the manufacture of the adhesive, but after the condensation reaction, the amount of added elements is excessive There is a problem of significantly lower physical properties.

또한 대한민국 특허 제10-0552548에는 저 포름알데히드 중밀도섬유판을 제조할 수 있었으나 상기 중밀도섬유판을 제조하기 위한 접착제의 제조과정이 복잡하고 경화촉진제의 첨가량이 높았으며 접착제 제조 후에도 숙성기간을 거치는 등 접착제 제조시간이 길다는 단점이 있다.In addition, the Republic of Korea Patent No. 10-0552548 was able to produce a low formaldehyde medium density fiberboard, but the manufacturing process of the adhesive for producing the medium density fiberboard is complicated, the addition amount of the curing accelerator is high, and after the aging period even after the production of the adhesive There is a disadvantage that the manufacturing time is long.

최근 들어 포름알데히드의 인체 유해성 등과 관련된 문제점들이 부각되고 있어서 포름알데히드 방출량을 낮춘 친환경 목질판상제품의 제조 및 사용이 필수 불가결하다. 이에 본 발명자들은 상기와 같은 문제점 중, 특히 포름알데히드 방출량을 낮추기 위하여 포름알데히드와 멜라민, 요소를 축합할 때 초기 포름알데히드/요소의 몰비를 특정범위로 제한하고, 특정량의 멜라민을 첨가하여 최종 접착제의 몰비를 조절하고, 접착제 합성공정을 단순화시킴으로써 접착제 제조원가 손실을 없애고, 중밀도섬유판을 제조한 후에는 포름알데히드 방출량을 최소화 시킬 수 있는 멜라민-요소-포름알데히드 수지 접착제의 제조방법을 제공하는데 목적이 있다. Recently, problems associated with human hazards of formaldehyde have been highlighted, so manufacturing and using eco-friendly wood board products having lowered formaldehyde emissions are indispensable. Accordingly, the present inventors limit the molar ratio of initial formaldehyde / urea to a specific range when condensing formaldehyde with melamine and urea in order to lower the amount of formaldehyde emission, and add a specific amount of melamine to the final adhesive. The purpose of the present invention is to provide a method for producing a melamine-urea-formaldehyde resin adhesive that can reduce the cost of adhesive manufacturing by controlling the molar ratio of the polymer, simplify the adhesive synthesis process, and minimize the amount of formaldehyde released after the production of the medium density fiber board. have.

또한 본 발명은 상기의 멜라민-요소-포름알데히드 수지 접착제를 이용하여 중밀도섬유판의 제조방법을 제공하고자 한다.In another aspect, the present invention is to provide a method for producing a medium density fiber board using the melamine-urea-formaldehyde resin adhesive.

본 발명은 1) 포름알데히드에 알칼리성 촉매를 첨가하여 pH를 9.0±0.2로 조절하고 반응온도를 75±5℃로 조절한 후 계산된 양의 멜라민을 첨가한 다음 반응온도를 90±2℃까지 상승시켜 30±5분 동안 유지시키는 단계; 2) 상기 1)단계 후 1차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.50∼1.64로 조절하고 반응온도를 90±2℃로 유지하면서 축합반응을 실시한 다음 2차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.05∼1.15으로 조절하여 미반응의 포름알데히드를 포집하는 단계; 3) 상기 2)단계 후 반응물을 75±5℃로 냉각시킨 다음 알칼리 촉매 또는 산 촉매를 첨가하여 pH를 8.5±0.2로 유지시키는 단계를 포함하는 중밀도섬유판용 멜라민-요소-포름알데히드 수지 접착제의 제조방법을 나타낸다.The present invention 1) by adding an alkaline catalyst to formaldehyde to adjust the pH to 9.0 ± 0.2 and the reaction temperature to 75 ± 5 ℃ and then add the calculated amount of melamine and then increase the reaction temperature to 90 ± 2 ℃ To maintain for 30 ± 5 minutes; 2) After the step 1), add the primary urea to adjust the molar ratio of formaldehyde / urea to 1.50∼1.64, perform condensation reaction while maintaining the reaction temperature at 90 ± 2 ℃, and then add the secondary urea to formaldehyde / Adjusting the molar ratio of urea to 1.05 to 1.15 to capture unreacted formaldehyde; 3) after the step 2) of the melamine-urea-formaldehyde resin adhesive for medium-density fiberboard comprising the step of cooling the reaction to 75 ± 5 ℃ and then adding an alkali catalyst or an acid catalyst to maintain the pH to 8.5 ± 0.2 The manufacturing method is shown.

본 발명에 의해 제조한 멜라민-요소-포름알데히드 수지 접착제는 접착제의 합성과정을 단순화시켜 접착제 제조원가를 절감할 수 있을 뿐만 아니라, 접착제나 접착제를 이용하여 제조한 중밀도섬유판의 물성의 저하 없이 포름알데히드 방출량이 낮은 중밀도섬유판을 제조하는 데 사용할 수 있다.The melamine-urea-formaldehyde resin adhesive prepared according to the present invention not only reduces the adhesive manufacturing cost by simplifying the synthesis process of the adhesive but also reduces the formaldehyde without deteriorating the physical properties of the medium-density fiber board manufactured by using the adhesive or the adhesive. It can be used to produce low density medium density fiberboard.

본 발명은 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법을 나타낸다.This invention shows the manufacturing method of the melamine-urea-formaldehyde resin adhesive for manufacturing medium density fiber boards.

본 발명은 1) 포름알데히드에 알칼리성 촉매를 첨가하여 pH를 9.0±0.2로 조절하고 반응온도를 75±5℃로 조절한 후 멜라민 120∼198중량부를 첨가한 다음 반응온도를 90±2℃까지 상승시켜 30±5분 동안 유지시키는 단계; The present invention is 1) by adding an alkaline catalyst to formaldehyde to adjust the pH to 9.0 ± 0.2 and the reaction temperature to 75 ± 5 ℃ after adding 120 to 198 parts of melamine and then increase the reaction temperature to 90 ± 2 ℃ To maintain for 30 ± 5 minutes;

2) 상기 1)단계 후 1차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.50∼1.64로 조절하고 반응온도를 90±2℃로 유지하면서 축합반응을 실시한 다음 2차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.05∼1.15로 조절하여 미반응의 포름알데히드를 포집하는 단계; 2) After the step 1), add the primary urea to adjust the molar ratio of formaldehyde / urea to 1.50∼1.64, perform condensation reaction while maintaining the reaction temperature at 90 ± 2 ℃, and then add the secondary urea to formaldehyde / Adjusting the molar ratio of urea to 1.05 to 1.15 to capture unreacted formaldehyde;

3) 상기 2)단계 후 반응물을 75±5℃로 냉각시킨 다음 알칼리 촉매 또는 산 촉매를 첨가하여 pH를 8.5±0.2으로 유지시키는 단계를 포함하는 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법을 나타낸다.3) after the step 2) of the melamine-urea-formaldehyde resin adhesive for producing a medium density fiber board comprising the step of maintaining the pH to 8.5 ± 0.2 by adding an alkali catalyst or an acid catalyst after cooling to 75 ± 5 ℃ The manufacturing method is shown.

상기 1)단계 및 3)단계에서 알칼리 촉매는 수산화나트륨(NaOH), 수산화칼륨(KOH)으로부터 선택된 어느 하나를 사용할 수 있다. In the steps 1) and 3), the alkali catalyst may be any one selected from sodium hydroxide (NaOH) and potassium hydroxide (KOH).

상기 3)단계에서의 산 촉매는 포름산(HCOOH), 염산(HCl)으로부터 선택된 어느 하나를 사용할 수 있다. The acid catalyst in step 3) may be any one selected from formic acid (HCOOH), hydrochloric acid (HCl).

상기 1)단계에서 초기반응의 pH를 9.0±0.2로 조절하고 반응시간을 30±5분 동안 유지시킴으로서 멜라민의 축합반응을 억제시키고 메틸올화 단계까지만 반응을 진행시킬 수 있다.In step 1), by controlling the pH of the initial reaction to 9.0 ± 0.2 and maintaining the reaction time for 30 ± 5 minutes, the condensation reaction of melamine can be inhibited and the reaction can proceed only to the methylolation step.

상기 1)단계 후 1차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.50∼1.64로 조절함으로서 요소의 메틸올화를 촉진시켜 멜라민과 요소의 효과적인 축합을 유도할 수 있고, 2차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.05∼1.15로 조절함으로서 미반응의 포름알데히드를 포집할 수 있다.After the step 1), by adding the primary urea to adjust the molar ratio of formaldehyde / urea to 1.50 to 1.64 to promote methylolation of the urea to induce effective condensation of melamine and urea, by adding a secondary urea form Unreacted formaldehyde can be collected by adjusting the mole ratio of aldehyde / urea to 1.05 to 1.15.

상기 3)단계 후 생성물의 pH를 8.5±0.2로 유지시킴으로서 생성물의 자가축합을 방지할 수 있다.By maintaining the pH of the product after the step 3) to 8.5 ± 0.2 can prevent the self-condensation of the product.

본 발명의 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조에 있어서 다양한 pH, 반응온도, 반응시간, 함량 등에 대해 조사한바, 본 발명의 목적을 달성하기 위해서는 상기에서 언급한 조건에 의해 중밀도섬유판 제조용 멜라 민-요소-포름알데히드 수지 접착제의 제조방법을 제공하는 것이 바람직하다.In the preparation of the melamine-urea-formaldehyde resin adhesive for producing a medium density fiber board of the present invention, various pH, reaction temperature, reaction time, content, etc. were investigated. In order to achieve the object of the present invention, It is desirable to provide a method for producing a melamine-urea-formaldehyde resin adhesive for producing a density fiber board.

본 발명은 상기에서 제조한 멜라민-요소-포름알데히드 수지 접착제를 이용하여 중민도섬유판의 제조방법을 포함한다.The present invention includes a method for producing a medium degree fiber board using the melamine-urea-formaldehyde resin adhesive prepared above.

본 발명은 중밀도섬유판의 제조에 있어서, 목섬유 100중량부에 대하여 상기에서 제조한 멜라민-요소-포름알데히드 수지 접착제 10∼20중량% 및 경화제 1∼5중량%를 도포하는 단계를 포함하는 중밀도섬유판의 제조방법을 나타낸다.The present invention provides a medium density comprising the step of applying 10 to 20% by weight of the melamine-urea-formaldehyde resin adhesive prepared above and 1 to 5% by weight of the curing agent to 100 parts by weight of wood fiber The manufacturing method of a fiber board is shown.

본 발명은 중밀도섬유판의 제조에 있어서, 목섬유 100중량부에 대하여 상기에서 제조한 멜라민-요소-포름알데히드 수지 접착제 15중량% 및 경화제 3중량%를 도포하는 단계를 포함하는 중밀도섬유판의 제조방법을 나타낸다.The present invention provides a method for producing a medium density fiber board comprising the step of applying 15% by weight of the melamine-urea-formaldehyde resin adhesive prepared above and 3% by weight of a curing agent to 100 parts by weight of wood fibers. Indicates.

상기에서 경화제는 본 발명의 기술분야에서 공지된 경화제를 선택적으로 사용할 수 있으며, 일예로 염화암모늄을 사용할 수 있다. In the above, the curing agent may selectively use a curing agent known in the art, and for example, ammonium chloride may be used.

본 발명의 중밀도섬유판의 제조방법에 대해 다야한 성분, 함량 및 조건에 의해 실시한바, 본 발명의 목적을 달성하기 위해서는 상기에서 언급한 조건에 의해 중밀도섬유판의 제조방법을 제공하는 것이 바람직하다.The method for producing a medium density fiber board of the present invention is carried out by various components, contents and conditions. In order to achieve the object of the present invention, it is preferable to provide a method for producing a medium density fiber board under the above-mentioned conditions. .

이하 본 발명의 내용을 실시예 및 시험예를 통하여 구체적으로 설명한다. 그러나, 이들은 본 발명을 보다 상세하게 설명하기 위한 것으로 본 발명의 권리범위가 이들에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to Examples and Test Examples. However, these are intended to explain the present invention in more detail, and the scope of the present invention is not limited thereto.

<실시예 1> 멜라민 첨가 저몰비 요소-포름알데히드 수지의 제조Example 1 Preparation of Melamine-Added Low Molar Ratio Urea-Formaldehyde Resin

37% 포르말린 650중량부 알칼리성 용액인 수산화나트륨 4중량부를 반응기에 넣고 교반을 하면서 pH를 9.0±0.2로 조절하고 반응온도를 75±5℃로 유지시켰다.  4 parts by weight of sodium hydroxide, a 650 parts by weight alkaline solution of 37% formalin, was added to the reactor while stirring to adjust the pH to 9.0 ± 0.2 and the reaction temperature was maintained at 75 ± 5 ° C.

상기와 같이 동일한 pH 범위를 유지하면서 멜라민을 125중량부 또는 198중량부 첨가하여 반응온도를 90±2℃까지 상승시켜 30±5분 동안 유지시켰다. While maintaining the same pH range as described above, by adding 125 parts by weight or 198 parts by weight of melamine, the reaction temperature was raised to 90 ± 2 ℃ was maintained for 30 ± 5 minutes.

324중량부의 1차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.50로 조절하고 반응온도를 90±2℃로 유지하면서 20분 동안 축합시켰다. 324 parts by weight of primary urea were added to control the molar ratio of formaldehyde / urea to 1.50 and condensed for 20 minutes while maintaining the reaction temperature at 90 ± 2 ° C.

139중량부의 2차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.05로 조절하여 15±5분 동안 유지하여 미반응의 포름알데히드를 포집하고, 반응물을 75±5℃로 냉각시켜 포름산 또는 염산을 첨가하여 pH를 8.5±0.2로 유지시키는 단계에 의해 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제를 제조하고, 이러한 접착제의 물성 측정결과는 아래의 표 1에 나타내었다.Add 139 parts by weight of secondary urea to adjust the molar ratio of formaldehyde / urea to 1.05 and hold for 15 ± 5 minutes to collect unreacted formaldehyde, and cool the reaction to 75 ± 5 ° C. to add formic acid or hydrochloric acid. To prepare a melamine-added low molar ratio urea-formaldehyde resin adhesive by the step of maintaining the pH at 8.5 ± 0.2, and the measurement results of the physical properties of the adhesive are shown in Table 1 below.

<실시예 2> 멜라민 첨가 저몰비 요소-포름알데히드 수지의 제조Example 2 Preparation of Melamine-Added Low Molar Ratio Urea-Formaldehyde Resin

37% 포르말린 650중량부 알칼리성 용액인 수산화나트륨 4중량부를 반응기에 넣고 교반을 하면서 pH를 9.0±0.2로 조절하고 반응온도를 75±5℃로 유지시켰다.  4 parts by weight of sodium hydroxide, a 650 parts by weight alkaline solution of 37% formalin, was added to the reactor while stirring to adjust the pH to 9.0 ± 0.2 and the reaction temperature was maintained at 75 ± 5 ° C.

상기와 같이 동일한 pH 범위를 유지하면서 멜라민을 122중량부 또는 194중량 부 첨가하여 반응온도를 90±2℃까지 상승시켜 30±5분 동안 유지시켰다. While maintaining the same pH range as described above, by adding 122 parts by weight or 194 parts by weight of melamine, the reaction temperature was raised to 90 ± 2 ℃ was maintained for 30 ± 5 minutes.

309중량부의 1차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.57로 조절하고 반응온도를 90± 2℃로 유지하면서 20분 동안 축합시켰다. 309 parts by weight of primary urea was added to control the molar ratio of formaldehyde / urea to 1.57 and condensed for 20 minutes while maintaining the reaction temperature at 90 ± 2 ° C.

132중량부의 2차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.10으로 조절하여 15±5분 동안 유지하여 미반응의 포름알데히드를 포집하고, 반응물을 75±5℃로 냉각시켜 포름산 또는 염산을 첨가하여 pH를 8.5±0.2로 유지시키는 단계에 의해 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제를 제조하고, 이러한 접착제의 물성 측정결과는 아래의 표 1에 나타내었다.Add 132 parts by weight of secondary urea to adjust the molar ratio of formaldehyde / urea to 1.10 and hold for 15 ± 5 minutes to collect unreacted formaldehyde, and cool the reaction to 75 ± 5 ° C to add formic acid or hydrochloric acid To prepare a melamine-added low molar ratio urea-formaldehyde resin adhesive by the step of maintaining the pH at 8.5 ± 0.2, and the measurement results of the physical properties of the adhesive are shown in Table 1 below.

<실시예 3> 멜라민 첨가 저몰비 요소-포름알데히드 수지의 제조Example 3 Preparation of Melamine-Added Low Molar Ratio Urea-Formaldehyde Resin

37% 포르말린 650중량부 알칼리성 용액인 수산화나트륨 4중량부를 반응기에 넣고 교반을 하면서 pH를 9.0±0.2로 조절하고 반응온도를 75±5℃로 유지시켰다.  4 parts by weight of sodium hydroxide, a 650 parts by weight alkaline solution of 37% formalin, was added to the reactor while stirring to adjust the pH to 9.0 ± 0.2 and the reaction temperature was maintained at 75 ± 5 ° C.

상기와 같이 동일한 pH 범위를 유지하면서 멜라민을 120중량부 또는 191중량부 첨가하여 반응온도를 90±2℃까지 상승시켜 30±5분 동안 유지시켰다. While maintaining the same pH range as described above, by adding 120 parts by weight or 191 parts by weight of melamine, the reaction temperature was raised to 90 ± 2 ℃ was maintained for 30 ± 5 minutes.

295중량부의 1차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.64로 조절하고 반응온도를 90±2℃로 유지하면서 20분 동안 축합시켰다. 295 parts by weight of primary urea were added to control the molar ratio of formaldehyde / urea to 1.64 and condensed for 20 minutes while maintaining the reaction temperature at 90 ± 2 ° C.

127중량부의 2차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.15로 조절하여 15± 5분 동안 유지하여 미반응의 포름알데히드를 포집하고, 반응물을 75±5℃로 냉각시켜 포름산 또는 염산을 첨가하여 pH를 8.5±0.2로 유지시키는 단계에 의해 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제를 제조하고, 이러한 접착제의 물성 측정결과는 아래의 표 1에 나타내었다.Add 127 parts by weight of secondary urea to adjust the molar ratio of formaldehyde / urea to 1.15 and hold for 15 ± 5 minutes to collect unreacted formaldehyde, and cool the reaction to 75 ± 5 ° C. to add formic acid or hydrochloric acid. To prepare a melamine-added low molar ratio urea-formaldehyde resin adhesive by the step of maintaining the pH at 8.5 ± 0.2, and the measurement results of the physical properties of the adhesive are shown in Table 1 below.

표 1. 멜라민 첨가 저몰비 요소-포름알데히드 수지의 물성Table 1. Physical Properties of Low Molar Ratio Urea-Formaldehyde Resin Added with Melamine

구분division 고형분 함량
(%)
Solid content
(%)
유리포름알데히드
(%)
Free formaldehyde
(%)
겔화시간
(sec)
Gel time
(sec)
항목Item 멜라민 첨가량
(중량부)
Melamine addition amount
(Parts by weight)
실시예 1
Example 1
125125 57.657.6 0.630.63 287287
198198 58.258.2 0.320.32 242242 실시예 2
Example 2
122122 55.555.5 0.770.77 249249
194194 57.557.5 0.500.50 209209 실시예 3
Example 3
120120 54.754.7 0.740.74 149149
191191 52.852.8 0.540.54 182182 비교예
Comparative example
250250 57.157.1 0.300.30 348348
200200 58.758.7 0.150.15 240240

* 비교예 : 상용으로 사용되고 있는 2종의 접착제 표시* Comparative Example: Marking two kinds of adhesives that are used commercially

표 1에 나타낸 바와 같이, 본 발명에 따른 실시예에서 유리포름알데히드량과 겔화시간에서 비교예와 비교하여 약간의 편차는 있었지만, 비교예로 사용한 제품의 멜라민 함량이 본 발명에서 제조한 접착제들의 양과는 큰 차이가 있어 직접적인 비교는 의미가 없었다. As shown in Table 1, the amount of free formaldehyde and gelation time in the Examples according to the present invention were slightly different from those of the Comparative Example, but the melamine content of the product used as the Comparative Example was compared with the amount of the adhesive prepared in the present invention. There was a big difference, so the direct comparison was not meaningful.

<실시예 4><Example 4>

목섬유 100중량부에 대하여 상기 실시예 1에서 제조한 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제 15중량부 및 경화제 3중량부를 도포한 후 중밀도섬유판은 목표밀도 700kg/㎥에서 두께 6mm로 열압기온도 170℃에서 240초 동안 열압하여 제조하였다. After applying 15 parts by weight of the melamine-added low molar ratio urea-formaldehyde resin adhesive prepared in Example 1 and 3 parts by weight of a curing agent based on 100 parts by weight of wood fiber, the medium density fiberboard was 6 mm thick at a target density of 700 kg / m 3. It was prepared by hot pressing at 170 ° C. for 240 seconds.

본 발명의 합성방법에 따라 제조한 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제로 제조한 중밀도섬유판의 물성 측정치를 표 2에 나타내었다.Table 2 shows the measured physical properties of the medium density fiberboard prepared with the melamine-added low molar ratio urea-formaldehyde resin adhesive prepared according to the synthesis method of the present invention.

<실시예 5>Example 5

목섬유 100중량부에 대하여 상기 실시예 2에서 제조한 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제 15중량부 및 경화제 3중량부를 도포한 후 중밀도섬유판은 목표밀도 700 kg/㎥에서 두께 6mm로 열압기온도 170℃에서 240초 동안 열압하여 제조하였다. After applying 15 parts by weight of the melamine-added low molar ratio urea-formaldehyde resin adhesive prepared in Example 2 and 3 parts by weight of a curing agent based on 100 parts by weight of wood fibers, the medium density fiberboard was heated to a thickness of 6 mm at a target density of 700 kg / m 3. It was prepared by hot pressing at a temperature of 170 ° C. for 240 seconds.

본 발명의 합성방법에 따라 제조한 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제로 제조한 중밀도섬유판의 물성 측정치를 표 2에 나타내었다.Table 2 shows the measured physical properties of the medium density fiberboard prepared with the melamine-added low molar ratio urea-formaldehyde resin adhesive prepared according to the synthesis method of the present invention.

<실시예 6><Example 6>

목섬유 100중량부에 대하여 상기 실시예 3에서 제조한 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제 15중량부 및 경화제 3중량부를 도포한 후 중밀도섬유판은 목표밀도 700kg/㎥에서 두께 6mm로 열압기온도 170℃에서 240초 동안 열압하여 제조하였다. After applying 15 parts by weight of the melamine-added low molar ratio urea-formaldehyde resin adhesive prepared in Example 3 and 3 parts by weight of a curing agent based on 100 parts by weight of wood fibers, the medium density fiberboard was heated to a thickness of 6 mm at a target density of 700 kg / m 3. It was prepared by thermal pressure at 170 ℃ for 240 seconds.

본 발명의 합성방법에 따라 제조한 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제로 제조한 중밀도섬유판의 물성 측정치를 표 2에 나타내었다.Table 2 shows the measured physical properties of the medium density fiberboard prepared with the melamine-added low molar ratio urea-formaldehyde resin adhesive prepared according to the synthesis method of the present invention.

표 2. 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제로 제조한 중밀도섬유판의 물성 Table 2. Properties of Medium Density Fiberboards Prepared with Melamine-Added Low Molar Ratio Urea-Formaldehyde Resin Adhesives

항목Item 밀도1)
(g/㎥)
Density 1)
(g / ㎥)
휨강도2)
(N/㎟)
Flexural strength 2)
(N / mm2)
박리강도3)
(N/㎟)
Peel Strength 3)
(N / mm2)
포름알데히드
방출량4)
(㎎/L)
Formaldehyde
Emission amount 4)
(Mg / L)
실시예 4
Example 4
0.7050.705 44.044.0 0.760.76 0.170.17
0.7040.704 35.235.2 0.630.63 0.100.10 실시예 5
Example 5
0.7030.703 40.440.4 0.850.85 0.270.27
0.7040.704 35.735.7 0.900.90 0.220.22 실시예 6
Example 6
0.7030.703 39.239.2 0.630.63 0.220.22
0.7050.705 42.642.6 0.780.78 0.230.23 비교예
Comparative example
0.7040.704 47.947.9 1.051.05 0.400.40
0.7020.702 28.628.6 0.650.65 0.510.51

1),2),3),4) : KS F 3200에 의거하여 측정 1), 2), 3), 4) : Measured according to KS F 3200

* 비교예 : 상용으로 사용되고 있는 2종의 접착제 표시* Comparative Example: Marking two kinds of adhesives that are used commercially

표상기 2의 나타낸 바와 같이, 실시예 4∼6에서 제조한 중밀도섬유판의 물성이 비교예로 사용한 접착제들로 제조한 중밀도섬유판과 비교하여 밀도, 휨강도, 박리강도 등의 물성이 저하되지 않았고, 포름알데히드 방출량은 본 발명에서 제조한 접착제를 사용하여 제조한 중밀도섬유판의 경우 모두 0.3㎎/L 이하인 Super E0급을 나타내어 포름알데히드 방출량을 낮출 수 있었다. 비교예로 사용한 접착제로 제조한 중밀도섬유판의 포름알데히드 방출량은 멜라민 함량이 본 발명에서 제조한 접착제들보다 높음에도 불구하고 0.4㎎/L 이상을 나타내었다. As shown in Table 2, the physical properties of the medium density fiber boards prepared in Examples 4 to 6 were not deteriorated compared to the medium density fiber boards prepared with the adhesives used as the comparative examples, and the physical properties such as density, bending strength, peel strength, etc. The amount of formaldehyde released showed a Super E 0 grade of 0.3 mg / L or less in the case of the medium density fiberboard manufactured using the adhesive prepared in the present invention, thereby lowering the amount of formaldehyde released. The formaldehyde emission of the medium density fiberboard prepared with the adhesive used as the comparative example was higher than 0.4 mg / L despite the higher melamine content than the adhesives prepared in the present invention.

따라서 본 발명에서 제조한 멜라민 첨가 저몰비 요소-포름알데히드 수지 접착제의 경우 기존의 접착제와 비교하여 유사한 물성을 유지하고, 이를 이용해 중밀도섬유판을 제조할 경우 박리강도와 휨강도는 유지하면서 포름알데히드 방출량을 저감시키는 효과를 가지는 결과를 얻었다. Therefore, in the case of the melamine-added low molar ratio urea-formaldehyde resin adhesive prepared in the present invention, similar physical properties are maintained compared to conventional adhesives, and when the medium density fiberboard is manufactured using the same, the release rate of formaldehyde is maintained while maintaining peel strength and bending strength. The result which has the effect of reducing was obtained.

상술한 바와 같이, 본 발명의 바람직한 실시예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다. As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. It will be appreciated that it can be changed.

Claims (3)

1) 포름알데히드 650중량부에 대하여 알칼리성 촉매를 첨가하여 pH를 9.0±0.2로 조절하고 반응온도를 75±5℃로 조절한 후 멜라민 120∼198중량부를 첨가한 다음 반응온도를 90±2℃까지 상승시켜 30±5분 동안 유지시키는 단계; 1) Add an alkaline catalyst to 650 parts by weight of formaldehyde to adjust the pH to 9.0 ± 0.2, adjust the reaction temperature to 75 ± 5 ° C, add 120-198 parts of melamine, and then set the reaction temperature to 90 ± 2 ° C. Raise to hold for 30 ± 5 minutes; 2) 상기 1)단계 후 1차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.50∼1.64로 조절하고 반응온도를 90±2℃로 유지하면서 축합반응을 실시한 다음 2차 요소를 첨가하여 포름알데히드/요소의 몰비를 1.05∼1.15로 조절하여 미반응의 포름알데히드를 포집하는 단계; 2) After the step 1), add the primary urea to adjust the molar ratio of formaldehyde / urea to 1.50∼1.64, perform condensation reaction while maintaining the reaction temperature at 90 ± 2 ℃, and then add the secondary urea to formaldehyde / Adjusting the molar ratio of urea to 1.05 to 1.15 to capture unreacted formaldehyde; 3) 상기 2)단계 후 반응물을 75±5℃로 냉각시킨 다음 산 촉매를 첨가하여 pH를 8.5±0.2로 유지시키는 단계를 포함하는 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법.3) Method of producing a melamine-urea-formaldehyde resin adhesive for producing a medium-density fiber board comprising the step of cooling the reaction to 75 ± 5 ℃ after step 2) and then to maintain the pH to 8.5 ± 0.2 by adding an acid catalyst. 제1항에 있어서, 1)단계의 알칼리성 촉매는 수산화나트륨(NaOH), 수산화칼륨(KOH)으로부터 선택된 어느 하나이고, 3)단계의 산촉매는 포름산(HCOOH), 염산(HCl)으로부터 선택된 어느 하나인 중밀도섬유판 제조용 멜라민-요소-포름알데히드 수지 접착제의 제조방법.The alkaline catalyst of step 1) is any one selected from sodium hydroxide (NaOH) and potassium hydroxide (KOH), and the acid catalyst of step 3) is any one selected from formic acid (HCOOH) and hydrochloric acid (HCl). Method for preparing melamine-urea-formaldehyde resin adhesive for producing medium density fiberboard. 중밀도섬유판의 제조방법에 있어서,In the manufacturing method of the medium density fiberboard, 목섬유 100중량부에 대하여 청구항 제1항 또는 제2항의 방법에 의해 제조한 멜라민-요소-포름알데히드 수지 접착제 10∼20중량부 및 경화제 1∼5중량부를 도포하는 단계를 포함하는 것을 특징으로 하는 중밀도섬유판의 제조방법.10 to 20 parts by weight of the melamine-urea-formaldehyde resin adhesive prepared by the method of claim 1 or 1 to 5 parts by weight of the hardwood fiber, characterized in that it comprises the step of applying Method for producing density fiberboard.
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CN108192544B (en) * 2017-12-24 2020-11-06 北京林业大学 Nano-cellulose modified low-molar-ratio urea-formaldehyde resin adhesive and preparation method thereof
KR102515787B1 (en) * 2020-09-25 2023-03-30 주식회사 유니드비티플러스 Fire retardant compositions and manufacturing method of fire retardant eco-frindly board using the same and resin composition of fire retardant board

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KR102168023B1 (en) 2020-07-27 2020-10-20 주식회사 인플러스 Wood board finishing material adhesion method

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