KR20030029119A - 기판의 화학적 기계 폴리싱 장치 및 방법 - Google Patents

기판의 화학적 기계 폴리싱 장치 및 방법 Download PDF

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Publication number
KR20030029119A
KR20030029119A KR10-2003-7001400A KR20037001400A KR20030029119A KR 20030029119 A KR20030029119 A KR 20030029119A KR 20037001400 A KR20037001400 A KR 20037001400A KR 20030029119 A KR20030029119 A KR 20030029119A
Authority
KR
South Korea
Prior art keywords
wafer carrier
wafer
retaining ring
bellows
pressure
Prior art date
Application number
KR10-2003-7001400A
Other languages
English (en)
Korean (ko)
Inventor
제이슨 멜빈
남 피. 수
힐라리오 엘. 오
Original Assignee
에이에스엠엘 유에스, 인코포레이티드
메사추세츠 인스티튜트 오브 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/628,563 external-priority patent/US6984168B1/en
Application filed by 에이에스엠엘 유에스, 인코포레이티드, 메사추세츠 인스티튜트 오브 테크놀로지 filed Critical 에이에스엠엘 유에스, 인코포레이티드
Publication of KR20030029119A publication Critical patent/KR20030029119A/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR10-2003-7001400A 2000-07-31 2001-07-31 기판의 화학적 기계 폴리싱 장치 및 방법 KR20030029119A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/628,563 US6984168B1 (en) 1999-07-28 2000-07-31 Apparatus and method for chemical mechanical polishing of substrates
US09/628,563 2000-07-31
US25901600P 2000-12-29 2000-12-29
US60/259,016 2000-12-29
PCT/US2001/041513 WO2002009906A1 (en) 2000-07-31 2001-07-31 Apparatus and method for chemical mechanical polishing of substrates

Publications (1)

Publication Number Publication Date
KR20030029119A true KR20030029119A (ko) 2003-04-11

Family

ID=49356551

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7001400A KR20030029119A (ko) 2000-07-31 2001-07-31 기판의 화학적 기계 폴리싱 장치 및 방법

Country Status (8)

Country Link
EP (1) EP1307320B1 (de)
JP (1) JP2004505456A (de)
KR (1) KR20030029119A (de)
CN (1) CN1460042A (de)
AU (1) AU2001283529A1 (de)
DE (1) DE60127269D1 (de)
TW (1) TW577785B (de)
WO (1) WO2002009906A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007001100A1 (en) * 2005-06-28 2007-01-04 Doosan Mecatec Co., Ltd. Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system
KR20150013483A (ko) * 2012-04-02 2015-02-05 에이에스엠엘 네델란즈 비.브이. 미립자 오염 측정 방법 및 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6758726B2 (en) * 2002-06-28 2004-07-06 Lam Research Corporation Partial-membrane carrier head
JP6938262B2 (ja) * 2017-07-24 2021-09-22 株式会社ディスコ ウエーハの加工方法
CN107703881B (zh) * 2017-09-11 2023-08-04 中国工程物理研究院机械制造工艺研究所 一种自动标定磁流变抛光缎带厚度的装置
CN113573844B (zh) 2019-02-28 2023-12-08 应用材料公司 用于化学机械抛光承载头的固定器
KR102339948B1 (ko) * 2019-07-02 2021-12-17 (주)미래컴퍼니 연마 시스템 및 연마 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5716258A (en) * 1996-11-26 1998-02-10 Metcalf; Robert L. Semiconductor wafer polishing machine and method
DE19651761A1 (de) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6068549A (en) * 1999-06-28 2000-05-30 Mitsubishi Materials Corporation Structure and method for three chamber CMP polishing head
US6206768B1 (en) * 1999-07-29 2001-03-27 Chartered Semiconductor Manufacturing, Ltd. Adjustable and extended guide rings

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007001100A1 (en) * 2005-06-28 2007-01-04 Doosan Mecatec Co., Ltd. Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system
KR20150013483A (ko) * 2012-04-02 2015-02-05 에이에스엠엘 네델란즈 비.브이. 미립자 오염 측정 방법 및 장치

Also Published As

Publication number Publication date
CN1460042A (zh) 2003-12-03
EP1307320A1 (de) 2003-05-07
EP1307320A4 (de) 2004-12-01
EP1307320B1 (de) 2007-03-14
DE60127269D1 (de) 2007-04-26
JP2004505456A (ja) 2004-02-19
TW577785B (en) 2004-03-01
WO2002009906A1 (en) 2002-02-07
AU2001283529A1 (en) 2002-02-13

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Legal Events

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N231 Notification of change of applicant
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application