CN114248209B - Diamond-solder composite belt and preparation process of brazed diamond tool based on same - Google Patents

Diamond-solder composite belt and preparation process of brazed diamond tool based on same Download PDF

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Publication number
CN114248209B
CN114248209B CN202111597042.4A CN202111597042A CN114248209B CN 114248209 B CN114248209 B CN 114248209B CN 202111597042 A CN202111597042 A CN 202111597042A CN 114248209 B CN114248209 B CN 114248209B
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diamond
solder
sensitive adhesive
tape
composite
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CN114248209A (en
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王波
林宗良
郭坤
丁潇杰
蔡昌鹏
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Jiangsu Weierbo New Material Technology Co ltd
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Jiangsu Weierbo New Material Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The invention discloses a diamond-solder composite belt and a preparation process of a brazed diamond tool based on the same. The diamond-solder composite belt is structurally composed of a double-sided pressure sensitive adhesive tape I, a diamond composite abrasive, an adhesive layer, a solder alloy layer and a double-sided pressure sensitive adhesive tape II from top to bottom in sequence, and the diamond-solder composite belt is attached to the surface of a substrate according to requirements through sticking cloth and then brazed to obtain the brazed diamond tool. The diamond-solder composite belt prepared by the invention is applied to the preparation of the brazed diamond tool, and the material distribution process of the diamond tool is simplified. The diamond-solder composite tape is prepared in advance in a mode of preparing the diamond-solder composite tape and then is attached to the surface of the substrate, batch and stable production of a material distribution process can be realized in the mode, the consistency is high, the operation requirement on workers is reduced, the equipment is simple and easy to operate, the preparation efficiency is obviously improved, and the diamond-solder composite tape has higher economic benefit.

Description

Diamond-solder composite belt and preparation process of brazed diamond tool based on same
Technical Field
The invention provides a diamond-solder composite belt and a preparation process of a brazed diamond tool based on the same, relates to a process for preparing the brazed diamond tool, and belongs to the field of diamond tool manufacturing.
Background
The existing brazing diamond tool has the advantages of sharpness and high efficiency due to high diamond exposure and high holding strength, and can be applied to processing in multiple fields of stone, castings, glass, ceramics, composite materials and the like. Due to the fact that the application fields are various, the structures of the diamond tools are different, the diamond tools are mainly divided into three types, namely drilling, cutting and grinding, and certain requirements are provided for the preparation process. The conventional preparation method is to arrange diamond and solder alloy particles on the surface of a substrate according to a certain mode. Some products use solder paste or solder pads, but due to manufacturing limitations, are less applicable.
In order to arrange diamond and solder alloy on the surface of a substrate and adapt to the shapes of substrates with various structures, various methods for arranging diamond and solder are invented in the field, for example, diamond particles are firstly distributed on the surface of the substrate manually or by equipment, then solder particles are filled in gaps of the diamond, and if the dosage of the solder is not enough, a binder is sprayed on the surface, and more solder particles are adhered. Or a layer of solder alloy particles is arranged firstly, then the surface is sprayed with the adhesive, and then the diamond particles are bonded.
The process has high requirements on operators in the preparation process, such as how to uniformly and densely scatter diamond particles, and because the product specifications are various, the diamond particles are difficult to completely replace by one or more automatic material distribution devices, manual operation is inevitable, and in addition, because the bonding of the surface of the substrate and solder or diamond is usually realized by using diluted bonding agents, the coating process has high requirements, and the diluted solvent has high volatility, so that the operation environment is influenced. And for the grinding tool or drill bit with special-shaped structure, the coating is difficult, the specification is multiple, the coating is difficult to be carried out by using a general tool, the manufacturing cost is increased, and the improvement of the production efficiency is influenced. Therefore, a new abrasive and solder preparation process is needed to fundamentally solve the problem of material distribution so as to adapt to different types of diamond tools.
Disclosure of Invention
Aiming at the problems of unstable material distribution process, low consistency and low preparation efficiency in the preparation process of the existing brazing diamond tool, the invention provides a preparation process of the brazing diamond tool based on a diamond-solder composite belt.
The invention provides a diamond-solder composite belt, which is structurally characterized in that a double-sided pressure sensitive adhesive tape I, a diamond composite abrasive, an adhesive layer, a solder alloy layer and a double-sided pressure sensitive adhesive tape II are sequentially arranged from top to bottom;
the double-sided pressure-sensitive adhesive tapes I and II comprise acrylate pressure-sensitive adhesives, wherein one side of each double-sided pressure-sensitive adhesive tape is a base material, and the other side of each double-sided pressure-sensitive adhesive tape is an acrylate pressure-sensitive adhesive film, and one side of each acrylate pressure-sensitive adhesive film of each double-sided pressure-sensitive adhesive tape faces to the diamond composite abrasive or the solder alloy layer and is used for adhering the diamond composite abrasive or the solder alloy;
the adhesive layer is prepared by mixing acrylate and a diluent according to the weight ratio of 1:5 to 1:12 volume ratio; the diluent is an organic solvent, and the organic solvent is acetone;
the diamond composite abrasive is prepared by mixing diamond and alumina particles according to the same particle size, wherein the mass ratio of diamond to alumina particles is 3:1 to 8:1 by volume ratio;
the diamond granularity interval is 16 meshes-120 meshes; the diamond is an artificial diamond;
the solder alloy used by the solder alloy layer is nickel-based alloy solder and can generate metallurgical chemical reaction with diamond; the granularity of the solder alloy is 40-300 meshes, and the solder alloy distributed on the same diamond-solder composite belt can be uniform in granularity or mixed in granularity. The solder alloy layer is also a granular layer, so the thickness of the solder alloy layer is generally the maximum grain size height of the solder alloy granules used, and is generally 70-80% of the average grain size of the diamond granules.
The preparation method of the diamond-solder composite band comprises the following steps: firstly spreading a solder alloy layer on the surface of an acrylate pressure-sensitive adhesive film of a double-sided pressure-sensitive adhesive tape II, then spraying a layer of adhesive on the surface of the solder alloy layer, adjusting the concentration of the adhesive according to the proportion of a diluent, then spreading a diamond composite abrasive material above the adhesive layer, and finally bonding the double-sided pressure-sensitive adhesive tape I on the surface of the diamond composite abrasive material layer for the convenience of operation to obtain the diamond-solder composite tape.
Because the surface of the alloy solder has viscosity, a layer of diamond composite abrasive is paved and buried on the alloy solder, and the purpose of adopting the composite abrasive is to reduce the risk of uneven arrangement, wherein the diamond composite abrasive is prepared by mixing artificial diamond and alumina particles according to the weight ratio of 3:1 to 8:1, because the nickel-based alloy solder and the alumina do not react, the alumina particles only play a spacing role.
The invention provides a preparation process of a brazed diamond tool based on a diamond-solder composite band, which comprises the following specific steps:
(1) Cleaning the surface of a substrate of the brazed diamond tool, and removing oil stains and rust stains;
(2) Preparing a diamond-solder composite tape in advance according to design requirements, pasting the diamond-solder composite tape on an area where diamonds need to be arranged on the surface of a base body, tearing off a base material of a double-sided pressure sensitive adhesive tape II below a solder alloy layer during pasting, pasting the diamond-solder composite tape on the surface of the base body, and tearing off the base material of the pressure sensitive adhesive tape I above a diamond composite abrasive after the bonding is finished;
(3) And (3) carrying out vacuum brazing on the integral structure obtained in the step (2).
And (2) cleaning the surface of the substrate in the step (1) by adopting sand blasting, and cleaning by using alcohol.
The diamond-solder composite tape prepared in the step (2) can be prepared in two ways, one way is that the diamond-solder composite tape with a large area can be prepared, and then the diamond-solder composite tape is cut according to the shape of a cloth area and is adhered to the surface of a substrate; alternatively, a double-sided pressure sensitive adhesive tape may be cut into a desired shape, adhered to the surface of a substrate, and then a diamond-solder composite tape may be prepared.
The vacuum brazing condition in the step (2): the highest brazing temperature is 930-1080 ℃, the temperature is kept for 15-25 minutes, and the whole process of the vacuum degree is kept higher than 0.1Pa.
The invention is described in detail below.
The most key part of the method is the preparation of the diamond-solder composite belt, which is equivalent to unifying the arrangement process of the surface of the substrate, leading the preparation process to be single and controllable and reducing the influence of the structure and the surface appearance of the substrate. According to the preparation process of the brazing diamond tool, the following steps are known: the diamond is firmly welded on the surface of the substrate by melting the solder alloy, and the mode of optimal appearance is to spread the solder alloy layer on the surface of the substrate and then distribute the diamond on the surface of the solder layer. Therefore, the structure of the diamond-solder composite belt is also simulated by the shape, and the structure is as follows from top to bottom: double-sided pressure sensitive adhesive tape, diamond composite abrasive, adhesive layer, solder alloy layer and double-sided pressure sensitive adhesive tape. Wherein, the surfaces of the upper and lower layers of pressure sensitive adhesive tapes are provided with a layer of base material, which is beneficial to preparation, transportation and packaging.
When the composite tape is prepared, firstly, the surface of a substrate is cleaned, and then the area of the surface, which needs to be welded with diamond, is coated with the composite tape, wherein the area of the surface of the substrate needed can be various, and the prepared composite tape can be prepared in two ways, namely, the composite tape with a large area can be prepared, and then the composite tape is cut according to the shape of a cloth area; alternatively, the double-sided adhesive tape may be cut into a desired shape and then prepared on the surface.
The acrylate in the invention can be gasified and volatilized when being heated to 250 ℃, so that the components of the adhesive tape basically do not influence the welding process when the brazing diamond tool is prepared in a vacuum furnace.
When the diamond-solder composite tape is adhered to the surface of the base body, the base material of the solder alloy end pressure-sensitive adhesive tape is torn off, the composite tape is adhered to the surface of the base body, and after the adhesion is finished, the base material of the diamond end pressure-sensitive adhesive tape is torn off.
The diamond-solder composite belt prepared by the invention is applied to the preparation of the brazed diamond tool, and the material distribution process of the diamond tool is simplified. The diamond-solder composite tape is prepared in advance in a mode of preparing the diamond-solder composite tape and then is attached to the surface of the substrate, batch and stable production of a material distribution process can be realized, the consistency is high, the operation requirement on workers is reduced, the equipment is simple and easy to operate, the preparation efficiency is obviously improved, and the diamond-solder composite tape has higher economic benefit.
Drawings
Fig. 1 is a schematic structural view of a diamond-solder composite tape according to the present invention.
In fig. 1, each is labeled: 1 double-sided pressure-sensitive adhesive tape I, 2 diamond, 3 alumina particles, 4 adhesive layers, 5 nickel-based alloy solder and 6 double-sided pressure-sensitive adhesive tape II.
Detailed Description
The present invention will be described in further detail with reference to the following examples, but the present invention is not limited to the following examples. The present invention includes various alterations and modifications made by those skilled in the art based on the above technical ideas and conventional means, and is intended to be included in the scope of the present invention.
Detailed description of the preferred embodiment example 1
A brazing diamond grinding disc is used for grinding the surface of stone materials, and the design parameters are as follows:
the granularity of the diamond is selected to be 35/40 meshes, and the diamond is mixed with 35/40 meshes of alumina according to the proportion of 4:1 volume ratio, the solder is BNi2 nickel-based alloy solder in a 40/60 mesh interval, the outer diameter of the grinding disc is 125, the distribution area is circular and has a width of 25mm, and the preparation process comprises the following steps:
(1) Preparing a diamond-solder composite tape: the diamond granularity adopts 35/40 meshes, the solder adopts 40/60 mesh interval, and the adhesive layer between the solder and the diamond composite abrasive adopts 1:8 volume ratio of acrylate and diluent; two sides of the diamond and the solder are respectively pasted with a layer of double-sided pressure sensitive adhesive tape, and the double-sided pressure sensitive adhesive tape is prepared and cut into a circular ring shape with the width of 25mm;
(2) Sand blasting and cleaning the surface of the millstone matrix, and cleaning the millstone matrix by using alcohol;
(3) Tearing off the base material of the double-sided pressure-sensitive adhesive tape at the solder end, and pasting the base material on the surface of the grinding disc base body;
(4) Tearing off the base material of the diamond-end double-sided pressure-sensitive adhesive tape;
(5) And (4) furnace brazing, wherein the maximum temperature of the vacuum brazing process is 1022 ℃, and the heat preservation time is 20 minutes.
Detailed description of the preferred embodiment example 2
A brazed diamond grinding wheel is used for cleaning and grinding castings, and has the following design parameters:
the granularity of the diamond is 30/35 mesh, and the diamond is mixed with 30/35 mesh alumina according to the proportion of 5:1 volume ratio to form the composite abrasive; the welding flux is BNi2 nickel-based alloy welding flux in an interval of 40/60 meshes and an interval of 50 meshes/80 meshes, the outer diameter of the grinding wheel is 400mm, the inner hole is 50mm, the thickness is 40mm, the side width is 10mm, the corner radius of an outer circle surface and a side surface R is 5mm, and the distribution area is 10mm between the outer circle surface and the side surface of the grinding wheel, and the preparation process comprises the following steps:
(1) Preparing a diamond-solder composite tape: the diamond granularity adopts 35/40 meshes, the solder adopts 40/60 mesh interval, and the binder layer between the solder and the diamond adopts 1: mixing 8 volume percent of acrylic acid and a diluent, and sticking a layer of double-sided pressure sensitive adhesive tape on both sides of the diamond and the solder;
because the grinding wheel has a larger structure and a simple appearance, the double-sided adhesive tape can be cut into a required shape, and the double-sided adhesive tape can be disassembled into a strip belt according to the appearance of the grinding wheel, wherein the strip belt has the width of 40mm, the diameter of 1256mm, the outer diameter of a circular ring of 400mm and the width of 10mm; then coating solder alloy on one end of the double-sided adhesive tape with the pressure-sensitive adhesive, then integrally spraying an adhesive layer, coating diamond and aluminum oxide composite abrasive, and then adhering a layer of double-sided adhesive tape on the surface;
(2) Sand blasting and cleaning the surface of the grinding wheel matrix, and cleaning the surface by using alcohol;
(3) Tearing off the base material of the double-sided pressure-sensitive adhesive tape at the solder end, and attaching the base material to the surface of the grinding wheel matrix;
(4) Tearing off the base material of the diamond-end double-sided pressure-sensitive adhesive tape;
(5) And (4) furnace brazing, wherein the maximum temperature of the vacuum brazing process is 1024 ℃, and the heat preservation time is 25 minutes.

Claims (9)

1. A diamond-solder composite tape, characterized by: the structure of the diamond composite abrasive tape comprises a double-sided pressure-sensitive adhesive tape I (1), a diamond composite abrasive, a binder layer (4), a solder alloy layer (5) and a double-sided pressure-sensitive adhesive tape II (6) from top to bottom in sequence;
the double-sided pressure-sensitive adhesive tapes I and II comprise acrylate pressure-sensitive adhesives, wherein one side of each double-sided pressure-sensitive adhesive tape I is a base material, and the other side of each double-sided pressure-sensitive adhesive tape II is an acrylate pressure-sensitive adhesive film, wherein one side of the acrylate pressure-sensitive adhesive film of the double-sided pressure-sensitive adhesive tape I faces towards the diamond composite abrasive, and the other side of the acrylate pressure-sensitive adhesive film of the double-sided pressure-sensitive adhesive tape II faces towards the solder alloy layer;
the adhesive layer (4) is prepared by mixing acrylate and a diluent according to the proportion of 1:5 to 1:12 volume ratio, wherein the diluent is an organic solvent;
the diamond composite abrasive is prepared by mixing diamond (2) and alumina particles (3) according to the same particle size, wherein the ratio of 3:1 to 8:1, uniformly mixing and preparing;
the solder alloy used by the solder alloy layer is nickel-based alloy solder and can generate metallurgical chemical reaction with diamond.
2. A diamond-solder composite tape according to claim 1, wherein the diamond grain size interval is 16 to 120 mesh; the diamond is an artificial diamond.
3. The diamond-solder composite strip according to claim 2, wherein the solder alloy particle size is 40-300 mesh, and the solder alloys arranged on the same diamond-solder composite strip have a uniform particle size or a mixed particle size;
the thickness of the solder alloy layer is 70-80% of the average grain diameter of the diamond grains.
4. A diamond-solder composite tape according to claim 3, wherein the organic solvent used for the adhesive layer is acetone.
5. A method of manufacturing a diamond-solder composite tape according to any one of claims 1 to 4, wherein: firstly spreading a solder alloy layer on the surface of an acrylate pressure-sensitive adhesive film of a double-sided pressure-sensitive adhesive tape II, then spraying a layer of adhesive on the surface of the solder alloy layer, adjusting the concentration of the adhesive according to the proportion of a diluent, then spreading a diamond composite abrasive material above the adhesive layer, and finally bonding the double-sided pressure-sensitive adhesive tape I on the surface of the diamond composite abrasive material layer to obtain the diamond-solder composite tape.
6. A process for the preparation of a brazed diamond tool based on the diamond-solder composite strip according to any one of claims 1 to 4, characterized in that it comprises the following specific steps:
(1) Cleaning the surface of a substrate of the brazed diamond tool, and removing oil stains and rust stains;
(2) Preparing a diamond-solder composite tape in advance according to design requirements, pasting the diamond-solder composite tape on an area where diamonds need to be arranged on the surface of a base body, tearing off a base material of a double-sided pressure sensitive adhesive tape II below a solder alloy layer during pasting, pasting the diamond-solder composite tape on the surface of the base body, and tearing off the base material of the pressure sensitive adhesive tape I above a diamond composite abrasive after the bonding is finished;
(3) And (3) carrying out vacuum brazing on the integral structure obtained in the step (2).
7. The process for preparing a brazed diamond tool according to claim 6, wherein the surface of the substrate in the step (1) is cleaned by sand blasting and cleaned by alcohol.
8. The process for preparing a brazed diamond tool according to claim 6, wherein the diamond-solder composite tape prepared in the step (2) is prepared in two ways, one is a diamond-solder composite tape with a large area, and the diamond-solder composite tape is cut according to the shape of the cloth area and then is adhered to the surface of the substrate; alternatively, a double-sided pressure sensitive adhesive tape may be cut into a desired shape, adhered to the surface of a substrate, and then a diamond-solder composite tape may be prepared.
9. The process for manufacturing a brazed diamond tool according to claim 6, wherein the vacuum brazing conditions in the step (3): the highest brazing temperature is 930-1080 ℃, the temperature is kept for 15-25 minutes, and the whole process of the vacuum degree is kept higher than 0.1Pa.
CN202111597042.4A 2021-12-24 2021-12-24 Diamond-solder composite belt and preparation process of brazed diamond tool based on same Active CN114248209B (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1261301A (en) * 1997-04-04 2000-07-26 宋健民 Brazed diamond tools by infiltration
CN1420810A (en) * 1999-12-17 2003-05-28 顶点研磨料系统责任有限公司 Abrasive surface and article and methods for making them
CN1657257A (en) * 2004-02-17 2005-08-24 河南黄河旋风股份有限公司 Diamond saw bit and its manufacturing method
CN102317037A (en) * 2008-12-18 2012-01-11 新日铁高新材料株式会社 Saw wire and method of manufacturing saw wire
CN202212646U (en) * 2010-12-03 2012-05-09 H·埃里克松 Bidirectional cutting device and saw ring used by same
CN203156160U (en) * 2013-01-15 2013-08-28 河南富耐克超硬材料股份有限公司 Brazing saw web
CN207915767U (en) * 2018-03-07 2018-09-28 禹州七方超硬材料制品有限公司 Integrated mixed mud cast-cutting saw slice
CN110026610A (en) * 2019-04-19 2019-07-19 江苏锋菱超硬工具有限公司 Light-duty thinned abrasive compound brazing saw blade and its production method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9238207B2 (en) * 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US20060254154A1 (en) * 2005-05-12 2006-11-16 Wei Huang Abrasive tool and method of making the same
CA2773197A1 (en) * 2012-03-27 2013-09-27 Yundong Li Electroplated super abrasive tools with the abrasive particles chemically bonded and deliberately placed, and methods for making the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1261301A (en) * 1997-04-04 2000-07-26 宋健民 Brazed diamond tools by infiltration
CN1420810A (en) * 1999-12-17 2003-05-28 顶点研磨料系统责任有限公司 Abrasive surface and article and methods for making them
CN1657257A (en) * 2004-02-17 2005-08-24 河南黄河旋风股份有限公司 Diamond saw bit and its manufacturing method
CN102317037A (en) * 2008-12-18 2012-01-11 新日铁高新材料株式会社 Saw wire and method of manufacturing saw wire
CN202212646U (en) * 2010-12-03 2012-05-09 H·埃里克松 Bidirectional cutting device and saw ring used by same
CN203156160U (en) * 2013-01-15 2013-08-28 河南富耐克超硬材料股份有限公司 Brazing saw web
CN207915767U (en) * 2018-03-07 2018-09-28 禹州七方超硬材料制品有限公司 Integrated mixed mud cast-cutting saw slice
CN110026610A (en) * 2019-04-19 2019-07-19 江苏锋菱超硬工具有限公司 Light-duty thinned abrasive compound brazing saw blade and its production method

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