KR200257219Y1 - Manufacturing apparatus for electro-luminescence - Google Patents

Abstract

The present invention relates to an apparatus for manufacturing an organic light emitting device capable of removing organic substances attached to a mask.

An apparatus for manufacturing an organic light emitting device according to the present invention includes a substrate holder 64 on which a substrate 58 is mounted; A deposition source 54 containing a light emitting organic material to be deposited on the substrate 58; Metal is formed between the substrate 58 and the film-forming source 54 and a plurality of holes are formed in a predetermined pattern to supply the light emitting organic material supplied in a vapor state to the substrate 58 in a predetermined pattern. A mask 56; A vacuum chamber 52 formed to cover the substrate holder 64, the metal mask 56, and the deposition source 54; A high frequency power source 72 connected to the vacuum chamber 52 for causing high frequency discharge in the vacuum chamber 52 and a ground voltage source connected to the substrate holder 64 are provided.

Description

Device for manufacturing organic light emitting device {MANUFACTURING APPARATUS FOR ELECTRO-LUMINESCENCE}

The present invention relates to an apparatus for manufacturing an organic light emitting device, and more particularly, to an apparatus for manufacturing an organic light emitting device capable of removing an organic material attached to a mask.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include Liquid Crystal Display (LCD), Field Emission Display (FED), Plasma Display Panel (PDP), and Electro-Luminescence (EL). And display devices.

The EL display device is a display device using an EL (Electro-Luminesce) phenomenon in which light is generated by a voltage applied to a phosphor. The EL display device has a fast response speed, low DC driving voltage, and ultra-thin film, compared to a light-receiving device such as an LCD, which is currently being spotlighted. On the other hand, the EL display device is divided into an inorganic EL display device and an organic EL display device according to the material and structure used.

1 is a view showing an organic EL display device.

Referring to FIG. 1, the organic EL display device includes a light emitting layer 45 and a light emitting layer 45 formed between the metal electrode 42 and the transparent electrode 48, the metal electrode 42 and the transparent electrode 48. And an electron injection layer 43 and an electron transport layer 44 formed between the metal electrode 42, a hole injection layer 47 and a hole transport layer formed between the light emitting layer 45 and the transparent electrode 48 ( 46).

The metal electrode 42 is made of a conductive material such as Al. The metal electrode 42 receives a scanning pulse from a gate driving circuit (not shown). The transparent electrode 48 is formed of a transparent conductive material such as indium-tin-oxide (ITO). The transparent electrode 48 receives data from a data driving circuit (not shown). When a scanning pulse is supplied to the metal electrode 42 and data is applied to the transparent electrode 48, holes generated from the transparent electrode 48 are accelerated toward the metal electrode 42, and electrons generated from the metal electrode 42 Accelerated toward the transparent electrode 48.

The electron injection layer 43 supplies electrons supplied from the metal electrode 42 to the electron transport layer 44. The electron transport layer 44 accelerates and supplies electrons supplied from the electron transport layer 43 to the light emitting layer 45. The hole injection layer 47 supplies holes supplied from the transparent electrode 48 to the hole transport layer 46. The hole transport layer 46 accelerates the holes supplied from the hole transport layer 47 and supplies them to the light emitting layer 45.

Holes supplied from the hole transport layer 46 and electrons supplied from the electron transport layer 44 collide at the center of the light emitting layer 45. In this case, light is generated in the emission layer 45 by recombination of electrons and holes. In other words, when a driving signal is applied to the transparent electrode 48 and the metal electrode 42, electrons and holes are emitted, and the electrons and holes emitted from the transparent electrode 48 and the metal electrode 42 are emitted from the light emitting layer 45. Recombination in the interior will generate visible light. At this time, the generated visible light comes out through the transparent electrode 48 to display a predetermined image or image.

Meanwhile, the light emitting materials of red (R), green (G), and blue (B) forming the light emitting layer 45 are deposited in the organic material deposition apparatus.

2 is a view showing a conventional organic material deposition apparatus.

Referring to FIG. 2, a conventional organic material deposition apparatus 2 includes a chamber 4, a film forming source 6 containing red (R), green (G), and blue (B) light emitting organic materials, A substrate 10 having a transparent electrode (not shown), a metal mask 8 provided between the film forming source 6 and the substrate 10, a substrate holder 16 for supporting the substrate 10, Magnet 12 for close contact with metal mask 8 and substrate 10, support rod 14 for supporting magnet 12, substrate holder 16, metal mask 8, etc. for supporting A support 18 is provided.

The chamber 4 maintains a vacuum state during the deposition process in order to prevent foreign substances from entering from the outside and improve the deposition force of the organic material. On the bottom of the chamber 4, a plurality of deposition sources 6 are installed. The light emitting organic materials of red (R), green (G), and blue (B) are respectively stored in the deposition sources 6. The film forming source 6 is heated to a predetermined temperature during the deposition process.

The metal mask 8 allows the light emitting organic material to be deposited on the substrate 10 in a predetermined pattern. To this end, a plurality of holes 24 are formed in the metal mask 8 in a predetermined pattern as shown in FIG. 3. The holes 24 selectively pass through the light emitting organic material supplied in a vapor state from the film forming source 6 to supply the substrate 10.

The CCD (Charge Coupled Device) camera 20 formed on the upper part of the chamber 4 is used at the time of aligning the substrate and the metal mask 8. The substrate holder 16 supports the substrate 10 during the deposition process. The magnet 12 supplies a predetermined magnetic force to the metal mask 8 to bring the metal mask 8 into close contact with the substrate 10.

Referring to the operation process in detail, first, the substrate 10 is supplied to the substrate holder 16 from the outside. When the substrate 10 is supplied to the substrate holder 16, the user aligns the substrate 10 and the metal mask 8 using the CCD camera 20. After the substrate 10 and the metal mask 8 are aligned, a predetermined magnetic force is supplied to the magnet 12 to closely contact the substrate 10 and the metal mask 8. At this time, the chamber 4 maintains a vacuum state.

Thereafter, predetermined heat is supplied to the film forming source 6 to heat the film forming source 6. When the film forming source 6 is heated to a constant temperature (about 200 ° C.), the luminescent organic substances contained in the film forming source 6 are evaporated. The luminescent organic materials evaporated from the deposition source 6 are deposited on the substrate 10 in a predetermined pattern via the holes 24 of the metal mask 8. In this case, the shield 22 formed to partially overlap the metal mask 8 prevents the light emitting organic materials in the vapor state from being supplied to the CCD camera 20.

However, when the deposition process is performed a predetermined number of times in the organic material deposition apparatus 2, the light emitting organic materials are caught in the holes 24 of the metal mask 8, and thus the holes 24 are formed by the light emitting organic materials. I get stuck. In this way, when the hole 24 is blocked, the light emitting layer 45 as shown in FIG. 1 is not formed, and the metal electrode 42 and the transparent electrode 48 are shorted to cause a defect.

Accordingly, an object of the present invention is to provide an apparatus for manufacturing an organic light emitting device capable of removing organic substances attached to a mask.

1 is a view showing a general organic light emitting device.

2 is a view showing a conventional organic material deposition apparatus.

3 is a view showing a metal mask shown in FIG.

4 is a view showing an organic material deposition apparatus according to an embodiment of the present invention.

5 is a view showing an organic material deposition apparatus according to another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

2,50 organic material deposition apparatus 4,52 chamber

6,54 source for deposition 8,56 metal mask

10,58: substrate 12,60: magnet

14,62: support rod 16,64: substrate holder

18,66 support 20,68 CCD camera

22,70: Shield 24: Hole

42 metal electrode 43 electron injection layer

44: electron transport layer 45: light emitting layer

46: hole transport layer 47: hole injection layer

48: transparent electrode 72,74: RF power

In order to achieve the above object, the device for manufacturing an organic light emitting device according to the present invention includes a substrate holder 64 on which a substrate 58 is mounted; A deposition source 54 containing a light emitting organic material to be deposited on the substrate 58; Metal is formed between the substrate 58 and the film-forming source 54 and a plurality of holes are formed in a predetermined pattern to supply the light emitting organic material supplied in a vapor state to the substrate 58 in a predetermined pattern. A mask 56; A vacuum chamber 52 formed to cover the substrate holder 64, the metal mask 56, and the deposition source 54; A high frequency power source 72 connected to the vacuum chamber 52 for causing high frequency discharge in the vacuum chamber 52 and a ground voltage source connected to the substrate holder 64 are provided.

Other objects and features of the present invention in addition to the above object will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 4 to 5.

4 is a view showing an organic material deposition apparatus according to an embodiment of the present invention.

Referring to FIG. 4, the organic material deposition apparatus 50 according to the embodiment of the present invention includes a chamber 52, a film forming source 54 containing a light emitting organic material, a substrate 58, and a film forming source ( The metal mask 56 provided between the 54 and the substrate 58, the substrate holder 64 for supporting the substrate 58, and the magnet 60 for closely contacting the metal mask 56 and the substrate 58. ), A support rod 62 for supporting the magnet 60, a support 66 for supporting the substrate holder 64, the metal mask 56, and the like, and an RF (radio frequency) connected to the chamber 52. ) And a power source 72.

The chamber 52 maintains a vacuum state during the deposition process to prevent the inflow of foreign substances from the outside and to improve the deposition power of the organic materials. The light emitting organic materials of red (R), green (G), and blue (B) are respectively stored in the deposition sources 54 provided on at least three bottom surfaces of the chamber 52. The film-forming source 54 is heated to a predetermined temperature during the deposition process.

A plurality of holes, not shown, are formed in the metal mask 56 in a specific pattern, and the holes allow light emitting organic materials to be deposited in a specific pattern on the substrate 58. That is, the holes formed in the metal mask 56 selectively pass through the light emitting organic material supplied in the vapor state from the film forming source 54 and supply it to the substrate 58.

When the operation process is described in detail, first, the substrate 58 supplied from the outside is seated on the substrate holder 64, and the user aligns the substrate 58 and the metal mask 56 using the CCD camera 68. . Thereafter, a predetermined magnetic force is supplied to the magnet 60 to closely contact the substrate 58 and the metal mask 56. At this time, the chamber 52 maintains a vacuum state.

Thereafter, a predetermined heat is supplied to the film forming source 54, and the light emitting organic materials contained in the film forming source 54 are evaporated by this heat. The luminescent organic materials thus evaporated are deposited on the substrate 58 in a specific pattern via the holes of the metal mask 56. Meanwhile, the shield 70 formed to partially overlap the metal mask 56 prevents the light emitting organic materials in the vapor state from being supplied to the CCD camera 68. This process is repeated a predetermined number of times to deposit the feet and organic materials on the plurality of substrates (58).

Meanwhile, in the present invention, in order to prevent the organic materials from adhering to the holes of the metal mask 56, high frequency discharge occurs after at least one deposition process. In other words, high frequency discharge is generated in the chamber 52 by using a high frequency supplied from the RF power source 72 connected to the chamber 52. As such, when a high frequency discharge occurs in the chamber 52, organic materials attached to the holes of the metal mask 56 are removed. On the other hand, the substrate holder 64 is connected to the ground voltage source GND so that high frequency discharge can occur in the chamber 52.

Meanwhile, in the present invention, as shown in FIG. 5, the RF power source 72 may be attached to the substrate holder 64. At this time, the chamber 52 is connected to the ground voltage source GND.

As described above, the organic light emitting device manufacturing apparatus according to the present invention can remove the organic material attached to the hole of the metal mask by causing a high frequency discharge in the chamber after at least one deposition process. Accordingly, the hole blocking phenomenon of the metal mask may not occur due to the attachment of the organic material, thereby minimizing the defect of the electro luminescence display device.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be determined by the scope of the utility model registration request.

Claims (1)

A substrate holder 64 on which the substrate 58 is seated; A deposition source 54 containing a light emitting organic material to be deposited on the substrate 58; A plurality of holes are formed in a predetermined pattern to supply the light emitting organic material, which is provided between the substrate 58 and the deposition source 54, to be supplied in a vapor state, to the substrate 58 in a predetermined pattern. A mask 56 for metal; A vacuum chamber 52 formed to cover the substrate holder 64, the metal mask 56 and the deposition source 54; A high frequency power source 72 connected to the vacuum chamber 52 for causing a high frequency discharge in the vacuum chamber 52, And a base voltage source connected to said substrate holder (64).