KR20020087845A - Evaporator of CPL cooling apparatus having a fine wick structure - Google Patents

Abstract

PURPOSE: An evaporator of capillary pumped loop(CPL) cooling system with fine wick structure is provided to improve cooling efficiency. CONSTITUTION: An evaporator is flat plate type and includes a refrigerant storage part(42) storing refrigerant flowing in from a condenser and collecting non-condensed gas contained in refrigerant in an upper space(42a); a cooling part(46) cooling a heating body(H) by evaporation of refrigerant; and an upper structure(50) and a lower structure(38) joined to limit a channel area(44) where refrigerant is delivered from the refrigerant storage part to the cooling part by capillary force.

Description

Evaporator of CPL cooling apparatus having a fine wick structure

The present invention relates to an evaporator of a cooling device, and more particularly, to an evaporator of a CPL cooling device having a fine wick structure.

Although the power required to drive the unit semiconductor elements constituting the chip is very small, the number of semiconductor elements constituting the unit chip, that is, the degree of integration of the chip is high, resulting in an increase in heat generation per unit area of the chip, thereby increasing the surface temperature of the chip. .

As such, when the surface temperature of the chip is increased, the chip reliability is lowered and the life is also shortened. As a result, the reliability and life of the semiconductor device are reduced and shortened.

Accordingly, various methods for chip cooling have been proposed, and one of them is a method using a capillary pumped loop (CPL) using the surface tension of the refrigerant in a microstructure as part of a driving force for circulating the refrigerant.

CPL is largely composed of an evaporator which contacts the heating element to absorb heat from the heating element, a condenser for condensing the evaporated gas and a liquid tube and a gas tube connected between the two elements.

The gases generated in the evaporator have a higher temperature and pressure than the gases in the condenser. Therefore, the gas generated in the evaporator naturally flows to the condenser. In addition, the liquid condensed in the condenser is introduced into the evaporator again by the capillary force induced in the liquid connecting tube and the evaporator having a fine wick structure to cool the heating element.

The factor that determines the cooling performance of the CPL is the structure and connection of each part of the cycle, but the structure of the evaporator, which absorbs heat from the heating element and pumps the condensed liquid from the condenser, plays an important role. can do.

When designing an evaporator, the most important thing to consider is the proper discharge structure to transfer the evaporated gas from the evaporator to the condenser in the process of absorbing heat from the heating element and the dry-out of the evaporator surface, It is a microstructure design for flowing condensed liquid from the condenser into the evaporator without drying.

When the discharge of the evaporated gas from the evaporator and the inflow of liquid from the condenser to the evaporator are balanced, an evaporator of a CPL cooling device capable of achieving stable and high performance can be obtained. It's falling short of this.

Therefore, the technical problem to be achieved by the present invention is to improve the above-described problems of the prior art, the balance between the discharge of the evaporated gas and the supply of the refrigerant to achieve a stable and efficient cooling CPL (CPL) cooling In providing an evaporator of the device.

1 is a plan view showing an evaporator bottom configuration of a CPL (CPL) cooling apparatus having a fine Wick structure according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of FIG. 1 taken along the direction of 2-2 ', showing a top plate covering the bottom.

3 is an exploded perspective view of FIG. 1.

4 is a plan view of a modified channel region applied to the evaporator shown in FIG.

5 is a plan view of another modified channel region applied to the evaporator shown in FIG.

FIG. 6 is a plan view symbolically showing pattern regions constituting a bottom of a refrigerant contact portion of the evaporator shown in FIG. 1.

7 to 11 are plan views illustrating a pattern distribution of first to fifth pattern regions among the pattern regions configuring the refrigerant contacting portion of FIG. 6, respectively.

FIG. 12 is a plan view illustrating another pattern distribution of a fourth pattern region among the pattern regions configuring the refrigerant contact unit of FIG. 6.

FIG. 13 is a plan view illustrating distribution of first to fifth pattern regions, a channel region, and patterns formed in each pattern region constituting the refrigerant contact unit of FIG. 6.

FIG. 14 is a plan view symbolically showing another example of a pattern distribution around a fifth pattern region among the pattern regions configuring the refrigerant contact portion of FIG. 6 through a refrigerant flow.

15 to 18 are plan views of the evaporator of the CPL cooling apparatus according to another embodiment of the present invention, each having a different distribution of pattern regions constituting the bottom of the refrigerant contact portion.

19 to 22 are cross-sectional views each showing an evaporator of a CPIEL cooling apparatus having a fine wick structure according to another embodiment of the present invention.

* Description of Signs of Major Parts of Drawings *

38, 50: lower and upper structure

40: first substructure (substrate) 40a, 40b, 40c: third substructure

40a: 1st piece 40b: 2nd piece

40c: Part 3 42: Refrigerant Storage

44: channel region 46: cooling section

46a, 46b: first and second cooling sections

50a: plane defining the channel region of the upper structure

51: second lower structure 60: refrigerant pumping means

A: Refrigerant contact A1: Refrigerant inlet

A2: Steam outlet H: Heating element

R1 to R5: first to fifth pattern regions

L1, L2, L3: lengths of patterns formed in the first to second pattern regions

P1, P2, P3, P4, P4 ', P5: Patterns formed in the pattern region

W1, W2, W3: width of the pattern formed in the first to third pattern regions

D1, D2, D3, D4, and D5: left and right spacing between patterns formed in the first to fifth pattern regions

H1, H2, H3, H4, H5: vertical gap between patterns formed in the first to fifth pattern regions

d4, d5: diameters of the patterns provided in the fourth and fifth pattern regions

In order to achieve the above technical problem, the present invention is a CPL cooling device having an evaporator for cooling the heating element through the phase change of the condenser and the refrigerant,

The evaporator is a refrigerant storage unit configured to collect the non-condensed gas contained in the introduced refrigerant in the upper space while storing the refrigerant flowing from the condenser, and a cooling unit for cooling the heating element through the vaporization of the refrigerant; And a flat plate including an upper and a lower structure coupled to define a channel region in which the refrigerant is transferred from the refrigerant storage unit to the cooling unit.

The lower structure is formed on the edge of the first lower structure and the first lower structure to be used as a substrate is connected to the refrigerant inlet and the vapor inlet of the condenser connected to the refrigerant outlet of the condenser between the upper structure And a second substructure forming a steam outlet.

The one substrate further includes a channel region for pumping the refrigerant stored in the refrigerant storage unit into the cooling unit by using capillary force, and is integrated with the refrigerant storage unit and the cooling unit. In this case, the channel region is provided between the refrigerant storage unit and the cooling unit, and a partial region may extend between the cooling unit and the substrate.

The coolant storage unit, the channel region, and the cooling unit may include at least one pattern region.

The cooling unit has two pattern regions. In other words, a predetermined pattern (hereinafter, referred to as a heating portion pattern region) is provided in an area corresponding to the heating portion, and another pattern region that completely surrounds the heating portion pattern region is formed between the channel region and the heating portion pattern region. Equipped. The other pattern region preferably includes a region in which at least two different patterns are formed.

At least one region of the coolant storage unit, the channel region, or the bottom of the cooling unit includes a plurality of patterns for anisotropically or isotropically flowing refrigerant flowing from a condenser or another adjacent region toward the cooling unit or its center. Formed. At this time, each of the plurality of patterns for allowing the refrigerant to flow anisotropically has a predetermined height, and its planar shape has a predetermined geometric shape having a predetermined length in the direction in which the refrigerant flows. Each height of the plurality of patterns is higher or lower than the patterns formed in the neighboring pattern region.

A plurality of patterns are distributed in any one of the pattern regions constituting the cooling unit so that the coolant flowing from the adjacent pattern region flows to the center of the cooling unit and isotropically flows through the entire pattern region thereof. It is.

In the center of the cooling unit, a plurality of patterns are distributed to allow the coolant flowing from the adjacent pattern region to flow uniformly and quickly to the entire region of the cooling unit and to transfer high heat from the heating element in the vertical direction. At this time, the plurality of patterns are each of a variety of geometric shapes having a predetermined height, it is preferred that the diameter is smaller and the height is distributed toward the center of the cooling unit from the edge.

According to another embodiment of the present invention, the lower structure together with the upper structure to form the refrigerant storage while the first piece to form a refrigerant inlet connected to the refrigerant outlet of the condenser, the channel of the upper structure The steam facing the surface defining the region while one side forms the cooling unit together with the second piece and the upper structure in close contact with the first piece so that the refrigerant does not leak, and is connected to the steam inlet of the condenser. And a third piece bonded to the other side of the second piece so as to form a discharge port and prevent the refrigerant from leaking.

At this time, a step exists between the first piece and the second piece and / or between the second piece and the third piece.

Pumping means for pumping the refrigerant flowing into the coolant storage portion filling the channel region between the second piece and the surface defining the channel region of the upper structure to the cooling unit is provided. The pumping means is preferably a porous member, but may be composed of a porous member and a pattern formed on a portion of the second piece. In this case, the pattern is preferably formed to act the capillary force on the refrigerant flowing into the refrigerant storage portion or the refrigerant flowing through the porous member.

A portion of the channel region extends between the cooling portion and a vertical portion of the third piece. In addition, another partial region of the channel region extends between the refrigerant reservoir and a vertical portion of the first piece.

In the case of using the present invention, since the non-condensation gas and the liquid is provided with a refrigerant storage unit that can be stored separately, it is possible to stably supply the refrigerant to the cooling unit as well as to prevent the non-condensable gas is introduced into and accumulated in the condenser, Cooling efficiency is increased because the refrigerant can be continuously and uniformly supplied from the refrigerant storage unit to the cooling unit by the amount of refrigerant removed by evaporation from the cooling unit.

Hereinafter, an evaporator of a CPL cooling apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this process, the thicknesses of layers or regions illustrated in the drawings are exaggerated for clarity. In the case of FIG. 1, a plan view of the lower structure of the evaporator. FIG. 2 is a cross-sectional view of FIG. 1 taken along the direction of 2-2 ', showing the upper structure together.

Referring to FIG. 1, reference numeral 38 denotes a lower structure of the evaporator. Substructure 38 is composed of first and second substructures 40, 51. The first lower structure 40 represents a substrate in which a coolant flows along a surface thereof, and a heating element contacts the rear surface thereof. Hereinafter, the first lower structure 40 is referred to as a substrate 40. The second lower structure 51 is formed along the edge of the substrate 40. The inner region A of the substrate 40 is defined by the second lower structure 51. The inner region A of the substrate 40 is in contact with the refrigerant flowing from the condenser (not shown) through the refrigerant inlet A1 formed at one side of the second lower structure 51. Hereinafter, the inner region A of the substrate 40 is referred to as the refrigerant contact portion A. FIG. The refrigerant contact portion A is composed of a refrigerant storage portion 42, a channel region 44, and a cooling portion 46. Patterns are formed at the bottom of each of these sections and regions in the form given for the flow of refrigerant. The refrigerant storage unit 42 is a region in which the refrigerant flowing from the condenser through the refrigerant inlet A1 is stored, and the channel region 44 is a portion of the refrigerant from the refrigerant storage unit 42 to the cooling unit 46 by capillary force. The pumping region is a region where the flow of the refrigerant flows, and the cooling unit 46 is a region where the refrigerant supplied through the channel region 44 absorbs heat of the heating element H and changes in phase, for example, when the refrigerant is water. It is a region where water absorbs heat of the heating element and vaporizes, thereby cooling the heating element.

On the other hand, considering that the refrigerant vaporizes (evaporates) by the heat transferred from the heating element in the cooling unit 46, the cooling unit 46 may be an evaporation unit.

The phase change (vaporized) refrigerant in the cooling unit 46 is discharged to the condenser (not shown) through the steam outlet A2. The refrigerant inlet A1 and the steam outlet A2 are provided in series along the refrigerant flow to prevent backflow between the steam generated in the cooling unit 46 and the condensed refrigerant, as well as the high temperature steam outlet A2 and the refrigerant. Heat transfer between the inlet section can be prevented as much as possible.

The coolant storage section 42, the channel region 44 and the cooling section 46 are formed in a row and continuously, and the coolant contact section A is a region defined on one substrate 40, so the coolant storage section 42, the channel region 44 and the cooling unit 46 can be seen as a unitary unit.

Although the coolant storage 42, the cooler 46, and the channel region 44 are classified according to the role of each part or region, as shown in FIG. 2, the coolant is stored in the channel region 44 in the coolant storage 42. It is connected to one through the substrate 40 so that it can flow continuously to the cooling unit 46 through the ().

2 and 3, three-dimensional regions of the evaporator, such as the refrigerant storage 42, the channel region 44, and the cooling unit 46, are defined by the upper structure 50 and the lower structure 38. You can see that. And it can be seen that the evaporator including the upper structure 50 and the lower structure 38 is a flat plate type.

The refrigerant contact portion A is divided into a refrigerant storage portion 42 and a cooling portion 46 around the channel region 44. The channel region 44 extends between the upper and lower sides of the cooling unit 46 and the second lower structure 51. Accordingly, the channel region 44 is in the shape of "c", and the cooling unit 46 is in the form of the "c" shape of the channel region 44 and the second lower structure 51. The channel region 44 of this type is for allowing the coolant to flow evenly and continuously from the coolant reservoir 42 to the entire region of the cooler 46. In other words, the refrigerant is not supplied to the cooling unit 46 only in one direction but is supplied to the cooling unit 46 from all directions. In this way, it is possible to prevent the entire cooling portion 46 or a partial region from being dried out instantaneously. If this object can be achieved, the channel region 44 may be in a form other than the letter "c". For example, as illustrated in FIG. 4, the channel region 44 may be provided by connecting the upper and lower sides of the refrigerant contact portion A to divide the refrigerant contact portion A into a refrigerant storage portion and a cooling portion. In addition, as shown in FIG. 5, the channel region 44 having a "wh" shape surrounding the entire cooling section 46 may be provided. In this case, each region of the refrigerant storage 42, the channel region 44, and the cooling unit 46 may be adjusted as necessary. Therefore, at this time, the width of the channel region 44 between the refrigerant storage 42 and the first cooling unit 46a corresponding to the heating element H is narrowed so that more refrigerant can be supplied to the cooling unit 46. Alternatively, the resistance of the refrigerant in the channel region 44 may be reduced to increase the amount of the refrigerant flowing into the first cooling unit 46a. In FIG. 1, reference numeral 46b denotes a remaining region of the cooling unit 46, that is, a second cooling unit, except for the first cooling unit 46a.

In order to smoothly and continuously and uniformly flow the coolant from the coolant reservoir 42 to the cooler 46, the coolant reservoir 42, the channel region 44, and the cooler 46 of the coolant contact portion A are provided. Patterns of various shapes are formed on the floor corresponding to the.

Meanwhile, referring to FIG. 3, a more specific form of the substrate 40, the second lower structure 51, and the upper structure 50 can be seen. Reference numeral 43 is provided to protrude from the bottom surface of the upper structure 50. It is a member defining the channel region 44 in the refrigerant contact portion A. The second lower structure 51 is hermetically bonded around the refrigerant contact portion A of the substrate 40, and the bottom edge of the upper structure 50 is hermetically bonded to the upper edge of the second lower structure 51. In addition, the thickness of the member 43 defining the channel region is preferably the same as the thickness of the upper structure 50. In this way, the refrigerant is prevented from being introduced into the refrigerant storage unit 42 through any other area except the refrigerant inlet A1, and the refrigerant introduced into the refrigerant storage unit 42 is cooled only through the channel region 44. ), The steam generated in the cooling unit 46 is discharged only through the steam outlet (A2).

6, according to the pattern formed on the bottom of the refrigerant contact portion A, the refrigerant contact portion A may include a first pattern region R1 in which a plurality of first patterns are formed and a first pattern in which a plurality of second patterns are formed. 2 pattern region R2, third pattern region R3 having a plurality of third patterns, fourth pattern region R4 having a plurality of fourth patterns, and fifth pattern region R5 having a plurality of fifth patterns Can be divided into It is preferable that the pattern density of one pattern region is uniform, but it is also preferable that the pattern density for each pattern region is different depending on the region to which each pattern region belongs. Moreover, the form of the pattern formed in each pattern area | region differs according to the area | region to which each pattern area belongs. For example, since the coolant must flow uniformly and continuously from the coolant storage part 42 toward the cooler part 46, the pattern formed in the coolant storage part 42 and the channel region 44 is defined by the coolant part 46. While it is desirable to have a shape that can flow smoothly, uniformly and continuously toward the surface, the pattern formed in the cooling unit 46 including the upper portion of the heating element is a form in which the refrigerant can flow uniformly and continuously from all directions to the upper portion of the heating element. It is preferable.

Comparing FIG. 1 and FIG. 6, it can be seen that the channel region 44 and the cooling unit 46 except for the coolant storage unit 42 are all composed of a plurality of pattern regions.

In detail, the coolant storage unit 42 includes only the first pattern region R1, but the channel region 44 includes first to third pattern regions R1, R2, and R3, and is cooled. The portion 46 includes second to fifth pattern regions R2, R3, R4, and R5. Among the pattern regions constituting the channel region 44, the second pattern region R2 is provided to maximize the pumping of the refrigerant from the coolant storage unit 42 to the center of the cooling unit, and thus, the second cooling unit 46b. A partial region of the channel region 44 in contact with the left side and a partial region of the second cooling unit 46a passing between the vertical portion of the channel region 44 and the first cooling unit 46a are included. As shown in FIGS. 14 and 15, the third pattern region R3 is provided to naturally and continuously induce the refrigerant flow in the channel region 44 having the left and right directions up and down toward the center of the cooling unit. Starting from some areas in contact with the first cooling section 46a of the two horizontal portions of the region 44 and extending to some areas of the second cooling section 46b, along the right side of the refrigerant contact portion A The portions starting in the partial regions of the two horizontal portions are in contact with each other. In other words, the entire region except the partial region on the left side of the edge region of the second cooling unit 46b belongs to the third pattern region R3. In FIG. 14, reference numeral 56 denotes a refrigerant flow in the third pattern region R3.

Among the pattern regions constituting the cooling unit 46, the fourth and fifth pattern regions R4 and R5 are regions corresponding to the heating element H, as shown in FIG. 2, and the refrigerant flowing into the cooling unit 46. It is also a final arrival region of the region where the phase change of the refrigerant is most active. The left side is surrounded by the second pattern region R2 and the remaining portion is surrounded by the third pattern region R3. The top, bottom and right sides of the fourth pattern region R4 form a boundary with the third pattern region R3 and the left side with the second pattern region R2. In other words, the fourth pattern region R4 is surrounded by the second and third pattern regions R2 and R3. The second and third pattern regions R2 and R3 surrounding the fourth pattern region R4 of the cooling unit 46 are respectively the second and third pattern regions R2 and R3 constituting the channel region 44. This is an extension.

If it is assumed that the coolant is smoothly, continuously and uniformly supplied from the coolant reservoir 42 to the cooler 46, the pattern of the coolant reservoir 42, the channel region 44 and the cooler 46 The region configuration may be different from that shown in FIG. 6, and may vary depending on the heating surface area of the heating element or the heating value of the heating element.

For example, as shown in FIG. 15, the third pattern region R3 may be replaced with the first pattern region R1 in the same manner as the refrigerant storage unit 42 among the pattern regions constituting the channel region 44. In addition, the third pattern region R3 constituting the right side of the cooling unit 46 may be replaced with a second pattern region R2 composed of patterns having a shape capable of increasing refrigerant pumping to the center of the cooling unit.

In addition, as shown in FIG. 16, the entire channel region 44 may be composed of only the second pattern region R2 composed of patterns having a shape capable of maximizing refrigerant pumping. As a result, only the third pattern region R3 formed of patterns having a shape into which the refrigerant can be smoothly introduced may be provided.

As such, the configuration of the pattern region of the refrigerant storage 42, the channel region 44, and the cooling unit 46 may be different.

On the other hand, as shown in Figs. 17 and 18, in the case where the shape of the channel region is different, the pattern regions constituting the refrigerant storage 42, the channel region 44 and the cooling section 46 are also different.

Specifically, referring to FIG. 17, the channel region 44a is a straight channel region as shown in FIG. 4 connecting the upper and lower sides of the refrigerant contact portion A vertically to connect the refrigerant contact portion A at both ends. . The channel region 44a is composed of first and second pattern regions R1 and R2, where the first pattern region R1 has a 'c' shape, and the second pattern region R2 has a first shape. The left side and the upper and lower sides are surrounded by the pattern region R1. The cooling unit 46 has a fifth pattern region R5 at the center and a fourth pattern region R4 at the periphery thereof, and a channel between the left side of the fourth pattern region R4 and the channel region 44a. The second pattern region R2 of the region 44a is extended to contact the left side of the fourth pattern region R4. The third pattern region R3 is provided between the second and fourth pattern regions R2 and R4 and the second lower structure 51. That is, the third pattern region R3 is provided in a form in which left and right 'c' letters are inverted, and the second and fourth pattern regions constituting the cooling unit 46 together with the third pattern region R3 ( R2 and R4 have a form in which the right and upper and lower sides are surrounded by the third pattern region R3.

Referring to FIG. 18, the channel region 44b has a '?' Shape and includes first to third pattern regions R1, R2, and R3. The cooling unit 46 surrounded by the channel region 44b includes second to fifth pattern regions R2, R3, R4, and R5. The fifth pattern region R5 is provided at the center of the cooling unit 46. The fourth pattern region R4 is provided around the fifth pattern region R5. The second pattern region R2 is provided between the right side of the fourth pattern region R4 and the channel region 44b, and the second pattern region R2 is formed on the second lower portion through the right side of the channel region 44b. It extends to the structure 51. The second channel region R2 is also provided between the right side of the fourth pattern region R4 and the left side of the channel region 44b, and the second channel region R2 has an upper side and a lower side of the channel region 44b. Extends vertically to the left, and extends to the left part of the channel region 44b to the left in this state.

Meanwhile, a third pattern region R3 is provided between the second and fourth pattern regions R2 and R4 and the channel region 44b, and the third pattern region R3 is formed above the channel region 44b. It extends to the lower part of the region, and extends to the second lower structure 51 to the right in this state.

As a result, the fourth pattern region R4 is surrounded by the left and right second pattern regions R2 and the upper and lower third pattern regions R3.

Subsequently, FIG. 7 shows a planar view of a pattern formed in the first pattern region R1 among the various pattern regions constituting the cooling contact portion A. Referring to this, in FIG. The formed plurality of patterns P1 are all the same form. Each pattern P1 has a predetermined length L1 and a left and right gap D1 in a direction A3 in which the refrigerant flows, and a predetermined width W1 and a vertical gap H1 that are much shorter than the length in a direction perpendicular thereto. ) Is a straight pattern on the plane. At this time, the patterns constituting the two neighboring rows up and down are aligned so that the patterns P1 cross each other in the vertical direction.

Although not shown in the drawing, these patterns P1 formed in the first pattern region R1 have a predetermined height. At this time, it is preferable that the heights of the patterns P1 formed in the first pattern region R1 are all the same, but the height of the pattern formed in other regions except the channel region 44 is higher or lower than that formed in the channel region 44. It's okay.

As such, the patterns P1 included in the first pattern region R1 are three-dimensionally formed. 7 illustrates a perspective view of a part of the pattern P1, and it can be clearly seen that the patterns P1 are three-dimensional in shape. Since the pattern P1 constituting the first pattern region R1 is three-dimensional as described above, the refrigerant stored in the refrigerant storage 42 flows into the channel region 44 through the bottom with directivity.

FIG. 8 shows an arrangement form of the pattern P2 constituting the second pattern region R2, and it can be seen that the original view is a perspective view of a part of the pattern P2 and is a three-dimensional form of the pattern P2. Referring to FIG. 8, it can be seen that the plurality of patterns P2 constituting the second pattern region R2 have the same shape as the pattern P1 constituting the first pattern region R. Referring to FIG. However, the length L2 of the pattern P2 formed in the second pattern region R2, the left and right intervals D2, the upper and lower intervals H2, and the width W2 are formed of the pattern P1 formed in the first pattern region R1. Is shorter and narrower than the length L1, the upper and lower intervals H1, and the width W1, and the left and right intervals D2 in the direction in which the refrigerant flows are also narrow, so that the pattern density of the second pattern region R2 is the first. It can be seen that it is higher than the pattern density of the pattern region R1. Therefore, the refrigerant flowing into the channel region 44 along the first pattern region R1 flows uniformly with a larger capillary force while meeting the second pattern region R2.

Since the pattern P2 formed in the second pattern region R2 also has the same shape as the pattern P1 formed in the first pattern region R1, the channel region 44 including the first and second pattern regions R1 and R2 is provided. Refrigerant introduced into the) flows into the cooling unit 46 having a direction.

The channel region 44 extends to the upper and lower regions of the cooling unit 46 in a “c” shape, and the region close to the second lower structure 51 among the expanded regions is the first pattern region R1, and the cooling is performed. The region close to the portion 46 is the third pattern region R3. In the third pattern region R3, the refrigerant flowing from a neighboring pattern region, that is, the first pattern region R1, flows along the periphery or edge of the cooling unit and directs the flow of the refrigerant toward the center of the cooling unit. A plurality of patterns are distributed. The height of each of the plurality of patterns is preferably the same as the patterns formed in another adjacent pattern area, but may be higher or lower.

Referring to FIG. 9, a plurality of patterns P3 are formed in the third pattern region R3, and the length L3, the width W3, the left and right spacing D3, and the upper and lower spacing ( It can be seen that the dimensions of H3) are almost similar to or somewhat smaller than those of the pattern P2 constituting the second pattern region R2, except that the patterns P3 are arranged in a matrix form, and the shapes are the same. have. Therefore, the coolant flowing into the channel region 44 flows quickly along the first pattern region R1, and meets the second and third pattern regions R2 and R3 more uniformly, and cools the cooling unit 46 in all directions. Will flow toward. At this time, the refrigerant flowing into the third pattern region R3 has both directivity in the vertical and horizontal directions as can be seen in the arrangement of the pattern P3 of FIG. 7. Therefore, the coolant flowing in the third pattern region R3 of the channel region 44 formed above and below the cooling unit 46 is the cooling unit 46 similar to the refrigerant flowing into the second pattern region R2 of the channel region 44. Not only can flow uniformly toward), but also flows along the periphery or edge of the cooling unit through the third pattern region R3 provided on the right side of the cooling unit. In this way, the supply of the coolant to the entire cooling section 46 is smoothly and continuously induced.

On the other hand, referring to Figure 2, it can be seen that the heating element (H) is in contact with the bottom surface of the substrate corresponding to the fourth and fifth pattern regions (R4, R5) of the cooling portion of the substrate 40.

Therefore, a large amount of heat is generated after the fifth pattern region R5 in the fourth pattern region R4 surrounding the fifth pattern region R5 and surrounded by the second to third pattern regions R2 and R3. Is delivered from). Therefore, the plurality of patterns formed in the fourth pattern region R4 must supply the flowing refrigerant rapidly and uniformly around the fifth pattern region R5 and at the same time have a large contact area with the refrigerant. A shape capable of absorbing heat transferred to the region R4 and transferring it in the vertical direction is preferable. In addition, since more heat is transferred to the fifth pattern region R5 from the heating element H more intensively than the fourth pattern region R4, the pattern formed in the fifth pattern region R5 is the fourth pattern region R4. There is a need for a plurality of patterns of high density with increased contact area that can utilize the refrigerant uniformly supplied evenly more effectively.

For example, as illustrated in FIGS. 10 and 11, the patterns P4 and P5 included in the fourth and fifth pattern regions R4 and R5 may have predetermined left and right intervals D4 and D5, and top and bottom. It is a three-dimensional form having the intervals H4 and H5 and the height and the predetermined diameters d4 and d5. Preferably it is a cylinder having a predetermined height as shown in the circle. These patterns P4 and P5 are preferably provided such that their density is uniform throughout the respective pattern regions. In other words, the patterns P4 and P5 of the fourth and fifth pattern regions R4 and R5 are refrigerants like the patterns P1 and P2 formed in the first pattern region R1 or the second pattern region R2. Rather than being distributed in such a way as to give the direction of flow, the refrigerant is preferably formed so as to be distributed in a way that isotropically flowing in all directions.

12 illustrates a plurality of patterns in which the density formed in the fourth pattern region R4 surrounding the fifth pattern region R5 changes.

The fifth pattern region R5 is a region where the most heat is transferred from the heating element H, compared to the other pattern regions constituting the cooling unit 46. Therefore, it is preferable that the refrigerant flows into the fifth pattern region R5 at the same time from all sides of the fifth pattern region R5, and this is naturally achieved because the fourth pattern region R4 is provided at the periphery.

On the other hand, it is preferable to disperse the refrigerant flowing in from all sides of the fifth pattern region R5 to the entire fifth pattern region R5 at about the same time. Absorption can be prevented, and a dry out phenomenon can be prevented locally, and the cooling efficiency of the heating element H can be improved.

In consideration of these things, the shape of the pattern P5 formed in the fifth pattern region R5 or the number of patterns formed in the unit area, that is, the density of the pattern or the degree of pattern integration and pattern distribution form the fourth pattern region R4. It is preferable to consider in the extension line of the pattern P4 'formed in the. However, in order to remove heat transferred from the heating element H more quickly and more uniformly in the entire region, the incoming refrigerant can be quickly and uniformly dispersed in the entire region, and the fourth and fifth patterns contacting the refrigerant. The surface area of the regions R4 and R5 is preferably as wide as possible.

Accordingly, the patterns constituting the fourth and fifth pattern regions R4 and R5 are isotropically distributed such that the incoming refrigerant is uniformly and quickly distributed in all directions as shown in FIGS. 10 and 11. It is preferred to have a geometric shape, such as a cylinder.

Therefore, the diameter d5 of the pattern P5 provided in the fifth pattern region R5 is narrower than that of the pattern P4 formed in the fourth pattern region R4, and the constituent density or integration degree of the pattern P5 is zero. It is preferable to make it higher than the constituent density or integration degree of the pattern P4 of 4 pattern area | region R4.

FIG. 13 illustrates an example of a plurality of patterns and channel regions formed in the plurality of pattern regions, that is, the first to fifth pattern regions R1, R2, R3, R4, and R5 constituting the refrigerant contact portion A described above. As a perspective view showing (44) together, the three-dimensional shape (original) of the pattern formed in each pattern region, the distribution form of the pattern, the constituent density or integration degree of the pattern, etc. can be compared with each other. The pattern shape, distribution form, composition density, and the like of each pattern region shown in FIG. 13 are rapidly changed from the refrigerant storage portion 42 to the entire region of the cooling portion 46, particularly the entire region of the fifth pattern region R5. It can be done differently, provided that it can be supplied uniformly and continuously. In particular, the coolant storage 42 and the channel region 44 are relatively far from the heating element H compared to the cooling unit 46. Therefore, the configuration of the pattern region of the refrigerant storage unit 42 or the channel region 44 and the deformation margin of the pattern formed in each pattern region may be larger than those of the cooling unit 46. Accordingly, compared to the cooling unit 46, the shape of the pattern of the refrigerant storage unit 42 and the channel region 44, or the shape of the pattern formed in each of the configured pattern regions, the density of the density, the degree of integration, and the distribution form may be more variously modified. have.

The refrigerant introduced into the refrigerant storage 42 is pumped to the cooling unit 46 by the capillary force of the channel region 44. Therefore, the amount of the refrigerant reaching the cooling unit 46 through the channel region 44 is smaller than the amount of the refrigerant flowing into the refrigerant storage 42, and as shown in FIG. ) Is stored in the refrigerant storage unit 42. The refrigerant accommodating capacity of the refrigerant storage unit 42 may be adjusted by adjusting the width and width or height of the refrigerant storage unit 42. The coolant accommodating capacity of the coolant storage unit 42 may be such that the coolant may be stably and uniformly supplied to the cooler 46 even though the coolant is not supplied from the condenser. The upper space 42a in the coolant storage unit 42 may be used as an area for collecting non-condensed gases G introduced together with the coolant flowing from the condenser. In addition, by storing a predetermined refrigerant in the refrigerant storage unit 42, the refrigerant can be stably supplied to the cooling unit 46, thereby improving the cooling efficiency of the heating element. That is, when the amount of heat generated by the heating element in the cooling unit 46 is instantaneously increased, the refrigerant is instantaneously evaporated in a predetermined region of the cooling unit 46, particularly in the fourth and fifth pattern regions R4 and R5. A dry out phenomenon may occur. When the refrigerant is always kept at a predetermined level in the refrigerant storage unit 42, the refrigerant may be continuously supplied to the cooling unit 46 that is overheated at a moment, and thus may occur instantaneously. Dry out may be prevented from diffusing into the channel region 44 and spreading through the evaporator.

2 and 3, the upper structure 50 is in contact with the second lower structure 51 around the refrigerant contact portion A to cover the entire area of the refrigerant contact portion A, but the refrigerant storage portion ( 42) and the cooling unit 46 is provided with a space for accommodating the refrigerant storage and the phase-changed refrigerant. However, the upper structure 50 is in contact with the channel region 44. Therefore, the pattern formed to direct the flow of the refrigerant is in contact with the pattern region constituting the upper structure 50 and the channel region 44. In this way, a fine channel through which the refrigerant flows is formed in the channel region 44, and thus a capillary phenomenon appears. Soon, a capillary force appears, and by the capillary force caused by the surface tension of the refrigerant, the refrigerant stored in the refrigerant storage unit 42 is naturally pumped to the cooling unit 46 without the help of an external force. The upper portion of each of the refrigerant storage unit 42 and the cooling unit 46 is provided with a refrigerant inlet A1 and a steam outlet A2 for discharging the steam resulting from the introduction of the refrigerant and the phase change. For convenience, the pattern formed on the bottom of the refrigerant contact portion A is not shown.

19 to 22 are cross-sectional views illustrating an evaporator of a C. P. C. cooling device according to another embodiment of the present invention. Referring to FIG. 19, a third lower structure (e.g., a corresponding upper structure 50) is provided. 40a, 40b, and 40c are constructed by bringing the first to third pieces in close contact with each other so that the refrigerant does not leak. The first piece 40a defines the coolant storage 42 together with the upper structure 50, and the coolant storage of the substrate (40 of FIG. 2) in the evaporator according to the embodiment illustrated in FIGS. 1 to 18. The portion corresponding to (42) and the portion surrounding the refrigerant storage portion 42 in the second lower structure 51 are equivalent to the result of combining in one unit. The second piece 40b provided between the first piece 40a and the third piece 40c of the substrate 40 facing the surface 50a defining the channel region 44 of the upper structure 50. Corresponding to a portion, the channel 50 is formed to face the surface 50a in which the refrigerant is transferred from the refrigerant storage unit 42 to the cooling unit 46. The third piece 40c extends vertically from the horizontal part and the horizontal part in close contact with the second piece 40b and in contact with the bottom surface of the heating element H, and has an upper portion for discharging steam generated from the cooling part 46. It consists of a vertical portion spaced apart from the structure 50 by a given distance. The third piece 40c has a single unit in the above-described embodiment, the portion corresponding to the cooling portion 46 of the substrate 40 and the portion surrounding the cooling portion 46 in the second lower structure 51. It is equivalent to the combined output. Thus, the portions extending vertically toward the upper structure 50 of the first and third pieces 40a and 40c become equivalent to the second lower structure (51 in FIGS. 2 and 3).

As illustrated in FIGS. 7 to 14, the bottoms of the portions corresponding to the refrigerant storage part 42, the channel region 44, and the cooling part 46 of the first to third pieces 40a, 40b, and 40c are illustrated. Various patterns for the coolant flow are formed, but as described in detail through the process and the related drawings for explaining the embodiment, detailed illustration thereof will be omitted. This fact also applies to FIGS. 20 to 22.

FIG. 20 illustrates a case in which the first pumping means 60 for pumping the refrigerant is provided in the channel region 44 in the embodiment shown in FIG. 19. In this case, a separate pattern is not provided on the second piece 40b.

Specifically, referring to FIG. 20, the cooling unit in the refrigerant storage unit 42 using capillary force between the second piece 40b and the surface 50a defining the channel region 44 of the upper structure 50. A first pumping means 60 is provided for pumping the refrigerant to 46. The surface facing the refrigerant storage 42 of the first pumping means 60 (hereinafter referred to as the first surface) is in contact with the refrigerant flowing into the refrigerant storage 42 and faces toward the cooling unit 46. Second surface) is in contact with or in contact with the patterns formed in the cooling unit 46. In this way, the refrigerant pumped by the first pumping means 60 reaches the second surface via the first pumping means 60 and flows directly into the cooling unit 46. The first pumping means 60 may exert a capillary force on the refrigerant introduced into the refrigerant storage 42, and pump the refrigerant introduced into the first pumping means 60 to the second surface by the capillary force. As long as it can be made, the member which has any structure may be sufficient, but it is preferable that it is a porous material. In this case, the hole in the porous member preferably has a size capable of applying a capillary force capable of sufficiently pumping the refrigerant to the second surface of the refrigerant introduced into the refrigerant storage 42.

Meanwhile, the first surface of the first pumping means 60 facing the refrigerant storage unit 42 may be further extended to the refrigerant storage unit 42 than illustrated in the drawing. In other words, the first surface of the first pumping means 60 may be provided to protrude to the refrigerant storage 42 by a given length.

FIG. 21 shows another modification of the embodiment shown in FIG. 19. Referring to this, the second piece 40b and the third piece 40c are provided in the same form as shown in FIG. 19. However, the first piece 40a and the second piece 40b are provided to have a step at the boundary. In other words, the surface of the horizontal portion in contact with the second piece 40b of the first piece 40a is positioned lower than the surface of the second piece 40b. This result is equivalent to moving the entire first piece 40a by a given distance along the surface in close contact with the first piece 40a of the second piece 40b. At this time, it is preferable that the moving distance is smaller than the thickness of the second piece 40b. In this way, a part of the surface which is in contact with the first piece 40a of the second piece 40b is in contact with the coolant flowing into the coolant storage 42. The exposed surface of the second piece 40b acts as a jaw to the coolant that is moved from the coolant reservoir 42 to the cooler 46.

Since the thicknesses of the horizontal portions of the first to third pieces 40a, 40b, and 40c are the same, when a step is generated between the upper surface of the first piece 40a and the second piece 40b, between the lower surfaces of both Even step is generated. Due to this step, a space 40c-1 having a thickness corresponding to the step exists below the second and third pieces 40b and 40c. This space 40c-1 may be left as it is, but may be filled with another member. In the latter case, since the heating element H should be attached to the lower surface thereof, it is preferable that the heating element H is at least the same member as the third piece 40c or a member having better thermal conductivity than the third piece 40c.

Meanwhile, a view showing a portion defined by the first circle C1 in FIG. 21 is shown below in FIG. 21. Referring to this, the thickness of the second piece 40b may be the first and third pieces 40a and 40c. It may be thicker than the thickness of), the surface of the second piece (40b) may be located higher than the surface of the horizontal portion of the first and third pieces (40a, 40c). Thus, where the channel between the second piece 40b and the face 50a defining the channel region 44 of the upper structure 50 is higher than the surface of the horizontal portion of the first and third pieces 40a, 40c. Positioned to allow a three-dimensional refrigerant supply.

FIG. 22 shows a case in which the second pumping means 60a for pumping the refrigerant is provided in the channel region 44 instead of the pattern in the embodiment shown in FIG. 21.

Specifically, the second pumping means 60a is disposed between the surface 50a defining the channel region 44 of the second piece 40b and the upper structure 50, that is, the surface facing the second piece 40b. It is provided, which is preferably the same as the first pumping means (60 in FIG. 20) described above, but may be other.

For example, the second pumping means 60a may be configured by combining the porous member and the pattern. That is, the portion close to the refrigerant storage portion 42 of the second pumping means 60a is composed of the first porous member, the portion close to the cooling portion 46 is composed of the second porous member, and the center portion is the first portion. The first and second porous members may be connected to each other, and may include patterns formed to exert capillary force on the refrigerant flowing through the first porous member. Alternatively, the portion close to the refrigerant storage unit 42 of the second pumping means 60a may be formed of patterns formed to apply capillary force to the refrigerant flowing into the refrigerant storage unit 42, and the remaining portion may be formed of a porous member. can do. Alternatively, a portion of the second pumping means 60a close to and in the middle of the refrigerant storage unit 42 may be formed of a porous member, and a portion of the second pumping means 60a, which is close to the cooling unit 46, may flow through the porous member constituting the center portion. It can be composed of patterns formed to act on the capillary force.

Meanwhile, a view showing a portion defined as the second circle C2 in FIG. 22 is shown below in FIG. 22. Referring to this, the second pumping means 60a may include the first piece and the second piece 40b. Even when provided to protrude upward from the three pieces 40a and 40c, the second piece 40b is provided between the second piece 40b and the surface 50a facing the second piece 40b of the upper structure 50. In this case, the second pumping means 60a may be configured by combining the porous member and the patterns as described above.

While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention. For example, those skilled in the art may further include another pattern region in the first pattern region R1 constituting the refrigerant storage unit 42. In addition, a part of the coolant storage part 42 may be extended toward the cooling part 46, and the first pattern area R1 may be one of the pattern areas constituting the cooling part 46. The channel region 44 may be provided in a different form from the "c".

In addition, by combining the foregoing, it will be possible to deform the cooling portion, the channel region and the refrigerant storage portion in a form not mentioned but sufficiently inducible, and to modify the pattern density of the pattern region constituting them or to form a pattern formed in each pattern region. It will be possible to change the shape of. In addition, not only the cooling unit 46 but also the refrigerant storage unit 42 may include a channel region 44 in which a partial region is extended. In addition, at least one of the pattern regions constituting the bottom of the coolant storage unit 42, the cooling unit 46, and the channel region 44 is formed from a pattern region to another position, that is, the degree of integration. May be a pattern area in which the pattern is distributed such that is gradually increased or decreased. In addition, the bottom of the coolant storage 42 or the cooling unit 46 may have patterns higher or lower than the pattern formed at the bottom of the channel region 44. In addition, the bottom of the refrigerant storage unit 42 may not have a special pattern. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

As described above, the present invention includes a refrigerant storage unit capable of storing the refrigerant flowing from the condenser and the non-condensed gas in the non-condenser, thereby not only stably supplying the refrigerant but also minimizing accumulation of non-condensable gas in the condenser. Since the coolant may be uniformly and continuously supplied from the coolant storage unit to the cooler unit by the amount of the coolant removed by evaporation, it is possible to prevent undesirable phenomena such as dry out, thereby improving cooling efficiency of the evaporator. .

Claims (49)

A CPL cooling apparatus comprising a condenser, an evaporator for receiving a refrigerant from the condenser, and cooling the heating element through a phase change of the refrigerant, and a liquid pipe and a gas pipe connecting the evaporator and the condenser. The evaporator, A refrigerant storage unit configured to collect non-condensed gas included in the refrigerant flowing into the upper space while storing the refrigerant flowing from the condenser; A cooling unit configured to cool the heating element through vaporization of the refrigerant; And Evaporator of the CPL cooling apparatus characterized in that the flat type including the upper and lower structures coupled to define a channel region in which the refrigerant is transferred by the capillary force from the refrigerant storage to the cooling unit. The condenser of claim 1, wherein the substructure is formed on a first substructure used as a substrate and the edge of the first substructure and is connected to a refrigerant outlet of the condenser between the substructure and the superstructure. Evaporator of the CPL cooling device, characterized in that consisting of a second substructure forming a steam outlet connected to the steam inlet of the. The evaporator of claim 2, wherein the channel region is formed between the refrigerant storage unit and the cooling unit, and a partial region extends between the cooling unit and the second lower structure. 4. The evaporator of claim 3, wherein another portion of the channel region extends between the refrigerant reservoir and the second substructure. The evaporator of claim 2, wherein the channel region is '-', straight or 'ㅁ' shaped. The evaporator of any one of claims 1 to 4, wherein the bottom of the coolant storage unit is formed of at least one pattern region. The evaporator of any one of claims 1 to 3, wherein the bottom of the cooling unit comprises at least one pattern area. The evaporator of any of claims 2 to 5 wherein the bottom of the channel region consists of at least one pattern region. The evaporator of claim 6, wherein the bottom of the refrigerant storage unit is configured of a first pattern region. The evaporator of claim 9, wherein at least one other pattern region is included in the first pattern region. The evaporator of claim 7, wherein the cooling unit bottom comprises a first pattern region. The evaporator of claim 11, wherein at least one other pattern region is further included in the first pattern region. The method of claim 7, wherein the bottom of the cooling unit includes second and third pattern regions at a circumference thereof, and includes a fourth pattern region surrounded therein and a fifth pattern region surrounded by the fourth pattern region. Evaporator of CPL cooling unit. The evaporator of claim 7, wherein the bottom of the cooling unit includes a fourth pattern region at a circumference thereof and a fifth pattern region surrounded by the fourth pattern region at an inner side thereof. The evaporator of claim 14, wherein a third pattern region is provided around the fourth pattern region, and the third pattern region is in contact with the channel region. The evaporator of claim 8, wherein the bottom of the channel region comprises a first pattern region. The evaporator of claim 16, wherein at least one other pattern region is further included in the first pattern region. 17. The method of claim 16, wherein the bottom of the channel region further comprises a second and third pattern regions in addition to the first pattern region, the first pattern region is in contact with the pattern region constituting the bottom of the refrigerant reservoir, And the second and third pattern regions are in contact with the pattern regions constituting the bottom of the cooling unit, respectively. 19. The evaporator of claim 18, wherein the first and third pattern regions constitute a region extending between the cooling unit and the substrate of the channel region. The evaporator of claim 19, wherein the pattern region constituting the bottom of the cooling unit in contact with the third pattern region is the third pattern region. The evaporator of claim 18, wherein the second pattern region extends into the cooling unit. The method of claim 9, wherein the refrigerant flowing from the condenser into the first pattern region is directed toward the cooling unit. Evaporator of the CPL cooling apparatus, characterized in that a plurality of patterns are formed to give. 23. The CPL cooling of claim 22, wherein each of the plurality of patterns formed in the first pattern region has a predetermined height, and a planar shape is a predetermined geometric shape having a predetermined length in a direction in which the refrigerant flows. Evaporator of the device. The evaporator of claim 23, wherein the patterns are distributed in a line in the direction in which the refrigerant flows, spaced apart from each other by a predetermined interval, and staggered in a vertical direction. The evaporator of claim 23, wherein the heights of the patterns formed in the coolant storage unit among the patterns formed in the first pattern region are higher or lower than the patterns formed in the channel region. 22. The method of claim 13, 18 or 21, wherein the second pattern region has a plurality of patterns for directing the flow of the refrigerant so that the refrigerant flowing from the adjacent pattern region toward the cooling unit or the center thereof Evaporator of a CPL cooling device, characterized in that distributed. 27. The evaporator of claim 26, wherein each of the plurality of patterns has a predetermined height and the planar shape is a predetermined geometric shape having a predetermined length in a direction in which the refrigerant flows. The evaporator of claim 26, wherein the patterns are distributed in a line in a direction in which the refrigerant flows, spaced apart from each other by a predetermined interval, and staggered in a vertical direction. The evaporator of claim 26, wherein a height of patterns formed in regions other than the channel region among the patterns formed in the second pattern region is higher or lower than patterns formed in the channel region. 21. The cooling medium according to any one of claims 13 or 16 to 20, wherein in the third pattern region, refrigerant flowing from a neighboring pattern region flows along or around the cooling unit and toward the center of the cooling unit. Evaporator of the CPL cooling apparatus, characterized in that a plurality of patterns are distributed to give a direction to the flow of the refrigerant. The evaporator of claim 30, wherein each of the plurality of patterns has a predetermined height, and patterns forming neighboring rows and neighboring columns are not distributed with each other. The evaporator of claim 30, wherein a height of the plurality of patterns is higher or lower than patterns formed in a neighboring pattern region. The method of claim 13, wherein the coolant flowing from the pattern region adjacent to the fourth pattern region flows to the center of the cooling unit and isotropically flows through the fourth pattern region. Evaporator of a CPL cooling device, characterized in that a plurality of patterns are distributed. The evaporator of claim 33, wherein each of the plurality of patterns is a cylinder having a predetermined height. The evaporator of claim 33, wherein a height of the plurality of patterns is higher or lower than patterns formed in a neighboring pattern region. The evaporator of claim 33, wherein the plurality of patterns are distributed such that the diameter thereof becomes smaller from the fourth pattern region to the fifth pattern region. The CPL of claim 13 or 14, wherein a plurality of patterns are distributed so that the coolant flowing from the pattern region adjacent to the fifth pattern region flows uniformly and quickly to all regions of the fifth pattern region. Evaporator of cooling unit. The evaporator of claim 37, wherein a diameter of each of the plurality of patterns is the same as or smaller than the patterns formed in the adjacent pattern region. The evaporator of claim 38, wherein each of the plurality of patterns is a cylinder having a predetermined height. The method of claim 1, wherein the lower structure, A first piece forming the refrigerant storage together with the upper structure and forming a refrigerant inlet connected to the refrigerant outlet of the condenser; A second piece facing the surface defining the channel region of the upper structure and in close contact with the first piece so that the refrigerant does not leak from one side; And CPL which forms the cooling unit together with the upper structure and forms a steam outlet connected to the steam inlet of the condenser and is composed of a third piece bonded to the other side of the second part so that the refrigerant does not leak. Evaporator of cooling unit. 41. The vaporizer of claim 40, wherein there is a step between the first piece and the second piece and / or between the second piece and the third piece. 42. The pump of claim 40 or 41, wherein the refrigerant flowing into the refrigerant reservoir, which fills the channel region between the second piece and the surface defining the channel region of the superstructure, is pumped to the cooling portion. Evaporator of a CPL cooling device, characterized in that the means is provided. 43. The vaporizer of claim 42, wherein the pumping means is a porous member. 43. The method of claim 42, wherein the pumping means comprises a porous member and a pattern formed on a portion of the second piece, wherein the pattern is a capillary tube for the refrigerant flowing into the refrigerant storage portion or the refrigerant flowing through the porous member Evaporator of the CPL cooling device, characterized in that formed to act on the force. 44. The evaporator of claim 43 wherein said porous member extends by a length given to said refrigerant reservoir. 43. The evaporator of claim 42 wherein a portion of said channel region extends between said cooling portion and a vertical portion of said third piece. 47. The evaporator of claim 46 wherein another portion of said channel region extends between said refrigerant reservoir and a vertical portion of said first piece. 43. The evaporator of claim 42, wherein at least one type of pattern is formed at the bottom of the cooling unit, and the patterns are formed to exert capillary force on the refrigerant flowing into the cooling unit. 43. The evaporator of claim 42, wherein a pattern of a given shape is formed at the bottom of the refrigerant reservoir.