KR20020062454A - Radiation apparatus of notebook computer - Google Patents

Radiation apparatus of notebook computer Download PDF

Info

Publication number
KR20020062454A
KR20020062454A KR1020010003452A KR20010003452A KR20020062454A KR 20020062454 A KR20020062454 A KR 20020062454A KR 1020010003452 A KR1020010003452 A KR 1020010003452A KR 20010003452 A KR20010003452 A KR 20010003452A KR 20020062454 A KR20020062454 A KR 20020062454A
Authority
KR
South Korea
Prior art keywords
chip
fan module
circuit board
fan
heat
Prior art date
Application number
KR1020010003452A
Other languages
Korean (ko)
Inventor
이혁기
Original Assignee
엘지전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자주식회사 filed Critical 엘지전자주식회사
Priority to KR1020010003452A priority Critical patent/KR20020062454A/en
Publication of KR20020062454A publication Critical patent/KR20020062454A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: An apparatus for radiating the heat of a notebook computer is provided to improve the radiation efficiency of a chip with the increase of the heat transfer rate between the chip and a fan module and with the decrease of the heat resistance through a thinner thermal interface by fixing the fan module to a circuit board. CONSTITUTION: The fan module(56) radiates the heat of the chip(53) outside through a contact part(55a). The thermal interface(57) fills up the gap made from a tolerance between the fan module and the circuit board(51). Many shoulder screws(59) make the fan module be fixed to the circuit board for adjusting the gap between the fan module and the circuit board. A coil spring(61) contacts the chip to the contact part by pressing the fan module into the chip side. When the heat is generated from the chip, the heat is transferred to the contact part of the fan module through the thermal interface. When the temperature of a fan body(55) rises, the fan is rotated and the cool air is entered from the outside through an air inlet(55b). The heat of the fan body is transferred to the cool air and the fan body gets cool. Finally, the hot air is exhausted to the outside through the air outlet(55c).

Description

노트북 컴퓨터의 방열 장치{RADIATION APPARATUS OF NOTEBOOK COMPUTER}Heat dissipation device for notebook computers {RADIATION APPARATUS OF NOTEBOOK COMPUTER}

본 발명은 노트북 컴퓨터의 방열 장치에 관한 것으로서, 특히 칩의 높낮이에 따른 팬모듈과 회로기판 사이의 간격 변화에 대응 가능한 구조로 상기 팬모듈이 회로기판에 고정되는 노트북 컴퓨터의 방열 장치에 관한 것이다.The present invention relates to a heat dissipation device of a notebook computer, and more particularly, to a heat dissipation device of a notebook computer in which the fan module is fixed to a circuit board in a structure capable of responding to a change in gap between a fan module and a circuit board according to a height of a chip.

도 1은 종래 기술에 따른 노트북 컴퓨터의 방열 장치가 도시된 단면도로서, 이를 참조하면 상기한 종래의 방열 장치는 본체의 회로기판(1)에 장착된 칩(3)과, 상기 칩(3)에 밀착되는 접촉부(5a)를 구비하여 상기 접촉부(5a)를 통해 전달된 칩(3)의 열을 외부로 방출시키는 팬모듈(6)과, 상기 팬모듈(6)의 접촉부(5a)와 칩(3) 사이에 설치되어 팬모듈(6)과 칩(3)의 공차로 인해 발생된 갭을 메우는 써멀 인터페이스(7)와, 상기 팬모듈(6)을 회로기판(1)에 고정하는 복수개의 체결스크루(9)로 구성된다.1 is a cross-sectional view showing a heat dissipation device of a notebook computer according to the prior art, referring to the conventional heat dissipation device is a chip (3) mounted on the circuit board (1) of the main body and the chip (3) A fan module 6 having a contact portion 5a in close contact and dissipating heat of the chip 3 transferred through the contact portion 5a to the outside, a contact portion 5a of the fan module 6 and a chip ( 3) a plurality of fastenings installed between the thermal interface 7 to fill the gap generated by the tolerance between the fan module 6 and the chip 3 and the fan module 6 to the circuit board 1. It consists of a screw 9.

여기서, 상기 팬모듈(6)은 일측에 접촉부(5a)가 형성된 팬바디(5)와, 상기 팬바디(5)의 내부에 설치되어 공기를 강제 유동시키는 팬(미도시)으로 이루어진다.The fan module 6 includes a fan body 5 having a contact portion 5a formed at one side thereof, and a fan (not shown) installed in the fan body 5 to force air flow.

또한, 상기 팬바디(5)에는 팬의 회전에 의해 외부의 공기가 유입되는 공기유입구(5b)와 상기 공기유입구(5b)를 통해 유입된 공기를 다시 외부로 유출시키는 공기유출구(5c)가 형성된다.In addition, the fan body 5 is provided with an air inlet 5b through which the outside air is introduced by the rotation of the fan and an air outlet 5c through which the air introduced through the air inlet 5b flows out again. do.

또한, 상기 각 체결스크루(9)는 팬바디(5)의 접촉부(5a)를 관통하여 상기 회로기판(1)에 상방으로 돌출 형성된 탭(11)에 결합됨으로써 상기 팬모듈(6)을 회로기판(1)에 고정한다.Each of the fastening screws 9 penetrates the contact portion 5a of the fan body 5 and is coupled to the tab 11 protruding upward from the circuit board 1 so that the fan module 6 is connected to the circuit board. Fix it to (1).

상기와 같이 구성된 노트북 컴퓨터의 방열 장치에서는, 먼저 칩(3)에서 열이 발생되면 이 열이 써멀 인터페이스(7)를 통해 팬모듈(6)의 접촉부(5a)로 전달된다. 이렇게 팬모듈(6)로 열이 전달되어 팬바디(5)의 온도가 상승되면 팬이 회전되어 공기유입구(5b)로부터 외부의 찬공기가 흡입된다.In the heat dissipation device of the notebook computer configured as described above, when heat is first generated in the chip 3, the heat is transferred to the contact portion 5a of the fan module 6 through the thermal interface 7. When heat is transferred to the fan module 6 and the temperature of the fan body 5 is increased, the fan is rotated to suck external cold air from the air inlet 5b.

상기와 같이 공기유입구(5b)를 통해 찬공기가 흡입되면 상기 팬바디(5)의 열이 찬공기로 전달되면서 팬바디(5)가 냉각되고, 상기 팬바디(5)를 냉각시키면서 데워진 공기는 공기유출구(5c)를 통해 외부로 배출된다. 이러한 과정을 통해 상기 칩(3)의 방열이 이루어진다.When cold air is sucked through the air inlet 5b as described above, the heat of the fan body 5 is transferred to the cold air while the fan body 5 is cooled, and the air warmed while cooling the fan body 5 is It is discharged to the outside through the air outlet 5c. Through this process, the heat dissipation of the chip 3 is performed.

그러나, 상기와 같은 종래의 노트북 컴퓨터의 방열 장치는 칩(3)의 높낮이에 관계없이 팬바디(5)의 접촉부(5a)와 회로기판(1) 사이의 간격이 상기 회로기판(1)에 형성된 탭(11)에 의해 고정되는 구조로 형성되어 있기 때문에 상기 칩(3)과 접촉부(5a) 사이에 삽입되는 써멀 인터페이스(7)의 두께가 두꺼워져 칩(3)과 접촉부(5a) 사이의 열저항이 커지고, 이렇게 열저항이 커지는 만큼 상기 칩(3)에서 접촉부(5a)로의 열전달이 제대로 이루어지지 않게 되어 칩(3)의 방열 효율이 떨어지는 문제점이 있었다.However, in the heat dissipation device of the conventional notebook computer as described above, the distance between the contact portion 5a of the fan body 5 and the circuit board 1 is formed on the circuit board 1 regardless of the height of the chip 3. Since it is formed in the structure fixed by the tab 11, the thickness of the thermal interface 7 inserted between the chip 3 and the contact portion 5a becomes thick, and the heat between the chip 3 and the contact portion 5a is increased. As the resistance increases, the heat resistance increases so that heat transfer from the chip 3 to the contact portion 5a is not performed properly, resulting in a poor heat dissipation efficiency of the chip 3.

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서, 칩의 높낮이에 따른 팬모듈과 회로기판 사이의 간격 변화에 대응 가능한 구조로 상기 팬모듈을 회로기판에 고정함으로써 두께가 얇은 써멀 인터페이스를 사용할 수 있게 되어 상기 써멀 인터페이스에 의한 열저항이 작아지고, 이에 따라 칩과 팬모듈 사이의 열전달율이 높아져 상기 칩의 방열 효율이 향상되도록 하는 노트북 컴퓨터의 방열 장치를 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, by using a thin thermal interface by fixing the fan module to the circuit board in a structure capable of responding to the change in the gap between the fan module and the circuit board according to the height of the chip. It is possible to provide a heat dissipation device of a notebook computer to reduce the heat resistance by the thermal interface, thereby increasing the heat transfer rate between the chip and the fan module to improve the heat dissipation efficiency of the chip.

도 1은 종래 기술에 따른 노트북 컴퓨터의 방열 장치가 도시된 단면도,1 is a cross-sectional view showing a heat radiation device of a notebook computer according to the prior art,

도 2는 본 발명에 따른 노트북 컴퓨터의 방열 장치가 도시된 분해도,2 is an exploded view showing a heat dissipation device of a notebook computer according to the present invention;

도 3은 본 발명에 따른 노트북 컴퓨터의 방열 장치가 도시된 단면도이다.3 is a cross-sectional view showing a heat radiation device of a notebook computer according to the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

51 : 회로기판 53 : 칩51: circuit board 53: chip

55 : 팬바디 55a : 접촉부55: fan body 55a: contact portion

56 : 팬모듈 57 : 써멀 인터페이스56: fan module 57: thermal interface

59 : 쇼울더 스크루 59a : 헤드부59: shoulder screw 59a: head portion

59b : 몸통부 59c : 나사부59b: body 59c: screw

61 : 코일스프링 63 : 관통홀61: coil spring 63: through hole

63a : 헤드 안착부 63b : 스프링 안착부63a: head seat 63b: spring seat

63c : 스프링 지지부 65 : 체결홀63c: spring support 65: fastening hole

상기의 목적을 달성하기 위한 본 발명에 따르면, 본체의 회로기판에 장착된 칩과, 상기 칩에 밀착되는 접촉부를 구비하여 상기 접촉부를 통해 전달된 칩의 열을 외부로 방출시키는 팬모듈과, 상기 팬모듈의 접촉부와 칩 사이에 설치되어 팬모듈과 칩의 공차로 인해 발생된 갭을 메우는 써멀 인터페이스와, 상기 칩의 높이에 따라 상기 팬모듈과 회로기판 사이의 간격이 조절되도록 팬모듈을 상기 회로기판에 고정하는 체결수단을 포함하는 것을 특징으로 하는 노트북 컴퓨터의 방열 장치가 제공된다.According to the present invention for achieving the above object, the fan module having a chip mounted on the circuit board of the main body, the contact portion in close contact with the chip to discharge the heat of the chip transferred through the contact portion to the outside, and A thermal interface provided between the fan module's contact portion and the chip to fill the gap generated by the tolerance between the fan module and the chip, and the fan module to adjust the gap between the fan module and the circuit board according to the height of the chip. Provided is a heat dissipation device for a notebook computer comprising a fastening means fixed to a substrate.

이하, 본 발명의 실시 예를 첨부한 도면에 의거하여 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 노트북 컴퓨터의 방열 장치가 도시된 분해도이고, 도 3은 본 발명에 따른 노트북 컴퓨터의 방열 장치가 도시된 단면도이다.2 is an exploded view showing a heat dissipation device of a notebook computer according to the present invention, Figure 3 is a cross-sectional view showing a heat dissipation device of a notebook computer according to the present invention.

본 발명에 따른 노트북 컴퓨터의 방열 장치는 도 2 및 도 3에 도시된 바와 같이, 본체의 회로기판(51)에 장착된 칩(53)과, 상기 칩(53)에 밀착되는 접촉부(55a)를 구비하여 상기 접촉부(55a)를 통해 전달된 칩(53)의 열을 외부로 방출시키는 팬모듈(56)과, 상기 팬모듈(56)의 접촉부(55a)와 칩(53) 사이에 설치되어 팬모듈(56)과 칩(53)의 공차로 인해 발생된 갭을 메우는 써멀 인터페이스(57)와,상기 칩의 높이에 따라 상기 팬모듈(56)과 회로기판(51) 사이의 간격이 조절되도록 팬모듈(56)을 상기 회로기판(51)에 고정하는 복수개의 쇼울더 스크루(59)와, 상기 팬모듈(56)을 칩(53) 방향으로 누르는 힘을 발생시켜 상기 칩(53)에 상기 접촉부(55a)를 밀착시키는 복수개의 코일스프링(61)을 포함하여 구성된다.As shown in FIGS. 2 and 3, a heat dissipation device of a notebook computer according to the present invention includes a chip 53 mounted on a circuit board 51 of a main body and a contact portion 55a in close contact with the chip 53. A fan module 56 provided to dissipate heat of the chip 53 transferred through the contact part 55a to the outside, and installed between the contact part 55a of the fan module 56 and the chip 53. The thermal interface 57 fills the gap generated due to the tolerance of the module 56 and the chip 53, and the fan is adjusted so that the gap between the fan module 56 and the circuit board 51 is adjusted according to the height of the chip. A plurality of shoulder screws 59 for fixing the module 56 to the circuit board 51 and a force for pressing the fan module 56 in the direction of the chip 53 are generated to generate the contact portion on the chip 53. It comprises a plurality of coil springs 61 for close contact with 55a).

여기서, 상기 팬모듈(56)은 일측에 접촉부(55a)가 형성된 팬바디(55)와, 상기 팬바디(55)의 내부에 설치되어 공기를 강제 유동시키는 팬(미도시)으로 이루어진다.The fan module 56 includes a fan body 55 having a contact portion 55a formed at one side thereof, and a fan (not shown) installed in the fan body 55 to force air flow.

또한, 상기 팬바디(55)에는 팬의 회전에 의해 외부의 공기가 유입되는 공기유입구(55b)와 상기 공기유입구(55b)를 통해 유입된 공기를 다시 외부로 유출시키는 공기유출구(55c)가 형성된다.In addition, the fan body 55 is provided with an air inlet 55b through which the outside air is introduced by the rotation of the fan and an air outlet 55c through which the air introduced through the air inlet 55b flows out again. do.

또한, 상기 각 쇼울더 스크루(59)는 팬모듈(56)에 형성된 관통홀(63)을 관통하여 하측의 나사부(59c)가 상기 회로기판(51)에 형성된 체결홀(65)에 결합됨으로써 상기 팬모듈(56)을 회로기판(51)에 고정한다.In addition, the shoulder screw 59 penetrates the through hole 63 formed in the fan module 56 so that the lower threaded portion 59c is coupled to the fastening hole 65 formed in the circuit board 51 so that the fan. The module 56 is fixed to the circuit board 51.

이와 같이 쇼울더 스크루(59)를 이용하여 팬모듈(56)을 회로기판(51)에 고정하면 상기 칩(53)의 높낮이 변화에 따른 상기 팬모듈(56)과 회로기판(51) 사이의 간격 변화에 대응할 수 있게 되어 상기 써멀 인터페이스(57)로 두께가 얇은 것을 사용할 수 있게 된다.When the fan module 56 is fixed to the circuit board 51 using the shoulder screw 59 as described above, the gap between the fan module 56 and the circuit board 51 according to the height change of the chip 53 is changed. It is possible to correspond to the thermal interface 57, it is possible to use a thin thickness.

또한, 상기 각 관통홀(63)은 쇼울더 스크루(59)의 헤드부(59a)가 안착되는 헤드 안착부(63a)와, 상기 헤드 안착부(63a)의 하측에 헤드 안착부(63a)보다 작은 직경을 갖도록 형성되어 상기 코일스프링(61)이 안착되는 스프링 안착부(63b)와,상기 스프링 안착부(63b)의 하측에 스프링 안착부(63b)보다 작은 직경을 갖도록 형성되어 상기 코일스프링(61)을 지지하는 스프링 지지부(63c)로 이루어진 3단 구조로 형성된다.In addition, each of the through holes 63 has a head seating portion 63a on which the head portion 59a of the shoulder screw 59 is seated, and a lower portion of the head seating portion 63a than the head seating portion 63a. A spring seating portion 63b formed to have a diameter and the coil spring 61 is seated thereon, and a coil seat 61 formed below the spring seating portion 63b to have a diameter smaller than that of the spring seating portion 63b. ) Is formed in a three-stage structure consisting of a spring support (63c) for supporting.

또한, 상기 각 코일스프링(61)은 각 쇼울더 스크루(59)의 몸통부(59b)에 삽입된 상태로 상기 관통홀(63)의 스프링 안착부(63b)에 안착되어 상기 쇼울더 스크루(59)의 헤드부(59a)에 의해서 하측으로 눌려지도록 설치된다.In addition, the coil spring 61 is seated in the spring seating portion (63b) of the through-hole 63 in the state inserted into the body portion (59b) of each shoulder screw (59) of the shoulder screw (59) It is provided so that it may be pressed downward by the head part 59a.

상기와 같이 구성된 본 발명에 따른 노트북 컴퓨터의 방열 장치에서는, 먼저 칩(53)에서 열이 발생되면 이 열이 써멀 인터페이스(57)를 통해 팬모듈(56)의 접촉부(55a)로 전달된다. 이렇게 팬모듈(56)로 열이 전달되어 팬바디(55)의 온도가 상승되면 팬이 회전되어 공기유입구(55b)로부터 외부의 찬공기가 흡입된다.In the heat dissipation device of the notebook computer according to the present invention configured as described above, when heat is first generated in the chip 53, the heat is transferred to the contact portion 55a of the fan module 56 through the thermal interface 57. When heat is transferred to the fan module 56 and the temperature of the fan body 55 is increased, the fan is rotated and external cold air is sucked from the air inlet 55b.

상기와 같이 공기유입구(55b)를 통해 찬공기가 흡입되면 상기 팬바디(55)의 열이 찬공기로 전달되면서 팬바디(55)가 냉각되고, 상기 팬바디(55)를 냉각시키면서 데워진 공기는 공기유출구(55c)를 통해 외부로 배출된다. 이러한 과정을 통해 상기 칩(53)의 방열이 이루어진다.When cold air is sucked through the air inlet 55b as described above, the heat of the fan body 55 is transferred to the cold air while the fan body 55 is cooled, and the air warmed while cooling the fan body 55 is It is discharged to the outside through the air outlet 55c. Through this process, the heat dissipation of the chip 53 is performed.

상기와 같은 본 발명에 따른 노트북 컴퓨터의 방열 장치는, 팬모듈(56)을 회로기판(51)을 고정하기 위해 쇼울더 스크루(59)를 이용하므로 칩(53)의 높낮이에 따른 상기 팬모듈(56)과 회로기판(51) 사이의 간격 변화에 대응 가능하게 되어 두께가 얇은 써멀 인터페이스(57)를 사용할 수 있게 되고, 이에 따라 상기 써멀 인터페이스(57)에 의한 칩(53)과 팬모듈(56) 사이의 열저항이 작아져 상기 칩(53)의 방열 효율이 향상되는 이점이 있다.In the heat dissipation device of the notebook computer according to the present invention as described above, since the shoulder screw 59 is used to fix the fan module 56 to the circuit board 51, the fan module 56 according to the height of the chip 53. And the thermal interface 57 between the circuit board 51 and the circuit board 51 can be used. Accordingly, the chip 53 and the fan module 56 by the thermal interface 57 can be used. There is an advantage in that the thermal resistance between the smaller the heat radiation efficiency of the chip 53 is improved.

또한, 본 발명은 코일스프링(61)에 의해 팬모듈(56)이 칩(53) 방향으로 눌려지면서 상기 팬모듈(56)의 접촉부(55a)가 상기 칩(53)에 밀착되므로 상기 접촉부(55a)와 칩(53)간의 열전도도가 높아져 상기 칩(53)에서 접촉부(55a)로의 열전달 효율이 향상되는 이점이 있다.In addition, in the present invention, as the fan module 56 is pressed by the coil spring 61 toward the chip 53, the contact part 55a of the fan module 56 is in close contact with the chip 53, so that the contact part 55a is provided. ) And the thermal conductivity between the chip 53 is increased, the heat transfer efficiency from the chip 53 to the contact portion 55a is improved.

Claims (4)

본체의 회로기판에 장착된 칩과, 상기 칩에 밀착되는 접촉부를 구비하여 상기 접촉부를 통해 전달된 칩의 열을 외부로 방출시키는 팬모듈과, 상기 팬모듈의 접촉부와 칩 사이에 설치되어 팬모듈과 칩의 공차로 인해 발생된 갭을 메우는 써멀 인터페이스와, 상기 칩의 높이에 따라 상기 팬모듈과 회로기판 사이의 간격이 조절되도록 팬모듈을 상기 회로기판에 고정하는 체결수단을 포함하는 것을 특징으로 하는 노트북 컴퓨터의 방열 장치.A fan module mounted on a circuit board of the main body and a contact part in close contact with the chip to dissipate heat from the chip transferred through the contact part to the outside, and installed between the contact part and the chip of the fan module. And a thermal interface that fills the gap generated due to the tolerance between the chip and the fastening means for fixing the fan module to the circuit board so that the gap between the fan module and the circuit board is adjusted according to the height of the chip. Heatsink of laptop computer. 제 1항에 있어서, 상기 체결수단은 팬모듈에 형성된 관통홀을 관통하여 하측의 나사부가 상기 회로기판에 형성된 체결홀에 결합되는 복수개의 쇼울더 스크루로 구성되는 것을 특징으로 하는 노트북 컴퓨터의 방열 장치.The heat dissipation device of a notebook computer according to claim 1, wherein the fastening means comprises a plurality of shoulder screws through the through holes formed in the fan module and coupled to the fastening holes formed in the circuit board. 제 1항에 있어서,The method of claim 1, 상기 팬모듈을 칩 방향으로 누르는 힘을 발생시켜 상기 칩에 상기 접촉부를 밀착시키는 밀착수단을 더 포함하는 것을 특징으로 하는 노트북 컴퓨터의 방열 장치.The heat dissipation device of a notebook computer, characterized in that it further comprises a close contact means for generating a force for pressing the fan module toward the chip in close contact with the contact portion. 제 2항 또는 제 3항에 있어서,The method of claim 2 or 3, 상기 각 관통홀은 쇼울더 스크루의 헤드부가 안착되는 헤드 안착부와, 상기헤드 안착부의 하측에 헤드 안착부보다 작은 직경을 갖도록 형성되는 스프링 안착부와, 상기 스프링 안착부의 하측에 스프링 안착부보다 작은 직경을 갖도록 형성되는 스프링 지지부로 이루어진 3단 구조로 형성되고, 상기 밀착수단은 각 쇼울더 스크루의 몸통부에 삽입되어 상기 관통홀의 스프링 안착부에 안착되는 복수개의 코일스프링으로 구성되는 것을 특징으로 하는 노트북 컴퓨터의 방열 장치.Each of the through holes may include a head seating portion on which a head portion of a shoulder screw is seated, a spring seating portion formed below the head seating portion to have a smaller diameter than the head seating portion, and a diameter smaller than a spring seating portion below the spring seating portion. It is formed of a three-stage structure consisting of a spring support formed to have a, the contact means is a notebook computer, characterized in that composed of a plurality of coil springs inserted into the body portion of each shoulder screw seated on the spring seating portion of the through hole Heat dissipation device.
KR1020010003452A 2001-01-20 2001-01-20 Radiation apparatus of notebook computer KR20020062454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020010003452A KR20020062454A (en) 2001-01-20 2001-01-20 Radiation apparatus of notebook computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020010003452A KR20020062454A (en) 2001-01-20 2001-01-20 Radiation apparatus of notebook computer

Publications (1)

Publication Number Publication Date
KR20020062454A true KR20020062454A (en) 2002-07-26

Family

ID=27692366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010003452A KR20020062454A (en) 2001-01-20 2001-01-20 Radiation apparatus of notebook computer

Country Status (1)

Country Link
KR (1) KR20020062454A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7388746B2 (en) 2005-09-29 2008-06-17 Samsung Electronics Co., Ltd. Heatsink assembly
KR100960131B1 (en) * 2009-12-23 2010-05-27 박준희 Heat dissipating member for substrate having wing-shaped heat dissipating part
KR100982431B1 (en) * 2010-04-06 2010-09-15 박준희 Heat dissipating member for substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990038493A (en) * 1997-11-05 1999-06-05 이계철 Heat pipe fixing device for chip cooling
KR20000003113U (en) * 1998-07-16 2000-02-15 구자홍 Heat dissipation module of notebook computer
KR200217176Y1 (en) * 2000-08-01 2001-03-15 주식회사현대멀티캡 Heat radiating apparatus of notebook computer
JP2001085585A (en) * 1999-09-13 2001-03-30 Matsushita Electric Ind Co Ltd Cooling fan fixing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990038493A (en) * 1997-11-05 1999-06-05 이계철 Heat pipe fixing device for chip cooling
KR20000003113U (en) * 1998-07-16 2000-02-15 구자홍 Heat dissipation module of notebook computer
JP2001085585A (en) * 1999-09-13 2001-03-30 Matsushita Electric Ind Co Ltd Cooling fan fixing device
KR200217176Y1 (en) * 2000-08-01 2001-03-15 주식회사현대멀티캡 Heat radiating apparatus of notebook computer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7388746B2 (en) 2005-09-29 2008-06-17 Samsung Electronics Co., Ltd. Heatsink assembly
KR100960131B1 (en) * 2009-12-23 2010-05-27 박준희 Heat dissipating member for substrate having wing-shaped heat dissipating part
KR100982431B1 (en) * 2010-04-06 2010-09-15 박준희 Heat dissipating member for substrate

Similar Documents

Publication Publication Date Title
US6525939B2 (en) Heat sink apparatus
US6480382B2 (en) Cooling device for hard disc
KR100322468B1 (en) a latching device of a fan in a computer and a portable computer provided with the latching device
US5673176A (en) Integrated circuit dual cooling paths and method for constructing same
US7474527B2 (en) Desktop personal computer and thermal module thereof
WO2020118629A1 (en) Electronic device
JP3786446B2 (en) Blower
JPH06209174A (en) Heat sink
JP4039316B2 (en) Electronic equipment cooling structure
US20040150952A1 (en) Integrated heat-dissipating module
JP2001244391A (en) Cooling structure of multichip module
JP2007243051A (en) Heat radiation device
US7382615B2 (en) Heat dissipation device
JP2000040780A (en) Heat radiating member of heat releasing element
JP4438526B2 (en) Power component cooling system
KR20020062454A (en) Radiation apparatus of notebook computer
JPH1195871A (en) Heat radiation structure of electronic equipment
JP4922903B2 (en) Cooling device for electronic equipment
JP2001257494A (en) Electronic apparatus
TWI273379B (en) Heat sink module
CN209563078U (en) The server cooling fin of interchangeable radiating fin
JP2005057070A (en) Heat radiating structure of electronic equipment
JP2000349482A (en) Electronic apparatus
CN219533742U (en) Auxiliary radiator for power supply main board
JPH08286783A (en) Heat radiating structure for electronic parts in information unit

Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E601 Decision to refuse application