KR20020086455A - Manufacturing method of copper foil - Google Patents

Manufacturing method of copper foil Download PDF

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Publication number
KR20020086455A
KR20020086455A KR1020020066840A KR20020066840A KR20020086455A KR 20020086455 A KR20020086455 A KR 20020086455A KR 1020020066840 A KR1020020066840 A KR 1020020066840A KR 20020066840 A KR20020066840 A KR 20020066840A KR 20020086455 A KR20020086455 A KR 20020086455A
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KR
South Korea
Prior art keywords
copper foil
resin film
synthetic resin
adhesive
coating
Prior art date
Application number
KR1020020066840A
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Korean (ko)
Inventor
이병금
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이병금
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to KR1020020066840A priority Critical patent/KR20020086455A/en
Publication of KR20020086455A publication Critical patent/KR20020086455A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper

Abstract

PURPOSE: A manufacturing method of copper foil is provided which enables continuous proceeding of the postprocessing using the manufactured copper foil. CONSTITUTION: The manufacturing method of copper foil comprises coating step (S1) of coating an adhesive on a synthetic resin film using a coating roller; drying step (S2) of drying the adhesive coated synthetic resin film for a certain period of time; lamination step (S3) of laminating the adhesive coated synthetic resin film with the copper foil; coiling step (S4) of coiling the synthetic resin film laminated copper foil on a coiling roller after aging the synthetic resin film laminated copper foil for a certain period of time; and cutting step (S5) of cutting the copper foil coiled on the coiling roller to a desired size, wherein the synthetic resin film is polyester, polyvinyl chloride, or polyimide, and a catalyst is added to the adhesive in the coating step to increase hardening speed of the adhesive.

Description

구리 호일의 제조방법{MANUFACTURING METHOD OF COPPER FOIL}MANUFACTURING METHOD OF COPPER FOIL

본 발명은 구리 호일의 제조방법에 관한 것으로, 특히 호일을 롤 타입으로 플렉시블하게 형성하여 사용상 효과를 증대시킨 롤 타입의 구리 호일 제조방법에 관한 것이다.The present invention relates to a method for producing a copper foil, and more particularly, to a method for producing a copper foil of a roll type in which the foil is flexibly formed in a roll type to increase the use effect.

일반적으로 구리 호일은 인쇄회로기판(PCB)의 제조에 이용되도록 라미네이트의 제조에서의 이용을 위한 중간생산물로서 또는 완료된 라미네이트의 일부분으로서 이용될 수 있다.In general, copper foil can be used as an intermediate for use in the manufacture of laminates or as part of a finished laminate for use in the manufacture of printed circuit boards (PCBs).

이러한 구리 호일을 이용한 일예로서, 콤비카드는 원하는 재질 및 규격으로 구리 호일을 발주하여 반도체칩을 탑재한 후 상면 및 저면에 소정의 패턴 형성 작업을 거쳐 인쇄회로기판의 제조를 마치며, 그 표면에 플라스틱 등을 합지하여 완제품을 형성하게 된다.As an example of using such a copper foil, the Combi card orders copper foil with a desired material and standard, mounts a semiconductor chip, and finishes the manufacturing of a printed circuit board through a predetermined pattern forming operation on the upper and lower surfaces thereof, and the plastic on the surface thereof. Laminate and the like to form a finished product.

그런데, 종래에는 이러한 인쇄회로기판을 형성하기 위해서는, 인쇄회로기판에 적당한 크기를 갖는 1매씩 제조된 구리 호일을 식각 등의 방법을 이용하여 패턴을 형성하게 되는데, 이러한 경우 로스 및 하자 발생이 너무 많아 엄청난 손실을 유발하게 되며, 아울러 연속적으로 후작업을 진행하기 어려운 문제점이 있었다.However, in the related art, in order to form such a printed circuit board, a pattern is formed by etching the copper foils, each having a suitable size, on the printed circuit board by etching. In this case, too much loss and defects occur. It caused a huge loss, and there was a problem that it is difficult to proceed with the subsequent work continuously.

본 발명은 이러한 문제점을 해결하기 위한 것으로, 제조 완료된 구리 호일을 이용한 후작업의 연속적인 진행이 가능하도록 한 구리 호일의 제조방법을 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a copper foil which enables continuous progress of post-working using a manufactured copper foil.

도 1은 본 발명에 의한 롤 타입의 구리 호일을 제조하기 위한 공정을 보인 블록도.1 is a block diagram showing a process for producing a roll-type copper foil according to the present invention.

상기 목적을 달성하기 위한 본 발명은, 코팅롤러를 이용하여 합성수지 필름에 접착제를 도포하는 코팅단계, 접착제가 코팅된 합성수지 필름을 소정 시간 건조하는 건조단계, 구리 호일에 접착제가 코팅된 합성수지 필름을 합지하는 합지단계, 합지된 구리 호일을 소정 시간 숙성시킨 후 권회롤러에 권회하는 권회단계, 및 권회롤러에 권회 완료된 구리 호일을 의도된 크기로 절단하는 절단단계를 포함하여 이루어지는 것을 특징으로 한다.The present invention for achieving the above object, a coating step of applying an adhesive to a synthetic resin film using a coating roller, a drying step of drying the adhesive-coated synthetic resin film for a predetermined time, laminating a synthetic resin film coated with an adhesive on a copper foil It is characterized in that it comprises a lamination step, the winding step of winding the laminated copper foil for a predetermined time and then wound in a winding roller, and the cutting step of cutting the copper foil wound on the winding roller to the intended size.

이하, 본 발명에 의한 구리 호일의 제조방법을 첨부 도면에 도시한 실시예에 따라 설명하면 다음과 같다.Hereinafter, a method for manufacturing a copper foil according to the present invention will be described according to the embodiment shown in the accompanying drawings.

본 발명에 의한 구리 호일은, 코팅단계(S1), 건조단계(S2), 합지단계(S3), 권회단계(S4) 및 절단단계(S5)를 순차적으로 진행하여 제조된다.Copper foil according to the present invention is manufactured by sequentially performing a coating step (S1), drying step (S2), lamination step (S3), winding step (S4) and cutting step (S5).

상기 코팅단계(S1)에서는 코팅롤러를 이용하여 각종 합성수지 필름에 접착제를 도포하게 된다.In the coating step (S1) it is to apply an adhesive to a variety of synthetic resin film using a coating roller.

이때, 미리 입력된 데이터에 의해 각종 필름에 접착제를 도포하여 원하는 식각작업이 이루어지도록 한다.At this time, the adhesive is applied to various films by pre-input data so that a desired etching operation is performed.

이때, 상기 합성수지 필름은 통상 폴리에스테르(PET), 폴리비닐클로라이드(PVC) 및 폴리이미드(PI) 등이 사용되며, 이러한 합성수지 필름에 도포되는 접착제는 폴리우레탄이 사용된다.In this case, the synthetic resin film is usually used polyester (PET), polyvinyl chloride (PVC) and polyimide (PI) and the like, the adhesive is applied to the synthetic resin film is used polyurethane.

또한, 상기 접착제를 합성수지 필름에 도포할 때에는 접착제의 경화 속도를 증가시킬 수 있는 촉매제를 첨가하여 코팅하게 된다.In addition, when the adhesive is applied to the synthetic resin film is added by coating a catalyst that can increase the curing rate of the adhesive.

상기 건조단계(S2)에서는 접착제가 코팅된 각종 필름을 건조박스에서 소정 시간 동안 건조를 하게 된다.In the drying step (S2) it is dried for a predetermined time in a drying box coated with an adhesive film.

이때, 상기 건조단계에는 접착제와 더불어 도포된 희석제 또는 기타 불순물 등을 제거하는 이물제거단계가 포함된다.At this time, the drying step includes a foreign material removal step of removing a diluent or other impurities, etc. applied with the adhesive.

상기 합지단계(S3)에서는 플렉시블한 동판에 접착제가 코팅된 합성수지 필름을 합지하게 된다.In the laminating step S3, the synthetic resin film coated with the adhesive is laminated on the flexible copper plate.

상기 권회단계(S4)에서는 합지된 동판을 소정 시간 숙성시킨 후 별도의 권회장치에 의해 권회롤러에 권회하게 된다.In the winding step (S4) after aging the laminated copper plate for a predetermined time it is wound on a winding roller by a separate winding device.

상기 절단단계(S5)에서는 권회롤러에 권회 완료된 구리 호일을 사용자의 의도에 맞는 크기로 절단하게 된다.In the cutting step (S5) it is to cut the copper foil wound on the winding roller to a size suitable for the user's intention.

이와 같이 본 발명에 의한 구리 호일은 롤 타입으로 제조되므로, 이러한 구리 호일을 사용하면 패턴 형성을 위한 작업이 연속적으로 가능하게 되며, 패턴 형성이 완료된 구리 호일을 사용자의 필요에 따라 필요한 크기로 절단하기만 하면 되므로, 예컨대 구리 호일을 이용한 인쇄회로기판의 제조 속도 역시 증가하게 된다.As described above, since the copper foil according to the present invention is manufactured in a roll type, the use of the copper foil enables continuous operation for pattern formation, and cutting the copper foil having the pattern formation to the required size according to the needs of the user. Since it is only necessary, for example, the manufacturing speed of a printed circuit board using copper foil is also increased.

한편, 본 발명에서는 구리 호일을 롤 타입으로 제조하는 것에 대해 설명하였지만, 구리 호일 뿐만 아니라 알루미늄 호일 등 각종 금속 호일을 제조할 때에도 동일한 과정을 거쳐 제조하는 것이 가능하다.On the other hand, in the present invention has been described for manufacturing a copper foil in a roll type, it is possible to produce not only copper foil but also through the same process when manufacturing various metal foils such as aluminum foil.

이상에서 설명한 바와 같이, 본 발명에 의하면 구리 호일을 롤 타입으로 제조하게 됨에 따라 인쇄회로기판을 제조하기 위한 공정을 연속적으로 진행할 수 있게 된다.As described above, according to the present invention, as the copper foil is manufactured in a roll type, the process for manufacturing a printed circuit board can be continuously performed.

Claims (3)

코팅롤러를 이용하여 합성수지 필름에 접착제를 도포하는 코팅단계,Coating step of applying an adhesive to a synthetic film using a coating roller, 접착제가 코팅된 합성수지 필름을 소정 시간 건조하는 건조단계,Drying step of drying the adhesive coated synthetic resin film for a predetermined time, 구리 호일에 접착제가 코팅된 합성수지 필름을 합지하는 합지단계,A lamination step of laminating an adhesive coated resin film on a copper foil, 합지된 구리 호일을 소정 시간 숙성시킨 후 권회롤러에 권회하는 권회단계, 및Winding step of winding the laminated copper foil for a predetermined time and wound on the winding roller, and 권회롤러에 권회 완료된 구리 호일을 의도된 크기로 절단하는 절단단계를 포함하여 이루어지는 것을 특징으로 하는 구리 호일의 제조방법.A method for producing a copper foil, comprising a cutting step of cutting the finished copper foil to a desired size in a winding roller. 제1항에 있어서, 상기 합성수지 필름은 폴리에스테르, 폴리비닐클로라이드, 폴리이미드 중의 어느 하나인 것을 특징으로 하는 구리 호일의 제조방법.The method of claim 1, wherein the synthetic resin film is any one of polyester, polyvinyl chloride, polyimide. 제1항에 있어서, 상기 코팅단계에서 접착제의 경화 속도를 증가시킬 수 있는 촉매제를 첨가하는 것을 특징으로 하는 구리 호일의 제조방법.The method of claim 1, wherein a catalyst for increasing the curing rate of the adhesive is added in the coating step.
KR1020020066840A 2002-10-31 2002-10-31 Manufacturing method of copper foil KR20020086455A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100452973B1 (en) * 2002-08-26 2004-10-14 라병철 Sheet winding machine

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101907A (en) * 1983-11-07 1985-06-06 Fujitsu Ltd Manufacture of electromagnetic coil
JPH03164241A (en) * 1989-11-24 1991-07-16 Toyobo Co Ltd Preparation of metal foil-laminated continuous length
JPH0563356A (en) * 1991-09-04 1993-03-12 Hitachi Chem Co Ltd Manufacture of film provided with metal foil for flexible printed wiring board
KR20000025525A (en) * 1998-10-10 2000-05-06 허만 나우웰에어츠 Multilayer laminate electric tapes
KR20010012203A (en) * 1997-05-14 2001-02-15 크리스 로저 에이치 Very ultra thin conductor layers for printed wiring boards

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101907A (en) * 1983-11-07 1985-06-06 Fujitsu Ltd Manufacture of electromagnetic coil
JPH03164241A (en) * 1989-11-24 1991-07-16 Toyobo Co Ltd Preparation of metal foil-laminated continuous length
JPH0563356A (en) * 1991-09-04 1993-03-12 Hitachi Chem Co Ltd Manufacture of film provided with metal foil for flexible printed wiring board
KR20010012203A (en) * 1997-05-14 2001-02-15 크리스 로저 에이치 Very ultra thin conductor layers for printed wiring boards
KR20000025525A (en) * 1998-10-10 2000-05-06 허만 나우웰에어츠 Multilayer laminate electric tapes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100452973B1 (en) * 2002-08-26 2004-10-14 라병철 Sheet winding machine

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