KR20020090813A - Flipchip bonder apparatus and method for operating the same - Google Patents

Abstract

PURPOSE: An apparatus for bonding a flip chip is provided to reduce errors occurring in a bonding process, by simultaneously detecting the align marks of a silicon substrate and the flip chip when the silicon substrate is bonded to the flip chip. CONSTITUTION: The silicon substrate having the align mark is disposed on a stage unit(10). The first transfer sector is installed under the stage unit, in connection with the stage unit. The second transfer sector is installed under the first transfer sector. A stage driving unit(200) transfers the stage unit in the X-axis and Y-axis direction. An infrared ray generating unit(100) radiates infrared rays over the stage unit, installed in the stage unit. A heating unit heats the stage unit. A substrate align unit aligns the silicon substrate. A flip chip align unit controls the angle and position of the flip chip, in connected with the stage unit. The flip chip is disposed on the flip chip align unit. A flip chip loading unit(500) picks up the flip chip and loads the flip chip to the upper surface of the silicon substrate. An infrared ray sensor(600) over the flip chip simultaneously detects the align marks of the flip chip and the silicon substrate by using infrared ray when the flip chip is loaded to the upper surface of the silicon substrate. A control unit transfers the stage unit to correct the bonding position of the silicon substrate and the flip chip according to the information detected by the infrared ray sensor.

Description

Flip chip bonder apparatus and method for operating the same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip bonder device and a method of operating the same, and more particularly, to a flip chip bonder device suitable for bonding the silicon substrate and the flip chip while simultaneously detecting an alignment mark of the silicon substrate and the flip chip. It is about a method.

In general, the configuration and operation of a flip chip bonder according to the prior art are as follows.

First, the silicon substrate is placed on the upper surface of the stage portion, and the flip chip to be bonded with the silicon substrate is vacuum-adsorbed to the end of the bonding head portion provided on the stage portion.

The flip chip adsorbed at the end of the bonding head portion moves to an upper portion of the silicon substrate, and an optical device is inserted between the silicon substrate and the flip chip to recognize alignment marks of the silicon substrate and the flip chip, respectively. do.

Based on the information recognized by the optical device, the flip chip and the silicon substrate are moved in the X-axis and Y-axis directions, respectively, and the bonding position is determined. The optical device inserted at the same time is located between the flip chip and the silicon substrate. Evict.

Then, the end of the bonding head portion is lowered and the flip chip contacts the upper surface of the silicon substrate. At this time, when heat is applied to the upper surface of the stage, the lead coated on the upper surface of the silicon substrate melts, The silicon substrate is compressed.

As a result, when the high temperature lead cools down, the bonding between the flip chip and the silicon substrate is completed.

However, the following configuration problems have been raised in the flip chip bonder according to the related art.

First, the optical device is inserted between the silicon substrate and the flip chip to detect the alignment mark of the silicon substrate and the flip chip, and the silicon substrate and the flip chip are aligned in position by detecting the alignment mark. That is, when the flip chip descends to bond the flip chip to the silicon substrate, the optical device must be moved out between the silicon substrate and the flip chip.

Therefore, the alignment error due to the thermal shock caused by the vibration or the external shock caused by the external shock generated while the flip chip is lowered toward the upper surface of the silicon substrate is not detected by the optical device and difficult to correct. There was a problem in that precise bonding with an error of ± 0.001 mm or less was difficult to be achieved.

Second, by using a hot wire heater having a large heat capacity thereof to melt lead coated on the upper surface of the silicon substrate, the heating rate and cooling rate of the stage portion are slowed down by the high heat capacity of the hot wire heater. There was a problem that bonding is not performed smoothly.

Accordingly, the present invention has been proposed to solve the above conventional problems, and an object of the present invention is to bond the flip chip to the silicon substrate while aligning the alignment marks formed on the silicon substrate and the flip chip in real time. To provide a configuration that can be.

In addition, another object of the present invention is to provide a configuration capable of smoothly bonding the silicon substrate and flip chip by heating the upper surface of the stage quickly.

1 is a perspective view showing a finished product bonded to a flip chip on the upper surface of the silicon substrate

Figure 2a is a front view showing a preferred embodiment of a flip chip bonder according to the present invention

Figure 2b is a plan view showing a preferred embodiment of a flip chip bonder according to the present invention

Figure 3a is an enlarged front view showing a preferred embodiment of the stage unit in the flip chip bonder according to the present invention

Figure 3b is an enlarged plan view showing a preferred embodiment of the stage unit in the flip chip bonder according to the present invention

Figure 3c is an enlarged side view showing a preferred embodiment of the stage unit in the flip chip bonder according to the present invention

Figure 4a is an enlarged plan view showing a preferred embodiment of the heating unit in the flip chip bonder according to the present invention

Figure 4b is an enlarged side view showing a preferred embodiment of the heating unit in the flip chip bonder according to the present invention

5 is an enlarged plan view showing a preferred embodiment of the substrate alignment means and flip chip alignment means in the flip chip bonder according to the present invention;

6 is an enlarged side view showing a preferred embodiment of flip chip alignment means in the flip chip bonder according to the present invention;

Figure 7a is an enlarged side view showing a preferred embodiment of the flip chip loading means in the flip chip bonder according to the present invention

Figure 7b is an enlarged side view showing a preferred embodiment of the bonding head portion in the flip chip loading means according to the present invention

Figure 7c is an enlarged side view showing a preferred embodiment of the arm in the bonding head portion according to the present invention

Figure 8a is an enlarged front view showing a preferred embodiment of the infrared sensor unit in the flip bonder equipment according to the present invention

Figure 8b is an enlarged plan view showing a preferred embodiment of the infrared sensor unit in the flip chip bonder according to the present invention

Figure 8c is an enlarged side view showing a preferred embodiment of the infrared sensor unit in the flip chip bonder according to the present invention

* Description of the symbols for the main parts of the drawings *

2: silicon substrate 4: flip chip

6: lead 10: stage part

12: rotary table 14: insulation block

16: Heater mounting block 12 '14' 16 ': No. 1,2,3 hole

100: infrared generating unit 200: stage driving unit

202: first moving sector 204: second moving sector

300: substrate alignment means 302: plate

304: body 306: jig

322: X-axis first female thread 324: X-axis second female thread

326: X-axis positioning screw 332: Y-axis first female thread

334 Y axis 2nd female thread 336 Y axis positioning screw

400: flip chip alignment means 402: support

404: rotating body 406: origin adjustment sensor

408: motor 500: flip chip loading means

501: Bonding head drive portion 502: Shanghai East body

504: driver 540: hinge coupling

550: bonding head portion 552: arm

552a: vacuum suction passage 552b: hinge hole

552c: Through hole 553: Transparent body

560: stopper 560 ': leveling screw

570: cooler 580: contact detection sensor

590: flip chip compression buffer 595: force adjustment screw

597: buffer spring 600: infrared sensor unit

602: infrared camera driver 650: infrared camera

700: heating unit 702: air duct

704: air heater

In order to achieve the above object, a flip chip bonder device and a method of operating the same according to the spirit of the present invention are provided.

The stage includes a stage portion on which a silicon substrate having an alignment mark is placed on an upper surface, a first moving sector provided in a lower portion of the stage portion in association with the stage portion, and a second moving sector provided in a lower portion of the first moving sector. A stage part driving part for moving the part in the X-axis and Y-axis directions, an infrared generating part provided under the stage part to emit infrared rays to the upper part of the stage part, a heating part for heating the stage part, and an upper surface of the stage part. Substrate aligning means for aligning the silicon substrate to be placed in position, and flip chip aligning means arranged to be interlocked with the stage part, and having a flip chip having an alignment mark placed on an upper surface thereof to adjust the angle and position of the flip chip. And picking up the flip chip mounted on the upper surface of the flip chip alignment means. Alignment mark of the flip chip and the silicon substrate on the top of the flip chip using flip chip loading means for loading the surface and infrared rays emitted from the lower part of the stage when the flip chip is loaded on the upper surface of the silicon substrate And an infrared sensor unit for simultaneously detecting an alignment mark of the control unit and a control unit for moving the stage unit to correct the bonding position of the silicon substrate and the flip chip according to the information detected by the infrared sensor unit. Is done.

According to such a configuration, the flip chip is lowered toward the upper surface of the silicon substrate in real time by simultaneously detecting the alignment mark of the flip chip and the alignment mark of the flip chip through an infrared sensor unit installed on the flip chip. The flip chip and the silicon substrate may be aligned and bonded.

In addition, the stage part has a first through-hole is formed in the center and is rotated around the first through-hole and the upper portion of the rotary table is installed in conjunction with the rotary table is rotated and connected to the first through the center A heater mounting block having a heat insulation block having a second flow passage and a third flow passage installed to be interlocked with an upper portion of the heat insulation block and connected to the second flow passage and having infrared rays directed to a flip chip placed on an upper surface of the heat insulation block; It is preferably configured to include, and the infrared ray generating unit is preferably mounted to the first passage.

According to this configuration, by installing a separate insulating block on the top of the rotary table there is an effect that can effectively block the transfer of heat generated in the heater mounting block to the bottom when bonding.

The heating unit preferably includes an air duct formed inside the heater mounting block and an air heater for selectively heating air introduced into the air duct according to on / off of power.

According to this configuration, the heater mounting block by heating the air flowing into the air duct with the air heater, and during cooling the air heater is turned off so that the outside cold air into the air duct into the air duct as it is This has the effect of being easily cooled.

The air duct has an inlet formed on the side of the heater mounting block and an outlet formed adjacent to the inlet on the side of the heater mounting block, and the air introduced into the inlet circulates inside the heater mounting block. Preferably it is discharged through said outlet.

According to this configuration, the contact area between the air flowing into the air duct and the heater mounting block is increased, so that the heating and cooling of the heater mounting block can be efficiently performed.

The substrate aligning means is fixed to an upper surface of the rotary table and is installed at a tip of the body and a body sliding in X and Y axis directions on a plate interlocking with the rotary table and an upper surface of the plate. It is preferably configured to include a jig for determining the position and the X-axis position adjusting portion for moving the body in the X-axis direction and the Y-axis position adjusting portion for moving the body in the Y-axis direction.

The X-axis direction adjusting unit may include a first female screw having a threaded hole formed in the body in the X-axis direction, and a second female screw and the first female screw formed with the threaded hole in the X-axis direction with the screw hole of the first female threaded in the plate. And an X-axis positioning screw which slides the body formed with the first female thread in the X-axis direction by being coupled to the second female screw and rotating.

The Y-axis direction adjusting unit includes a first female screw having a threaded hole in the Y-axis direction in the body and a second female screw and a Y-axis formed with the screw hole in the Y-axis direction and the screw hole of the first female thread in the Y-axis direction in the plate. It is preferably configured to include a Y-axis positioning male screw for sliding the body formed in the Y-axis direction first female thread in the Y-axis direction by being coupled to the direction first female screw and the Y-axis direction second female screw.

According to this configuration, if the silicon substrate mounted on the upper surface of the heater mounting block is moved to the correct position by the X-axis, Y-axis direction adjusting portion, and fixed to the position adjusting portion, the fixed position to be mounted by the jig Becomes fixed.

Therefore, after the bonding of the flip chip to the first placed silicon substrate, another silicon substrate having the same size needs to be inserted into the jig, so that the silicon substrate can be easily mounted.

In addition, the flip chip alignment means is fixed to the first moving sector and the upper surface is installed on the support parallel to the upper surface of the stage and the support is rotated to rotate the rotating body and the rotating plate to place the flip chip on the upper surface It is preferable to comprise a motor.

According to this configuration, the flip chip alignment means is moved in the X-axis, Y-axis direction in conjunction with the stage portion and the angle of the flip chip is aligned primarily before the flip chip is loaded by the flip chip loading means. As a result, precise bonding is achieved between the flip chip and the silicon substrate.

In addition, the flip chip loading means extends in parallel with the upper surface of the stage part from the side of the stage part, the other end of the bonding head part so that one end of the bonding head part and the bonding head part to which the flip chip is adsorbed at one end thereof can be moved upward. It is preferably configured to include a bonding head driving portion hinged to the stage and the bonding head portion to move up and down to seat the flip chip on the upper portion of the silicon substrate.

According to this configuration, the bonding head portion is provided on the side of the stage portion, so that the infrared sensor portion can be mounted on the stage portion.

Therefore, the infrared sensor unit may simultaneously detect the alignment mark of the flip chip and the alignment mark of the silicon substrate on the flip chip.

The bonding head portion is formed at a lower portion of one end of the arm having an adsorption port for adsorbing the flip chip and a vacuum suction passage connected to the adsorption port, and a transparent body attached to the arm so as to be positioned above the adsorption port. It is preferred to include a stopper installed to keep the arm level and a cooler to cool the arm.

According to such a configuration, by installing the transparent body on the suction hole, the infrared sensor unit can simultaneously detect the alignment mark of the flip chip and the silicon substrate on the flip chip.

And, the flip chip compression buffer consisting of a force adjustment screw inserted into the upper portion of the tube formed in the bonding head drive portion in the vertical direction and the buffer spring is inserted from the lower portion of the hole in contact with the force adjustment screw and in contact with the upper surface of the bonding head portion. It is preferable to comprise a part further.

According to this configuration, there is an effect that the bonding force between the flip chip and the silicon substrate can be properly adjusted during bonding.

The flip chip loading means may further include a touch sensor for detecting whether the flip chip is seated on an upper surface of the silicon substrate, and the touch sensor is configured at the other end of the bonding head unit. It is more preferable that the electrical contact is provided on the upper surface and short-circuited when the arm rotates upward.

According to this configuration, the touch detection sensor detects that the flip chip is in contact with the upper surface of the silicon substrate, thereby limiting the operation of the bonding head driver, thereby preventing the bonding head from falling down. have.

The infrared sensor unit is installed on the silicon substrate and the flip chip to drive the infrared camera and the infrared camera to detect an alignment mark of the silicon substrate and the flip chip using the infrared rays in the X and Y axes. It is preferably configured to include an infrared camera driver.

According to such a configuration, by using the infrared rays emitted from the infrared generating unit, the alignment mark formed on the lower surface of the flip chip can be detected by the infrared sensor unit installed on the flip chip.

Hereinafter, an embodiment according to the spirit of the present invention as described above will be described in detail with reference to the accompanying drawings.

1 illustrates a finished product in which a flip chip is bonded to an upper surface of a silicon substrate.

As shown, the flip chip 4 is bonded to the upper surface of the silicon substrate 2 via the lead (6).

2A and 2B show a front view and a plan view of a flip chip bonder according to the present invention, respectively.

As shown in the figure, a stage part 10 on which a silicon substrate is mounted is provided on a lower side of the case 1, and a stage part driving part for moving the stage part 10 below the stage part 10. 200 is installed.

In addition, the inside of the stage 10, the infrared generating unit 100 is installed to emit infrared toward the upper portion of the stage 10, the side of the stage 10, the stage portion A heating unit (not shown) for heating 10 is provided.

In addition, the substrate aligning means 300 and the flip chip aligning means 400 are provided on the stage 10.

The substrate aligning means 300 functions to align the silicon substrate placed on the upper surface of the stage unit 10 primarily, and the flip chip aligning means 400 aligns the flip chip to be bonded to the silicon substrate. Function.

On the other hand, the flip chip loading means 500 is provided on the side of the stage 10. The flip chip loading means 500 serves to move the flip chips aligned in the flip chip alignment means 400 to the upper surface of the silicon substrate.

An infrared sensor unit 600 is installed above the stage unit 10. The infrared sensor unit 600 functions to detect alignment marks of the flip chip and the silicon substrate by using infrared rays emitted from the infrared ray generator 100.

3A, 3B, and 3C show a front view, a plan view, and a side view of a stage portion in a flip chip bonder according to the present invention.

As shown, the stage unit 10 is composed of a rotary table 12, a heat insulating block 14 and a heater mounting block 16.

The center of the rotary table 12 is provided with a first vent 12 'formed toward the upper portion of the rotary table 12, the infrared aperture 100 is inserted into the first vent 12' is infrared Is emitted toward the top of the heater mounting block 16.

In addition, it is preferable that the rotary table 12 uses a mega torque motor that rotates itself without attaching a separate motor.

On the other hand, the upper side of the rotary table 12 is provided with a heat insulating block 14 which is rotated in conjunction with the rotary table 12. A second vent 14 ′ is formed inside the heat insulating block 14 to be connected to the first vent 12 ′, and the second vent 14 ′ is disposed at the infrared ray generator 100. The emitted infrared rays pass through.

The insulating block 14 serves to block heat transferred from the top to the rotary table 12. That is, by using the material of the heat insulating block 14 as a material with less thermal conductivity, and the cooling water flows inside or by circulating the air can be obtained the effect of heat insulation.

The heater mounting block 16 that rotates in conjunction with the insulating block 14 is installed on the upper side of the insulating block 14. The heater mounting block 16 has a third vent 16 'connected to the second vent 14' therein, and the infrared light passing through the second vent 14 'is passed through the third vent ( 16 ') is discharged to the upper portion of the heater mounting block 16.

In addition, air is sucked into the upper end of the third vent 16 '. That is, when air is extracted from the side surface of the third vent 16 'through a through hole (not shown) formed at one side of the inner side of the third vent 16', the upper portion of the third vent 16 ' Air is sucked in through the upper end of the third vent 16 '.

Therefore, a suction force is generated at the upper end of the third vent 16 'and the silicon substrate can be stably placed on the upper surface of the heater mounting block 16 by using the suction force.

On the other hand, the infrared generating unit 100 is mounted inside the stage unit 10. The infrared ray generating unit 100 is inserted into the first passage 12 ′ as shown in the figure, and emits infrared rays toward the upper portion of the stage unit 10.

However, the infrared ray generating unit 100 is inserted across the first vent 12 'and the second vent 14', or is not inserted into the first vent 12 'and the first vent ( 12 ') may be installed at the lower end.

On the other hand, a stage part driving part 200 for moving the stage part 10 in the X-axis and Y-axis directions is provided below the stage part 10.

The stage driving unit 200 is installed under the stage 10 and moves below the first moving sector 202 and the first moving sector 202 to move the stage 10 in the X-axis direction. It is comprised in the 2nd moving sector 204 which moves in the Y-axis direction and the said stage part 10 is provided in this.

In addition, guides 202 'and 204' for guiding the first and second moving sectors 202 and 204 in the X-axis and Y-axis directions are provided below the first and the second moving sectors 202 and 204, respectively. Motors 202a and 204a are mounted to move the first and second moving sectors 202 and 204 along the guides 202 'and 204' in the X and Y axes, respectively.

The stage unit driver 200 is controlled by a controller (not shown) to move the stage unit 10 to a desired position.

Reference numeral 700 in the drawings, which is not described, denotes a heating unit, 300 denotes a substrate alignment means, and 400 denotes flip chip alignment means.

4A and 4B are enlarged plan views and enlarged side views showing the heating unit in detail in the flip chip bonder according to the present invention.

As shown, the heating part 700 is provided on the side surface of the stage part 10. The heating unit 700 is configured to include an air duct 702 formed inside the heater mounting block 16 and an air heater 704 for heating air introduced into the air duct 702.

The air duct 702 has a shape that circulates inside the heater mounting block 16. That is, as shown in the figure, the air duct 702 has an inlet and an outlet formed on the same side of the heater mounting block 16, and is formed in a 'c' shape in the heater mounting block 16. It is.

Therefore, the air flowing into the air duct 702 circulates inside the heater mounting block 16 along the air duct 702 and is in wide contact with the heater mounting block 16.

However, the air duct 702 may be modified in the form of zigzag flowing air introduced into the air duct 702.

Meanwhile, air introduced into the air duct 702 is heated by the air heater 704.

That is, when the air heater 704 is turned on, air at room temperature introduced into the air heater 704 from the outside passes through the air heater 704, and heated and heated air is introduced into the air duct 702. will be.

In addition, when the air heater 704 is turned off, air at room temperature flows into the air duct 702 as it is, thereby rapidly cooling the heater mounting block 16. Reference numeral 400 in the drawings, which is not described, indicates flip chip alignment means.

5 and 6 are enlarged plan views and enlarged side views showing the substrate alignment means and the flip chip alignment means in detail in the flip chip bonder according to the present invention.

As shown, the substrate alignment means 300 and the flip chip alignment means 400 is provided on the upper side of the stage 10.

The substrate aligning means 300 is a plate 302 fixed to the rotary table 12 and the body 304 and the front end 304 of the body 304 to move and slide on the upper surface of the plate 302 It comprises a jig 306 installed in the ') and the position adjusting unit 320, 330 for moving the body 304.

That is, the plate 302 is in the shape of a flat plate and both ends are fixed by screwing the rotary table 12.

A polyhedral body 304 is disposed on the upper surface of the plate 302 and slides in the X-axis and Y-axis directions on the upper surface of the plate 302.

In addition, the jig 306 installed at the front end 304 ′ of the body 304 has an “a” shape as shown in the drawing, and integrally forms the upper surface of the plate 302 with the body 304. Slid.

The body 304 slides the upper surface of the plate 302 by the position adjusting unit. That is, the body 304 is moved by sliding the upper surface of the plate 302 in the X-axis and Y-axis direction by the X-axis and Y-axis direction adjusting units 320 and 330, respectively.

The X-axis direction adjusting unit 320 includes a first female screw 322 having a screw hole in the X-axis direction and a second female screw 324 having a screw hole corresponding to the first female screw 322 in the X-axis direction and the first female screw 324. It consists of X-axis positioning screw 326 coupled to the first and second female threads 322 and 324.

Here, the first female screw 322 is formed on the side of the body 304 and the second female screw 324 is formed on the plate 302 fixed on the rotary table 12.

Accordingly, when the positioning screw 326 is rotated after being coupled to the first and second female screws 322 and 324, respectively, the second female screw 324 is fixed, so only the first female screw 322 is the positioning screw 326. In accordance with the rotation of the) to move forward or backward in the X-axis direction, the body 304 is also forward and backward along the X-axis integrally with the first female screw 322.

On the other hand, the Y-axis direction adjusting unit 330 is provided with a screw hole formed to match the Y-axis direction and the screw hole formed in the first female screw 332 and the first female screw 332 is formed in the Y-axis direction It consists of the 2 female screw 334 and the Y-axis positioning screw 336 coupled to the screw hole of the said 1st and 2nd female thread 332,334.

Since the operation principle of the Y-axis direction adjusting unit 320 is the same as that of the X-axis direction adjusting unit 330, detailed description thereof will be omitted.

The substrate aligning means 300 having such a configuration is arranged so that the alignment mark of the silicon substrate placed on the upper surface of the heater mounting block 16 is located in the third hole 16 ′ of the heater mounting block 16. Play a role.

The jig 306 also serves to store the alignment position of the silicon substrate placed on the upper surface of the heater mounting block 16.

That is, since the jig 306 is fixed at the alignment position of the silicon substrate originally placed, other silicon substrates of the same size may be aligned by simply inserting the jig 306.

Meanwhile, the flip chip is mounted on the flip chip alignment means 400 fixed to the first moving sector 202.

The flip chip alignment means 400 includes a support 402 fixed to the first moving sector 202, a rotating body 404 installed on the support 402, and a rotating body 404. 408.

The support 402 is fixed to the first moving sector 202 and moves in the X-axis direction and the Y-axis direction integrally with the first moving sector 202.

The upper surface of the support 402 and the upper surface of the rotating body 404 provided on the upper surface of the support 402 is installed in parallel with the upper surface of the stage 10.

In addition, the rotor 404 is rotated by a motor 408 installed on one side of the support 402.

The flip chip is placed on the upper surface of the rotating body 404, and the flip chip has an alignment mark of the flip chip as the third passage 16 'of the stage unit 10 is rotated by the rotating body 404. Aligned to be within.

The flip chip alignment means 400 having such a configuration serves to reduce the error range by first correcting a large angle error of the flip chip placed on the upper surface.

7A is a front view showing the flip chip loading means, FIG. 7B is a plan view showing an arm in the bonding head portion, and FIG. 7C is a side view of the arm.

As shown, the flip chip loading means 500 is a bonding head portion 550 to which the flip chip is adsorbed at one end and a bonding head portion driving portion 501 for moving the bonding head portion 550 upward and downward. It is composed.

The bonding head unit driving unit 501 is configured of a shanghai body 502 and a driver 504 for moving the shanghai body 502 up and down.

A hinge protrusion 503 'is formed at one side of the shanghai copper body 502 and is coupled to the bonding head portion 550, and a shanghai copper female screw 502' is formed at the other side.

The shandong copper female thread 502 'is coupled to the screw 504' which is rotated by the driver 504 to move the shank copper body 502 up and down in accordance with the rotational direction of the screw 504 '. do.

The driver 504 is fixed to one side of the case (not shown).

In addition, the bonding head part 550 is coupled to the hinge hole 552b formed through the side surface of the bonding head part 550 and the hinge protrusion 503 'formed in the shanghai body 502 is coupled to the The bonding head part 550 rotates about the hinge coupling 540.

On the other hand, the configuration of the bonding head portion 550 is an arm 552 having a vacuum suction passage 552a therein and a transparent body 553 attached to one side of the arm 552 and the horizontal of the arm 552. And a cooler 570 for cooling the arm 552.

The arm 552 is elongated toward the upper surface of the heater mounting block 16 on the side of the stage unit 10, and the vacuum suction passage 552a is formed inside the arm 552. 552 is formed in the longitudinal direction.

At the end of the vacuum adsorption passage 552a, an adsorption port 552a 'is formed toward the stage 10, and the flip chip is adsorbed to the adsorption port 552a'.

That is, when air is discharged to the outside of the arm 552 along the vacuum suction passage 552a, suction force of air is generated in the suction port 552a ', so that the flip chip is sucked by the suction hole 552a'. Will be done.

In addition, a transparent body 553 is provided above the suction hole 552a '. The transparent body 553 allows infrared rays passing through the suction port 552a 'to be transmitted to the upper portion of the arm 552.

That is, in order for the infrared ray emitted from the infrared ray generating unit 100 to pass through the silicon substrate and the flip chip to pass through the adsorption port 552a 'and reach the infrared sensor unit 600, the adsorption port 552a'. The upper portion of the transparent body 553 is to be made.

In this case, the transparent material 553 is preferably made of transparent crystal.

On the other hand, the stopper 560 and the contact detection sensor 590 is installed at the end of the arm 552 opposite to the installation direction of the suction port 552a 'based on the hinge coupling 540, the hinge coupling The upper surface of the arm 552 located between the 540 and the suction port 552a 'is configured to contact the end of the flip chip compression buffer 590.

The configuration of the stopper 560 is inserted into the trough 552c and the trough 552c which penetrates one side of the arm 552 up and down so that the front end thereof is in contact with the bottom surface of the shank body 502. Screw 560 '.

Here, when the horizontal adjustment screw 560 'advances from the lower portion of the arm 552 to the upper portion, the suction hole 552a' rotates upward with the hinge coupling 540, and the horizontal adjustment is performed. When the screw 560 'proceeds from the upper portion to the lower portion of the arm 552, the suction hole 552a' is moved downward. As necessary, the horizontal adjusting screw 560 'is adjusted to adjust the arm ( 552 may be maintained horizontal.

The touch sensor 580 is a sensor that detects whether the flip chip attached to the suction hole 552a 'is in contact with the top surface of the silicon substrate.

The contact sensor 580 is installed at each end of the shank body 502 and the arm 552 and whether the flip chip attached to the suction port 552a 'is in contact with the upper surface of the silicon substrate. It is preferable that the contact is made of an electrical contact or mutual contact.

In addition, the flip chip compression buffer 590 includes a force adjusting screw 595 and a buffer spring 597.

The force adjusting screw (595) is fitted to a cylinder 502 "formed in one side of the shank body 502 in the vertical direction, the end of which is a buffer spring (597) inserted into the cylinder 502" Is in contact with the top of the. The lower end of the buffer spring 597 is in contact with the upper surface of the arm 552.

The flip chip compression buffer 590 having such a configuration is formed by the buffer spring 597 when the flip chip adsorbed to the adsorption port 552a 'is compressed for bonding to the upper surface of the silicon substrate. It acts as a buffer to control the pressure exerted by the flip chip downward on the silicon substrate.

8A, 8B, and 8C show front, plan, and side views of the infrared sensor unit, respectively.

As shown, the infrared sensor unit 600 is composed of an infrared camera driver (602a, 602b, 602c) to move the infrared camera 650 and the infrared camera 650 in the X-axis, Y-axis and Z-axis direction. It is.

The infrared camera 650 is installed to recognize an image from the upper portion of the stage unit 10 toward the upper surface of the stage unit 10, and the infrared camera drivers 602a, 602b, and 602c are provided in the case 1. The first driver 602a and the second driver 602b and the third driver 602c for moving the infrared camera 650 in the X-axis and Y-axis directions. .

The third driver 602c functions to move the infrared camera 650 up and down to focus the infrared camera 650.

As a result, the infrared camera 650 recognizes the alignment marks of the flip chip and the silicon substrate at the same time on the flip chip adsorbed by the adsorption port 552a 'of the bonding head unit to align the alignment marks. will be.

The operation of the flip chip bonder according to the present invention configured as described above will be described in detail with reference to the accompanying drawings.

First, the silicon substrate is placed on a jig 306 located on the upper surface of the heater mounting block 16. At this time, the alignment mark of the silicon substrate is aligned using the substrate aligning means 300 such that the alignment mark of the silicon substrate is located in the suction hole 552a '.

That is, the infrared camera 650 is positioned on the silicon substrate, and the alignment mark of the silicon substrate is monitored by using the infrared rays generated from the infrared ray generator 100.

When the X-axis positioning screw 326 and the Y-axis positioning screw 336 of the substrate alignment means 300 are properly rotated, the jig 306 installed at the tip of the body 304 moves the silicon substrate. By aligning the silicon substrate.

On the other hand, the flip chip is placed on the upper surface of the flip chip alignment means 400. Then, the flip chip alignment means 400 is moved so that the flip chip moves below the infrared camera 650.

The flip chip alignment means 400 can be moved by moving the stage unit 10.

That is, since the flip chip alignment means 400 is fixed to the stage unit 10, the flip chip alignment means 400 also moves when the stage unit driving unit 200 is adjusted with the controller (not shown). It will move.

When the flip chip is positioned below the infrared camera 650 by the stage unit driver 200, the flip chip is sensed while moving the infrared camera 650 upward and downward to detect an alignment mark formed on the flip chip. Will be aligned.

That is, the rotating body 404 of the flip chip alignment means 400 or the stage driving unit 200 is operated, and the alignment mark of the flip chip is attached to the suction hole 552a 'of the bonding head unit 550. ) To align with

Then, the completed flip chip is attracted to the suction port 552a 'of the bonding head portion 550.

That is, when the arm 552 of the bonding head portion 550 is moved toward the upper surface of the flip chip by the bonding head portion driving portion 501, the flip chip aligned in advance contacts the suction hole 552a ′. Done.

The arm 552 of the bonding head 550 is moved upward by the bonding head driver 501 after the flip chip is sucked into the suction hole 552a 'by vacuum suction. Done.

On the other hand, when the flip chip is loaded upward by the flip chip loading means 500, the stage unit 10 moves so that the silicon substrate mounted on the top surface of the stage unit 10 is loaded. It is located at the bottom.

Therefore, the infrared camera 650, the flip chip, and the silicon substrate are aligned in a row from above to below.

Then, the stopper 560 is adjusted to keep the arm 552 horizontal.

Meanwhile, the infrared camera 650 simultaneously detects alignment marks formed on the flip chip and the silicon substrate by using infrared rays emitted from the infrared ray generating unit 100 and based on the detected data, the stage unit 10. ) To coincide with the alignment mark of the flip chip and the silicon substrate.

When the alignment marks of the flip chip and the silicon substrate are matched as described above, the bonding head unit driving unit 501 is operated to move the arm 552 downward and to contact the flip chip with the silicon substrate.

At this time, the infrared camera 650 continues to detect the alignment mark of the flip chip and the silicon substrate. When the alignment mark is displaced while the arm 552 moves downward, the alignment mark is aligned while the stage unit 10 is adjusted in the X-axis and Y-axis directions by the controller (not shown).

Therefore, when the flip chip and the silicon substrate are bonded, the flip chip and the silicon substrate may be bonded while being aligned in real time.

Contact between the flip chip and the silicon substrate is detected by the touch sensor 580.

That is, when the flip chip and the silicon substrate are in contact with each other, the end of the arm 552 at which the suction hole 552a 'is positioned is finely rotated upward with respect to the hinge coupling 540.

Therefore, the upper surface of the end of the arm 552 facing the suction port 552a 'is separated from the lower surface of the shank body 502 so that the contact detection sensor 580 is short-circuited and thus between the flip chip and the silicon substrate. It will detect contact.

When the contact of the flip chip and the silicon substrate is detected by the touch sensor 580, the bonding head driver 501 stops the operation so that the arm 552 no longer moves downward. .

On the other hand, between the flip chip and the silicon substrate adsorbed to the adsorption port (552a ') must be pressed at an appropriate pressure.

That is, when the flip chip contacts the upper surface of the silicon substrate while the arm 552 moves downward, the arm substrate 552 pushes the flip chip upwards, so that the arm 552 has the hinge coupling 540. ) Rotates counterclockwise on the drawing.

At this time, the rotation of the arm 552 through the flip chip compression buffer 590 is limited. That is, the buffer spring 597 presses the upper surface of the arm 552 between the hinge coupling 540 and the suction port 552a ', thereby limiting the rotation of the arm 552 and the suction port 552a'. Is to have the elasticity downward.

When the flip chip and the silicon substrate are in contact with each other, the heater mounting block 16 is heated by the heating unit 700.

That is, as the air heated by the air heater 704 circulates through the air duct 702, the heater mounting block 16 is heated.

At this time, the infrared sensor unit 600 is moved away from the top of the stage unit 10 in order not to be affected by heat.

When the heater mounting block 16 is heated, the lead coated on the upper surface of the silicon substrate is melted, and the flip chip and the silicon substrate are compressed with the liquid lead therebetween.

When the air heater 704 stops operating, external air flows into the air duct 702 as it is, so that the heater mounting block 16 is rapidly cooled and the liquid lead is hardened so that the flip chip and the Bonding of the silicon substrate is completed.

As described above, the present invention uses the infrared sensor unit 600 to simultaneously detect the alignment marks of the flip chip and the silicon substrate and aligns the flip chip and the silicon substrate in real time to enable more precise bonding.

Although the preferred embodiment of the present invention has been described above, the present invention may use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. Accordingly, the above description does not limit the scope of the invention as defined by the limitations of the following claims.

As described above, according to the flip chip bonder device and an operation method thereof according to the present invention,

First, when the infrared sensor unit bonds the flip chip to the upper surface of the silicon substrate by simultaneously detecting the alignment mark of the flip chip and the alignment mark of the flip chip on the flip chip, the flip chip and the silicon in real time. Since the alignment chip of the substrate is matched and the flip chip can be bonded to the silicon substrate, the bonding can be bonded while correcting the mismatch of the alignment mark while the arm is lowered, thereby enabling precise bonding.

Second, more precise bonding is possible by first aligning the flip chip by the flip chip alignment means and finely rearranging the aligned flip chip.

Third, the heater mounting block is easily heated and heated by heating the air introduced into the air duct with the air heater and turning off the air heater to cool external air into the air duct. It has the effect of cooling.

Fourth, since the silicon substrate placed on the upper surface of the heater mounting block is moved to the right position by the X-axis, Y-axis direction adjusting portion, and then fixing the position adjusting portion, the correct position to be mounted by the jig is fixed. After the bonding of the flip chip to the first placed silicon substrate is completed, another silicon substrate of the same size may be easily inserted into the jig, thereby easily placing the silicon substrate.

Fifth, by installing the flip chip pressing buffer separately, there is an effect that the bonding force between the flip chip and the silicon substrate can be properly adjusted during bonding.

Sixth, by detecting that the flip chip is in contact with the upper surface of the silicon substrate by the touch sensor, the bonding head portion can be lowered only by an appropriate position.

Claims (15)

A stage portion on which a silicon substrate on which an alignment mark is formed is placed on an upper surface thereof; A stage part driving part configured to move the stage part in the X-axis and Y-axis directions, each of which comprises a first moving sector provided below the stage part in association with the stage part and a second moving sector provided below the first moving sector; An infrared generating unit installed inside the stage unit to emit infrared rays above the stage unit; A heating unit for heating the stage unit; Substrate aligning means for aligning the silicon substrate placed on the upper surface of the stage to be in a correct position; Flip chip alignment means installed in association with the stage unit, the flip chip having an alignment mark formed on the top surface thereof, and for adjusting an angle and a position of the flip chip; Flip chip loading means for picking up the flip chip mounted on the top surface of the flip chip alignment means and loading it on the top surface of the silicon substrate; When the flip chip is loaded on the upper surface of the silicon substrate, the infrared sensor for detecting the alignment mark of the flip chip and the alignment mark of the silicon substrate at the same time on the top of the flip chip by using the infrared rays emitted from the bottom of the stage unit Wealth; And a control unit for moving the stage unit to correct the bonding position of the silicon substrate and the flip chip according to the information sensed by the infrared sensor unit. The method of claim 1, The stage unit, A rotary table formed at a center of the first vent and rotated about the first vent; An insulating block installed on an upper portion of the rotary table and having a second cylinder connected to the first cylinder at a center thereof to be rotated in association with the rotary table; And a heater mounting block having a third passage through which infrared rays toward the flip chip mounted on the upper surface of the insulating block are interlocked and connected to the upper side of the insulating block. Chip Bonder Device. The flip chip bonder according to claim 2, wherein the infrared ray generator is mounted to the first hole. The method of claim 2, The heating unit, An air duct formed in the heater mounting block; And an air heater for selectively heating the air introduced into the air duct according to the on / off of the power source. The method of claim 4, wherein The air duct, An inlet formed at a side of the heater mounting block; An outlet formed adjacent to the inlet on the side of the heater mounting block, And the air introduced into the inlet is discharged through the outlet after circulating the inside of the heater mounting block. The method of claim 2, The substrate alignment means, A plate fixed to an upper surface of the rotary table and interlocked with the rotary table; A body sliding in the X-axis and Y-axis directions on the upper surface of the plate, A jig installed at the tip of the body to determine the exact position of the silicon substrate; An X axis direction adjusting unit for moving the body in the X axis direction; And a Y-axis position adjusting unit for moving the body in the Y-axis direction. The method of claim 6, The X-axis direction adjusting unit, A first female screw having a screw hole formed in the X-axis direction in the body, A second female screw formed on the plate such that the screw hole coincides with the screw hole in the X-axis direction; And an X-axis positioning screw for sliding the body in which the first female thread is formed in the X-axis direction by being coupled to the first female screw and the second female screw to rotate. The Y-axis direction adjusting unit, A first female screw having a threaded hole in the Y-axis direction in the body, A second female screw formed on the plate such that the screw hole of the first female thread in the Y-axis direction coincides with the screw hole in the Y-axis direction; And a Y-axis position adjusting screw for sliding the body in which the Y-axis first female thread is formed in the Y-axis direction by being rotated by being coupled to the Y-axis first female screw and the Y-axis second female screw. Flip chip bonder device. The method of claim 1, The flip chip alignment means, A support fixed to the first moving sector and having an upper surface parallel to the upper surface of the stage; A rotating body installed on the support and rotating to place the flip chip on the upper surface; Flip chip bonder device comprising a motor for rotating the rotating body. The method of claim 1, The flip chip loading means, A bonding head portion extending in parallel with an upper surface of the stage portion at a side of the stage portion, and having a flip chip adsorbed to one end thereof; A bonding head driver configured to be hinged with the other end of the bonding head part so that one end of the bonding head part is finely moved upward, and to move the bonding head part upward and downward to seat the flip chip on the silicon substrate. Flip chip bonder device, characterized in that. The method of claim 9, The bonding head portion, An arm formed at a lower portion of one end and having an adsorption port for adsorbing the flip chip and a vacuum suction passage connected to the adsorption port; A transparent body attached to the arm so as to be positioned above the suction port, A stopper installed on the arm to keep the arm horizontal; And a cooler configured to cool the arm. The method according to claim 9 or 10, A force adjusting screw fitted to an upper portion of the trough formed in the bonding head driving unit in a vertical direction; The flip chip bonder device further comprises a flip chip crimping buffer which is inserted from the lower portion of the hole and one end is in contact with the force adjustment screw and the other end is configured to be a buffer spring in contact with the upper surface of the bonding head portion. The method of claim 11, The flip chip loading means, And a touch sensing sensor for sensing whether the flip chip is seated on an upper surface of the silicon substrate. The method of claim 12, The touch sensor, And an electrical contact provided at the other end of the bonding head to be short-circuited when the arm rotates upward. The method of claim 1, The infrared sensor unit, An infrared camera installed on the silicon substrate and the flip chip to sense alignment marks of the silicon substrate and the flip chip using the infrared rays; Flip chip bonder device characterized in that it comprises an infrared camera driver for driving the infrared camera in the X-axis and Y-axis. Placing a silicon substrate provided with an alignment mark and a flip chip provided with the alignment mark on an upper surface of the stage portion and an upper surface of the rotating body of the flip chip chip alignment means installed in association with the stage portion; Aligning the silicon substrate by moving the substrate alignment means mounted on the stage; Moving the flip chip chip alignment means below the infrared sensor unit; Sensing the alignment mark of the flip chip with the infrared sensor unit and rotating the rotating body so that the flip chip is positioned in alignment with the flip chip; Moving the bonding head portion of the flip chip loading means downward; Adsorbing the flip chip to a suction hole formed in the bonding head; Moving the bonding head portion upward; Moving the stage unit so that the silicon substrate is positioned below the flip chip; Detecting alignment marks formed on the flip chip and the silicon substrate through the infrared sensor unit, aligning the alignment marks in real time through a control unit, and moving the bonding head portion downward; The flip chip is pressed onto the silicon substrate and the stage unit is heated by operation of the air heater; Method of operating a flip chip bonder device comprising the step of stopping the operation of the air heater and the stage portion is cooled.