KR200225840Y1 - Test board of integrated circuit chip - Google Patents

Abstract

The present invention has a plurality of recesses formed by the lattice projections on the upper side of the test board for checking whether the integrated circuit chip is defective, and the chip holder having the IC chip is inserted in each recess. Since the multiple chip holders are automatically arranged in a lattice shape, they are not scattered arbitrarily, which improves the assemblability of the test board and prevents the board from being warped by the lattice protrusions, thereby making it possible to test IC chips accurately. In particular, in a test board of an integrated circuit chip that moves a plurality of IC chips toward the inspection equipment while moving on a conveyor belt, a plurality of recesses are formed by a lattice protrusion on the upper portion of the board, and each recess A chip holder for fixing the IC chip is placed, and each protrusion is formed on the board so that it is flush with the latching jaw of the chip holder. It is configured to be provided with a fixing plate to cover the locking jaw of the chip holder is placed on the top of each projection.

Description

Test board of integrated circuit chip

The present invention relates to a test board of an integrated circuit chip, and more particularly, a plurality of recesses are formed at the top of the board by a lattice-shaped protrusion so that the plurality of integrated circuit chips are placed in an aligned state. When the IC chip is placed, each IC chip is fixed by the fixing plate, so that the fixed state of each IC chip can be firmly fixed, and the lattice-shaped protrusion is provided on the top of the board to prevent warpage and smoothness of the board. The present invention relates to a test board of an integrated circuit chip capable of improving IC chip testing.

In general, IC chips should be checked for proper layout of the circuit during production. For the inspection of the IC chip, a plurality of IC chips 5 are arranged in a lattice shape on the upper part of the board 1 moving on a conveyor, as shown in FIG. The chip was pressed into place.

The fixed IC chips 5 were found to have short circuits or defective circuits while the test probes falling from the test equipment touched each IC chip 5 while the board 1 passed through the test equipment.

However, since the edge 2 formed on the upper part of the board 1 is fixed by means of welding or the like, there is a fear that the board on the plate is warped due to heat deformation, and the fixing plate for fixing the board, the edge and the IC chip, etc. It was made of heavy material and had disadvantages such as inconvenient handling.

And each fixing plate (4) is fastened by the screw is fastened so as to cross the upper and lower sides of the board to increase the tightening force, but if the screw on the bottom of the board is loosened in the process of moving the board on the conveyor is interfered with the conveyor and the board is turned over or screw There was a problem such as breakage.

The present invention was developed in view of the conventional problems, and an object of the present invention is to form a plurality of recesses formed by a lattice-shaped protrusion on an upper side of a test board for checking whether an integrated circuit chip (IC chip) is defective. By inserting chip holders with IC chips in each recess, multiple chip holders are automatically aligned in a grid, so that they are not scattered arbitrarily, thereby improving the assemblability of the test board and preventing distortion of the board by the grid-shaped protrusions. In order to provide a test board for an integrated circuit chip in which an IC chip test is accurate.

1 is a cross-sectional view of a conventional test board

2 is a perspective view of the subject innovation test board

Figure 3 is a front sectional view of the subject innovation test board

Figure 4 is a side cross-sectional view of the subject innovation test board

<Code Description of Main Parts of Drawing>

1: Board

2: border

3: Chip holder

4: fixed plate

5: IC chip

10: board

11: protrusion

12: recessed part

13: spring catch

20: Chip Holder

21: jamming jaw

22: heat dissipation fin

30: fixed plate

31: screw

40: IC chip

50: spring

In order to achieve the above object, the present invention provides a test board of an integrated circuit chip which moves a plurality of IC chips toward an inspection device while moving on a conveyor belt, and a plurality of recesses are formed by a lattice-shaped protrusion on the board. A chip holder for fixing the IC chip is placed at each recess, and each protrusion is formed on the board so that the height is the same as the locking jaw of the chip holder, and a fixing plate is placed on the top of each protrusion to cover and fix the locking jaw of the chip holder. It is configured to be provided.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a perspective view of the subject innovation test board, Figure 3 is a front sectional view of the subject innovation test board. The test board of the present invention is provided with a plate-like board 10, which is made of aluminum alloy, such as duralumin, has a light and robust feature. A plurality of lattice-shaped protrusions 11 are formed on the board 10, and a rectangular recessed portion 12 is formed between the protrusions 11 at a predetermined depth.

And each recess 12 is provided with a chip holder 20 for placing the IC chip 40, the engaging jaw 21 is formed in all directions on the outer peripheral surface of the chip holder 20. When the chip holder 20 is placed on the recess 12, the upper end of the locking jaw 21 of the chip holder coincides with the same height as the upper end of each protrusion 11.

The chip holder 20 is to fix the IC chip 40, and a heat dissipation fin 22 for cooling the IC chip 40 is installed at the center, and clamps for holding the IC chip 40 are provided at both sides of the chip holder 20. As shown in FIG. 4, a plurality of springs 50 are provided on the bottom of the chip holder 20, and the concave inlet 12 is provided with a spring support 13 supporting each spring 50.

In addition, a plurality of chip holder 20 is provided with a fixing plate 30 for fixing it when placed in the recess 12. The fixing plate 30 is placed between the chip holders 20, and the locking jaws 21 of the chip holders 20 adjacent to both sides of each protrusion 11 of the board 10 are simultaneously fixed by the fixing plate 30. At this time, the fixing plate 30 is fastened and fixed by the screw (31).

The present invention configured as described above is assembled as follows. On the upper side of the board 10 is provided a grid-shaped protrusion 11 and a plurality of recesses 12 formed by these protrusions. These concave portions 12 and the projections 11 are formed in the process of cutting the upper portion of the board 10 by machining such as milling, in particular, the board is warped because the upper portion of the board is reinforced by the projections 11 No bending deformation

In addition, the chip holder 20 is inserted into each of the corresponding recesses 12 of the board 10. In this case, each recess 12 is provided with a spring support 13 and a spring 50 supporting the chip holders. 20 is elastically installed in the recess 12. Then, when the fixing plate 30 is placed between each chip holder 20 of the board, and the fixing plate 30 is fastened and fixed to the board with the screw 31, a pair of adjacent chip holders 20 with the protrusion 11 therebetween. ) Is fixed at the same time.

When the IC chip 40 is placed on the upper part of the chip holder 20 in a fixed state, the IC chip 40 is fixed to the upper side of the chip holder without being arbitrarily flown by clamps provided at both sides of the upper end of the chip holder. When the board 10 is placed on the conveyor, the board is moved to the inspection equipment, and the inspection probe of the inspection equipment is lowered to simultaneously inspect the IC chip 40 placed on each chip holder 20.

As described above, according to the present invention, a plurality of chip holders are arranged in an aligned state by protrusions and recesses formed on an upper portion of the board, and assembling properties are improved by fixing each chip holder by a fixing plate. In addition, since the bending deformation of the board is prevented by the lattice-shaped protrusion formed on the board, the flatness of the board is improved, so that the IC chip can be accurately inspected.

In addition, since the board is made of aluminum alloy such as duralumin, the board is light and convenient to handle, and the recessed part is formed on the board to hold the position of the chip holder, thus simplifying the structure of the fixing plate to fix the chip holder. .

Claims (1)

In the test board of the integrated circuit chip to move a plurality of IC chip 40 toward the inspection equipment while moving on the conveyor belt, A plurality of concave indentations 12 are formed by the lattice protrusions 11 on the board 10, A chip holder 20 for fixing the IC chip 40 is placed at each recess 12, and each of the protrusions 11 is flush with the latching jaw 21 of the chip holder 20. Test board of the integrated circuit chip, characterized in that is provided on the fixing plate 30 is formed on the upper portion of each protrusion (11) to cover and secure the locking jaw (21) of the chip holder (20).