KR200221823Y1 - Trim die for semiconductor package manufacturing equipment - Google Patents

Abstract

The present invention relates to a trim die fixing holder of a semiconductor package manufacturing equipment, and the die is worn by dividing the die installed in the feed direction of the lead frame into two dies formed with different punch blade positions and fixed to the fixing holder. It is a trim die fixing holder of semiconductor package manufacturing equipment that can prevent the damage of the punch blade by distributing the load applied when trimming by dividing the die into two so that only one die can be replaced when the die is replaced.

Description

Trim die for semiconductor package manufacturing equipment

1 is a plan view of a trim die according to the present invention

(A) and (b) of FIG. 2 are a plan view and a side view of a die according to the present invention.

Explanation of symbols on the main parts of the drawings

10; Die 11; Punch blade

20; Fixed holder 21; Opening

22; Protruding jaw 23; Fixing groove

The present invention relates to a trim die of a semiconductor package manufacturing equipment, and more particularly, to improve work efficiency and productivity by simply fixing a die for cutting a dam bar connecting a lead and a lead in a semiconductor package manufacturing process. It relates to a trim die of a package manufacturing equipment.

In general, a semiconductor package bonds a semiconductor chip obtained by sawing a wafer to a plurality of mounting plates formed of a lead frame material using epoxy, and then bonding pads, which are circuit terminals inside the semiconductor chip. And bonding each lead of the leadframe material with a wire, and molding the leadframe material with compound material to protect the circuit and peripheral components of the semiconductor chip from external impact and contact, and to shape the product into a predetermined shape in appearance. To complete the package. In this way, the lead frame material of which package molding is completed is plated with each lead in a plating process, and then subjected to a trim process of cutting a dam bar connecting the lead and the lead, and then the lead is formed by a forming process.

In this case, the trimming process is performed by a trim device provided with a mold (top die, bottom die). A trim die provided in such trim equipment includes a fixing holder, and a die for actually trimming the dam bar of the lead frame is coupled to the fixing holder.

In addition, the trimming process is performed by simultaneously providing dies by the pitch of the package molded in the leadframe material (the distance between the package and the package). In other words, when trimming each dam bar of the lead frame material, the gap between the lead and the lead is minute, so if all the dam bars are trimmed at the same time, the lead will be deformed, resulting in a defect of the package in the trimming process. Trimming is done by two trimming operations. In other words, first trim the dambars (e.g. even numbered) located one by one, then transfer the leadframe material one pitch to trim the remaining dambars (e.g. odd numbered dambars) to trim the entire dambar, It is also designed to prevent package defects during trimming.

In order to trim as described above, a die in the form of a square frame and a holder for fixing the die are conventionally formed to be long in the feeding direction of the lead frame material. That is, the die bar is formed by continuously forming a plurality of dies in the conveying direction and forming punches formed in the dies at different positions (crossed each other).

However, the continuous installation of the die of the wing is concentrated in any part of the load applied during trimming, so that a certain part of the die is easily worn or broken when used for a long time. Since the whole needs to be replaced, there is a big problem in wasting due to die replacement.

Therefore, the present invention was devised to solve such a problem, and the die is worn by dividing the die installed in the feed direction of the lead frame into two dies formed with different positions of the punch blades and fixed to the fixing holder. It is an object of the present invention to provide a trim die of a semiconductor package manufacturing equipment which can prevent the breakage of the die by distributing the load applied when trimming by dividing the die into several pieces to prevent waste by replacing only one die when replacing the die. .

In order to achieve the above object, the present invention provides a trim die of a semiconductor package that trims a dam bar of a lead frame by a top die and a bottom die. And a fixing holder having a fixing groove and a protruding jaw formed at each corner of the first opening portion and the second opening portion, and the boundary regions of the first opening portion and the second opening portion, respectively. And a plurality of punch blades are fixed to the fixing grooves formed in the respective circumferences and boundary regions of each of the first and second open portions, and the plurality of punch blades are coupled with a constant pitch toward the inside of the first and second open portions. Punch blades facing the first open portion only trim the even (or odd) dam bars of the leadframe, and punch blades facing the second open portion only the odd (or even) dambars of the leadframe Including a die punch with each other is formed on the other edge position to be trimmed is characterized in that is made.

Here, the die coupled to the boundary region of the first open portion and the second open portion has punch blades formed on both sides, respectively, so that the punch blades on both sides can trim the dam bars at different positions of the lead frame, respectively. Are mutually staggered.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 to 2 show a trim die according to the present invention, the trim process is discharged through a trim process by receiving a lead frame from a magazine loaded with molded lead frame material. Here, the side supplying the molded lead frame material is called an on-loader, and the side discharged through a trimming process is called an off-loader.

In this way, the trim die is installed and trimmed while being supplied from the onloader and discharged to the offloader. The trimming process is performed by the top die and the bottom die, and the die 10 having the actual punch blade 11 is fixed in the holder. It is fixed by 20. Here, the die 10 and the fixed holder 20 are called trim dies, and the trim dies are provided on the top die and / or the bottom die.

First, the fixing holder 920 has a first opening portion 1 and a second opening portion 2 which are continuous so as to penetrate the upper and lower surfaces and have a substantially rectangular shape. In addition, each of the corners of the first opening portion 1 and the second opening portion 2 and the boundary region between the first opening portion 1 and the second opening portion 2 are fixed grooves 23 and protruding, respectively. The jaw 22 is formed. That is, as shown in FIG. 1, the fixing groove 23 and the protruding jaw 22 are formed at two left corners of the first opening part 1 and two right corners of the second opening part 2. A fixing groove 23 and a protruding jaw 22 are formed in the center of the boundary area between the first opening part 1 and the second opening part 2 so as to face each other.

Subsequently, a plurality of dies 10 fixed to the first opening portion 1 and the second opening portion 2 are in the form of a bar having a substantially rectangular shape in plan, and the first opening as shown in the drawing. It is fixed to the said fixing groove 23 formed in each circumference and boundary area | region of the part 1 and the 2nd opening part 2, respectively. In addition, the die 10 is coupled to the plurality of punch blades 11 having a constant pitch toward the inner side of the first open portion 1 and the second open portion (2). In addition, the punch blade 11 facing the inside of the first opening 1 is formed so as to trim only the even (or odd) dam bars of the lead frame, and the punch blade facing the second opening 2. 11 is formed so as to trim only the odd (or even) number of dam bars of the lead frame. That is, the formation positions of the punch blade 11 located in the inner periphery of the said 1st opening part 1 and the 2nd opening part 2 are mutually formed mutually, without mutual interference.

On the other hand, the die 10 coupled to the boundary region of the first opening portion 1 and the second opening portion 2 is one side toward the first opening portion 1 as shown, the other side is the second opening The punch blade 11 is formed toward the part 2. Similarly, the punch blades 11 on both sides are alternately formed so as to trim dam bars at different positions of the lead frame as described above.

As described above, the trim die according to the present invention first removes all of the lead frames, for example, even-numbered dam bars, by trimming all the dies 10 located in the first opening 1, and then moves the lead frame one pitch. And then trim the remaining odd-numbered dambars with the die 10 located in the second open part 2, thereby eventually removing all the dambars.

Therefore, according to the trim die according to the present invention, by installing a plurality of dies fixed to the fixed holder, so that only a die corresponding to that part can be replaced when the wear is severely worn by the load applied during trimming. It is effective in preventing waste of materials.

In addition, since only one die can be provided in the boundary area between the first open portion and the second open portion of the fixed holder, the number of required dies can be reduced, and the manufacturing cost can be reduced.

Claims (2)

In configuring the trim die of the semiconductor package to trim the dam bar of the lead frame by the top die and the bottom die, A first open part 1 and a second open part 2 are formed so as to penetrate the upper and lower surfaces and have a substantially rectangular shape, and each of the first open part 1 and the second open part 2 is formed. A fixing holder 20 having a fixing groove 23 and a protruding jaw 22 formed at an edge and a boundary area between the first opening portion 1 and the second opening portion 2, It is fixed to the fixing groove 23 formed in each circumference and boundary area of the first opening portion 1 and the second opening portion 2, respectively, each of the first opening portion 1 and the second opening portion A plurality of punch blades 11 are coupled with a constant pitch toward the inside of (2), but the punch blades 11 facing the first open portion 1 have only the even (or odd) dam bars of the lead frame. The punch blade 11 facing the second open portion 2 trims the die 10 having the punch blades 11 formed at different positions to trim only the odd (or even) number of dam bars of the lead frame. Trim die of semiconductor package manufacturing equipment comprising a. According to claim 1, The die 10 coupled to the boundary region of the first opening portion 1 and the second opening portion 2 has a punch blade 11 formed on both sides, respectively, the punch on both sides The blades 11 are trim dies of the semiconductor package manufacturing equipment, characterized in that they are alternately formed so as to trim each of the dam bars at different positions of the lead frame.