KR200264007Y1 - Wafer transfer equipment - Google Patents

Abstract

The present invention relates to a semiconductor wafer transfer apparatus in which a wafer transfer position is accurately maintained. The wafer transfer apparatus according to the present invention is installed at predetermined intervals so as to seat a wafer, and transfers wafers to a predetermined work area. The transfer table, at least four or more transfer guides provided at both ends of the first and second transfer tables, and the transfer guides to drive the wafer to be detached or seated from the first and second transfer tables. A servo motor that extends or narrows the interval between the first and second carriages, a light emitting sensor provided on one side of the first and second carriages to control the driving of the servo motor, and the first and second light emitting sensors corresponding to each other. It consists of a light receiving sensor installed on the other side of the second conveyance.

Thus, there is an effect that the wafer to be transferred is accurately positioned in the work area.

Description

Wafer Transfer Device

The present invention relates to a wafer transfer device, and more particularly, to a wafer transfer device that improves the accuracy of the transfer position of the wafer when transferring the wafer to the work area.

1 is a plan view of a wafer transfer device for transferring a wafer to apply a coating liquid onto a wafer in a rotary coating device, wherein a conventional wafer transfer device has a fixed upper, lower track 1a, 1b, and There are first and second carriage guides 2a and 2b provided at both ends of the upper and lower tracks, respectively. The second transfer guide guider (2b) is formed stepped to serve as a stopper to adjust the position.

The wafer 6 is installed at predetermined intervals between the first and second carrier guides 2a and 2b so that the wafer 6 is seated, and when the wafer 6 is seated, the wafer 6 is driven by a belt drive (not shown). ) And the first and second transfer tables 3a, 3b for transferring the upper portion of the spin chuck 5 are connected to each other.

The first and second transfer tables 3a and 3b are provided with wafer steps 4a and 4b, respectively, to stop the wafer 6 transferred from the upper end of the spin chuck 5, and the cylinder ( In connection with the 7), the interval between the first and second transfer tables 3a and 3b is widened or narrowed by the driving of the cylinder 7.

The wafer transfer by the wafer transfer device having such a structure is performed when the wafer 6 is seated on the first and second transfer tables 3a and 3b by a transfer means (not shown). The wafer 6 transferred to the upper end of the spin chuck 5 is stopped at the top of the spin chuck 5 by the wafer steps 4a and 4b.

Subsequently, the spin chuck 5 moves upward to vacuum suck the transferred wafer 6, and the first and second transfer tables 3a and 3b are spaced apart by the cylinder 7 at a predetermined interval. Will be opened.

Thereafter, the spin chuck 5 descends downward to perform a rotation coating process on the wafer 6, and when the applied wafer 6 rises upward by the spin chuck 5, the first and second spacings are widened. The second conveyances 3a and 3b are narrowed again until the second conveyance 3b is brought into contact with the stepped portion of the second conveyance guide 2b by the cylinder 7, and the wafer (6) is seated on the first and second conveyers 3a, 3b.

The wafers 9 seated on the first and second transfer tables 3a and 3b are belt driven and moved to the next process.

However, in such a conventional wafer transfer apparatus, the first and second transfer stages are subjected to shocks such as vibration by the cylinder driving while the intervals are widened or narrowed by the cylinders.

In particular, an impact is generated when the second carriage is driven and contacted by the cylinder by the stepped portion of the second carriage guide, and the impact of the wafer steps or the entire wafer transfer attached to the first and second carriages is caused by the impact. The position of the device is displaced.

Such a misaligned position does not accurately maintain the transfer position of the wafer, thereby shifting the transfer position of the wafer and the wafer vacuum suction position of the spin chuck.

Therefore, the wafer unstablely vacuum-adsorbed to the spin chuck has a problem in that the coating liquid is unevenly applied during the spin coating process and breakage of the wafer during the spin chuck rotation occurs when the transfer position and the vacuum suction position are greatly displaced.

Accordingly, the present invention has been made to solve the problems of the prior art, to accurately maintain the wafer transfer position to uniformly apply the coating liquid on the wafer, and to provide a wafer transfer apparatus for preventing wafer breakage There is this.

Therefore, in order to achieve the above object, the present invention is a wafer transfer apparatus equipped with a first and second transfer table for transferring the wafer to a predetermined working area is installed at a predetermined interval so that the wafer is seated, the first and At least four carriage guides provided at both ends of each of the second carriages, and the carriage guides drive the gap between the first and second carriages so that the wafer is separated or seated from the first and second carriers. A servo motor for widening or narrowing the motor, a pair of light emitting sensors provided on one side of the first and second feeders for controlling the driving of the servo motor, and the other side of the first and second feeders so as to correspond to the light emitting sensors. It consists of a pair of light-receiving sensors installed on it.

1 is a plan view of a conventional wafer transfer apparatus,

2 is a plan view of the wafer transfer device of the present invention.

Brief description of the main parts of the drawings

1,101: Transport track 2a, 2b, 102: Transport guide

3,103 transfer tray 4,104 wafer step

5,105: spin chuck 6,106: wafer

107 light emitting sensor 108 light receiving sensor

109: Servo Motor

Hereinafter, with reference to the accompanying drawings, the wafer transfer device of the present invention will be described.

2 is a plan view of the wafer transfer device of the present invention, wherein the wafer transfer device of the present invention is provided with fixed upper and lower tracks 101a and 101b, and the upper and lower tracks 101a and 101b. First and second conveyance tables 103a and 103b which are installed at predetermined intervals to allow the wafer 106 to be seated therein and which convey the wafer 106 to the upper end of the spin chuck 105 by belt driving (not shown). ) Is installed.

Wafer steps 104a and 104b are provided to stop the wafers 106 transferred to the upper ends of the spin chucks 105 of the first and second transfer tables 103a and 103b, respectively.

In addition, first and second carriage guides 102a and 102b driven by the servomotor 109 are installed at both ends of the first carriage 103a, and both ends of the second carriage 103b. The third and fourth carriage guides 102c and 102d driven by the servomotor 109 are installed to correspond to the first and second carriage guides 102a and 102b.

The first to fourth carriage guides 102a to 102d are connected to the first and second carriages 103a and 103b in the form of a threaded spiral.

Then, a light emitting sensor 107 is installed on one side of the first and second conveyances 103a and 103b, respectively, and a light receiving sensor is provided on the other side of the first and second conveyances 103a and 103b. Install 108 respectively.

The light emitting sensor 107 and the light receiving sensor 108 control the driving of the servo motor 108.

The wafer transfer in the wafer transfer device having such a configuration is as follows.

When the wafers 106 are seated on the first and second conveyers 103a and 103b by the conveying means (not shown), the wafers are belt driven to be transferred to the top of the spin chuck 105 where the coating process is to proceed. The wafer to be transferred is stopped at the working position above the spin chuck 105 by the wafer steps 104a and 104b.

Subsequently, the spin chuck 105 moves upward to vacuum suction the transferred wafer, and the carriage guides 102a to 102d connected to the first and second carriages 103a and 103b are servo motors 109. Rotational drive by) to widen the interval between the first and second conveyance (103a, 103b).

At this time, since the driving of the first and second carriages 103a and 103b is made by the servo motor 109, vibration is suppressed, and the first to fourth carriage guides 102a to 102d are threaded. The formed spiral shape ensures that the drive of the servomotor 109 is transmitted securely.

When the first and second conveyers 103a and 103b are widened by the servomotor 109 and the light continuously generated by the light emitting sensor 107 is detected by the light receiving sensor 108, the first and second conveyers 103a and 103b are first and second. The distance between the second conveyance table 103a, 103b means that the wafer 106 has been widened to move on the spin chuck 105, so that the light emitting sensor 107 and the light receiving sensor 108 each have a servo motor. The driving of 109 is stopped so that the gap is no longer widened.

Thereafter, the spin chuck 105 descends downward to advance the rotation coating process to the wafer 106, and after the application is completed, the wafer 106 is raised upward again by the spin chuck 105.

At this time, the servo motor 109 is driven in the reverse direction to reverse the first and fourth carriage guides (102a to 102d) to narrow the gap between the first and second carriage (103a, 103b).

When the gap between the first and second transfer tables 103a and 103b is narrowed and the wafer 106 blocks the light received by the light receiving sensor 108 from the light emitting sensor 107, the driving of the servomotor 109 is stopped. If it stops so that the space | interval of the 1st and 2nd conveyance tables 103a and 103b does not become narrow anymore, the wafer 106 will be seated on the 1st and 2nd conveyance tables 103a and 103b, and it will move to the next process. Transferred.

As described above, in the wafer transfer device of the present invention, the spacing of the transfer table is controlled by the drive of the servo motor to improve driving stability, and the position accuracy of the wafer is improved, so that the wafer transfer position and the vacuum suction position of the spin chuck are improved. By maintaining it correctly, the film thickness of the coating liquid applied on the wafer becomes uniform, and wafer breakage is prevented.

Claims (1)

In the wafer transfer apparatus provided with a first and a second transfer table which is provided at a predetermined interval so that the wafer is seated to transfer the wafer to a predetermined working area, At least four carriage guides installed at both ends of each of the first and second carriages and formed in a spiral shape having a thread; A plurality of servo motors for driving the carrier guider to widen or narrow the interval between the first and second carriers so that the wafer is separated from or seated on the first and second carriers; A light emitting sensor installed at one side of the first and second conveyances to control the driving of the servo motor; And a light receiving sensor provided on the other side of the first and the second conveyance table so as to correspond to the light emitting sensor.