CN201360395Y - BGA precise visual bonding and welding repair system - Google Patents
BGA precise visual bonding and welding repair system Download PDFInfo
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- CN201360395Y CN201360395Y CNU2009200319952U CN200920031995U CN201360395Y CN 201360395 Y CN201360395 Y CN 201360395Y CN U2009200319952 U CNU2009200319952 U CN U2009200319952U CN 200920031995 U CN200920031995 U CN 200920031995U CN 201360395 Y CN201360395 Y CN 201360395Y
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Abstract
The utility model discloses a BGA precise visual bonding and welding repair system, which comprises an X-Y positioning and adjusting mechanism for holding a PCB to be treated and adjusting the position of the PCB in grip longitudinally and horizontally, a bonding component for pick up a BGA device and transferring the BGA to a corresponding bonding pad position on the PCB for welding, an image splitting device for counterpointing the BGA device and the corresponding bonding pad position on the PCB visually, and a computer connected with the image splitting device, wherein, the bonding component consists of a pick-up and welding mechanism and a counterpoint adjusting mechanism for counterpoint-adjusting the pick-up and welding mechanism, the bonding component is positioned above the X-Y positioning adjusting mechanism, and the image splitting device is positioned between the bonding component and the X-Y positioning adjusting mechanism. The utility model is simple and reasonable in structure, and convenient to use and operate, and therefore can effectively solve the problems around bonding, welding and repairing such devices as BGA, CSP and the like on the PCB. Moreover, the utility model is reliable in working performance and high in operating precision.
Description
Technical field
It is that devices such as BGA, CSP on the electronic printing plate mount, weld and reprocess system to being welded on PCB that the utility model relates to a kind of, especially relates to a kind of BGA precise vision and mounts welding and reprocess system.
Background technology
Miniaturization (as mobile phone), portability (as notebook computer) and multi-functional development trend along with electronic product, the function of integrated circuit is more and more stronger, meanwhile, make the IC chip of BGA (BallGrid Array ball grid array structure), CSP (chip scale package wafer-level package), QFP different packing forms such as (the small-sized square planar package of Quad Flat Package) develop towards the direction that pin number increases, pin-pitch reduces, above-mentioned growth requirement also causes the increase of weld defect simultaneously.
The utility model content
Technical problem to be solved in the utility model is at above-mentioned deficiency of the prior art, provide a kind of BGA precise vision to mount welding and reprocess system, it is simple and reasonable and use easy and simple to handle, can effectively solve devices such as BGA, CSP and on pcb board, mount, weld and reprocess problem, and reliable working performance, performance accuracy height.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of BGA precise vision mounts welding and reprocesses system, it is characterized in that: comprise the pending pcb board of horizontal from bottom to up clamping and can be in length and breadth to the X-Y location adjusting mechanism of adjusting clamping pcb board position, pick up the BGA device of required welding and picking up BGA device delivered to the beam split device for image that mounts assembly, the corresponding pad locations with pcb board of picking up BGA device is carried out the vision contraposition of corresponding pad locations of pcb board and welding, and the computer that joins with the beam split device for image; The described assembly that mounts is by the welding mechanism that picks up that described BGA device is picked up and welds, and the described welding mechanism that picks up is carried out the contraposition adjusting mechanism that contraposition adjusts and forms, and described contraposition adjusting mechanism is installed in the described welding mechanism top of picking up; The described assembly that mounts is positioned at adjusting mechanism top, X-Y location; Described beam split device for image mounts between assembly and the described X-Y location adjusting mechanism described.
Described X-Y location adjusting mechanism comprises pedestal, be installed on the pedestal and the position can carry out in length and breadth to the X-Y coordinates platform of adjusting, be used for the hold assembly that clamping pcb board and position can be adjusted, and the bottom hot air head that corresponding pad locations week side of pcb board is heated from the bottom; Described hold assembly and bottom hot air head are installed in X-Y coordinates platform top; Described position of picking up welding mechanism is corresponding with the position of bottom hot air head.
The described welding mechanism that picks up is by described BGA device being adsorbed and the compound suction nozzle of hot blast/vacuum that welds, the suction nozzle replacing device that is used to change the compound suction nozzle of hot blast/vacuum, hot air duct and vacuum pipe are formed; The compound suction nozzle of described hot blast/vacuum is made up of at the hot blast sleeve pipe in the vacuum slot outside vacuum slot and coaxial package, circular passage between described hot blast sleeve pipe and the vacuum slot is a hot-air channel, and described hot air duct and vacuum pipe correspondence communicate with hot-air channel and vacuum slot respectively; The position of the compound suction nozzle of described hot blast/vacuum is corresponding with the position of bottom hot air head.
Described contraposition adjusting mechanism is by picking up elevating mechanism and the rotating mechanism that the welding mechanism position adjusts accordingly and form described; Described elevating mechanism is installed in the described welding mechanism top of picking up, and described rotating mechanism is installed in elevating mechanism top, and described elevating mechanism is formed by the lifting guiding mechanism and to the manual rotating handle that the lifting guiding mechanism carries out regulating and controlling.
Also comprise in the welding process pressure sensor that in real time pressure between described BGA device and pcb board is detected, described pressure sensor institute detected pressures signal is sent to computer behind signal processing unit one.
Described assembly, beam split device for image and the X-Y location adjusting mechanism of mounting is installed in installing rack inside from top to bottom successively.
Video camera, zoom lens and lighting mechanism composition that described beam split device for image is served as reasons and fitted together; Described beam split device for image stretches out when described BGA device and pcb board are carried out the vision contraposition, and the vision contraposition finish after the device for image of withdrawal; Described lighting mechanism is two lighting devices that respectively described BGA device and pcb board thrown light on up and down.
The quantity of described hold assembly is two and is installed in the left and right sides, X-Y coordinates platform top respectively; Described bottom hot air head is installed in X-Y coordinates platform upper center and is positioned at the pcb board below.
Described hot air duct and vacuum pipe are installed in the compound suction nozzle of hot blast/vacuum top.
Described picking up is equipped with the temperature sensor that described BGA device surface temperature is detected in real time on the welding mechanism, described temperature sensor institute detected temperatures signal is sent to computer behind signal processing unit two.
The utility model compared with prior art has the following advantages, and 1, simple and reasonable, each several part is installed compact and use easy and simple to handle.2, reliable working performance, performance accuracy height carry out firm clamping by the X-Y location adjusting mechanism that is positioned at the below to pending pcb board; Simultaneously by being positioned at the BGA device that assembly picks up required welding that mounts of the top, and with the BGA device that picked up after contraposition is adjusted, deliver to the corresponding pad locations of pcb board, carry out the Reflow Soldering welding afterwards; In addition, when the BGA device that picked up and pcb board were carried out the contraposition welding, what the utility model adopted was to carry out the vision contraposition at the beam split device for image that mounts between the adjusting mechanism of assembly and X-Y location, thereby aligning accuracy is very high.3, usedly pick up the welding mechanism modern design, use is easy and simple to handle and welding effect good, it picks up welding mechanism and comprises that mainly compound suction nozzle of hot blast/vacuum and the hot air duct that communicates with the compound suction nozzle of hot blast/vacuum inside respectively and vacuum pipe form; When mainly being welding, hot air duct provide welding required thermal source, the thermal source in the time of can effectively guaranteeing the welding of BGA device by hot air duct to the compound suction nozzle of hot blast/vacuum; Vacuum pipe mainly is to provide to the compound suction nozzle of hot blast/vacuum when picking up the BGA device to pick up required absorption affinity; In addition, because the compound suction nozzle of hot blast/vacuum is corresponding with the position of the bottom hot air head that is positioned at the pcb board below and from the bottom all sides of pcb board pad locations is heated, when then welding, the compound suction nozzle of hot blast/vacuum heats from pcb board top by the hot blast of sending here from top to bottom from the warm-air pipe road, the bottom hot air head heats from the pcb board bottom, realized that finally the purpose of heat treated is simultaneously carried out to the weld between BGA device and pcb board in both sides up and down, thereby welding effect is good, also can not occur any changing of the relative positions phenomenon simultaneously.4, used the applied widely of welding mechanism that pick up because the logical top of the compound suction nozzle of hot blast/vacuum is provided with its suction nozzle replacing device of changing and changes easy and simple to handlely, thereby can satisfy the installation requirements of the compound suction nozzle of multiple different model hot blast/vacuum.5, BGA device and pcb board are being carried out in the welding process, in real time the pressure between BGA device and pcb board is detected in real time by pressure sensor, after treatment simultaneously with pressure sensor institute detection signal, synchronous driving to computer carries out correspondingly analyzing and processing and demonstration, can realize welding process between BGA device and pcb board is carried out the purpose of complete monitoring like this, further guarantee welding quality.6, applied widely, the utility model is applicable to the attachment process of various surface mount device on pcb board, as CSP, BGA, QFP and other particular device, in the actual mechanical process, temperature by the heating of High Accuracy Control hot blast, various surface mount devices ground is mounted automatically with automatic dismounting be able to simple realization, this kind type has increased one to one heating and other new mechanism in real time in addition, can process the BGA device and the little CSP device to 5mm * 5mm that arrive 50mm * 50mm greatly; For scientific research institutions' development of new products, because it all adopts form chips such as BGA, CSP, QFP mostly, thereby available the utility model carries out that precise vision mounts and directly carry out reflow soldering, and use value is very high.In sum, the utility model structure advantages of simple and use easy and simple to handlely can effectively solve devices such as BGA, CSP and mount, weld and reprocess problem on pcb board, and reliable working performance, performance accuracy height.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the structural representation of the compound suction nozzle of the utility model hot blast/vacuum.
Fig. 3 is a circuit block diagram of the present utility model.
Description of reference numerals:
The 1-pedestal; The 2-X-Y coordinates platform; The 3-hold assembly;
4-bottom hot air head; 5-beam split device for image; The compound suction nozzle of 6-hot blast/vacuum;
The 7-suction nozzle replacing device; The 8-elevating mechanism; 8-1-lifting guiding mechanism;
The 8-2-manual rotating handle; The 9-rotating mechanism; The 10-hot air duct;
The 11-vacuum pipe; The 12-pressure sensor; The 13-vacuum slot;
The 14-thermocouple; The 16-computer; 17-signal processing unit one;
The 18-installing rack; The 19-hot-air channel; 20-signal processing unit two.
Embodiment
As Fig. 1, Fig. 2 and shown in Figure 3, the utility model comprise the pending pcb board of horizontal from bottom to up clamping and can be in length and breadth to the X-Y location adjusting mechanism of adjusting clamping pcb board position, pick up the BGA device of required welding and picking up BGA device delivered to the beam split device for image 5 that mounts assembly, the corresponding pad locations with pcb board of picking up BGA device is carried out the vision contraposition of corresponding pad locations of pcb board and welding, and the computer 16 that joins with beam split device for image 5.Wherein, the described assembly that mounts is by the welding mechanism that picks up that described BGA device is picked up and welds, and the described welding mechanism that picks up is carried out the contraposition adjusting mechanism that contraposition adjusts and forms, and described contraposition adjusting mechanism is installed in the described welding mechanism top of picking up.The described assembly that mounts is positioned at adjusting mechanism top, X-Y location; Described beam split device for image 5 mounts between assembly and the described X-Y location adjusting mechanism described.In the present embodiment, described assembly, beam split device for image 5 and the X-Y location adjusting mechanism of mounting is installed in installing rack 18 inside from top to bottom successively.Described computer 16 is a PC.
In addition, the utility model also comprises the pressure sensor 12 that in real time pressure between described BGA device and pcb board is detected in the welding process, and 12 detected pressures signals of described pressure sensor are sent to computer 16 behind signal processing unit 1.
Described X-Y location adjusting mechanism comprises pedestal 1, be installed on the pedestal 1 and the position can carry out in length and breadth to the X-Y coordinates platform of adjusting 2, be used for the hold assembly 3 that clamping pcb board and position can be adjusted, and the bottom hot air head 4 that corresponding pad locations week side of pcb board is heated from the bottom.Described hold assembly 3 and bottom hot air head 4 are installed in X-Y coordinates platform 2 tops; Described position of picking up welding mechanism is corresponding with the position of bottom hot air head 4.In the present embodiment, the quantity of described hold assembly 3 is two, and is installed in the left and right sides, X-Y coordinates platform 2 top respectively; Described bottom hot air head 4 is installed in X-Y coordinates platform 2 upper center and is positioned at the pcb board below.
Particularly, described pedestal 1 is processed through hot investment casting by aluminium.Described X-Y coordinates platform 2 is used for fixing pcb board, and X-Y coordinates platform 2 goes up the XY adjustment component that is provided with by it, respectively from about with the front and back four direction position of pcb board is adjusted; That is to say,, reach the purpose of the two dimensional surface position of pcb board being carried out easy adjustment by adjusting described XY adjustment component.Described hold assembly 3 is used for gripping large-size and heavier pcb board, and the clamping action of the hold assembly 3 by being positioned at pcb board below makes that pcb board can move left and right and bending; If desired, can also adjust the position and the height of hold assembly 3 arbitrarily.During actual the use, from the pcb board back side, the pad peripheral position of installation BGA device is heated by described bottom hot air head 4.During equipment work, its temperature rises automatically, also can detect in real time its temperature by temperature transducer simultaneously.
The described assembly that mounts is specifically by picking up welding mechanism and the described welding mechanism that picks up being carried out the contraposition adjusting mechanism that contraposition adjusts and forms.In the present embodiment, pressure sensor 12 is installed in the described top that mounts assembly,, that is to say that pressure sensor 12 is a described part that mounts assembly mounting the pressure between the real-time testing BGA device and pcb board in the process automatically.
The described welding mechanism that picks up is by described BGA device being adsorbed and the compound suction nozzle 6 of hot blast/vacuum that welds, the suction nozzle replacing device 7 that is used to change the compound suction nozzle 6 of hot blast/vacuum, hot air duct 10 and vacuum pipe 11 are formed.The compound suction nozzle 6 of described hot blast/vacuum is made up of at the hot blast sleeve pipe in vacuum slot 13 outsides vacuum slot 13 and coaxial package, circular passage between described hot blast sleeve pipe and the vacuum slot 13 is a hot-air channel 19, and described hot air duct 10 and vacuum pipe 11 correspondences communicate with hot-air channel 19 and vacuum slot 13 respectively.The position of the compound suction nozzle 6 of described hot blast/vacuum is corresponding with the position of bottom hot air head 4.The compound suction nozzle 6 of described hot blast/vacuum is installed on the suction nozzle replacing device 7, and described suction nozzle replacing device 7 is fixedly mounted on the installing rack 18.
In addition, described picking up is equipped with the temperature sensor that described BGA device surface temperature is detected in real time on the welding mechanism, and described temperature sensor institute detected temperatures signal is sent to computer 16 behind signal processing unit 2 20.In the present embodiment, described temperature sensor is the thermocouple 14 that is positioned at vacuum slot 13 inside, and described thermocouple 14 connects computer 16 behind signal processing unit 2 20.To sum up, the center of the compound suction nozzle 6 of hot blast/vacuum is vacuum slots 13, and the circular passage of vacuum slot 13 outsides is hot-air channels 19, and thermocouple 14 is equipped with in vacuum slot 13 inside.Thereby the compound suction nozzle 6 of hot blast/vacuum has blowing hot-air, vacuum suction BGA device, and multi-functional such as test b GA device surface temperature.Simultaneously, the compound suction nozzle 6 of hot blast/vacuum has multiple size, to adapt to the user demand of corresponding different size BGA device.Described suction nozzle replacing device 7 comes the more compound suction nozzle 6 of heat exchange hot blast/vacuum by individual pen rotation clamping bar, uses operation very easy, by promoting suction nozzle replacing device 7 forward, can unload or install the compound suction nozzle 6 of hot blast/vacuum.
In the present embodiment, described hot air duct 10 and vacuum pipe 11 are installed in the compound suction nozzle of hot blast/vacuum 6 tops.When picking up the BGA device, described vacuum pipe 11 is by the compound suction nozzle 6 of hot blast/vacuum, and the BGA device of required welding is carried out vacuum suction and fixing.In the actual welding process, hot air duct 10 is heated to high temperature with gas at normal temperature, and blows to soldered BGA device by the compound suction nozzle 6 of hot blast/vacuum, and reaches the welding temperature of the BGA device being carried out reflow soldering.In the welding process, in real time BGA device surface temperature is detected by thermocouple 14.
Described contraposition adjusting mechanism is realized described the moving up and down and rotatablely moving of assembly that mount by picking up elevating mechanism 8 and the rotating mechanism 9 that the welding mechanism position adjusts accordingly and form described by elevating mechanism 8 and rotating mechanism 9.Described elevating mechanism 8 is installed in the described welding mechanism top of picking up, and described rotating mechanism 9 is installed in elevating mechanism 8 tops.Described elevating mechanism 8 is formed by lifting guiding mechanism 8-1 and to the manual rotating handle 8-2 that lifting guiding mechanism 8-1 carries out regulating and controlling, during actual the use, can regulate the described upper-lower position that mounts assembly by manual rotating handle.Described rotating mechanism 9 is used for adjusting the BGA device that is adsorbed on the compound suction nozzle 6 of hot blast/vacuum and the mutual alignment of pcb board, pass through lever, the described assembly that mounts can be rotated in ± 15 ° of scopes, that is to say, adjust the relative angle of BGA device and pcb board by rotating mechanism 9.
Usually in use, rotating mechanism 9 will be united use with X-Y coordinates platform 2.Particularly, in the position alignment process of pcb board and BGA device, adjust the two dimensional surface position of pcb board by adjusting X-Y coordinates platform 2, to reach the position concentric with the BGA device, simultaneously, adjust by adjusting the described rotational angle that mounts 9 pairs of BGA devices that pick up of rotating mechanism of assembly, make that corresponding pad locations overlaps up and down on BGA device and the pcb board.Be noted that: the position alignment process of pcb board and BGA device is to carry out on beam split device for image 5 carries out the basis of accurate vision contraposition.
Video camera, zoom lens and lighting mechanism composition that described beam split device for image 5 is served as reasons and fitted together; Described beam split device for image 5 stretches out when described BGA device and pcb board are carried out the vision contraposition, and the vision contraposition finish after the device for image of withdrawal; Described lighting mechanism is two lighting devices that respectively described BGA device and pcb board thrown light on up and down.In the present embodiment, described video camera is a ccd video camera.Described lighting mechanism is the LED lighting mechanism.To sum up, described beam split device for image 5 is to pcb board be adsorbed on and stretch out when BGA device on the compound suction nozzle 6 of hot blast/vacuum carries out the vision contraposition, puts in reposition when carrying out the mounting and weld of BGA device.In addition, because described beam split device for image 5 joins with computer 16, then in vision contraposition process, on the remote data indicator of computer 16, then can show pcb board surface simultaneously and be adsorbed on BGA device on the compound suction nozzle 6 of hot blast/vacuum, and the two image respectively accounts for 50%, in the actual mechanical process, also can be according to concrete needs, the displaying ratio of pcb board and BGA device image also can adjust accordingly.
The course of work of the present utility model is: at first, pcb board is placed on the X-Y coordinates platform 2, and with hold assembly 3 it is fixedly clamped, make that simultaneously the pad locations that will mount the BGA device on the pcb board is corresponding with the position of bottom hot air head 4; Afterwards, by described pick up welding mechanism with the BGA device of required welding by vacuum suction, suck-back is in the compound suction nozzle of hot blast/vacuum 6 bottoms; Stretch out 5 pairs of pcb boards of beam split device for image and BGA device again and carry out accurate vision contraposition, in the vision contraposition process, pcb board and BGA device are imaged on the remote data indicator by beam split device for image 5 simultaneously; Then, unite adjustment by adjusting X-Y coordinates platform 2 and the described rotating mechanism 9 that mounts assembly again, in the associating adjustment process, image corresponding relation with reference to shown pcb board on the remote data indicator and BGA device is adjusted, very directly perceived and the contraposition effect is very good, aligning accuracy is than higher, in a word, by adjusting X-Y coordinates platform 2 and rotating mechanism 9, make on BGA device and the pcb board that the pad picture position coincides accordingly; Then, stretch back beam split device for image 5, adjust the described elevating mechanism 8 that mounts assembly, make and drop under the BGA device on the corresponding pad of pcb board, the hot blast of sending by hot-air channel 19 heats, detect the surface temperature of BGA device simultaneously by thermocouple 14 in real time, finally realize mounting welding and reprocessing of BGA device.
In the operating process, because thermocouple 14 and pressure sensor 12 real-time institute's detection signals separately all are sent to computer 16 after treatment, and after computer 16 carries out analyzing and processing to importing into data respectively, draw corresponding analysis processing result, with reference to above-mentioned analysis processing result, welding degree between corresponding judgement BGA device and the pcb board is carried out corresponding adjusting to parameters such as the temperature of hot blast that hot air duct 10 is sent into, speed simultaneously.
The above; it only is preferred embodiment of the present utility model; be not that the utility model is imposed any restrictions; everyly any simple modification that above embodiment did, change and equivalent structure are changed, all still belong in the protection range of technical solutions of the utility model according to the utility model technical spirit.
Claims (10)
1. a BGA precise vision mounts welding and reprocesses system, it is characterized in that: comprise the pending pcb board of horizontal from bottom to up clamping and can be in length and breadth to the X-Y location adjusting mechanism of adjusting clamping pcb board position, pick up the BGA device of required welding and picking up BGA device delivered to the beam split device for image (5) that mounts assembly, the corresponding pad locations with pcb board of picking up BGA device is carried out the vision contraposition of corresponding pad locations of pcb board and welding, and the computer (16) that joins with beam split device for image (5); The described assembly that mounts is by the welding mechanism that picks up that described BGA device is picked up and welds, and the described welding mechanism that picks up is carried out the contraposition adjusting mechanism that contraposition adjusts and forms, and described contraposition adjusting mechanism is installed in the described welding mechanism top of picking up; The described assembly that mounts is positioned at adjusting mechanism top, X-Y location; Described beam split device for image (5) mounts between assembly and the described X-Y location adjusting mechanism described.
2. mount welding according to the described BGA precise vision of claim 1 and reprocess system, it is characterized in that: described X-Y location adjusting mechanism comprises pedestal (1), be installed in that pedestal (1) is gone up and the position can carry out in length and breadth to the X-Y coordinates platform of adjusting (2), be used for the hold assembly (3) that clamping pcb board and position can be adjusted, and the bottom hot air head (4) that corresponding pad locations week side of pcb board is heated from the bottom; Described hold assembly (3) and bottom hot air head (4) are installed in X-Y coordinates platform (2) top; Described position of picking up welding mechanism is corresponding with the position of bottom hot air head (4).
3. mount welding according to the described BGA precise vision of claim 2 and reprocess system, it is characterized in that: the described welding mechanism that picks up is made up of the compound suction nozzle of hot blast/vacuum (6) that described BGA device is adsorbed and weld, the suction nozzle replacing device (7) that is used to change the compound suction nozzle of hot blast/vacuum (6), hot air duct (10) and vacuum pipe (11); The compound suction nozzle of described hot blast/vacuum (6) is made up of at the hot blast sleeve pipe in vacuum slot (13) outside vacuum slot (13) and coaxial package, circular passage between described hot blast sleeve pipe and the vacuum slot (13) is hot-air channel (19), and described hot air duct (10) and vacuum pipe (11) correspondence communicate with hot-air channel (19) and vacuum slot (13) respectively; The position of the compound suction nozzle of described hot blast/vacuum (6) is corresponding with the position of bottom hot air head (4).
4. mount welding according to claim 1,2 or 3 described BGA precise visions and reprocess system, it is characterized in that: described contraposition adjusting mechanism is by picking up elevating mechanism (8) and the rotating mechanism (9) that the welding mechanism position adjusts accordingly and form described; Described elevating mechanism (8) is installed in the described welding mechanism top of picking up, described rotating mechanism (9) is installed in elevating mechanism (8) top, and described elevating mechanism (8) is formed by lifting guiding mechanism (8-1) and to the manual rotating handle (8-2) that lifting guiding mechanism (8-1) carries out regulating and controlling.
5. mount welding according to claim 1,2 or 3 described BGA precise visions and reprocess system, it is characterized in that: also comprise the pressure sensor (12) that in real time pressure between described BGA device and pcb board (15) is detected in the welding process, described pressure sensor (12) institute detected pressures signal is sent to computer (16) behind signal processing unit one (17).
6. mount welding according to claim 1,2 or 3 described BGA precise visions and reprocess system, it is characterized in that: described assembly, beam split device for image (5) and the X-Y location adjusting mechanism of mounting is installed on the installing rack (18) from top to bottom successively.
7. mount welding according to claim 1,2 or 3 described BGA precise visions and reprocess system, it is characterized in that: video camera, zoom lens and lighting mechanism composition that described beam split device for image (5) is served as reasons and fitted together; Described beam split device for image (5) stretches out when described BGA device and pcb board are carried out the vision contraposition, and the vision contraposition finish after the device for image of withdrawal; Described lighting mechanism is two lighting devices that respectively described BGA device and pcb board thrown light on up and down.
8. mount welding according to the described BGA precise vision of claim 2 and reprocess system, it is characterized in that: the quantity of described hold assembly (3) is two and is installed in X-Y coordinates platform (2) left and right sides, top respectively; Described bottom hot air head (4) is installed in X-Y coordinates platform (2) upper center and is positioned at the pcb board below.
9. mount welding according to the described BGA precise vision of claim 3 and reprocess system, it is characterized in that: described hot air duct (10) and vacuum pipe (11) are installed in the compound suction nozzle of hot blast/vacuum (6) top.
10. mount welding according to claim 1,2 or 3 described BGA precise visions and reprocess system, it is characterized in that: described picking up is equipped with the temperature sensor that described BGA device surface temperature is detected in real time on the welding mechanism, and described temperature sensor institute detected temperatures signal is sent to computer (16) behind signal processing unit two (20).
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|---|---|---|---|
| CNU2009200319952U CN201360395Y (en) | 2009-02-24 | 2009-02-24 | BGA precise visual bonding and welding repair system |
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| CNU2009200319952U CN201360395Y (en) | 2009-02-24 | 2009-02-24 | BGA precise visual bonding and welding repair system |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036488A (en) * | 2010-11-12 | 2011-04-27 | 北大方正集团有限公司 | Plate overhaul facility and overhaul method thereof |
| CN102331426A (en) * | 2011-07-15 | 2012-01-25 | 富社（上海）商贸有限公司 | Method and device for detecting failure of suction nozzle |
| CN102573326A (en) * | 2011-12-29 | 2012-07-11 | 华为终端有限公司 | Repairing method and repairing workstation for circuit board |
| CN103874343A (en) * | 2014-04-04 | 2014-06-18 | 深圳市卓茂科技有限公司 | High-precision full-automatic BGA repair workbench |
| CN107734959A (en) * | 2017-10-11 | 2018-02-23 | 天津大学 | A kind of surface mount device and method for silver paste connection |
| CN108656532A (en) * | 2018-03-16 | 2018-10-16 | 嘉兴领科材料技术有限公司 | A kind of preparation facilities of fiber reinforcement High Performance Thermoplastic Composites |
| CN109905974A (en) * | 2019-04-12 | 2019-06-18 | 深圳市隽美泰和电子科技有限公司 | A kind of integrated circuit board rework equipments improving tip-off safety |
| CN111432622A (en) * | 2020-05-18 | 2020-07-17 | 雷彭波 | Machining method of manual chip mounter |
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- 2009-02-24 CN CNU2009200319952U patent/CN201360395Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036488A (en) * | 2010-11-12 | 2011-04-27 | 北大方正集团有限公司 | Plate overhaul facility and overhaul method thereof |
| CN102036488B (en) * | 2010-11-12 | 2012-07-04 | 北大方正集团有限公司 | Plate overhaul facility and overhaul method thereof |
| CN102331426A (en) * | 2011-07-15 | 2012-01-25 | 富社（上海）商贸有限公司 | Method and device for detecting failure of suction nozzle |
| CN102573326A (en) * | 2011-12-29 | 2012-07-11 | 华为终端有限公司 | Repairing method and repairing workstation for circuit board |
| CN103874343A (en) * | 2014-04-04 | 2014-06-18 | 深圳市卓茂科技有限公司 | High-precision full-automatic BGA repair workbench |
| CN103874343B (en) * | 2014-04-04 | 2017-02-15 | 深圳市卓茂科技有限公司 | High-precision full-automatic BGA repair workbench |
| CN107734959A (en) * | 2017-10-11 | 2018-02-23 | 天津大学 | A kind of surface mount device and method for silver paste connection |
| CN108656532A (en) * | 2018-03-16 | 2018-10-16 | 嘉兴领科材料技术有限公司 | A kind of preparation facilities of fiber reinforcement High Performance Thermoplastic Composites |
| CN109905974A (en) * | 2019-04-12 | 2019-06-18 | 深圳市隽美泰和电子科技有限公司 | A kind of integrated circuit board rework equipments improving tip-off safety |
| CN111432622A (en) * | 2020-05-18 | 2020-07-17 | 雷彭波 | Machining method of manual chip mounter |
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