JP2001085585A - Cooling fan fixing device - Google Patents
Cooling fan fixing deviceInfo
- Publication number
- JP2001085585A JP2001085585A JP25881899A JP25881899A JP2001085585A JP 2001085585 A JP2001085585 A JP 2001085585A JP 25881899 A JP25881899 A JP 25881899A JP 25881899 A JP25881899 A JP 25881899A JP 2001085585 A JP2001085585 A JP 2001085585A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- cooling fan
- fan
- cpu
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、パーソナルコンピ
ュータ、その他の電子機器等におけるＣＰＵ等の発熱部
品の冷却に用いる冷却ファン取付装置に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a cooling fan mounting device used for cooling a heat-generating component such as a CPU in a personal computer, other electronic equipment, or the like.
【０００２】[0002]
【従来の技術】一般に多機能、高性能のパーソナルコン
ピュータ等の小型の電子機器には、機能部品としてＣＰ
Ｕが用いているが、このＣＰＵは発熱し、約９０℃以上
になると熱破壊することから、ＣＰＵに冷却装置を付設
し、ＣＰＵで発生する熱を放熱して機器の安全を図るよ
うにしている。2. Description of the Related Art In general, small electronic equipment such as a multi-function, high-performance personal computer has a CP as a functional component.
U is used, but this CPU generates heat and breaks down at about 90 ° C. or higher. Therefore, a cooling device is attached to the CPU to dissipate the heat generated by the CPU and to secure the equipment. I have.
【０００３】前記冷却装置としては小型なものが要望さ
れるが、放熱フィンをもつ通常のヒートシンクでは十分
な冷却ができなく、したがって、図４に示すように導熱
材料であるアルミダイカストよりなる偏平なファンケー
シング１内に、モータ部と前記モータ部によって回転駆
動するインペラー２を有し、ファンケーシング１の底板
３をＣＰＵ４の上面に接合する構成の冷却ファン５が用
いられている。そして、ＣＰＵ４の熱をファンケーシン
グ１に導き、ファンケーシング１のヒートシンク作用
と、インペラー２の回転で生じる風でファンケーシング
１を強制冷却し、放熱冷却するようにしている。Although the cooling device is required to be small, a normal heat sink having heat radiation fins cannot provide sufficient cooling. Therefore, as shown in FIG. 4, a flat heat sink made of aluminum die casting, which is a heat conductive material, is used. In the fan casing 1, a cooling fan 5 having a motor unit and an impeller 2 driven to rotate by the motor unit and having a bottom plate 3 of the fan casing 1 joined to an upper surface of the CPU 4 is used. Then, the heat of the CPU 4 is guided to the fan casing 1, and the fan casing 1 is forcibly cooled by the heat sink action of the fan casing 1 and the wind generated by the rotation of the impeller 2, so that the heat is radiated and cooled.
【０００４】ところで、前記ＣＰＵ４は、機器の筐体６
の内面に突設した取付ボス７に取り付けられたプリント
回路基板８の上面に取り付けられており、冷却フアン５
は、そのファンケーシング１の底面の一部が前記ＣＰＵ
４の上面に設けた熱伝導ラバー９に接触するように、取
付部材１０を用いて機器の筐体６の内面に取り付けた構
成としている。The CPU 4 is provided with a housing 6 of the device.
The cooling fan 5 is mounted on the upper surface of the printed circuit board 8 mounted on the mounting boss 7 protruding from the inner surface of the cooling fan 5.
A part of the bottom surface of the fan casing 1 is the CPU
The mounting member 10 is attached to the inner surface of the housing 6 of the device so as to be in contact with the heat conductive rubber 9 provided on the upper surface of the device 4.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記Ｃ
ＰＵ４と冷却フアン５の取付構成において、取付ボス７
の高さ、プリント回路基板８の厚み、取付部材１０の高
さにはバラツキがあり、ファンケーシング１の底面の一
部を前記ＣＰＵ４の上面に設けた熱伝導ラバー９に圧接
させて、ＣＰＵ４の熱をファンケーシング１に良好に伝
導させることができないことが多い。また、熱伝導ラバ
ー９は、前記の寸法バラツキを吸収するために厚さ１．
０ｍｍのものを用い、０．３〜０．９ｍｍの範囲に圧縮
可能にしているが、前記０．３ｍｍ〜０．９ｍｍの範囲
では寸法バラツキが大きいため、ＣＰＵ４の熱をファン
ケーシング１に良好に伝導させることができない。However, the above C
In the mounting configuration of the PU 4 and the cooling fan 5, the mounting boss 7
The height of the printed circuit board 8 and the height of the mounting member 10 vary, and a part of the bottom surface of the fan casing 1 is brought into pressure contact with the heat conductive rubber 9 provided on the upper surface of the CPU 4 so that the CPU 4 In many cases, heat cannot be well conducted to the fan casing 1. The thermal conductive rubber 9 has a thickness of 1.about.1 to absorb the dimensional variation described above.
Although it is possible to compress the fan casing 1 to a size of 0.3 mm to 0.9 mm, the heat of the CPU 4 is transmitted to the fan casing 1 satisfactorily because the dimensional variation is large in the range of 0.3 mm to 0.9 mm. It cannot be conducted.
【０００６】本発明は前記問題に留意し、ＣＰＵをきわ
めて有効に冷却できる冷却ファン取付装置を提供するこ
とを目的とする。The present invention has been made in view of the above problems, and has as its object to provide a cooling fan mounting device capable of cooling a CPU very effectively.
【０００７】[0007]
【課題を解決するための手段】前記目的を達成するた
め、本発明は、冷却ファンをＣＰＵの上面に熱伝導ラバ
ーを介して接合配置する構成であって、取付基板に雌ね
じ部材を取り付け、冷却ファンのファンケーシングにお
ける前記雌ねじ部材に対応する部分に内周に突座をもつ
取付用孔を形成し、外周にコイルばねを装備した取付ピ
ンを前記取付用孔に挿入し、前記取付ピンの先端に設け
た雄ねじ部を前記雌ねじ部材に螺合し、前記コイルばね
の下端を取付用孔の内周の突座に当接させ、冷却ファン
のファンケーシングをＣＰＵの上面の熱伝導ラバーに付
勢圧接させた冷却ファン取付装置とする。In order to achieve the above object, the present invention is directed to a structure in which a cooling fan is joined and disposed on the upper surface of a CPU via a heat conductive rubber. A mounting hole having a protruding seat on the inner periphery is formed in a portion corresponding to the female screw member in the fan casing of the fan, and a mounting pin equipped with a coil spring on the outer periphery is inserted into the mounting hole, and a tip of the mounting pin is provided. The male screw portion provided on the CPU is screwed into the female screw member, and the lower end of the coil spring is brought into contact with a protruding seat on the inner periphery of the mounting hole to urge the fan casing of the cooling fan against the heat conductive rubber on the upper surface of the CPU. It is a cooling fan mounting device that has been pressed.
【０００８】本発明によれば、取付ピンの外周に装備し
たコイルばねにより冷却ファンのファンケーシングをＣ
ＰＵの上面の熱伝導ラバーに付勢圧接させるので、雌ね
じ部材の高さ、ＣＰＵの高さ、冷却ファンのファンケー
シングの厚みにバラツキがあっても、これを吸収して熱
伝導ラバーを薄くできるため、ＣＰＵと冷却ファンのフ
ァンケーシング間の良好な熱伝導が得られ、効果的にＣ
ＰＵの熱を放熱できる。また、冷却ファンのファンケー
シングにおける取付用孔には、取付ピンおよび雌ねじ部
材が嵌まり込むので、取付部材による冷却装置の高さが
大きくならなく、機器の小型化に寄与することができ
る。According to the present invention, the fan casing of the cooling fan is formed by the coil spring mounted on the outer periphery of the mounting pin.
The heat conductive rubber on the upper surface of the PU is urged and pressed, so that even if the height of the female screw member, the height of the CPU, and the thickness of the fan casing of the cooling fan vary, the heat conductive rubber can be thinned by absorbing the unevenness. As a result, good heat conduction between the CPU and the fan casing of the cooling fan is obtained, and C
The heat of PU can be radiated. Further, since the mounting pin and the female screw member are fitted into the mounting holes in the fan casing of the cooling fan, the height of the cooling device formed by the mounting members does not increase, thereby contributing to downsizing of the device.
【０００９】[0009]
【発明の実施の形態】本発明の請求項１に記載の発明
は、熱伝導性金属よりなるファンケーシングの内部に、
モータ部およびこのモータ部によって回転駆動するイン
ペラーを備えて構成された冷却ファンを、ＣＰＵの上面
に熱伝導ラバーを介して接合配置する冷却装置であっ
て、取付基板に雌ねじ部材を取り付け、冷却ファンのフ
ァンケーシングにおける前記雌ねじ部材に対応する部分
に内周に突座をもつ取付用孔を形成し、外周にコイルば
ねを装備した取付ピンを前記取付用孔に挿入し、前記取
付ピンの先端に設けた雄ねじ部を前記雌ねじ部材に螺合
し、前記コイルばねの下端を取付用孔の内周の突座に当
接させ、冷却ファンのファンケーシングをＣＰＵの上面
の熱伝導ラバーに付勢圧接させた冷却ファン取付装置で
あり、取付部材の寸法バラツキがあっても、これを吸収
してＣＰＵと冷却ファンのファンケーシング間の良好な
熱伝導が得られ、効果的にＣＰＵの熱を放熱できるとい
う作用を有する。BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention provides a fan casing made of a heat conductive metal,
What is claimed is: 1. A cooling device, comprising: a cooling unit having a motor unit and an impeller rotatably driven by the motor unit. The cooling unit is mounted on a top surface of a CPU via a heat conductive rubber. A mounting hole having a protruding seat on the inner periphery is formed in a portion corresponding to the female screw member in the fan casing, and a mounting pin equipped with a coil spring on the outer periphery is inserted into the mounting hole. The provided male screw portion is screwed into the female screw member, the lower end of the coil spring is brought into contact with a protruding seat on the inner periphery of the mounting hole, and the fan casing of the cooling fan is pressed against the heat conductive rubber on the upper surface of the CPU. The cooling fan mounting device is designed to absorb the dimensional variation of the mounting member and to obtain good heat conduction between the CPU and the fan casing of the cooling fan, thereby improving the efficiency. To such an action can radiate the heat of the CPU.
【００１０】本発明の請求項２に記載の発明は、請求項
１に記載の冷却ファン取付装置において、冷却ファンの
ファンケーシングにおける取付用孔を、取付ピンおよび
雌ねじ部材が嵌まり込む形状に形成したものであり、Ｃ
ＰＵと冷却ファンのファンケーシング間の良好な熱伝導
が得られとともに、取付部材による冷却装置の高さが大
きくならなく、機器の小型化に寄与することができると
いう作用を有する。According to a second aspect of the present invention, in the cooling fan mounting device according to the first aspect, the mounting hole in the fan casing of the cooling fan is formed in a shape into which the mounting pin and the female screw member are fitted. And C
Good heat conduction between the PU and the fan casing of the cooling fan is obtained, and the height of the cooling device due to the mounting member does not increase, thereby contributing to downsizing of the device.
【００１１】本発明の請求項３に記載の発明は、請求項
１に記載の冷却ファン取付装置において、取付ピンは、
取付用孔の突座より下部に位置する部分に頸溝を有し、
前記頸溝に止め輪を嵌め合わせ構成であり、ＣＰＵと冷
却ファンのファンケーシング間の良好な熱伝導が得られ
とともに、取付ピンの落脱がなく、安全な冷却ファンの
取り付けができるという作用を有する。According to a third aspect of the present invention, in the cooling fan mounting apparatus according to the first aspect, the mounting pins are:
It has a neck groove in the part located below the protruding seat of the mounting hole,
The retaining ring is fitted into the neck groove, which has good heat conduction between the CPU and the fan casing of the cooling fan, and has the effect that the mounting pin does not fall off and the cooling fan can be safely mounted. .
【００１２】本発明の請求項４に記載の発明は、請求項
１に記載の冷却ファン取付装置において、冷却ファンの
ファンケーシングにファンカバーを設けて取付用孔に嵌
め入れた取付ピンおよびコイルバネをファンケーシング
と一体にし、前記ファンカバーにおけるファンケーシン
グの取付用孔に対応する部分に取付ピンの頭部より小さ
な開口孔を形成したものであり、取付ピンおよびコイル
バネが常にファンケーシングに付随しているので、冷却
ファンの取り付けが容易であり、また、取付ピンおよび
コイルバネが紛失することがない等の作用を有する。According to a fourth aspect of the present invention, in the cooling fan mounting apparatus according to the first aspect, a mounting cover and a coil spring which are provided in a fan casing of a cooling fan and are fitted in mounting holes are provided. An opening smaller than the head of the mounting pin is formed at a portion of the fan cover corresponding to the mounting hole of the fan casing, and the mounting pin and the coil spring are always attached to the fan casing. Therefore, the cooling fan can be easily attached, and there is an effect that the attachment pin and the coil spring are not lost.
【００１３】本発明の請求項５に記載の発明は、請求項
１に記載の冷却ファン取付装置において、ＣＰＵおよび
冷却ファンを取り付ける取付基板は、プリント回路基板
としたものであり、ＣＰＵと冷却ファンのファンケーシ
ング間の良好な熱伝導が得られとともに、ＣＰＵと冷却
ファンの取付基板を共通化し、取付構造を簡易化すると
いう作用を有する。According to a fifth aspect of the present invention, in the cooling fan mounting apparatus according to the first aspect, the mounting board on which the CPU and the cooling fan are mounted is a printed circuit board. Good heat conduction between the fan casings is obtained, and a common mounting substrate for the CPU and the cooling fan is used, thereby simplifying the mounting structure.
【００１４】以下、本発明の冷却ファン取付装置の実施
の形態について、図面を参照して説明する。An embodiment of a cooling fan mounting device according to the present invention will be described below with reference to the drawings.
【００１５】（実施の形態１）図１は、本発明の実施の
形態１の冷却ファン取付装置の断側面図、図２は、同冷
却ファン取付装置の要部の断面図である。なお、図１、
図２において、前記図３に示す従来の技術と同じ構成部
には、従来の技術と同じ符号を付与する。(Embodiment 1) FIG. 1 is a sectional side view of a cooling fan mounting apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a sectional view of a main part of the cooling fan mounting apparatus. In addition, FIG.
2, the same components as those of the conventional technology shown in FIG. 3 are denoted by the same reference numerals as those of the conventional technology.
【００１６】まず、冷却装置の構成について説明する。
図１および図２に示すように、ファンケーシング１は熱
伝導性のよいアルミダイカストよりなり、全体として四
角形で、かつ、偏平に形成され、ヒートシンクを兼ねて
いる。前記ファンケーシング１内には、モータ部（図示
せず）と前記モータ部によって回転駆動するインペラー
２を有し、ファンケーシング１の底板３をＣＰＵ４の上
面の熱伝導ラバー９に接合させ、熱的結合をもたせるよ
うにしている。First, the configuration of the cooling device will be described.
As shown in FIGS. 1 and 2, the fan casing 1 is made of aluminum die-casting having good heat conductivity, is formed in a square shape and flattened as a whole, and also serves as a heat sink. The fan casing 1 includes a motor unit (not shown) and an impeller 2 that is driven to rotate by the motor unit. The bottom plate 3 of the fan casing 1 is joined to a heat-conducting rubber 9 on the upper surface of the CPU 4. We are trying to have a bond.
【００１７】上記の構成において、ＣＰＵ４で生じる熱
が熱伝導ラバー９を介してファンケーシング１に伝導
し、ファンケーシング１のヒートシンク作用で放熱およ
び、インペラー２の回転で生じる冷却風で強制的に冷却
される。なお、前記熱伝導ラバー９は、熱伝導の機能以
外に、ファンケーシング１のＣＰＵ４への過大な機械的
加圧力の緩和機能および、取付寸法誤差を吸収する機能
を有する。In the above configuration, the heat generated by the CPU 4 is transmitted to the fan casing 1 via the heat conductive rubber 9, and the heat is radiated by the heat sink function of the fan casing 1 and is forcibly cooled by the cooling air generated by the rotation of the impeller 2. Is done. In addition to the heat conduction function, the heat conduction rubber 9 has a function of alleviating an excessive mechanical pressure applied to the CPU 4 of the fan casing 1 and a function of absorbing a mounting dimensional error.
【００１８】つぎに、冷却ファン５およびＣＰＵ４の取
付構成について説明する。Next, the mounting configuration of the cooling fan 5 and the CPU 4 will be described.
【００１９】図１および図２に示すように、機器の筐体
１１の内側には、取付部材１２により一定の高さになる
ようにプリント回路基板８を取り付けている。このプリ
ント回路基板８の上面には、ＣＰＵ４を実装しており、
ＣＰＵ４の上面には、厚さ０．３〓の熱伝導ラバー９を
貼り付けている。また、プリント回路基板８の上面の４
ヶ所（図２では１ヶ所を示している）には、雌ねじ孔１
３をもつ雌ねじ部材１４を突設している。なお、この雌
ねじ部材１４の高さは、ＣＰＵ４の高さよりやや大きい
ものとしている。As shown in FIGS. 1 and 2, a printed circuit board 8 is attached to the inside of a housing 11 of the device by an attachment member 12 so as to have a constant height. The CPU 4 is mounted on the upper surface of the printed circuit board 8,
A heat conductive rubber 9 having a thickness of 0.3 mm is attached to the upper surface of the CPU 4. In addition, 4 on the upper surface of the printed circuit board 8
At two places (one place is shown in FIG. 2), the female screw hole 1
The female screw member 14 having the number 3 is protruded. Note that the height of the female screw member 14 is slightly larger than the height of the CPU 4.
【００２０】一方、前記ＣＰＵ４の上方に配置される冷
却ファン５は、ファンケーシング１における前記ＣＰＵ
４に対応する部分に接触用の突面部を形成してあり、ま
た、各雌ねじ部材１４に対応する部分に上面から下面に
貫通する取付用孔１５を形成している。この取付用孔１
５は、前記雌ねじ部材１４および後述の取付ピン１６が
余裕をもって嵌まり合う径となっており、そして内周に
は突座１７を有している。前記取付ピン１６は、外周に
ピアノ線よりなるコイルばね１８を装備しており、上部
にドライバー係合溝１９をもつ頭部２０を有し、下部に
雄ねじ部２１を有している。さらに、下部近くに頸溝２
２を有し、この頸溝２２に止め輪２３を嵌め合わせてい
る。On the other hand, the cooling fan 5 disposed above the CPU 4
4 is formed with a contact protruding surface, and a portion corresponding to each female screw member 14 is formed with a mounting hole 15 penetrating from the upper surface to the lower surface. This mounting hole 1
Reference numeral 5 denotes a diameter with which the female screw member 14 and a later-described mounting pin 16 fit with a margin, and has a projection 17 on the inner periphery. The mounting pin 16 is equipped with a coil spring 18 made of a piano wire on the outer periphery, has a head 20 having a driver engagement groove 19 on an upper part, and has a male screw part 21 on a lower part. In addition, cervical groove 2 near the lower part
2 and a retaining ring 23 is fitted in the neck groove 22.
【００２１】この構成において、取付ピン１６をファン
ケーシング１における各取付用孔１５に挿入し、取付ピ
ン１６の先端に設けた雄ねじ部２１を雌ねじ部材１４に
螺合し、コイルばね１８の下端を取付用孔１５の内周の
突座１７に当接させることにより、冷却ファン５はプリ
ント回路基板８に取り付けられるとともに、そのファン
ケーシング１はコイルばね１８によりＣＰＵ４の上面の
熱伝導ラバー９に付勢圧接させられ、ファンケーシング
１とＣＰＵ４は熱伝導関係をもつ構成となるものであ
る。In this configuration, the mounting pin 16 is inserted into each mounting hole 15 in the fan casing 1, the male screw portion 21 provided at the tip of the mounting pin 16 is screwed to the female screw member 14, and the lower end of the coil spring 18 is connected. The cooling fan 5 is mounted on the printed circuit board 8 by being brought into contact with the protruding seat 17 on the inner periphery of the mounting hole 15, and the fan casing 1 is attached to the heat conductive rubber 9 on the upper surface of the CPU 4 by the coil spring 18. The fan casing 1 and the CPU 4 are pressed against each other, and have a configuration having a heat conduction relationship.
【００２２】上記の構成において、雌ねじ部材１４の高
さ、ＣＰＵ４の高さ、冷却ファン５のファンケーシング
１の厚み、その他プリント回路基板８の厚みにバラツキ
があっても、取付ピン１６の外周に装備したコイルばね
１８により冷却ファン５のファンケーシング１をＣＰＵ
４の上面の熱伝導ラバー９に付勢圧接させるので、熱伝
導ラバー９による寸法誤差吸収範囲以上の寸法誤差吸収
ができ、したがって、ＣＰＵ４と冷却ファン５のファン
ケーシング１間の良好な熱伝導が得られ、効果的にＣＰ
Ｕの熱を放熱できる。また、冷却ファン５のファンケー
シング１における取付用孔１５には、取付ピン１６およ
び雌ねじ部材１４が嵌まり込むので、取付部材による冷
却装置の高さが大きくならなく、機器の小型化に寄与す
ることができる。また、止め輪２３は取付用孔１５の突
座１７の下に位置しており、突座１７が取付ピン１６の
抜け止めをするので、取付ピン１６の脱落がなく、安定
した取付構成とすることができる。In the above configuration, even if the height of the female screw member 14, the height of the CPU 4, the thickness of the fan casing 1 of the cooling fan 5, and the thickness of the printed circuit board 8 vary, the outer periphery of the mounting pin 16 The fan casing 1 of the cooling fan 5 is mounted on the CPU
4 is pressed against the heat conductive rubber 9 on the upper surface of the heat transfer rubber 4, so that the dimensional error can be absorbed by the heat conductive rubber 9 beyond the dimensional error absorption range. Therefore, good heat conduction between the CPU 4 and the fan casing 1 of the cooling fan 5 can be achieved. Obtained and effectively CP
The heat of U can be radiated. Further, since the mounting pin 16 and the female screw member 14 are fitted into the mounting holes 15 in the fan casing 1 of the cooling fan 5, the height of the cooling device by the mounting members does not increase, thereby contributing to downsizing of the device. be able to. In addition, the retaining ring 23 is located below the protruding seat 17 of the mounting hole 15 and the protruding seat 17 prevents the mounting pin 16 from coming off, so that the mounting pin 16 does not fall off and a stable mounting configuration is achieved. be able to.
【００２３】（実施の形態２）図３は、本発明の実施の
形態２の冷却ファン取付装置の要部断面図である。(Embodiment 2) FIG. 3 is a sectional view of a main part of a cooling fan mounting apparatus according to Embodiment 2 of the present invention.
【００２４】この実施の形態２では、冷却ファン５と取
付ピン１６およびコイルばね１８を一体化したことに特
徴を有する。The second embodiment is characterized in that the cooling fan 5, the mounting pin 16 and the coil spring 18 are integrated.
【００２５】すなわち、図３に示すようにファンケーシ
ング１の上面にはファンカバー２４を設けている。そし
て、このファンカバー２４におけるファンケーシング１
の取付用孔１５に対応する部分には、取付用孔１５に嵌
め込まれた取付ピン１６の頭部２０より小さい開口孔２
５を形成している。That is, a fan cover 24 is provided on the upper surface of the fan casing 1 as shown in FIG. The fan casing 1 in the fan cover 24
An opening 2 smaller than the head 20 of the mounting pin 16 fitted in the mounting hole 15 is provided in a portion corresponding to the mounting hole 15.
5 are formed.
【００２６】したがって、ファンケーシング１の取付用
孔１５に嵌め込まれた取付ピン１６およびコイルバネ１
８はファンケーシング１と一体化され、取付用孔１５か
ら脱落することがなく、取付ピン１６には前述の実施の
形態１のように止め輪を設ける必要はない。また、取付
ピン１６のねじ込み作業は、ファンカバー２４の開口孔
２５にドライバーを挿入して自由にすることができる。Therefore, the mounting pin 16 fitted into the mounting hole 15 of the fan casing 1 and the coil spring 1
8 is integrated with the fan casing 1 and does not fall off from the mounting hole 15, and the mounting pin 16 does not need to be provided with a retaining ring as in the first embodiment. The screwing operation of the mounting pin 16 can be freely performed by inserting a driver into the opening 25 of the fan cover 24.
【００２７】なお、前記実施の形態では、ファンケーシ
ング１をアルミダイカストで形成しているが、他の金属
材料で形成してもよく、また、板金製としてもよい。In the above embodiment, the fan casing 1 is made of aluminum die-cast, but may be made of another metal material or may be made of sheet metal.
【００２８】[0028]
【発明の効果】以上の説明より明らかなように、本発明
は冷却ファンをＣＰＵの上面に熱伝導ラバーを介して接
合配置する構成であって、取付基板に雌ねじ部材を取り
付け、冷却ファンのファンケーシングにおける前記雌ね
じ部材に対応する部分に内周に突座をもつ取付用孔を形
成し、外周にコイルばねを装備した取付ピンを前記取付
用孔に挿入し、前記取付ピンの先端に設けた雄ねじ部を
前記雌ねじ部材に螺合し、前記コイルばねの下端を取付
用孔の内周の突座に当接させ、冷却ファンのファンケー
シングをＣＰＵの上面の熱伝導ラバーに付勢圧接させた
冷却ファン取付装置としたので、雌ねじ部材の高さ、Ｃ
ＰＵの高さ、冷却ファンのファンケーシングの厚み等に
バラツキがあっても、熱伝導ラバーによるバラツキ吸収
範囲以上のバラツキを吸収することができ、したがつて
ＣＰＵと冷却ファンのファンケーシング間の良好な熱伝
導が得られ、効果的にＣＰＵの熱を放熱できる。また、
冷却ファンのファンケーシングにおける取付用孔には、
取付ピンおよび雌ねじ部材が嵌まり込むので、取付部材
による冷却装置の高さが大きくならなく、機器の小型化
に寄与することができる。As is apparent from the above description, the present invention has a structure in which a cooling fan is joined and disposed on the upper surface of a CPU via a heat conductive rubber, and a female screw member is mounted on a mounting board, and the fan of the cooling fan is mounted. A mounting hole having a projection on the inner periphery was formed in a portion corresponding to the female screw member in the casing, and a mounting pin equipped with a coil spring on the outer periphery was inserted into the mounting hole, and provided at a tip of the mounting pin. The male screw portion was screwed into the female screw member, the lower end of the coil spring was brought into contact with the protruding seat on the inner periphery of the mounting hole, and the fan casing of the cooling fan was pressed against the heat conductive rubber on the upper surface of the CPU. Since the cooling fan mounting device is used, the height of the female screw member, C
Even if there is variation in the height of the PU, the thickness of the cooling fan fan casing, etc., it is possible to absorb the variation that exceeds the variation absorption range due to the heat conductive rubber, and therefore, the goodness between the CPU and the cooling fan fan casing is achieved. Heat conduction can be obtained, and the heat of the CPU can be effectively radiated. Also,
In the mounting holes in the fan casing of the cooling fan,
Since the mounting pin and the female screw member are fitted, the height of the cooling device provided by the mounting member does not increase, which can contribute to downsizing of the device.
【図１】本発明の実施の形態１の冷却ファン取付装置の
断側面図FIG. 1 is a cross-sectional side view of a cooling fan mounting device according to a first embodiment of the present invention.
【図２】同冷却ファン取付装置の要部の断面図FIG. 2 is a sectional view of a main part of the cooling fan mounting device.
【図３】本発明の実施の形態２の冷却ファン取付装置の
要部断面図FIG. 3 is a sectional view of a main part of a cooling fan mounting device according to a second embodiment of the present invention.
【図４】従来の冷却ファン取付装置の断側面図FIG. 4 is a cross-sectional side view of a conventional cooling fan mounting device.
１ ファンケーシング ２ インペラー ３ 底板 ４ ＣＰＵ ５ 冷却ファン ６ 筐体 ７ 取付ボス ８ プリント回路基板 ９ 熱伝導ラバー １１ 筐体 １２ 取付部材 １３ 雌ねじ孔 １４ 雌ねじ部材 １５ 取付用孔 １６ 取付ピン １７ 突座 １８ コイルばね １９ ドライバー係合溝 ２０ 頭部 ２１ 雄ねじ部 ２２ 頸溝 ２３ 止め輪 ２４ ファンカバー ２５ 開口孔 Reference Signs List 1 fan casing 2 impeller 3 bottom plate 4 CPU 5 cooling fan 6 housing 7 mounting boss 8 printed circuit board 9 heat conductive rubber 11 housing 12 mounting member 13 female screw hole 14 female screw member 15 mounting hole 16 mounting pin 17 protrusion 18 coil Spring 19 Driver engagement groove 20 Head 21 Male screw part 22 Neck groove 23 Retaining ring 24 Fan cover 25 Opening hole
Claims (5)
内部に、モータ部およびこのモータ部によって回転駆動
するインペラーを備えて構成された冷却ファンを、ＣＰ
Ｕの上面に熱伝導ラバーを介して接合配置する冷却装置
であって、取付基板に雌ねじ部材を取り付け、冷却ファ
ンのファンケーシングにおける前記雌ねじ部材に対応す
る部分に内周に突座をもつ取付用孔を形成し、外周にコ
イルばねを装備した取付ピンを前記取付用孔に挿入し、
前記取付ピンの先端に設けた雄ねじ部を前記雌ねじ部材
に螺合し、前記コイルばねの下端を取付用孔の内周の突
座に当接させ、冷却ファンのファンケーシングをＣＰＵ
の上面の熱伝導ラバーに付勢圧接させたことを特徴とす
る冷却ファン取付装置。1. A cooling fan comprising a motor unit and an impeller rotatably driven by the motor unit inside a fan casing made of a heat conductive metal,
A cooling device which is joined and disposed on a top surface of a U through a heat conductive rubber, wherein a female screw member is mounted on a mounting board, and a mounting portion having a projection on an inner periphery in a portion corresponding to the female screw member in a fan casing of a cooling fan. Forming a hole, inserting a mounting pin equipped with a coil spring on the outer periphery into the mounting hole,
A male screw portion provided at a tip of the mounting pin is screwed into the female screw member, and a lower end of the coil spring is brought into contact with a protruding seat on an inner periphery of the mounting hole, and a fan casing of the cooling fan is mounted on the CPU.
A cooling fan mounting device, wherein the cooling fan mounting device is biased and pressed against a heat conductive rubber on an upper surface of the cooling fan.
付用孔は、取付ピンおよび雌ねじ部材が嵌まり込む形状
に形成されたことを特徴とする請求項１記載の冷却ファ
ン取付装置。2. The cooling fan mounting device according to claim 1, wherein the mounting hole in the fan casing of the cooling fan is formed in a shape into which the mounting pin and the female screw member are fitted.
置する部分に頸溝を有し、前記頸溝に止め輪を嵌め合わ
せたことを特徴とする請求項１記載の冷却ファン取付装
置。3. The cooling fan according to claim 1, wherein the mounting pin has a neck groove in a portion located below the protruding seat of the mounting hole, and a retaining ring is fitted in the neck groove. Mounting device.
バーを設けて取付用孔に嵌め入れた取付ピンおよびコイ
ルバネをファンケーシングと一体にし、前記ファンカバ
ーにおけるファンケーシングの取付用孔に対応する部分
に取付ピンの頭部より小さな開口孔を形成したことを特
徴とする請求項１記載の冷却ファン取付装置。4. A fan cover is provided in a fan casing of a cooling fan, and a mounting pin and a coil spring fitted into a mounting hole are integrated with the fan casing, and mounted on a portion of the fan cover corresponding to the mounting hole of the fan casing. 2. The cooling fan mounting device according to claim 1, wherein an opening hole smaller than the head of the pin is formed.
基板は、プリント回路基板であることを特徴とする請求
項１記載の冷却ファン取付装置。5. The cooling fan mounting apparatus according to claim 1, wherein the mounting board for mounting the CPU and the cooling fan is a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25881899A JP2001085585A (en) | 1999-09-13 | 1999-09-13 | Cooling fan fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25881899A JP2001085585A (en) | 1999-09-13 | 1999-09-13 | Cooling fan fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001085585A true JP2001085585A (en) | 2001-03-30 |
Family
ID=17325479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25881899A Pending JP2001085585A (en) | 1999-09-13 | 1999-09-13 | Cooling fan fixing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001085585A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020062454A (en) * | 2001-01-20 | 2002-07-26 | 엘지전자주식회사 | Radiation apparatus of notebook computer |
| CN1308788C (en) * | 2004-03-16 | 2007-04-04 | 奇鋐科技股份有限公司 | Externally mounted heat abstractor |
| EP1845435A2 (en) * | 2006-04-14 | 2007-10-17 | Fujitsu Ltd. | Electronic apparatus and cooling component |
| JP2008263028A (en) * | 2007-04-11 | 2008-10-30 | Toshiba Corp | Electronic apparatus |
| JP2014049760A (en) * | 2012-08-31 | 2014-03-17 | Furui Precise Component (Kunshan) Co Ltd | Heat dissipation device |
| CN104142716A (en) * | 2013-05-10 | 2014-11-12 | 鸿富锦精密电子(天津)有限公司 | Fan fixing device |
| JP2015083251A (en) * | 2015-02-04 | 2015-04-30 | 株式会社三洋物産 | Game machine |
| US9739291B2 (en) | 2015-04-13 | 2017-08-22 | Minebea Mitsumi Inc. | Cooling fan |
| CN108958435A (en) * | 2018-08-14 | 2018-12-07 | 郑州国知网络技术有限公司 | A kind of heat radiator for notebook computer with anti-slip function |
| CN110691485A (en) * | 2019-10-17 | 2020-01-14 | 淮阴师范学院 | Electric power and electric element installation device capable of being cooled rapidly |
| TWI692612B (en) * | 2018-11-28 | 2020-05-01 | 大陸商宸展光電(廈門)股份有限公司 | Cooling tray assembly and electronic device |
| CN111946529A (en) * | 2020-08-28 | 2020-11-17 | 杨克瑞 | Variable speed protection hydroelectric power generation equipment |
-
1999
- 1999-09-13 JP JP25881899A patent/JP2001085585A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020062454A (en) * | 2001-01-20 | 2002-07-26 | 엘지전자주식회사 | Radiation apparatus of notebook computer |
| CN1308788C (en) * | 2004-03-16 | 2007-04-04 | 奇鋐科技股份有限公司 | Externally mounted heat abstractor |
| EP1845435A2 (en) * | 2006-04-14 | 2007-10-17 | Fujitsu Ltd. | Electronic apparatus and cooling component |
| EP1845435A3 (en) * | 2006-04-14 | 2009-12-02 | Fujitsu Ltd. | Electronic apparatus and cooling component |
| JP2008263028A (en) * | 2007-04-11 | 2008-10-30 | Toshiba Corp | Electronic apparatus |
| JP2014049760A (en) * | 2012-08-31 | 2014-03-17 | Furui Precise Component (Kunshan) Co Ltd | Heat dissipation device |
| CN104142716A (en) * | 2013-05-10 | 2014-11-12 | 鸿富锦精密电子(天津)有限公司 | Fan fixing device |
| JP2015083251A (en) * | 2015-02-04 | 2015-04-30 | 株式会社三洋物産 | Game machine |
| US9739291B2 (en) | 2015-04-13 | 2017-08-22 | Minebea Mitsumi Inc. | Cooling fan |
| CN108958435A (en) * | 2018-08-14 | 2018-12-07 | 郑州国知网络技术有限公司 | A kind of heat radiator for notebook computer with anti-slip function |
| TWI692612B (en) * | 2018-11-28 | 2020-05-01 | 大陸商宸展光電(廈門)股份有限公司 | Cooling tray assembly and electronic device |
| CN110691485A (en) * | 2019-10-17 | 2020-01-14 | 淮阴师范学院 | Electric power and electric element installation device capable of being cooled rapidly |
| CN111946529A (en) * | 2020-08-28 | 2020-11-17 | 杨克瑞 | Variable speed protection hydroelectric power generation equipment |
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