KR20020066005A - Coating method of printed circuit board - Google Patents
Coating method of printed circuit board Download PDFInfo
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- KR20020066005A KR20020066005A KR1020010006159A KR20010006159A KR20020066005A KR 20020066005 A KR20020066005 A KR 20020066005A KR 1020010006159 A KR1020010006159 A KR 1020010006159A KR 20010006159 A KR20010006159 A KR 20010006159A KR 20020066005 A KR20020066005 A KR 20020066005A
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- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
Abstract
Description
본 발명은 인쇄회로기판의 코팅방법에 관한 것으로, 특히 실리콘, 실리카 및 백금촉매의 혼합물을 혼합하여 인쇄회로기판에 도막을 입히고 일련의 공정을 통하여 기판을 도금할 수 있는 인쇄회로기판의 코팅방법에 관한 것이다.The present invention relates to a method for coating a printed circuit board, and more particularly, to a method for coating a printed circuit board which can mix a mixture of silicon, silica and platinum catalyst to coat the printed circuit board and plate the substrate through a series of processes. It is about.
일반적으로, 인쇄회로기판(PCB : printed circuit board)은 미세한 도체패턴과 관통홀(through hole)이 형성되어 있고, 관통홀에 전자부품을 접지 또는 접점시키도록 되어 있다.In general, a printed circuit board (PCB) has a fine conductor pattern and through holes formed therein, and the electronic parts are grounded or contacted with the through holes.
기존에는 인쇄회로기판에 마스킹처리할 때 도체패턴위에 금도금을 행하는 소정부분을 제외한 부분에 마스킹용 테이프를 점착시키고 금도금을 하는 방법을 채택하여 주로 사용하여 왔다. 이러한 방법은 관통홀의 크기가 다를 경우 테이프를 각각의 형상과 형태에 맞추어 제단과 절단을 해야하므로 작업효율이 떨어지는 단점을 지니고 있다.Conventionally, when masking a printed circuit board, a masking tape is adhered to a portion except for a predetermined portion of the gold plating on the conductor pattern and gold plating has been mainly used. This method has a disadvantage in that the work efficiency is inferior because the tape has to be cut and cut in accordance with the shape and shape of the through-holes.
이와 같은 문제를 해결하기 위하여, 한국 공개특허 2000-6744호에서는 기판에서 도체패턴과 미세한 관통홀이 형성되어 있는 배선영역 중에서 필요한 부분만들 도금할 수 있는 방법을 도입하여 인쇄회로기판의 마스킹처리에 따른 작업성과 불량율을 대폭적으로 개선하였다.In order to solve such a problem, Korean Patent Laid-Open Publication No. 2000-6744 introduces a method for plating only necessary portions of a wiring area in which a conductive pattern and a fine through hole are formed in a substrate, and according to the masking process of a printed circuit board. The workability and defective rate were greatly improved.
하지만, 상기 공개특허에서는 PVC분말을 포함한 유기화합물을 사용하고 있는데, 건조작업할 때 가소제에 따른 유해가스가 생기는 단점과 함께 건조 온도에 따른 점도의 변화로 불완전하게 도막이 형성되는 한편, 잔여물 폐기에 따른 환경문제를 야기시키는 문제점을 지니고 있었다.However, the above-mentioned patent uses an organic compound including PVC powder, which is incompletely formed due to the change of viscosity according to drying temperature along with the disadvantage that harmful gas is generated by plasticizer during drying operation, Had a problem causing environmental problems.
이에 본 발명은 상술한 기존 인쇄회로기판의 인쇄방법이 지닌 문제점을 해소하기 위하여 안출된 것으로, 도체패턴과 관통홀을 포함한 배선영역중에서 필요한 부분만을 도포하고 동시에 도막의 안정성을 이루어 낼 수 있으며, 공정중에서 유해가스 등을 발생시키지 않는 환경 친화적인 인홰회로기판의 코팅방법을 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the problems of the conventional printing method of the conventional printed circuit board, it is possible to apply only the necessary portion of the wiring area including the conductor pattern and the through-hole and at the same time achieve the stability of the coating film It is an object of the present invention to provide a coating method of environmentally friendly inductive circuit boards that do not generate harmful gases.
상기한 목적을 달성하기 위하여 본 발명은, 소정의 비닐그룹과 수소원자가 각각 결합된 폴리실록산 형태의 실리콘 80∼95중량％, 실리카 5∼20중량％, 백금촉매 0.3중량％ 를 서로 혼합하는 혼합단계와, 상기 혼합단계를 거친 혼합액을 인쇄회로기판의 소정부위에 100∼150㎛ 정도로 도포하는 도포단계, 상기 도포단계를 거친 인쇄회로기판의 한쪽면에 대하여 열건조기에서 120∼150℃에서 30∼40초이내로 1차건조시키고 다른쪽면에 대하여 120∼150℃ 에서 30∼50초이내로 건조시키는 건조단계 및, 상기 건조단계를 거친 인쇄회로기판에 금도금하고 도막을 입힌 부분을 제거하는 도금 및 박리단계를 포함한다.In order to achieve the above object, the present invention provides a mixing step of mixing 80 to 95% by weight of silicon, 5 to 20% by weight of silica, and 0.3% by weight of a platinum catalyst in the form of polysiloxane to which a predetermined vinyl group and a hydrogen atom are respectively bonded; A coating step of applying the mixed solution, which has been subjected to the mixing step, to a predetermined portion of the printed circuit board at about 100 to 150 μm, and 30 to 40 seconds at 120 to 150 ° C. in a heat dryer for one side of the printed circuit board which has been subjected to the applying step. First drying to within 30 to 50 seconds at 120-150 ° C. with respect to the other side, and a plating and peeling step of removing gold-plated and coated parts of the printed circuit board after the drying step. .
이와 같은 본 발명에 따른 인쇄회로기판의 코팅방법에 의하면, 도막조성물이 기존에 비해 내열성, 인장성, 슬립성 등이 향상되어 기판의 특정부위에 얇게 균일하게 도막을 입히고 건조시킴으로써 도금작업 후 뛰어난 박리성에 따른 작업성이 향상되고, 건조과정에서 시간이 단축되므로 전체적인 코팅작업시간이 크게 단축되게 된다.According to the coating method of the printed circuit board according to the present invention, the coating composition has improved heat resistance, tensile properties, slip properties, etc. compared to the conventional one, so that the coating film is thinly and uniformly coated on a specific part of the substrate and dried to achieve excellent peeling after plating. The workability is improved according to the sex, and the time is shortened in the drying process, thereby greatly reducing the overall coating work time.
도 1은 본 발명에 따른 인쇄회로기판의 코팅방법을 도시한 공정도이다.1 is a process chart showing a coating method of a printed circuit board according to the present invention.
이하, 본 발명의 바람직한 실시예를 첨부한 예시도면에 따라 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.
도 1은 본 발명에 따른 인쇄회로기판의 코팅방법을 도시한 공정도이다.1 is a process chart showing a coating method of a printed circuit board according to the present invention.
본 발명에 따른 인쇄회로기판의 코팅방법은 도 1에 도시된 바와 같이, 원료를 혼합하는 혼합단계와, 이 혼합단계를 거친 혼합액을 인쇄회로기판에 도포하는 도포단계, 이 도포단계를 거친 후 열건조기에서 건조하는 건조단계 및, 이 건조단계를 거친 인쇄회로기판에 금도금하고 불필요한 부분을 제거하는 도금 및 박리단계를 포함하고 있다.As shown in FIG. 1, a coating method of a printed circuit board according to the present invention includes a mixing step of mixing raw materials, an application step of applying a mixed solution having undergone the mixing step to the printed circuit board, and a heat after the application step. A drying step of drying in a dryer, and a plating and peeling step of gold plating and removing unnecessary parts of the printed circuit board after the drying step.
이하에 언급하는 %는 중량%를 의미한다.% Mentioned below means weight%.
상기 혼합단계에서는 소정의 비닐그룹과 수소원자가 각각 결합된 폴리실록산형태의 실리콘 80∼95％, 실리카 5∼20％, 백금촉매 0.3％ 를 서로 혼합한다.In the mixing step, 80 to 95% of polysiloxane-type silicon, 5 to 20% of silica, and 0.3% of platinum catalyst are mixed with a predetermined vinyl group and a hydrogen atom, respectively.
상기 실리콘은 화학적으로 부가반응에 의하여 경화가 진행되는 것으로, 소정의 비닐그룹과 수소원자가 각각 결합된 폴리실록산에 백금촉매를 사용하고 열경화에 의해 다음과 같은 반응이 이루어지게 한다.The silicon is chemically hardened by addition reaction, and a platinum catalyst is used in a polysiloxane having a predetermined vinyl group and a hydrogen atom bonded to each other, and the following reaction is performed by thermal curing.
여기서, 부가형 골격은 Si-O-Si 이고, 부가형으로 경화시킬 때 부산물이 생기지 않는 특징을 지니고 있다.Here, the addition type skeleton is Si-O-Si, and has a feature that no by-products are generated when curing the addition type.
그리고 실리카는 응집력과 접착력을 향상시키고 점도를 조절하는 용도로 사용되었다.Silica was used to improve cohesion and adhesion and to control viscosity.
상기 폴리실록산형태의 실리콘은 다음과 같이 제조할 수 있다. 메탄올은 염화메틸형태로 실리콘 제조 원료로 사용되며, 염화메틸은 실리콘 모노머인 메틸클로로실란에 흡수되고 가수분해에 의해 메틸기는 폴리머에 남으며 염소는 염산으로 회수된다. 회수된 염산은 메탄올과 다시반응하여 재사용한다. 상기 백금촉매는 휘발성용제가 전혀 함유되지 않으므로써 건조과정에서 열안정을 얻을 수 있다. 한편, 혼합단계에서 에폭시실란을 더 첨가하여 점도조절을 할 수 있다.The polysiloxane-type silicone may be prepared as follows. Methanol is used as a raw material for the production of silicon in the form of methyl chloride, methyl chloride is absorbed by methylchlorosilane, a silicone monomer, and by hydrolysis, the methyl group remains in the polymer and chlorine is recovered as hydrochloric acid. The hydrochloric acid recovered is reused by reacting with methanol again. Since the platinum catalyst does not contain any volatile solvent, thermal stability can be obtained during the drying process. On the other hand, the viscosity can be adjusted by further adding an epoxy silane in the mixing step.
상기 도포단계에서는 상기 혼합단계를 거친 혼합액을 인쇄회로기판의 특정부위에 100~150㎛ 정도로 도막을 입힌다. 여기서, 상기 혼합액은 회로기판에 인쇄하고자 하는 부위를 먼저 촬영하여 스크린 후막 제판을 한 후, 인쇄하고자하는 부위를 제외한 부분에 도막을 입히게 된다.In the coating step, the mixed solution that has undergone the mixing step is coated on a specific portion of the printed circuit board to about 100 ~ 150㎛. In this case, the mixed solution is to first screen the portion to be printed on the circuit board to make a thick film screen, and then to coat the portion except for the portion to be printed.
상기 건조단계는 상기 도포단계를 거친 인쇄회로기판의 한쪽면에 대하여 열건조기에서 120∼150℃에서 대략 30~40초로 1차건조시키고 다른쪽면에 대하여 120~150℃ 에서 30~50초간 건조시킨다. 이때 인쇄회로기판에 도포된 혼합액이 경화되게 된다.The drying step is first dried in a heat dryer for about 30 to 40 seconds at 120 to 150 ° C. with respect to one side of the printed circuit board subjected to the coating step and dried at 120 to 150 ° C. for 30 to 50 seconds for the other side. At this time, the mixed solution applied to the printed circuit board is cured.
상기 도금 및 박리단계에서는 건조단계를 거친 인쇄회로기판에 금도금을 한 후 도막을 입힌 부분을 제거한다. 여기서, 인쇄회로기판에 도포된 도막은 필름형태로 자연스럽게 이탈되고, 특히 관통홀에 입혀진 돌기형 도막도 필름형 도막과 같이 박리되게 된다. 그리고 도막은 강한 인장력, 슬립성, 고내열성을 띄고 있으므로 금도금과 박리에 따른 불량을 예방할 수 있게 된다.In the plating and peeling step, after plating the printed circuit board through the drying step, the coated part is removed. Here, the coating film applied to the printed circuit board is naturally separated in the form of a film, and in particular, the projection coating film coated on the through hole is peeled off like the film coating film. In addition, since the coating has strong tensile strength, slip resistance, and high heat resistance, defects due to gold plating and peeling can be prevented.
위의 공정대로 본 발명을 실시한 결과, 도막조성물이 내열성과 화학적안정성을 갖추고 동시에 슬립성과 인장력을 구비함으로써 인쇄회로기판에 균일하게 도포되면서 박리가 용이하게 이루어지게 되므로 원하는 부위에 정밀하게 도금할 수 있었다.As a result of carrying out the present invention according to the above process, the coating composition has heat resistance and chemical stability and at the same time has slip and tensile force, so that the coating film can be uniformly applied to the printed circuit board and easily peeled off. .
이상에서 설명한 바와 같은 본 발명에 따른 인쇄회로기판의 코팅방법에 의하면, 도막조성물이 기존에 비해 내열성, 인장성, 슬립성 등이 향상되어 기판의 특정부위에 얇게 균일하게 도막을 입히고 건조시킴으로써 도금작업 후 뛰어난 박리성에따른 작업성이 향상되고, 기판에 정밀하게 도금작업을 할 수 있게 된다. 이에 따라 본 발명에 따른 인쇄회로기판의 코팅방법은 작업정확성이 확보되어 마스크용 기판을 대량생산할 수 있게 된다.According to the coating method of the printed circuit board according to the present invention as described above, the coating film composition is improved in heat resistance, tensile properties, slip properties, etc. compared to the conventional one by coating a thin film uniformly on a specific portion of the substrate and drying the plating operation After the workability according to the excellent peelability is improved, it is possible to precisely plate the substrate. Accordingly, the coating method of the printed circuit board according to the present invention ensures work accuracy, thereby enabling mass production of a mask substrate.
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| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11114309B2 (en) * | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US11972993B2 (en) | 2021-05-14 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11114309B2 (en) * | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11972993B2 (en) | 2021-05-14 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
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