KR20030028449A - Abrasive surface and article and methods for making them - Google Patents

Abstract

The present invention provides a method of making an abrasive material comprising a plurality of light particles (75) that provide a polishing quality dispersed in a retention matrix, in order to retain the particles in place. Positioning a mask 50 having an opening relative to the supportable carrier 60, providing an attachment capability on the outer surface of the mask away from the carrier to which light particles are attached, the outer side of the mask Applying a plurality of light particles to a surface such that a portion of the particle passes through the opening of the mask to form a pattern of the particle on the carrier corresponding to the opening of the mask, and another portion of the particle is attached to the mask, the carrier Separating the mask comprising the light particles attached from the carrier, leaving a pattern of the particles on it, carrying with the retaining matrix material By heating the stage and the hold on the matrix material surrounding the particles, at least in part achieved by that the material includes the step of forming the retention matrix for holding the particles in said pattern.

Description

ABRASIVE SURFACE AND ARTICLE AND METHODS FOR MAKING THEM

US Patent No. 4,925,457, which is incorporated herein by reference; 5,092,910 and; 5,380,390 as well as 5,049,165; 5,203,880; 5,190,568; 5,190,568; 5,817,204; 5,817,204; No. 5,620,489; 5,991,330 and; All of US Pat. No. 5,980,678 teaches a method for providing light particles uniformly dispersed in a deliberate manner on the surface of an abrasive article.

International Publication No. WO98 / 51448 places perforated stencils or masks relative to the instrument preform so that the perforations define cavities, and after filling and packaging these cavities with a metal brazing compound in the form of a paste, A method of removing a template is disclosed, leaving discrete particles of brazing paste added to the incision surface. The light particles (polishing grains) are deposited on the paste particles or premixed with the paste particles and fixed in place by igniting the preform in brazing state.

In US Pat. Nos. 5,380,390, 5,817,204, 5,980,678, incorporated herein by reference, various adhesive materials and at least one mask retain light particles on the substrate and / or carrier prior to heat treatment of the synthetic abrasive material, It is used to form non-uniform dispersion of light particles. For example, the substrate is coated with an adhesive, the mask is positioned over the adhesive-coated substrate, and the substrate is brought into contact with a large amount of hard adhesive particles to allow particles to adhere to the substrate through the openings of the mask, followed by The abrasive material can be formed by removing all the plurality of particles that are not held and optionally removing the mask. The particles remaining in the pattern of the substrate are then surrounded by a sinterable or soluble matrix material, while the particles are temporarily held by the adhesive. Continuous treatment of heat and / or pressure completes the adhesive material.

The mask may take the form of a mesh or other cellular material positioned relative to the substrate prior to contacting the substrate with the light particles. Then, depending on the mesh or other cellular material, the mask will determine the dispersion of the light particles and / or regions or particle masses. Moreover, the mask can be removed prior to heating, or left to be an integral part of the abrasive material. Moreover, as described in the present invention, the substrate may be a sinterable preform and the light particles may be pressed or compressed by various pressing means, such as roll compaction, of the pre-located light particles prior to sintering of the material.

As further described herein, the matrix material may be a sinterable, soluble material and may be deposited by a temperature associated with pressure, such as thermal (eg, plasma) application or vapor deposition, wherein the thermal deposition of the material. Is considered equivalent to a sinterable material. Depending on the variation in sintering, by placing the soluble material on at least one side of the assembly prior to initiation of heating or compression, the matrix material may be saturated with the soluble material, during heating the soluble material is dissolved and the matrix material is subjected to osmotic action. Is carried into.

US Pat. No. 5,620,489, incorporated herein by reference, discloses a sinterable matrix material in the form of a soft, easily deformed and flexible preform made of a mixture of a large amount of powder and a sinterable matrix material and a liquid binder. . The plurality of abrasive particles can then be included, at least in part, in the preform, which is then sintered to form the abrasive article. For example, the binder-powder mixture may be administered on a support surface and mixed to a uniform thickness by a doctor blade to form the preform. For example, a plurality of abrasive particles may be included in the preform by placing the particles on at least one side of the preform and then pressing the particles into the preform. Before or during the preform is sintered, the abrasive particles may be pressed into the preform. Moreover, particles may be included in the preform in any or deliberate manner that may be defined by cellular type mesh or mask material.

US Pat. No. 5,791,330, incorporated herein by reference, relates to a similar abrasive material having a planned dispersion of abrasive particles, wherein the mesh material, after being used to position the abrasive particles, is physically prior to sintering the matrix material. It may be partially or completely removed or dissolved or decomposed at the temperature used to sinter the matrix material, leaving abrasive particles uniformly dispersed within the matrix material. In addition, the present patent claims that a structural member may be located between the matrix material and the abrasive particles and the mesh material or on at least one side thereof, and may be a metal or nonmetallic composite or powder, fibers, meshes, shims, foils. And what may be any combination thereof. The composite of the structural members can be different from the composite of the matrix material, which can be sintered or brazed with abrasive material, preferably sintered under pressure. In addition, this patent is a composite of a suitable sinterable matrix material or sinterable matrix material, comprising boron and carbide forming elements such as steel, with or without chromium, zinc, the brazing and melting materials of which are composites. Together with additives.

FIELD OF THE INVENTION The present invention relates to abrasive and wear resistant surfaces and articles having such surfaces, and in particular, discloses new and improved methods for achieving such surfaces comprising intentionally dispersed light particles that provide abrasive and wear resistance to the surface. do.

1 is a plan view of a mask showing cutting sections of various shapes made by the treatment of the present invention;

2 is a plan view of another mask showing a cut section of an alternative shape;

3 is a cross-sectional view of an assembly showing a mask similar to that of FIG. 1 or 2 on the surface of a carrier;

4 is a cross-sectional view of the assembly of FIG. 3 with a plurality of light particles applied;

FIG. 5 is a view similar to FIG. 4 showing the assembly after removal of a mask, carrier or particles that do not adhere to each other, FIG.

FIG. 6 is a view similar to FIG. 5 showing the use of an adhesive coating to help attach particles to a carrier;

FIG. 7 is a view similar to FIG. 5 showing various variations of the type of particles used;

8 is a view similar to FIG. 7 showing another variant of the particle type;

9 is a schematic representation showing the separation of a mask with particles attached from a carrier,

9A and 9B are schematic views showing a method of fixing particles in holding a matrix material;

10 is a schematic representation showing the compression of particles into a carrier;

11 is an enlarged view showing particles embedded in a carrier as a result of the compression of FIG. 10;

12 shows the material of FIG. 11 with additional holding material applied to the carrier, FIG.

FIG. 13 is a schematic view similar to FIG. 10 showing compression of particles and masks;

FIG. 14 is a view similar to FIGS. 7 and 8 showing another variation between the size of the particles and the mask;

15 shows the material of FIG. 14 compressed;

FIG. 16 shows the material of FIG. 15 with particles held by additional holding material; FIG.

17 is a view similar to FIG. 5 showing an alternative mask;

18 is a view similar to FIG. 4 showing an alternative carrier,

FIG. 19 is similar to FIG. 18 and shows a variation in the type of particles used;

19A shows the material of FIG. 19 after removal of the mask;

20 is a schematic cross-sectional view showing an apparatus for holding the assembly together;

21 shows the assembly of FIG. 20 after removal of the mask;

FIG. 22 is similar to FIG. 12 and illustrates an alternative method for fixing particles in retaining matrix material;

FIG. 23 shows the material of FIG. 22 after compression;

FIG. 24 is a view similar to FIG. 23 after increased compression of material;

FIG. 25 is a view similar to FIG. 22 showing another alternative method for fixing particles;

FIG. 26 shows the material of FIG. 25 after compression.

The present invention makes, but is not limited to, an article comprising abrasive and wear resistant articles comprising hard abrasive particles most suitable for mechanization, automation, and mass production, preferably dispersed in a deliberately or non-uniform pattern. It provides a new and improved invention for.

In accordance with the present invention, there is provided a method of making an abrasive material comprising a plurality of light particles that provide abrasive quality dispersed in a retention matrix, in order to hold particles in place, which method comprises: Positioning a mask having an opening to a supportable carrier; providing an attachment means on an outer surface of the mask away from the carrier to which light particles are attached; applying a plurality of light particles to the outer side of the mask. Whereby a portion of the particle passes through the opening of the mask to form a pattern of the particle on the carrier corresponding to the opening of the mask and other portions of the particle attached to the mask, and another portion of the particle is attached to the mask. A mask comprising light particles attached from a carrier, leaving a pattern of the particles on the carrier To heat the surrounding the particles on the carrier with a separating, holding the matrix material, at least in part steps and, the retention matrix material is made by which the material comprising the step of: to form a retention matrix for holding the particles in said pattern.

In general, the treatment of the present invention involves the treatment of selecting at least one mask with openings (eg, stencils, templates, cellular type materials, meshes, etc.), and temporarily and / or at least some light particles. Or a process of positioning or assembling the mask with respect to a permanently supported or acceptable carrier or substrate.

The assembly of mask and carrier then receives a large amount of light particles, some of which pass through the openings of the mask to be fixed or seated on the carrier and other portions, and some of them proceed onto the mask and onto the space of the mask between the openings. Is seated on.

According to the invention, the outer surface of the mask opposite the surface adjacent to the carrier has attachment means to which the particles are attached to retain the particles on the space on the outer surface of the mask. Then, the mask having the light particles attached to the attachment means is separated from the carrier, whereby the separated mask effectively removes the plurality of light particles so as not to form part of the final abrasive product. By removing the light particles that do not form part of the abrasive material in this way, less particle dust is caused during the treatment, which makes it easier and more effective to recover the abrasive material, for example for reuse or sale. Moreover, this minimizes the chance that unwanted light particles become part of the abrasive material.

This results in leaving light particles in a dispersed pattern on the carrier. The light particles are dispersed on the carrier not only by the size and shape of the light particles, but also mainly by the design of the mask according to the size, shape and dispersion of the openings of the mask. Thus, a programmed or deliberate dispersion of the light particles is provided on the carrier.

In this process, the support or temporary maintenance of the light particles on the carrier is not only the characterization of the carrier and / or light particles, but also the coating material applied to the carrier and / or light particles, or the moisture content, humidity, weight, (use of gravity temperature) temperature (e.g., , Negative temperature), magnetization, electrostatic force, discharge state, and the like, by surface characterization of the carrier or light particles. Moreover, after placing the particles on the carrier, another material may be applied to more permanently attach the particles to the carrier. The mask can be removed from the carrier during or before or after this fixation of the light particles to the carrier. Removing the mask simultaneously or immediately during the deposition process constitutes the most preferred embodiment of the present invention.

If removal of the mask is involved, preferably the light particles attached to the mask are separated from the mask, recovered and then used again to make another abrasive material.

Means for attaching the light particles to the mask and to each other include an adhesive coated on the mask or anchored through surface roughness. In addition, a mask made of an inherent tacky material may also be used. However, since the particles are retained on the outer surface of the mask, certain means may be allowed to be removed when the mask is separated from the carrier.

Preferably, the light particles that are not fixed to the mask and / or carrier and / or to each other are removed from the carrier and mask or from their assembly, thus forming another plurality of light particles that can be gathered and used again to make the abrasive material. Done. These light particles include, but are not limited to, gravity, brushing, blowing, blasting, picking, suction, vacuum, scraping, shacking, tapping. It may be removed by any suitable method including tapping, vibration, heating, magnetization, device, electrical charge, and discharge.

After placing the light particles on the carrier and removing the mask, this assembly is subject to another process. This process may include at least one or more of the following processes.

By locking the light particles in place, in order to improve the retention of the light particles in the carrier, the particles can be at least partially pressed into the carrier. This compression and / or lock may be provided during or before or after removing the mask from the carrier.

Providing carriers and light particles with permanent retention matrix materials (eg, sinterable materials, depositable materials, soluble materials, solderable materials or thermally curable materials).

Heating, sintering, blazing, melting, molding, casting, deposition (eg, electrical or thermal deposition) and plating; Or under a specific atmosphere or vacuum under pressure or in the absence of pressure; Or a variety of treatments of any combination thereof to provide permanent retention directly and / or through retention matrix material between the light particles and the carrier.

As a result of these further treatments, the light particles are permanently attached or bonded to the retention matrix and / or carrier, optionally attached or bonded to each other.

With reference to the drawings and with reference to these embodiments of the invention selected for illustration, FIGS. 1 and 2 are masks having openings suitable for use in the present invention that may be templated, stenciled cellular or mesh materials. An example is shown. The mask may be made in a variety of ways, including but not limited to, methods such as drilling, drilling, cutting, soldering, welding and glue bonding or laser. The mask 10 shown in FIG. 1 has a plurality of through openings 15-24, each of which is formed in various ways. The mask 30 shown in FIG. 2 shows a plurality of round openings 35 and a plurality of polygonal openings 40.

3 is a cross-sectional view of a mask 50 assembly similar to the mask 10 or 30, having a mask portion 57 between the through opening 55 and the through opening 55 and seated on the carrier 60. According to the invention the side of the mask away from the carrier is provided with attachment means such as a coating of the adhesive 100 to which the particles are attached. On the other hand, the mask may be made of an intrinsic tacky material or a material that becomes tacky under the influence of light or temperature, for example, so that the particles adhere directly to the mask. By the way, any means for retaining particles on the outer surface of the mask to attach to the mask may be acceptable.

The carrier may be any type of substrate that supports and / or at least temporarily holds a plurality of light particles. As described in more detail below, the carrier may be a plate (eg metal), foil, mesh-type material (eg wire mesh or non-wire cellular material), or a preform of sintered material forming a portion of the abrasive material; It may be a substrate which is formed and immediately removed from the abrasive material.

4 shows that a plurality of light particles 70 are applied on the mask 50 and the carrier 60 to cover the surfaces of the mask and the carrier. Some light particles 75 travel through the opening of the mask 50 and are seated on the carrier, and some light particles 80 proceed to the portion 57 of the mask and are held in place by the adhesive 100. Thus, the light particles are seated and / or fixed with respect to each other as well as the mask and carrier. 5 shows how the assembly looks after removing light particles that are not held in the mask or held by the openings 55 if desired.

As shown in Fig. 6, the surface of the carrier 60 adjacent to the mask 50 may provide an attachment means, so that the light particles passing through the opening 55 are attached to the carrier. Between the masks 50, a thin film of adhesive 90 may be provided that adheres the light particles in a coating layer, such as opening 55. This helps keep the particles in the opening 55 as a plurality of particles that do not adhere to the mask 50 are removed as shown in FIG. 5. In addition, by applying an adhesive or liquid and / or curly and / or magnetized material to the light particles, the light particles can be attached to each other by natural electrostatic, mechanical interlocking.

7, alternatively, after removing all light particles that are not retained by the carrier or mask, only a single layer of light particles 80 and a single layer of particles 75 are directly or through the adhesive material 90, 100. And attached to the carrier 60.

Depending on the average size of the light particles and the size of the opening 55 and the thickness 110 of the mask 50, the light particles 75 are arranged in heaps or pillars within the openings as shown in FIG. 6, or as shown in FIG. 7. It should be understood that a single layer can be formed as well, and can also consist only of a single particle in each opening 55 as shown in FIG. 8. 8 shows an adhesive layer 90. This layer 90 should be understood as a part attached or attached to an independent device or mask 50 or carrier 60.

The inner surface of the mask may also be provided with attachment means to which adjacent surfaces of the carrier are attached. In this case, the attachment means prevents peeling or damage of the mask and / or the substrate during the separation process of the mask from the substrate. Examples of such attachment means may be a low tack adhesive (eg, pressure sensitive) and a low suction / release action, eg, through a hole or opening or channel in a substrate or carrier.

According to the invention, after the particles have been applied to the carrier and the mask and any excess or unattached particles have been removed, the mask comprising the attached particles 80 preferably leaves a pattern on the carrier 60. While being separated from the carrier. 9 schematically shows a process of separating the mask 50 and the carrier 60 from each other. After separation as well as separation treatment, the mask 50 preferably retains all or at least most of the light particles 80 and the carrier 60 holds the light particles 75. In particular, as shown in FIG. 9, the mask 50 can be removed from the carrier 60 by separating it from the mask and winding it on a roll. It is understood that the separation treatment may be in a continuous or semi-continuous manner, or in a discontinuous or batch manner.

To assist in this separation of the mask 50 from the carrier 60, if adhesive materials 90 are used, they should not make it difficult to separate them from each other. Thus, in most cases the material 90 becomes sufficiently sticky so that the particles 75 adhere, but not too strong in order not to make it difficult to separate the mask 50 from the carrier.

According to the invention, following the separation of the mask from the carrier, the particles 75 left on the carrier are in contact with or at least partially surrounded by the retention matrix material. As shown in FIG. 9A, this may be, for example, a powder sinterable matrix material 76, to dissolve or sinter the material, to retain the particles 75 in the desired pattern, and to form an adhesive material. In order to be heated. The carrier can be part of the adhesive material and can also be removed after sintering.

On the other hand, preforms of sinterable matrix materials may be applied to the sides or both sides of the structure in addition to or instead of the material 76 or other retention type materials. FIG. 9B shows the preforms 77 and 78 of the sintered material being applied to both sides of the assembly of FIG. 9A where plate 79 exerts pressure on the assembly and heat is applied to sinter the abrasive material. Material 76 may be omitted and may be a sinterable matrix material or soluble material of powder. If the material 76 is a soluble material, the material may dissolve at or below the final sintering temperature of the preform, helping to attach the particles to each other and to the retention matrix provided by the preform. On the other hand, the carrier 60 may be a preform of a sinterable material, which itself forms a retaining matrix to hold the particles 75 during the process of making the adhesive material.

Another treatment of the carrier 60 and the light particles 75 after removal of the mask and before heating is a pair of compression means, as shown in FIG. 10, in particular if the carrier 60 is a preform of a sinterable matrix material, For example, pressing the particles into the carrier with the rolls 130, 140. The compression roll presses the hard particles 75 into the carrier 60 to deform the carrier. The initial thickness 110 of the carrier 60 may change under some conditions of compression or deformation, with the resulting thickness 120 becoming similar to the initial thickness 110. In addition, the width of the carrier 60 (not shown) can be changed under this compression.

During compression, the light particles 75 may be embedded at least partially or completely within the carrier 60. Different applications of the final product may require different levels of protrusion. In one embodiment of the present invention, in the production of a single layer paste grinding tool, there are protrusions of light particles over the surface 150 of the carrier 60 as shown in FIG. Depending on the nature of the carrier 60 and the depth of penetration of the light particles 75 and the light particles 75 into the carrier 60, the light particles 75 may be seated in the nest 155, thereby anchoring in the carrier. do. Preferably, other applications require complete protrusion of the light particles 75 into the carrier / preform 60.

6 and 8 and also with respect to FIG. 11, if the adhesive material 90 is present in the nest 155 as a result of compression / compression, by heating, combustion, adsorption, vacuum or decomposition processes, The adhesive material can be removed together with the carrier. In particular, in order to reduce the generation of organic materials and water and gas under heating to provide a cleaning treatment environment and good retention between the light particles 75 and the desired permanent retaining material, removal of the substance 90 is important for manufacturing. It can be a step. This is particularly important for both sintering, brazing, melting, electro-deposition and thermal curing, with or without the use of negative (vacuum) and / or protective and / or reducing atmospheres.

Referring to FIG. 12, after pressing / compressing the particles 75 into the carrier 60, additional retaining material 125 may be applied to the hard particles 75, and optionally at least partially applied to the carrier. The reason for requiring the "extra" material 125 is that the carrier 60 itself can provide a retention matrix for the light particles, especially if the carrier material itself is a sinterable matrix material. After proper processing, the additional retaining material helps to permanently bond the light particles 75 to the carrier 60.

If the carrier 60 is not a sinterable material, such as a metal foil or plate or mesh material, then only the "additional" material 125 may be the material providing the integration of the light particles and the carrier 60. In this case, the "additional" material 125 can function as a true brazing material, as it defines the function of the brazing process to consolidate the parts together via the liquid and then solidify the brazing material. In this case, therefore, under the process for producing the abrasive material, the solder is dissolved by heat (along with loads and / or pressures applied or not applied) and then solidified (with loads and / or pressures applied or not applied) Together). When the braze material is combined (mixed or applied) with the non-solder type sinterable material, the solder that dissolves at a suitable temperature can penetrate into the skeleton (capillary channel) of the non-solder type sinterable material.

These additional holding materials may be powders, chips, fibers, pastes, slurries, tapes, sheets, chopped or crushed solid flake materials, compacted powder dissolved metals, preferably powdered materials, and electrolytic It may have the form of a solution. Metals (eg, metal and alloy powders and mixtures) and nonmetallic materials (eg, thermoplastics, resins, epoxies). The retention material may be selected from pre-sintered or fully sintered powder materials, including cellular type materials and metal base mesh materials, cast powder tapes, roll compacted powder tapes, or plates.

If the mask 50 is not removed from the carrier 60 at the time the additional retaining material is applied, the retaining material may be used to help retain the particles 80 to the mask to assist in their subsequent removal with the mask. Note the possibility. In addition, if the light particle 80 comprises a predetermined retaining material, the retaining material should be able to be separated from the light particle to allow recovery of the light particle for future use involving the removal of the light particle with the mask. In particular, prior to reverting the light particles for future use, the light particles must be cleaned with a holding material. Nevertheless, in some cases, the removed light particles can be returned for reuse, in the presence of traces of the holding material.

As shown in FIGS. 9B and 10, the compression of the carrier 60 and the pressing of the light particles 75 into the carrier may be performed prior to removing the mask 50 as shown in FIG. 13. Preferably, this is when the mask 50 is thin, deformable, stretchable or elastic. Under the action of compression means such as plate 79 or rolls 130-1 and 140-1, the mask 50 is compressed, the light particles 80 are at least partially pressed into the mask, and the light particles 75 are also carrier 60. Squeezed into). After the mask 50 is removed, the final material will be similar to that shown in FIG.

Roll compression should be understood to be just one of many possible options for compressing the carrier 60 and forcing the hard particles 75 into the carrier. The compression means may be flat, corrugated, rectangular or circular. The compression means can be attached to or in part of an electrical, hydraulic, aerodynamic, or vibratory machine.

An embodiment when the mask 50 is a thin material as compared to the linear dimension of the light particles 80 and 75 (eg, the linear dimension of the light particles of 3.0 × 10 ⁻¹ to 1.0 × 10 ⁻⁶ ) is shown in FIGS. 14-16. do. FIG. 14 shows light particles 80 located on the outer surface 150 of the mask 50 and light particles 75 on the outer surface 160 of the carrier 60. FIG. 15 shows the structure after the light particles 80 and 75 are pressed (by compression means as shown in FIGS. 10 and 13) with the mask 50 and the carrier 60, respectively. FIG. 16 shows the structure of the carrier 60 and the particles 75 embedded in the carrier after separating the mask 50 and the particles 80 attached to the mask from the carrier.

Another processing of the compressed carrier 60 comprising light particles 75 to provide permanent retention of particles is, but is not limited to, under pressure or in the absence of pressure and / or under vacuum or in the absence of vacuum. Heating under sintering, sintering, brazing, melting, curing, and combinations thereof; Thermal application and electrical deposition performed in a continuous, semi-continuous or batch manner; It comprises a variety of methods including a combination of these. Various of these processes are disclosed in US patents, including US Pat. No. 5,203,880, the contents of which are incorporated herein by reference.

As noted above, the level of protrusion into and / or out of the carrier 60 of the light particles 75 may vary from 0-100%.

FIG. 16A shows only one abrasive material made of a compressed carrier 60 that includes light particles 75 using optional additional retaining material 125 penetrated into the carrier 60.

FIG. 17 shows a mask 50 having a plurality of pockets or channels 65 on at least side 170 of the mask opposite the surface 180 of the carrier 60 containing the light particles 75. Under certain pressure (eg, as shown in FIG. 13) and / or vacuum, air is at least partially removed from these pockets 65 to seal the mask to the surface 180. As a result, the mask 50 is attached to the surface 180 of the carrier. This design and application method of the mask allows for easy separation of the mask from the carrier (eg, as shown in FIG. 9). Other methods of allowing air to penetrate these pockets 65 (eg, to release vacuum) can be employed. Despite the need to have a particular mask configured with pockets 165, the method may require an adhesive 90 or other material because removal of the adhesive from the carrier may require additional processing in the manufacturing process. It may have advantages over the temporarily attached mask 50 and carrier 60. The pocket or channel 165 may be made in a variety of ways, including but not limited to compression, molding, etching, and fine replication.

Masks used in the present invention include metal alloys and nonmetal materials; Organic materials, for example esters; silk; textile; It can be made using a variety of materials of various classes and origins, including paper and foils, thin film tapes, sheets, and plates. Masks and / or adhesives used include adhesive materials and glues; Pressure sensitive adhesives; One-sided and double-sided adhesive materials (preferably tapes, sheets, and plates); Pressure sensitive adhesive tapes; plastic; Suzy; Rubber; Paste; Glass; Ceramic, fiber, glass; Gels; Mesh type materials including wire mesh filters, woven or non-woven meshes, expanded, perforated, cut, drilled and other machined and / or modified materials; Powder and / or fiber materials, including cast, compressed and at least partially sintered materials; Any combination thereof and any combination thereof with other materials. Preferably, the mask is deformable, stretchable and elastic. The thickness of the mask can be similar to or substantially smaller than the linear dimension of, but not limited to, light particles (eg, linear dimension / size of 2.0 to 10 × 10 ⁻⁶ of the light particles).

Processes for making the mask include laser emission, drilling or cutting as well as electronic and mechanical etching processes. Various treatments, including laser drilling, may provide masks in actual size (eg, 24 inches wide by 100 feet long) or in continuous belt form with or without roll rolls or hole cylinders (so-called drums) or seams. Can be. By way of example, a pressure sensitive adhesive sheet or (one or both sides) tape may be converted to a mask by a laser drilling tool that cuts or drills through openings in the tape.

The mask may have various adhesive properties on various aspects of the mask. For example, the side of the mask adjacent to the carrier may have a low adhesion performance relative to the surface of the carrier to facilitate separation of the mask from the carrier, while the side of the mask receiving the light particles may provide good adhesion of the light particles to the mask. It has a relatively strong adhesion performance to the light particles in order to facilitate and therefore minimize the falling of the light particles on the carrier while separating the mask and carrier from each other.

Carriers include, but are not limited to, metals, alloys, non-alloy materials; Organic materials; silk; textile; Paper, foil, tape, plate, plastic, resin; Rubber; Paste; Glass, ceramic, fiber glass; Mesh type materials including wire mesh, filters, woven and non-woven meshes, expanded, perforated, cut, drilled, and other machined and / or modified materials; Powders and / or preforms including, but not limited to, green compacts, roll compacted materials, cast powders and / or fibers, sintered and / or partially sintered and / or expanded materials, and / or Or fiber materials; It can be made from a variety of materials, including any combination thereof and any combination thereof with other materials. The carrier can be a flexible hard monolayer or a synthetic multilayer; It may be configured with one or a plurality of materials, and may be a solid material or a powder material before and after compression and / or heat treatment, and may be configured with an opening including a hole and a capillary channel. The carrier is a flexible, rigid porous and non-porous material, a cast and roll worked material, and may be an alloy, composite, unsintered powder, presintered and fully sintered material.

In a preferred embodiment of the present invention, preforms of sinterable material, such as cast powder preforms, are used as the carrier 60. This preform is disclosed in US Pat. No. 5,620,489, the contents of which are incorporated herein by reference. It may be used as casting and / or curing and / or pre sintering and / or completely sintered. In the process, this casting material as a carrier receives the light particles passing through the opening in the mask and presses the light particles onto the carrier so that they adhere to the carrier. This causes the amount of light particles to adhere to the carrier 60 to be reduced or not to use any adhesive material. Minimization or absence of such adhesive materials contributes to productivity and the amount of final product.

While Figures 3 to 17 show the carrier 60 as a solid material, for example a plate, foil or tape, Figure 18 shows that the carrier 60-2 can be a mesh or cellular type material. 18 is similar to FIG. 4 for the process of making the abrasive material, the plurality of light particles 70-2 and the plurality of particles 75-2 and the mask 50-2 in the opening 190 of the cellular carrier. The plurality of particles 80-2 on the? In addition, FIG. 18 illustrates a mask 50 in which the cellular carrier 60-2 is opposed to the side by another material or carrier 200 which prevents the light particles from falling through the opening 190 not covered by the mask. -2) to be sealed.

FIG. 19 illustrates a variation of FIG. 18, showing that one light particle may be formed per cell within a single layer of cellular particles 60-3 or cellular carrier 60-3. Note that for the material 200-3, the cellular carrier 60-3 can serve as a dispersion mask, in which case the carrier 200-3 becomes the second carrier. In addition, the carrier 60-3, which is a mask, leaves the second carrier 200-3 while leaving the light particles 75-3 in accordance with the combined effect of the mask 50-3 and the carrier-mask 60-3 on its surface. ) Can be removed. The second carrier 200-3 may be made of the same material and may be made of the same material as the predetermined carrier material 60. Moreover, the second carrier 200-3 and / or the light particles 75-3 can be treated in the same manner as described above. 19A shows second carrier 200-3 of FIG. 19 after removal of mask 50-3 and mask carrier 60-3 and before enveloping the light particles with retention matrix material.

In a preferred embodiment, the mask is a combination of a wire mesh and a double sided pressure sensitive adhesive tape having openings on one side. In this method, the particles form a pattern on an opening in the tape and a carrier corresponding to the particles in each opening, the pattern corresponding to a wire mesh.

20 shows conventional holding means that can be used to hold the carrier and mask together firmly in the process of filling and removing light particles. The figure shows the carrier 650, the cellular carrier-mask 680, the dispersion mask 700, and the light particles 770 in the load elements 760, 740 opposite the light particles 770 in the openings of the cellular carrier mask. The loads that provide and control the pressures on the elements 650, 680, 700, and hold them together, either the weight of the load elements, the additional weight loads, or the application of pressure on the elements of the mechanical force 800, e.g. C-clamps, It may be generated by the application of a magnetic field or the like. It can be seen that this method of holding the carrier and mask together provides an easy way to remove light particles that separate them and do not form part of the final abrasive product. This principle for maintenance can be easily done by a semi-automatic or fully automatic machine (eg using a robot). After removal of the mask 700 and the carrier-mask 680, if desired with the light particles 700 dispersed thereon and pressed into the carrier, the structure shown in FIG. 21 of the carrier 650 is achieved.

For the purposes of the present invention, the terms "sintering", "sintering under pressure or thermocompression", "sintering in solid state", "sintering in liquid state", "liquid sintering", "partial sintering", "with permeation Sintering "," nap soldering "," fusion "," deposition "," thermal curing "," thermal application "," electrodeposition "," electroplating "and their synonyms and alternatives are the same, namely useful abrasive materials and By means of incorporation of the component into the tool, it provides permanent retention of the light particles (survival of the light particles in the abrasive article) on or without a carrier or abrasive tool.

If the carrier is a metal foil or plate or a fully sintered material or solid metal appliance carrier (eg steel), when sufficient heat and / or pressure and / or atmosphere is applied to both the carrier and the holding material, the material is sintered or dissolved And serve as a soldering or melting material that permanently attaches or attaches the light particles to the carrier.

If the carrier is a powder composite and / or preform of a base retaining material (e.g., a non-sintered or partially sintered Co-Ni-Fe powder composite composed optionally with Ni-Cr-P additives), further retention Materials (such as 125 in FIG. 12) may be used. When sufficient heat and / or pressure and / or atmosphere is applied to both the carrier and / or additional holding material, this additional holding material will dissolve and penetrate into the carrier. When liquid, the material penetrates into and fills the pores of the base holding material, while at the same time several treatments (eg diffusion, decomposition, reduction, oxidation, graphite, between components of the base holding material and additional holding materials and light particles). Painting, etching). Therefore, in the intrusion treatment, the additional holding material changes the base holding material. At the same time, this material and / or its components attach the light particles to itself and to the base retaining material. As a result, the light particles are retained by the combination of the sintered carrier and the additional retaining material. This treatment may be referred to as "sintering by infiltration" or "infiltration", and may also be called "sintering by melting" or the like.

When heating occurs in the mold and pressure is applied to components of the carrier or holding material assembled from the light particles and / or holding material, the treatment is called "sintering under pressure" with or without a liquid state. The formation of the liquid phase depends on the synthesis and combination of the carrier and the holding material and their components.

In order to provide the strongest and most reliable light particle integration and bonding, the holding or retaining matrix material may be a sinterable matrix material sintered in a mold, either under a protective and / or negative atmospheric pressure or in the absence thereof. have. Moreover, this may be due to protective and / or negative atmospheric pressure; This occurs in the furnace with the liquid phase produced by the carrier and / or additional holding material.

In a preferred embodiment of the present invention, a smooth and easily deformable powder preform of a sinterable matrix material as disclosed in US Pat. No. 5,620,489 is used as a carrier and (by spraying on at least light particles and / or carriers). Additional retaining material in powder form is used to help stabilize the light particles in the desired pattern.

22 shows a variant of FIG. 12. An additional retaining material 125 of FIG. 12 is shown in the figure as a preform 125-1 with respect to the carrier 60-1. The hard particles 75-1 are in a preferred pattern on the preform 125-1. It is dispersed in the same manner as the above method. FIG. 23 shows these particles 75-1 pressed at least in part into material 125-1, through material 125-1 and into carrier 60-1 as shown in FIG. 24.

25 shows a variant of FIGS. 22-24. Here, the material 125-1 of FIG. 22 is a preform 125-2 located on top of the particles 75-2 dispersed on the carrier 60-1 in the same manner as the above method in the required pattern. to be. FIG. 26 shows material 125-2 and these particles 75-2 partially pressed into the carrier. The light particles may protrude from the surface of the preform 125-2 and the carrier. Means for providing protrusion of light particles over the maintenance surface are disclosed in US Pat. No. 5,203,880, which is incorporated herein by reference. These means can be used during or before or after heating the synthetic material.

The carrier for the particles may be a solid material which is used to support only the particles during processing and which is later discarded. In this case, the particles are dispersed on the carrier in the same desired pattern as described above, then surrounded by a holding material such as a sinterable matrix material and then sintered, so that they are embedded in the sintered material and are repositioned by the sintered material. Abrasive article is formed with the particles to be kept. The material may be provided by applying the sinterable matrix powder over the particles or by providing a preform of the sinterable matrix material over and / or under the particles and pressing the particles onto the preform during or before and after sintering.

On the other hand, the carrier 60 material itself may be a holding material that is integrated and bonded with the light particles (eg, cobalt, nickel, steel, manganese, molybdenum, tungsten, nickel-bronze composite). Sintering in the solid state, sintering under load or pressure in a mold of furnace or sintering pressure is the best treatment for such materials.

An option for the carrier is that the carrier comprises an additional retention-reinforcing material (eg, 0.5-10, preferably 3-7% by mass). Examples of such retention-reinforcing materials are low pressure bronze filter materials such as silver, copper, zinc and / or tin based materials and high temperature bronze filters, fusion and surface hardening materials. Preferably, these retention-reinforcing materials comprise at least some carbide forming materials (eg chromium, titanium) of the Periodic Table of IVA, VA, VIA, VIIA, IIB, and some metals of the IB and IIB Groups of the Periodic Table. It is configured to include. Sintering in the presence of the liquid phase (up to 30%, preferably 2-15% of the liquid phase) and sintering with infiltration are the best choices for this combined material. Sintering under load or pressure in the mold of the furnace and sintering pressure is preferred.

Another option for the carrier material is that it consists of an overwhelming additional fat-reinforcing material (at least 50% by weight) with the additive as described above. Sintering with infiltration in the presence of a liquid phase, or in some cases with direct kneading and melting, is the best choice for this combined material.

Another option for the carrier 60 is that it is made of any of the above materials and further has another additional holding material as shown in FIG. 12. Additional holding materials may comprise IVA, VA, VIA, VIIA, IIB of the periodic table of elements and at least some carbide forming materials of the IVB group (eg chromium, titanium) and / or some metals of the IB and IIB groups of the periodic table. It is composed.

Therefore, for the purposes of the present invention, and generally, in order to produce an abrasive article comprising light particles retained by the retention matrix, preferably retained by the predominant metal component, preferably in a deliberate manner. For the purpose of this, it is not important that the specific treatment (sintering, infiltration) be used to permanently retain the light particles.

It is to be understood that the material of the single layer can be multilayered by assembling the various monolayers together and integrating them into a single assembly, with or without adding additional parts to the assembly. Such treatments include thermosetting, vulcanization, sintering, brazing (all in molds, furnaces; by induction, conventional resistive heating; by flame / torch, adhesive, epoxy, glue, etc.).

The support, the interlayer, the tool work surface and the tool carrier can be added to or assembled with the composite and its assembly and used as a carrier. This assembly can be made before or after the final treatment of the synthetic material, for example before or after sintering.

Light particles include a small variety of natural and synthetic materials that provide abrasive properties, such as diamond (natural, synthetic and polycrystalline); Nitrides (eg, boric silica boride), carbides, borides, preferably mineral abrasives of the highest hardness, or combinations thereof.

Articles made by this method include abrasive and high grade abrasive single and multilayer surfaces, tools and wear resistant articles and parts, tools for cutting, grinding, roughening, drilling, dressing, polishing, and lapping. Examples of these articles include, but are not limited to, face and rotary grinding discs, drums and dressers; Segments; Reversible and freely used abrasive segments and portions for abrasive tools and wear resistant articles; Circular and reciprocating divided and continuous rim blades, drill bits; Contains bread for a wire saw.

Useful abrasive portions for abrasive and wear resistant articles and portions are described in US Pat. No. 5,791,330 (eg, by water jets and / or lasers) and “Methods for Making Sintered Articles and Products Produced thereby”. It can be obtained by extracting a useful abrasive portion from a single structure as disclosed in pending US patent application Ser. No. 09 / 448,840. The extracted portions can then be integrated together, for example by soldering, welding or sintering and used in a single unit.

With reference to FIG. 12, the particles are a solid material, such as a steel foil or plate, to which the particles are soldered or melted, and the carrier is pre-sintered or fully sintered, and the particles are pressed at least partially into the carrier for temporary holding. When the permanent retention of particles in the carrier is provided prior to or after positioning or pressing the particles into the carrier, by supplying a material in the form of a soldered or melted powder or preform (optionally preferably with flux) , Can be provided. The heat treatment then dissolves and solders the material, thereby retaining the particles in the carrier.

If the carrier is a solid material or a completely sintered material (eg 0-5% predominantly closed residual porosity), and without the penetration of particles into the carrier, the dissolved and soldered material will fuse the light particles into the carrier. . In this case, there is no substantial physical penetration of the dissolved material into the carrier. The carrier 60 as a solid or suitably presintered material does not shrink during the heat treatment. A furnace comprising a sintered body or a special brazing furnace (preferably in vacuum), an induction fixture, an open flame / torch can be used to provide the heat required for this treatment.

To braze diamond, nickel or cobalt based on fusion and brazing filter metal powders and preforms, preferably comprising carbide forming elements comprising chromium, titanium, boron, silica can be used. (By weight%) "4-25% Cr, 0-10% P, 2-3% B, 0-10% Si, 0-4% Fe, 0-15% W, 0-37% Mn, 0- 5% Cu, 0-5% Ta, 0-4% Al, 0-0.02% Y, 0-0.05% La, 0-0.03% Re, Ni and Co-balance ", is a Sulzer Plasma TeckniK, Inc. (Troy, MI) (material known as AMD Brazing Materials), Wall Colmony Corporation (Madison Heights, MI) (Colmony Hard Facing Alloys and High Temperature Brasing Filler Metals), Coast Metals (Friendswood, TX) (materials known as Hard FGacing Alloys) ) And powders or pastes or preforms (tape) from Lucas-Mihaupt, Inc. (a material known as High temperature Braising Alloys and Low Temperature Braising Alloys) of A Handy & Herman Company (Cudahy, WI). .

Powders or unsintered or partially sintered powder preforms, wherein the same materials and / or components thereof (eg cobalt and / or nickel) are all configured with substantially open porosity (eg 90 to 30%) It can be used in the form of. In addition, the same material may be used as additional holding material in the form of powder, paste, preform. In this case, the powder or preformed carrier has a substantially open porosity and therefore shrinks during heat treatment. There are two predominant treatments that occur during heating: (1) diffusion between the powder components of the carrier, accompanied by shrinkage and shape distortion of the carrier and an increase in its strength, and, if present, between the powder components of the additional retaining material. And diffusion of the dissolved phase into the open hole of the carrier in the process of diffusion and (2) heating and pore reduction. Note that the carrier or component can produce a liquid phase as a holding material at the same and lower temperatures. A combination of these two treatments can be described as sintering or sintering together with sintering or sintering in the presence of a liquid phase. Because of the tendency of shrinkage and distortion in the heat treatments to dislodge the light particles from their attachment position in the carrier, the application of heat is preferably accompanied by a weight load or pressure on the assembly of the carrier and the light particles. This treatment is carried out in a furnace or in a so-called sintering press and is usually referred to as hot compression or sintering under pressure.

Other embodiments of the present invention are apparent to those skilled in the art from consideration of the specification and examples of the present invention. The specification and characteristic embodiments are to be considered as examples of the invention and are considered to be within the scope and spirit of the invention.

Claims (33)

In order to hold the particles in place, a method of making an abrasive material comprising a plurality of light particles that provides abrasive quality dispersed in a retention matrix is provided. Positioning a mask having an opening for a carrier capable of supporting a plurality of the particles, providing an attachment means on an outer side of the mask away from the carrier to which light particles are attached, the outer surface of the mask Applying a plurality of light particles such that a portion of the particles passes through the openings of the mask to form a pattern of the particles on the openings of the mask and the corresponding carrier, and other portions of the particles are attached to the mask, on the carrier Separating the mask comprising the light particles attached from the carrier while leaving the pattern of particles, at least partially enclosing the particles on the carrier with a retaining matrix material, and heating the retaining matrix material so that the material is in the pattern And forming a retention matrix that holds the particles. How to make the abrasive material which comprises. The method of claim 1 wherein the retention matrix material is a sinterable matrix material. 3. The method of claim 2 wherein the carrier is a preform of sinterable matrix material. 4. The method of claim 3, wherein the particles are surrounded by at least partially sinterable matrix material, at least in part, by being pressed into the preform. The method of claim 4 wherein during heating the material, the particles are pressed into the preform. The method of claim 4, wherein the particles are pressed into the preform before heating the material. The method according to claim 4, wherein the preform of sinterable matrix material has dispersed light particles. The method of claim 2, wherein after separating the mask from the carrier, particles are surrounded by at least partially sinterable matrix material by applying a sinterable matrix material to the particles and carrier. The method of claim 1, wherein the carrier has an adhesive coating to which particles passing through the opening in the mask are attached. The method of claim 1 wherein the carrier forms part of an adhesive material. The method of claim 1 wherein the carrier is a mesh material. 12. The method of claim 11, wherein the mesh material forms part of the adhesive material. The method of claim 1 wherein the carrier is removed from the adhesive material after heating. The method of claim 1, wherein the side of the mask adjacent to the carrier temporarily attaches the mask to the carrier while providing particle attachment means, and when the mask is detached from the carrier, the adhesive is removed with the mask. How to. 15. The method of claim 14, wherein the attachment means for the mask is an adhesive coating. The method of claim 1, wherein the particles are pressed into the carrier through openings in the mask before the mask is separated from the carrier. The method of claim 1, wherein the particles are pressed against the carrier after the mask is removed and before the particles are at least partially enclosed in the retention matrix material. 10. The method of claim 9, wherein particles that are not attached to the mask or carrier are removed before the mask is separated from the carrier. The method of claim 1 wherein the mask has a plurality of openings of the same shape. A method according to claim 1, wherein the attachment means comprises an adhesive layer on the outside of the mesh. The method of claim 1 wherein the mask is a pressure sensitive adhesive tape having an adhesive on the tape providing the attachment means. 2. A method according to claim 1, wherein the mask is a double sided adhesive tape having one side of the adhesive providing the attachment means and particles on the other side for temporarily attaching the mask to the carrier while applying the particles. The method of claim 1 wherein the mask is separated from the carrier by winding the mask on a roll. The method of claim 1 wherein the particles are pressed before heating. The method of claim 24, wherein after the mask is removed, the particles are pressed into the carrier. The method of claim 24, wherein the particles are pressed against the carrier before the mask is removed. The method of claim 1 wherein additional retaining material is applied to the particles on the carrier prior to heating. 28. The method of claim 27, wherein the additional holding material is a soluble material that dissolves at a lower temperature than the retention matrix material. 28. The method of claim 27, wherein the additional retaining material is a brazing material. The method of claim 1 wherein the retention matrix material is a brazing material. The method of claim 1 wherein the retention matrix material is a mixture of a braze material and a sinterable material. The method of claim 1, wherein during heating of the retention matrix material, pressure is applied to the carrier and the particles. In order to hold the particles in place, a method of making an abrasive material comprising a plurality of light particles that provides abrasive quality dispersed in a retention matrix is provided. Positioning a mask having an opening to a carrier capable of supporting the plurality of particles, applying a plurality of light particles to the outside of the mask away from the carrier, a portion of the particle passing through the opening of the mask to mask the Forming a pattern of the particles on the carrier corresponding to the opening of and attaching another portion of the particles to the mast, separating the mask comprising light particles attached from the carrier while leaving the pattern of particles on the carrier At least partially enclosing the particles on the carrier with a retaining matrix material, and heating the retaining matrix material to form a retaining matrix that retains the particles in the pattern. Method of making abrasive materials.