KR20070016716A - Vacuum chamber in manufacturing system of organic light emitting diode display device - Google Patents

Abstract

The present invention relates to a vacuum chamber of an organic light emitting diode display device, and generates a heat of a predetermined temperature in a lower portion of the chamber so that the deposition material is discharged in a fan shape from the deposition material deposited on the upper surface, and the upper surface of the deposition material. A first and a second deposition substrate, which are fixed at the top of the chamber and spaced apart relative to the chamber and are deposited by the emissive deposition material, wherein the first and second deposition substrates are respectively positioned at predetermined preset angles relative to the central axis of the heat source. It is characterized by inclined symmetrically. According to the present invention, it is possible not only to improve the deposition uniformity by adjusting the deposition angle, but also to maximize the space efficiency to double the manufacturing amount.

Organic light emitting diode, vacuum chamber, deposition, uniformity

Description

Vacuum chamber of organic light emitting diode display device manufacturing apparatus {VACUUM CHAMBER IN MANUFACTURING SYSTEM OF ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE}

1A through 1C are cross-sectional views illustrating a process of manufacturing a conventional organic light emitting diode display device;

2 is a view showing a vacuum chamber of a conventional organic light emitting diode display device manufacturing apparatus,

3 is a view showing a vacuum chamber of the organic light emitting diode display device manufacturing apparatus according to a preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

202: heat source 204: deposition material

208a, 208b: deposition substrates 210a, 210b: clamps

212a, 212b: rotation axis

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to organic light emitting diode (OLED) display devices, and more particularly to a vacuum chamber of an organic light emitting diode display device manufacturing apparatus suitable for efficiently using the amount of material to be deposited.

Due to the rapid development of semiconductor technology, it is possible to accumulate vast amounts of data in a smaller area or to process vast amounts of data in a short time. Most information that processes information and outputs results in proportion to the development of such semiconductor technologies. The performance of processing equipment has been rapidly improved, enabling the rapid processing of large amounts of data in unit time.

Recently, development of a display device that serves as an interface between the information processing device and the user so that the user can recognize the result data processed by the information processing device as well as the performance of the information processing device is also rapidly progressing.

CRT-type display devices and liquid crystal display devices (LCDs) have been commonly used in information processing devices, but recently, the disadvantages of these CRT-type display devices and liquid crystal display devices have been ruled out. The organic light emitting diode display device, which is a next-generation display device that adopts all the advantages, for example, takes into consideration conditions such as response speed, driving voltage, power consumption, brightness, color gamut, and device thickness, has been developed and spread.

The organic light emitting diode display device has attracted attention as a next generation display device because it has a wide optical viewing angle, excellent contrast, and fast response speed. In addition, the organic light emitting diode display device is a self-luminous display device that emits light by electrically exciting a fluorescent organic compound. Since the organic light emitting diode display device can be driven at a low voltage, power consumption is low.

The organic light emitting diode display device has a structure in which a positive electrode and a negative electrode are separated from each other and stacked, and an organic light emitting layer is inserted between the electrodes. Here, the organic light emitting film has a multilayer structure in which a hole injection layer, a hole transporting layer, an organic light emitting layer, and an electron transporting layer are laminated to transport electrons and holes and emit light, thereby achieving good balance between electrons and holes. Improve the efficiency.

In the organic light emitting diode display, excitons are generated by injecting and recombining holes and electrons into the organic light emitting layer by applying a predetermined voltage to the positive electrode and the negative electrode, respectively, and when the excitons are deactivated, By using light emitted (fluorescence and phosphorescence), a desired character or image is displayed.

Like the flat panel display devices such as LCD, PDP and FED, the organic light emitting diode display is classified into a passive matrix type and an active matrix type according to its driving method.

The manufacturing process of the passive matrix organic light emitting diode display device will be described with reference to FIGS. 1A to 1C.

First, as shown in FIG. 1A, a transparent conductive metal having a large work function, such as indium tin oxide (ITO), is deposited on the substrate 1 and then patterned to form an anode electrode. One electrode 2 is formed. At this time, lead electrodes 3 for cathode electrodes to be formed later are formed together. That is, the positive electrode 2 to which the positive power is applied is formed in the screen display area, which is the part where the screen is displayed, and the lead electrodes for the positive electrode and the lead electrodes 3 for the negative electrode are formed outside the screen display area. .

The lead electrodes 3 are divided into odd-numbered and even-numbered groups based on the column order of the negative electrodes, and are formed in a pattern to be subtracted left and right, respectively, to form contact holes for connection between the lead electrode 3 and the negative electrode. A large area (contact area) 4 can be secured.

Subsequently, an insulating material is coated on the first electrode 2, and then a patterning process for forming R, G, and B pixels is performed to form an insulating film 5, wherein the patterning for forming the insulating film 5 is performed. In the process, the contact hole 6 in which the lead electrode 3 is exposed is also formed in the contact region 4.

In more detail, a first photoresist (not shown) is applied to a screen display area on which the first electrode 2 is formed, and then an insulating region is formed in which the remaining areas are opened except for a portion corresponding to a portion where dot pixels are to be formed. A dot pixel is formed on the substrate between the first electrode 2 and the first electrode 2 to form an insulating film 5 that positions the mask on the substrate and exposes and develops the first photoresist to insulate the respective dot pixels. It forms in the part which is not.

Next, in FIG. 1B, after the second photoresist (not shown) is applied and exposed on the entire surface of the substrate 1 on which the insulating film 5 is formed, the insulating film 5 is patterned to form a partition region for separating the negative electrode. The partition wall 7 is formed at the top of the.

In more detail, the second photoresist, which is different from the first photoresist, is thickly coated on the insulating film 5, and then the stripe intersects the screen display area at a portion corresponding to the space between the lead electrodes 3. The opening of the shape is formed, and the remaining part is placed on top of the second photoresist, and then the second photoresist is exposed and developed. Then, in the screen display area, barrier ribs 7 having an inverted trapezoid shape are formed to intersect the first electrode 2 on the same line as the space between the lead electrodes 3.

Thereafter, photoresist patterns other than the barrier region are removed. Such barrier ribs 7 are necessary to separate the metal layers into respective lines when forming the negative electrode in the vacuum thin film process to prevent electrical short between the negative electrode lines.

After this process, the organic light emitting film 8 is formed on the first electrode 2 between the partitions 7. The organic light emitting film 8 is formed in a multilayer structure in which a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and the like are stacked. At this time, in the method of depositing R, G, and B separately, the deposition mask is made in the shape of a slit having a width of several tens of micrometers, which is about the size of each pixel. When the mask is in close contact with the substrate, it may also serve as a support to prevent the mask surface from touching the organic layer below it.

Finally, in FIG. 1C, the second electrode 9 is formed on the organic light emitting film 8 through a deposition process. The second electrode 9 is formed by selecting one of metals composed of calcium (Ca), magnesium (Mg), aluminum (Al), and the like as the negative electrode. In this case, even when the negative electrode metal is deposited on the entire surface, the second electrode 9 is patterned by the partition wall 7 and the contact hole 6 is also buried together when the negative electrode metal is deposited, and thus the second electrode 9 is connected to the lead electrode 3 through the contact hole 6. ) Can be connected. That is, by depositing a metal forming the second electrode 9 on the screen display area, the first electrode 2 and the second electrode 9 intersect each other between the partitions 7.

Here, a portion in which the organic light emitting film 8 and the second electrode 9 are sequentially stacked on the upper surface of the first electrode 2 exposed to the outside of the insulating film 5 emits light to display predetermined information. It becomes a dot pixel.

On the other hand, as a method of manufacturing the organic light emitting diode display device, several methods such as a vacuum deposition method and a reity method are employed, and an organic-inorganic material used for organic light emission, its electrons, and hole movement on a patterned ITO substrate. Since they must be deposited in a highly precise laminated structure, technology development on manufacturing methods such as lamination thickness, high precision of deposition, and vacuum degree is emerging as a core of device development.

In this case, when manufacturing a device by a vacuum deposition method, the use of a limited vacuum space has emerged as a problem, and developments have been made to increase the space utilization thereof. In the case of organic materials used in organic light emitting diode display devices, there is a problem that very expensive materials are used, thereby increasing the material efficiency.

The inefficiency of such materials arises not only from the manufacturing method but also from the process design.

Currently applied vacuum deposition method, as shown in Figure 2, the heat source 102 and the deposition material 104 is mounted on the lower portion of the cylindrical vacuum chamber 100, the metal shadow mask 106 and the ITO pattern on the top The deposited deposition glass 108 is located. And the deposition substrate 108 is fixed by a magnetic clamp 110, the clamp 110 is fixedly connected by a shaft 112 formed on the upper surface of the chamber (100).

Due to this configuration, the position is determined in consideration of the distance between the top and the bottom, the direction of the material to be deposited from the deposition material 100, the clamp 110, the deposition substrate 108 due to the rotational movement of the shaft 112 The back will rotate.

The deposition direction of the material during vacuum deposition remains approximately fan-shaped as shown in FIG. 2. Therefore, in the current method, since the deposition substrate 108 is rotated in consideration of the deposition uniformity of the center and the edge portion of the deposition substrate 108, the center of the deposition material 104 is located at the edge portion of the substrate, which is about 50%. Only the design of is used for actual deposition and the rest of the material is not used for device fabrication and is discarded. In addition, due to space problems, there is no choice but to manufacture substrates one by one.

That is, since the deposition direction of the material 104 forms a constant inclination with the deposition substrate 108, the deposition uniformity is lowered. This is because the deposition direction of the deposition material 104 is not perfectly vertical. Because it represents.

In conclusion, in the conventional deposition process of the organic light emitting diode display device, since the deposition substrate is disposed perpendicular to the deposition material, the deposition uniformity of the organic material may be maintained at an angle to the deposition direction of the actual material, resulting in poor deposition uniformity. There are many obstacles to improvement.

The present invention is to solve the above-mentioned problems of the prior art, by adjusting the deposition angle of the deposition material and the deposition substrate to improve the uniformity of the deposition, the organic space that can double the chamber space efficiency due to the change of the angle of the deposition substrate It is an object of the present invention to provide a vacuum chamber of an LED display device manufacturing apparatus.

According to a preferred embodiment of the present invention for achieving the above object, as a vacuum chamber of the organic light emitting diode display device, the deposition material is discharged in a fan shape from the deposition material seated on top by generating heat of a predetermined temperature in the lower part of the chamber And a first heat source and a second vapor deposition substrate fixed to a top of the chamber at a predetermined distance from the upper surface of the deposition material and being deposited by the evaporation deposition material. The substrate provides a vacuum chamber of the organic light emitting diode display device manufacturing apparatus inclined left and right symmetrically with respect to the central axis of the heat source, respectively, at a predetermined placement angle.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

Prior to the description, the vacuum chamber of the organic light emitting diode display device manufacturing apparatus according to the present embodiment is to maximize the deposition efficiency by maintaining the placement angle of the deposition substrate to correspond to the deposition direction of the deposition material. It will be easy to achieve the purpose of.

3 illustrates a vacuum chamber of an organic light emitting diode display device manufacturing apparatus according to a preferred embodiment of the present invention, wherein a heat source 202, a deposition material 204, and first and second deposition substrates 208a and 208b are provided. And first and second clamps 210a and 210b and first and second rotational axes 212a and 212b.

As shown, a heat source 202 and a deposition material 204 are mounted beneath the cylindrical vacuum chamber 200 with metal shadow masks 206a and 206b and an ITO patterned deposition substrate 208a on top. 208b is located.

The heat source 202 generates a constant temperature of heat at the bottom of the chamber 200 to allow the deposition material to be ejected in a fan shape from the deposition material 204 seated thereon.

Each of the deposition substrates 208a and 208b is fixed by the magnetic clamps 210a and 210b, and the clamps 210a and 210b are rotated shafts 212a and 212b formed on the upper surface of the chamber 200. By fixed connection.

The first and second deposition substrates 208a and 208b are spaced apart from the top surface of the deposition material 204 by a deposition material that is fixed above the chamber 200 and discharged through the deposition material 204. Is processed.

In this case, the first and second deposition substrates 208a and 208b may be inclined left and right symmetrically with respect to the central axis of the heat source at a predetermined arrangement angle, respectively. That is, in this embodiment, the deposition material emitted from the deposition material 204 can be uniformly deposited on the first and second deposition substrates 208a and 208b, that is, the second and second deposition substrates 208a ( 208b is configured to be inclined at an angle so as to be concentrated on the deposition material of the deposition material 204.

Meanwhile, a first clamp 210a is disposed on the first deposition substrate 208a to fix the first deposition substrate 208a. The first clamp 210a may be disposed on the first deposition substrate in a left-emission direction of the deposition material. 208a has a preset placement angle to correspond.

Similarly, a second clamp 210b is disposed on the second deposition substrate 208b to fix the second deposition substrate 208b, and the second clamp 210b is disposed in the right direction of the deposition material. 208b has a preset placement angle to correspond.

The first and second clamps 210a and 210b are fixed to the upper surface of the chamber 200 by the first and second rotation shafts 212a and 212b, respectively, inclined at a predetermined placement angle. do.

On the other hand, the present embodiment is characterized in that the deposition substrate is formed to be inclined at an angle to implement uniform deposition, but additionally, due to the change in the angle of the deposition substrate, two deposition substrates can be easily mounted in the chamber. It also creates the characteristic that it can.

In other words, when the deposition substrate is horizontally formed as in the related art, only one deposition substrate may be included in the chamber. However, when the deposition substrate is formed at a predetermined angle as in the present embodiment, the same size may be included. Two deposition substrates may be included in the chamber. Therefore, the space utilization of the chamber can be increased.

As mentioned above, although this invention was demonstrated concretely based on the Example, this invention is not limited to such an Example, Of course, various deformation | transformation are possible for it within the technical idea and the scope of a claim mentioned later.

According to the present invention, not only the deposition uniformity can be improved by adjusting the deposition angle, but also the production volume can be doubled by maximizing the space efficiency.

Claims (3)

A vacuum chamber of an organic light emitting diode display element, A heat source for generating heat at a predetermined temperature in the lower part of the chamber to discharge the deposited material in a fan shape from the deposited material deposited on the upper part; Having first and second deposition substrates spaced a predetermined distance from an upper surface of the deposition material and fixed to the chamber and deposited by the emitted deposition material, The first and second deposition substrates are inclined left / right symmetrically at a predetermined placement angle with respect to the central axis of the heat source, respectively. Vacuum chamber of an organic light emitting diode display device manufacturing apparatus. The method of claim 1, The chamber, A first clamp fixing the first deposition substrate, the first clamp having the predetermined placement angle such that the first deposition substrate corresponds to a left emission direction of the deposition material; A second clamp holding the second deposition substrate and having the predetermined placement angle such that the second deposition substrate corresponds to a right emission direction of the deposition material The vacuum chamber of the organic light emitting diode display device manufacturing apparatus further comprising a. The method of claim 2, And the first and second clamps are fixed to the chamber upper surface by first and second rotation shafts which are inclined at the predetermined placement angle, respectively.

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