KR20020061151A - Wire handling apparatus, flux applying apparatus and soldering apparatus - Google Patents

Abstract

PURPOSE: A wire processing apparatus, a flux spreading device, and a solder depositing device are provided to reduce the size, and to prevent liquid leakage by forming a flux tub and a soldering tub with a simple structure. CONSTITUTION: A wire processing apparatus includes an applicator(60) for crimping a pressing terminal contact onto an end of a wire(2) and solder depositing units(7,8) for depositing solder onto an exposed core on the wire end. The applicator and the solder depositing units are attachable to and removable from a placement section(13a) and are interchangeable with each other. Each of the solder depositing units includes a flux bath(15) for storing flux liquid therein, a solder bath(16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein for inserting the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath, whereby the solder is deposited on the core.

Description

Wire processing device, flux coating device and solder attachment device {WIRE HANDLING APPARATUS, FLUX APPLYING APPARATUS AND SOLDERING APPARATUS}

TECHNICAL FIELD The present invention relates to a wire processing apparatus, a flux coating device, and a solder attachment device that perform a predetermined treatment on an end portion of an electric wire.

Background Art Conventionally, a wire processing apparatus that performs a predetermined process on an end portion of an electric wire, comprising a terminal blower at both ends of which terminal crimping is performed at both ends of the electric wire, and a terminal crimping treatment at one end and the other. At the end, there was a piece of terminal blower with a piece of solder to which soldering treatment was performed, and these were manufactured as individual models.

The difference between such a terminal blower with solder and a terminal blower at both ends is a final step after stripping the wire ends, and a solder attachment unit (solder jaw, flux jaw, etc.) for solder attachment to the terminal crimp unit mounting portion. Is provided.

Moreover, as a typical typical soldering apparatus, the flux liquid is affixed to the flux liquid circulated in the flux layer by inserting the core wire portion of the wire end portion from the insertion hole formed in the side wall of the flux bath, and then attaching the flux liquid. The core portion of the wire end portion is inserted into the solder fractionation section which flows in the solder tank, and the solder is attached. For example, it is as disclosed by Unexamined-Japanese-Patent No. 4-55788.

However, according to the conventional wire processing apparatus, the purchaser must purchase the required model according to the use, and in some cases, it is necessary to purchase both of the above models, requiring a large space for installation. There was a problem.

In addition, according to the conventional solder attaching device, since the flux liquid is circulated or the solder is sorted, there is a risk of liquid leakage from the insertion hole formed in the side wall of the flux bath, and a drive mechanism for circulating or a drive for sorting is performed. There is a problem that a mechanism or the like is required, resulting in an enlargement of the flux bath or the solder bath, and from these points, there is a problem that the enlargement of the wire processing apparatus is caused.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a wire processing apparatus capable of miniaturizing and reducing space as a whole apparatus.

Moreover, an object of this invention is to provide the apparatus provided with the flux tank which simplifies a structure, prevents liquid leakage, and makes it possible to miniaturize.

Moreover, an object of this invention is to provide the apparatus provided with the solder tank which enabled the simplification and miniaturization of a structure.

Brief Description of Drawings [Fig. 1] Fig. 1 is an overall schematic explanatory diagram of a first embodiment of the present invention.

2 is a front view of a partial cross section of the front soldering unit.

3 is a plan view of the lower unit.

4 is a partially enlarged side view of FIG. 2.

5 is a partially enlarged side view of FIG. 2.

6 is a front view of the film removing mechanism.

7 is an operation explanatory diagram of the film removing mechanism.

8 is an explanatory diagram of a flux coating step.

9 is an explanatory diagram of a flux coating step.

It is explanatory drawing of a solder adhesion process.

It is explanatory drawing of a solder adhesion process.

It is explanatory drawing of a solder adhesion process.

13 is an explanatory diagram of a detection circuit.

14 is an explanatory diagram of solder replenishment.

It is sectional drawing which shows the connection structure of a ram shaft body and an applicator.

It is explanatory drawing which shows the attachment structure of the board | substrate to an installation part.

It is explanatory drawing of a solder adhesion process.

It is explanatory drawing of a solder adhesion process.

It is explanatory drawing of a solder adhesion process.

In one embodiment of the wire processing apparatus according to the present invention, in the wire processing apparatus in which the processing is performed by the wire processing unit provided in the mounting portion with respect to the distal end portion of the electric wire moved by the moving means, the wire processing unit Silver is provided with a terminal crimping unit for crimping the crimp terminal in the distal end, and the solder attaching unit for soldering to the core wire exposed from the distal end, which is detachable and interchangeable It is composed.

According to this embodiment, since the terminal crimping unit and the soldering unit can be installed interchangeably with respect to a single mounting portion in the wire processing apparatus, it is not necessary to separately install a plurality of models as in the prior art and to reduce the installation space. It is possible to reduce the size of the device as a whole.

In another embodiment of the wire processing apparatus according to the present invention, the terminal crimping unit and the solder attaching unit each have a lift section, and the lifter for elevating and manipulating the lift section of the terminal crimping unit or the solder attaching unit provided in the mounting section. The means has a structure provided in the wire processing apparatus.

According to this embodiment, the elevating means can be combined.

In still another embodiment of the electric wire treating apparatus according to the present invention, the elevating means is configured of a press mechanism.

According to this embodiment, it is possible to easily cope by allowing the soldering unit to be installed in the mounting portion of the terminal crimping unit in the terminal crimping apparatus.

In still another embodiment of the wire processing apparatus according to the present invention, the solder attachment unit is provided with a solder bath in which the solder in the molten state to be attached to the core wire portion is stored, and the lowering operation is performed by the moving means. The solder is attached by immersing the core wire in a bulging portion caused by the surface tension of the solder stored in the solder bath.

According to this embodiment, the solder bath may be any container structure capable of storing the solder in the molten state, so that the conventional solder flow structure is unnecessary, and the structure of the solder bath can be simplified, and the size of the solder bath can be simplified. You can do it.

In another embodiment of the electric wire treating apparatus according to the present invention, the elevating portion of the soldering unit is provided with an electric wire pressing guide located above the solder bath in which the core wire portion is dipped, and the electric wire pressing guide is lowered. And a pressing surface for pressing down the core wire portion immersed in the bulging portion caused by the surface tension of the solder by an operation, and the core wire portion pressed by the pressing surface by the retraction operation of the moving means from the bulging portion. The lead is drawn out so that the solder is attached.

According to this embodiment, a better adhesion state of the solder to the core portion is obtained.

In still another embodiment of the wire processing apparatus according to the present invention, the solder attachment unit is provided with a flux jaw in which a flux solution to be attached to the core wire portion is stored, and the elevating portion of the solder attachment unit is located above the flux jaw. The lifting liquid is freely supported at the rising position to be positioned and the lowering position to be located in the flux liquid, and at the same time, the flux liquid holding body is provided with a holding hole in which the flux liquid is held and the core wire portion is freely insertable. It is provided with the structure provided.

According to this embodiment, the flux bath may be a container structure capable of storing the flux liquid, so that the flux structure and the insertion hole formed in the side wall of the flux bath are unnecessary as in the prior art, thereby simplifying the structure in the flux bath. At the same time, liquid leakage can be effectively prevented, and the flux bath itself can be miniaturized.

In still another embodiment of the electric wire treating apparatus according to the present invention, the end portion of the core wire portion of the retaining hole in the flux liquid holding cylinder is inserted into a tapered insertion guide surface which is gradually enlarged. have.

According to this embodiment, the insertion of the core wire portion to the holding hole is stabilized by the guide function of the insertion guide surface.

In still another embodiment of the wire processing apparatus according to the present invention, a supporting rod is provided at the lifting portion of the solder attachment unit, and the flux-liquid holding cylinder and the wire pressing guide are respectively supported at the lower end of the supporting rod. The solder bath in which the flux liquid holding cylinder is located at the lift position above the flux bath at the rising position of the support rod, and the core wire portion is immersed in the bulging portion caused by the surface tension of the solder. Located above and at the lowered position of the supporting rod, the flux liquid holding cylinder is located at the lowered position in the flux liquid, and the bulging portion caused by the surface tension of the solder by the pressing surface of the wire pressing guide. The core wire part immersed in the structure is pressed downward.

According to this embodiment, the flux liquid holding cylinder and the electric wire pressing guide are lifted and operated integrally to improve the operation efficiency.

In still another embodiment of the wire processing apparatus according to the present invention, the solder attachment unit is configured to further include a film removal mechanism for removing an oxide film formed on the liquid surface of the solder stored in the solder bath.

According to this embodiment, the solder can be attached with the liquid level of the solder in the solder bath always in good condition.

In one embodiment of the flux applicator according to the present invention, in a flux applicator for attaching the flux liquid to a core wire exposed at the distal end of the electric wire, the flux bath in which the flux liquid is stored, and the lift located above the flux bath The lifting liquid is freely supported at the position and the lowering position located in the flux liquid, the flux liquid holding cylinder having a holding hole for holding the flux liquid, and the wire is freely supported by the movement operation, and at the rising position. It is a structure provided with the movement means which inserts and inserts the said core wire part freely in the said holding hole of the said flux liquid holding body located.

According to this embodiment, the flux bath may be any container structure capable of storing the flux liquid, and therefore, the conventional circulation structure of the flux liquid and the insertion hole formed in the side wall of the flux bath are unnecessary, thereby simplifying the structure in the flux bath. At the same time, liquid leakage can be effectively prevented, and the flux bath itself can be miniaturized.

In another embodiment of the flux applying device according to the present invention, the end portion of the flux hole holding cylinder in which the core wire portion is inserted is gradually formed to have a tapered insertion guide surface.

According to this embodiment, the insertion of the core wire portion to the holding hole is stabilized by the guide function of the insertion guide surface.

In one embodiment of the soldering apparatus according to the present invention, in the soldering apparatus for attaching the solder to the core wire exposed at the distal end of the electric wire, the solder bath in which the solder in the molten state is stored, and the wire can be freely moved. Supporting means is provided with a moving means for immersing the core wire portion in the bulging portion caused by the surface tension of the solder stored in the solder bath by the lowering operation to attach the solder.

According to this embodiment, the solder bath can be any container structure capable of storing the solder in the molten state, so that the solder sorting structure as in the prior art is not necessary, so that the structure in the solder bath can be simplified and downsized. .

In another embodiment of the solder attachment device according to the present invention, the solder attachment device is further provided with a wire pressing guide positioned above the solder bath in which the core wire portion is immersed and freely lifting and lowering, and the wire pressing guide is provided with a lowering operation. And a pressing surface for pressing down the core wire portion immersed in the bulging portion caused by the surface tension of the solder downward, and the core wire portion pressed by the pressing surface by the retraction operation of the moving means is drawn out from the bulging portion. It is a structure to which the said solder adheres.

According to this embodiment, a better adhesion state of the solder to the core portion is obtained.

In still another embodiment of the solder attachment device according to the present invention, there is provided a solder attachment device for attaching solder to a core wire having a short exposed length at a wire end portion, the solder tank storing the solder in a molten state, and the core wire portion being soldered. A moving means positioned above the jaw to freely support the movement of the wire, and a lifting operation is freely arranged above the wire in which the core wire portion is located above the solder bath, and the wire is moved downward by the lowering operation. And a wire pressing guide for pressing the core wire to immerse the core wire in the solder, wherein the core wire is pulled out of the solder by the retraction operation of the moving means.

According to this embodiment, the solder can be attached well to the core part having a short exposure length, and the solder bath may be a container structure capable of storing the solder in a molten state, thus eliminating the need for a conventional sorting structure of the solder. The structure of the tank can be simplified and at the same time miniaturized.

In another embodiment of the soldering apparatus according to the present invention, there is provided a flux bath in which a flux liquid to be attached to a core wire exposed at a distal end of a wire, a solder bath in which molten solder to be attached to the core wire is stored, and the wire is supported. At the same time, a solder attachment device provided with a moving means freely moveable for attaching the flux liquid at the flux jaw position to the core wire portion and for attaching the solder at the solder jaw position, comprising: a support rod which is lifted and operated; And a holding hole in which the elevating operation is freely supported at the lower end of the supporting rod at the ascending position located above the flux bath and the descending position located in the flux liquid, and at the same time, the flux liquid is held and the core wire portion can be inserted and detached freely. Formed flux liquid holding cylinder and said flux liquid holding cylinder Is located above the solder bath in which the core wire portion is immersed in the bulging portion caused by the surface tension of the solder at the raised position of the supporting rod, and is supported at the lower end of the supporting rod, In the lowered position of the support bar located in the lowered position, the wire pressing guide is provided with a pressing surface for pressing the core wire portion immersed in the solder downward.

According to this embodiment, the flux liquid holding cylinder and the electric wire pressing guide are lifted and operated integrally to improve the operation efficiency.

(Preferred embodiment)

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, 1 is a wire processing apparatus, and the wires 2 sequentially supplied along the wire supply line P are measured for a predetermined length. Cut-off and peeling of the measuring unit 3, the front clamp 4 and the rear clamp 5, and the electric wire 2 which hold | disconnect and hold | disengage the electric wire 2 freely. (Iii) convey the cutter unit 6, the front soldering unit 7, the rear soldering unit 8, and the electric wire 2 held by the front clamp 4 to a predetermined position. (F) front moving means (9), rear moving means (10) for conveying the electric wire (2) held by the rear clamp (5) to a predetermined position, and a discharge unit for discharging the processed electric wire (2) ( 11).

The measuring unit 3 includes a wire feeding mechanism for feeding the wires 2 along the wire supply line P, and a measuring device for measuring the wire length of the wires 2 sent by the wire feeding mechanism. have.

The front solder attaching unit 7 and the rear solder attaching unit 8 are each provided with a flux bath 15 for storing a flux liquid and a solder bath 16 for storing solder in a molten state.

The front clamp 4 is supported by the front moving means 9 provided on the mount 13, and the front moving means 9 is a three-axis direction (X, Y, Z) orthogonal to each other. (In the drawing, only the two-axis directions (X, Y) are indicated by arrows), that is, the front clamp 4 is freely supported in three dimensions in the front, rear, left, right, and up and down directions. The movement operation of the position of the length measurement unit 3, the position of the cutter unit 6, the position of the flux tank 15 of the front soldering unit 7, and the position of the solder tank 16 is free.

Similarly, the rear clamp 5 is also supported by the rear moving means 10 provided on the mount 13, and the rear moving means 10 is in the three axis directions orthogonal to each other, i.e., front, rear, left and right and up and down. Movement of the rear clamp 5 is freely supported in three directions in the direction, and the rear clamp 5 has the position of the cutter unit 6 and the position of the flux jaw 15 of the rear soldering unit 8. And the movement operation of the position of the solder bath 16 and the position of the discharge unit 11 are free.

Then, the electric wires 2, which have been fed a predetermined length along the electric wire supply line P by the measuring unit 3, are gripped by the front clamp 4 and the rear clamp 5, respectively, and the cutter unit 6 in that state. ), And is separated into a wire (2) held by the front clamp (4) and a wire (2) held by the rear clamp (5), and then to each clamp (4) (5) The distal end of the gripped wire 2 is peeled off by the cutter unit 6.

The electric wire 2 gripped by the front clamp 4 is then moved to the position of the flux bath 15 of the front soldering attachment unit 7, and the flux liquid adheres to the exposed core wire part. It moves to the position of the solder tank 16, and a solder adheres to a core wire part. After the soldering attachment process, the electric wire 2 held by the front clamp 4 is returned to the initial position facing the cutter unit 6.

On the other hand, while soldering is applied to the electric wire 2 on the front clamp 4 side, the electric wire 2 on the rear clamp 5 side is also moved to the flux jaw 15 position of the rear soldering unit 8. The flux liquid adheres to the core part exposed by the movement operation, and after that, the soldering process is performed in which the solder is attached to the core part by the movement operation to the position of the solder bath 16, and then the wire 2 is three-dimensional. The operation is transferred to the free discharge unit 11 and discharged to the predetermined discharge portion, and the rear clamp 5 returns to the initial position facing the cutter unit 6.

Then, as described above, the wire 2 is sent out a predetermined length along the wire supply line P by the operation of the measuring unit 3, the predetermined wire length with solder attached to both ends by repeating the same operation Harnesses having are made in turn.

Here, since the front soldering unit 7 and the rear soldering unit 8 as the wire processing unit are configured in the same way, the front soldering unit 7 will be described.

That is, the front soldering unit 7 has an upper unit 7a and a lower unit 7b as shown in FIGS. 2 to 7, and supports the support on the substrate 17 of the lower unit 7b. The flux bath 15 and the solder bath 16 are supported in parallel with each other via (18) and (19).

In the flux bath 15, an appropriate amount of flux liquid 21 is stored, and in the solder bath 16, the molten state of the solder 22 is formed by the surface tension of the upper edge of the solder bath 16. It is stored bulging upward from.

In addition, the foreign matter container 23 is disposed adjacent to one side of the solder bath 16, and the solder 22 in the solder bath 16 is heated to a lower surface of the solder bath 16 to be prescribed. The heater 24 which maintains the molten state of temperature is provided, and the heat insulation plate 25 is arrange | positioned so that the solder tank 16, the foreign matter container 23, and the side and bottom part of the heater 24 may be enclosed.

Moreover, the film removal mechanism 27 which removes the oxide film which arises on the liquid surface of the solder 22 is provided on the board | substrate 17, The film removal mechanism 27 is the support support 28 on the board | substrate 17. The upper portion of the slide cylinder 29 attached and fixed through the support cylinder, the support block body 30 mounted on the distal end of the piston rod 29a of the slide cylinder 29, and the support block body 30; ) Is provided with a support shaft 31 freely rotatably supported.

Moreover, the positioning pin 33 is fixed to the edge part in which the support arm 32 fixed to the one end protrusion part of the support shaft 31 was extended, and is a film under the action force by the tension spring 35. The removal plate 37 is freely supported around the support shaft 36 by the plate support 34 fixed to the other end projection of the support shaft 31.

The swing operation cylinder 38 is mounted to the middle portion of the support block 30 in the vertical direction, and the tip of the piston rod 38a of the swing operation cylinder 38 is in contact with the bottom surface of the positioning pin 33. It is. And in this initial state, as shown in FIG.2 and FIG.6, the film removal plate 37 is comprised so that it may become a perpendicular attitude | position.

As shown in FIG. 4, a return spring 39 made of a tension spring is mounted between the positioning pin 33 and the support block body 30 so that the positioning pin 33 is a piston rod 38a. The tensile force acts in the direction of contact with the tip of the tip.

And when removing the oxide film of the solder 22 which arises in the liquid level of the solder 22, the piston rod 38a of the rocking | operation operation cylinder 38 moves forward, and the positioning pin 33 will move upwards. The support shaft 31 is rotated in response to the rising of the positioning pin 33, and the plate support 34 and the film are removed as shown by the imaginary line in FIG. The plate 37 is pivoted up integrally around the axis of the support shaft 31.

In the ascending rotational position of the plate support 34 and the de-filming plate 37, the piston rod 29a of the slide cylinder 29 is moved out, so that the plate support 34 and the de-coating plate 37 are soldered. The solder 22 of 16 is moved and operated above the liquid level.

Then, when the piston rod 38a of the swinging operation cylinder 38 is retracted at the advanced position of the piston rod 29a, the positioning pin 33 is lowered by the tension of the return spring 39, Thereby, the plate support body 34 and the de-filming plate 37 return to the initial state in which the de-coating plate 37 becomes a vertical posture, as shown by the virtual line of FIG. At this time, the lower side of the film removal plate 37 slightly penetrates into the solder 22 liquid level.

After that, when the piston rod 29a of the slide cylinder 29 is retracted, the descaling plate 37 is moved and operated along the liquid level of the solder 22, and then the initial position located above the foreign matter receiver 23. Returning to the position, the oxide film removed by the film removing plate 37 is accommodated by falling into the foreign matter container 23, and the removal of the oxide film is completed. The removal of the oxide film of the solder 22 is controlled so as to be automatically performed every predetermined time.

The lower unit 7b has a structure in which the substrate 17 is detachably attached to the predetermined mounting portion 13a of the mount 13. In addition, also in the rear soldering unit 8, the structure is detachably attached to the predetermined mounting portion 13a.

The upper unit 7a is a lifting unit that is lifted and operated by lifting means such as a press mechanism or a hydraulic cylinder, for example, the press mechanism 40.

2, 4, and 5, the attachment shaft portion 42a is inserted into the mounting hole portion 41a formed in the lower end portion of the ram shaft body 41 in which the press mechanism 40 is elevated. The support rod 42 which can be attached and detached freely by the fastening of the bolt 43, etc., and the flux liquid holding body 44, the electric wire press guide 45, and the electrode which are detachably attached to the lower end of the support rod 42 are matched. A probe 46 is provided.

As shown in Figs. 8 and 9, the flux-liquid holding cylinder 44 has a fine diameter holding in which the core portion 2a of the electric wire 2 can be inserted along the axis of the square pillar block. At the same time as the hole 44a is formed, the end portion of the holding hole 44a into which the core wire portion 2a of the electric wire 2 is inserted is configured as a tapered insertion guide surface 44b which is gradually enlarged.

Then, one side of the outer circumference of the flux liquid holding cylinder 44 is fixed to the lower end of the support plate 47 with the holding hole 44a in a horizontal state, and the flux liquid holding cylinder 44 is the flux bath 15. The upper end of the support plate 47 is mounted to the lower end of the support rod 42 via the support support 48 so as to be positioned above the.

And in application | coating of the flux liquid 21 to the core wire part 2a of the electric wire 2, the flux liquid by the fall of the support rod 42 which follows the operation | movement (Z direction) of the ram shaft 41 is carried out. The holding cylinder 44 is immersed in the flux liquid 21 of the flux tank 15, as shown by the virtual line of FIG.

Thereafter, the flux liquid holding cylinder 44 causes the flux liquid 21 of the flux bath 15 to rise by the raising of the supporting rod 42 according to the raising operation of the ram shaft 41. Return to the initial position above. At this time, the holding | maintenance state by which the flux liquid 21 was filled in the filling shape in the holding hole 44a of the flux liquid holding cylinder 44 is obtained.

Then, at the flux jaw 15 position, on the axial extension line of the holding hole 44a, the electric wire 2 gripped by the front clamp 4 moves forward by the operation of the front moving means 9 (Y direction). Operated, the core part 2a with the end exposed is inserted in the holding hole 44a. The flux liquid 21 adheres to the core wire part 2a by insertion in the holding hole 44a of this core wire part 2a.

Thereafter, the core coating portion 2a is drawn out from the holding hole 44a by the retreat of the front moving means 9, and the flux applying process is completed. Thereby, the flux application apparatus is comprised by these flux tank 15, the flux liquid holding cylinder 44, the front moving means 9, etc.

As shown in Figs. 2 and 4, the wire pressing guide 45 has a structure in which an elongated rectangular plate is bent in an approximately L shape, and the lower end of the electric wire pressing guide 45a is further soldered in a horizontal state. The upper end part is attached to the lower end part of the support rod 42 via the support support 49 so that it may be located above 16.

And in the attachment of the solder 22 to the core part 2a of the electric wire 2, as shown in FIG. 10, the core part 2a is the position of the solder tank 16 in the solder tank 16 position. The electric wire 2 located between the solder surface 22 and the pressing surface 45a of the electric wire pressing guide 45 and held by the front clamp 4 is lowered by the operation of the front moving means 9 (Z direction). 11), the core wire portion 2a is immersed in a bulging portion that swells upward by the surface tension at the surface of the solder 22. As shown in FIG.

Subsequently, by the lowering of the supporting rod 42 according to the lowering operation of the ram shaft 41, the pressing surface 45a of the electric wire pressing guide 45 presses the core wire portion 2a from above and the core wire portion 2a. Settles in the solder 22.

In this state, as shown in FIG. 12, when the electric wire 2 is pulled out from the inside of the solder 22 of the solder tank 16 by retreat (Y direction) of the front moving means 9, core part 2a ), The state in which the solder 22 is attached is obtained, and the electric wire pressing guide 45 is lifted by the raising of the supporting rod 42 according to the raising operation of the ram shaft 41, as shown in FIG. Return to the initial position. This completes the solder attaching process. Then, the solder attachment device is constituted by the solder bath 16, the electric wire pressing guide 45, the front moving means 9, and the like.

Moreover, by the elevating operation of the ram shaft body 41 in this soldering attaching process, the flux liquid holding cylinder 44 is also elevating operation as described above, and the flux to the core wire portion 2a of the electric wire 2 is next. The flux liquid 21 of the application | coating process is filled in the holding hole 44a of the flux liquid holding cylinder 44. As shown in FIG.

As shown in Figs. 2 and 4, the mating probe 46 has an axial center in the vertical direction in the support block 50 and is attached and supported in parallel with a predetermined interval, and each lower end thereof is connected to the wire. It is attached to the lower end of the support rod 42 via the support support 48 so that it may be located above the solder bath 16 at approximately the same height as the pressing surface 45a of the press guide 45.

In the solder attaching step, when the wire pressing guide 45 is lowered and shown in FIGS. 11 and 12, when the pressing surface 45a contacts the liquid surface of the solder 22, each probe ( 46 is also configured to be immersed in the solder 22.

In addition, as shown in FIG. 13, a detection circuit 51 is connected to both probes 46, and the detection circuit 51 supplies a power supply 52, a photo-coupler 53, and the like. Equipped.

And in detecting the liquid surface position of the solder 22, when the wire pressing guide 45 is operated to descend in the solder attachment process and the pressing surface 45a abuts against the liquid surface of the solder 22, FIGS. 13 and 14. As shown in FIG. 6, when each probe 46 also comes into contact with the liquid level of the solder 22, the detection circuit 51 generates a closed circuit through the solder 22, which is a conductive material, thereby forming a photo coupler ( 53 is configured to output a liquid level detection signal to a controller (not shown).

At this time, as the amount of the solder 22 decreases, the liquid level of the solder 22 is lowered, as shown by an imaginary line in FIG. 14, so that both probes 46 do not contact the liquid level of the solder 22. Otherwise, since the detection circuit 51 does not generate a closed circuit and the diode of the photo coupler 53 does not emit light, the liquid level detection signal is not output to the controller and the controller determines that the amount of solder 22 is insufficient. 22) is configured to perform supplemental control.

As the supplementary control, for example, the intermittent rotation of the supply roller 55 sandwiching the thread solder 22 causes the thread solder 22 to be sequentially supplied into the solder bath 16 through the guide pipe 56. Controlled. The supplied thread solder 22 is melted by heating by the heater 24. Thus, the solder replenishment means 57 is comprised by these thread solder 22, the supply roller 55, the guide pipe 56, etc. As shown in FIG.

Moreover, if the liquid surface position of the solder 22 detected by each said probe 46 is previously set in the suitable position which can attach the required amount of solder 22 with respect to the core part 2a of the electric wire 2, good. In addition, the solder replenishment means 57 may be mounted at an appropriate position on the mount 13.

The rear solder attachment unit 8 is also configured in the same manner, and the solder attachment treatment is similarly performed.

Furthermore, in the present embodiment, the solder attachment units 7 and 8 provided in the mounting portions 13a and the applicator 60 as the terminal crimping unit constituting the wire processing unit are provided so as to be interchangeable with each other.

That is, when the bolt 43 is unwound and the attachment shaft portion 42a is pulled out from the mounting hole portion 41a of the ram shaft body 41, the support rod 42 can be pulled out, and the ram shaft body 41 and the applicator 60 can be pulled out. 15, the connecting member 61 for connecting the applicator 60 is mounted on the ram shaft 41 in the same manner, and the head and the ram shaft 41 as the lifting portions of the applicator 60 are connected. ) Is connected via the connecting member (61). Moreover, this connection structure is substantially the same as the connection of the ram applicator 41 of the conventional applicator 60 and the press mechanism 40. FIG.

In addition, a connection structure in which the applicator 60 is detachably attached to the mounting portion 13a of the mount 13 is also substantially configured in the same manner as in the prior art, and the method is similar to that of the lower unit 7b and the mount 13. I adopt it to a connection structure. That is, as shown in FIG. 5 and FIG. 16, the edge part of the board | substrate 17 in the lower unit 7b is provided with the wedge-shaped locking part 17a, 17b, and the installation part 13a. The locking nails 13c and 13d which lock / unlock freely engage with the locking portions 17a and 17b on the base portion 13b of the upper position 13b to position and fix the lower unit 7b to the mounting portion 13a. ) Is installed opposite. One of the hooking nail portions 13d is configured to be movable as shown by the arrow Q in FIG. 16.

And when installing the lower unit 7b, in the state which attached the lower unit 7b to the installation part 13a, raise the latching nail part 13d to the locking position shown by the virtual line of FIG. By locking in the state engaged with 17b), the lower unit 7b is comprised so that the position may be determined and fixed to the installation part 13a. When removing the lower unit 7b, the lower unit 7b is removed by releasing the locking nail portion 13d and knocking down the latching nail portion 13d to release engagement with the locking portion 17b. Can be.

In addition, when performing a solder adhesion process by this wire processing apparatus 1, the solder attachment unit 7 is installed in the installation part 13a, an operation mode is installed in a solder attachment mode, and a terminal crimping process is performed. In this case, the applicator 60 is installed in the mounting portion 13a and the operation mode is changed to the terminal crimping mode.

In addition, when the applicator 60 is installed in the installation part 13a, it is a component required for terminal crimping, Although not shown in figure, it is driven by the press mechanism 40 at least, and it is chained from a terminal reel. Iii) a terminal transport mechanism for drawing out the continuous terminal (not shown) in a shape and feeding the terminal of the applicator 60 to the crimping unit. The terminal is provided at both ends as in the conventional terminal crimping apparatus. It is configured to sequentially manufacture a crimped harness.

In addition, in the solder attachment process by the wire processing apparatus 1, when attaching the solder 22 to the core wire part 2a with the short exposure length in the wire end part 2, the flux application | coating is carried out similarly to the above-mentioned. As shown in FIG. 17, the electric wire 2 after the process is completed is connected to the front moving means 9 at the position of the solder bath 16 with the core wire portion 2a positioned above the solder bath 16. In this state, the ram shaft 41 is lowered by a predetermined distance and the electric wire 2 is pushed downward by the pressing surface 45a of the electric wire pressing guide 45, as shown in FIG. 18. The core wire portion 2a is immersed in the solder 22. At this time, each probe 46 is appropriately adjusted up and down in advance so as to contact the solder 22.

Then, in this state, when the electric wire 2 is pulled out from the inside of the solder 22 of the solder tank 16 by retreat of the front moving means 9, as shown in FIG. The state in which the solder 22 is attached to 2a) is obtained, and the electric wire pressing guide 45 is lifted by the raising of the support rod 42 in accordance with the raising operation of the ram shaft 41, as shown in FIG. Return to the initial position. Thereby, it is controlled so that a solder adhesion process may be complete | finished.

This embodiment is comprised as mentioned above, and the holding hole 44a of the flux liquid holding body 44 which elevates and operates at the raise position located above the flux tank 15, and the descending position located in the flux liquid 21. The flux bath 15 should just be a container structure which can store the flux liquid 21 by inserting the core part 2a in the inside, and attaching the flux liquid 21 to the core part 2a. Therefore, the conventional circulating structure of the flux liquid and the insertion hole formed in the side wall of the flux bath are unnecessary, the structure of the flux bath 15 can be simplified, and liquid leakage can be effectively prevented, and the flux bath 15 can be prevented. ) Itself can be miniaturized. At this time, since the edge part of the holding hole 44a becomes the tapered insertion guide surface 44b which gradually expands, the core wire part with respect to the holding hole 44a is guided by the guide function of the insertion guide surface 44b. Insertion of 2a) can also be performed stably.

Further, the wire 22 is lowered and the solder 22 is placed on the core portion 2a by immersing the core portion 2a in the bulging portion caused by the surface tension of the solder 22 stored in the solder bath 16. As a method of attaching, the solder bath 16 should just be a container structure which can store the solder 22 in a molten state. Therefore, the conventional solder flow dividing structure becomes unnecessary, and the structure of the solder bath 16 can be simplified, and the size can be reduced.

Then, the core wire portion 2a immersed in the bulging portion due to the surface tension of the solder 22 is pressed downward by the pressing surface 45a of the wire pressing guide 45, and in this state, the core wire portion 2a is pressed. By taking out from the bulging part, as a method of attaching solder to the core part 2a, the more favorable state of attachment of the solder 22 is obtained.

In addition, by removing the oxide film on the surface of the solder 22 by the film removing mechanism 27, the liquid level of the solder 22 can be maintained in the solder bath 16 in a good state, and always with respect to the core portion 2a. The solder 22 can be attached in a good state.

Furthermore, a so-called switch circuit in which a detection circuit 51 as liquid level detection means for detecting the liquid level position of the solder 22 stored in the solder bath 16 constitutes a closed circuit by contact with the liquid level of the solder 22. In this case, an expensive thermocouple, an analog circuit for complex temperature detection, or the like is unnecessary, and a liquid level position detection method of the solder 22 having a simple structure can be provided at a very low cost.

In addition, since each of the probes 46 is provided with a lifting operation freely, adhesion of the oxide film of the solder 22 to the probes 46 can be effectively prevented as compared with the case where the solders 22 are always submerged in the surface of the solders 22. There is also an advantage.

In addition, since the solder attachment units 7 and 8 and the applicator 60 are detachably attached to the mounting portion 13a and can be exchanged with each other, the replacement part 13a can be used as appropriate depending on the use situation. As described above, it is not necessary to separately install both models of the terminal hammers on both ends and the terminal hammers with one piece of solder, so that the installation space can be reduced and the size of the entire wire processing apparatus 1 can be reduced.

In this case, as described above, the flux bath 15 and the solder bath 16 can be downsized, and the solder attaching unit 7 or 8 as a whole can be downsized. The installation occupation space can also be configured without a large difference, and in this respect, the wire processing apparatus 1 can be further miniaturized.

In addition, the flux liquid holding cylinder 44 and the electric wire press guide 45 are supported by the support rod 42, and the flux liquid is hold | maintained by the lifting operation of the support rod 42 accompanying the ram shaft 41 lifting operation. Since the cylinder 44 and the electric wire pressing guide 45 are elevated and operated integrally, when the solder attachment process by the electric wire pressing guide 45 with respect to the core wire part 2a is complete | finished, the other flux liquid holding body 44 The flux liquid 21 for the core wire portion 2a is then filled in the retaining hole 44a of the cavities, so that the harness can be manufactured efficiently and the operation efficiency can be improved.

Claims (16)

In the electric wire processing apparatus which processes with the wire processing unit provided in the installation part with respect to the terminal part of the electric wire moved and operated by the moving means, The wire processing unit includes a terminal crimping unit which is freely detachable and interchangeable with the mounting part for crimping the crimp terminal to the distal end, and a solder attachment unit for soldering to the core wire exposed from the distal end. Wire processing apparatus characterized in that the provided. The method of claim 1, The terminal crimping unit and the solder attaching unit each have a lift section, and the lifting means for lifting and lowering the lift section of the terminal crimping unit or the solder attaching unit provided in the mounting section is provided in the wire processing apparatus. Wire handling device. The method of claim 2, And said lifting means comprises a press mechanism. The method of claim 2, The solder attachment unit is provided with a solder tank in which the solder in the molten state to be attached to the core wire portion is stored, and the core wire portion is formed in a bulged portion due to the surface tension of the solder stored in the solder tank by the lowering operation by the moving means. And the solder is attached to the wire treating apparatus. The method of claim 4, wherein The elevating portion of the solder attachment unit is provided with an electric wire pressing guide located above the solder bath in which the core wire portion is immersed, and the electric wire pressing guide is immersed in the bulging portion caused by the surface tension of the solder by the lowering operation. And a pressing surface for attaching the core portion to be pressed downwards, wherein the solder is attached by drawing the core wire portion pressed from the pressing surface by the retraction operation of the moving means from the bulging portion. The method of claim 4, wherein The solder attachment unit is provided with a flux jaw storing the flux liquid to be attached to the core wire portion, and the lifting portion of the solder attachment unit has a rising position located above the flux bath and a falling position located in the flux liquid. And a flux liquid holding cylinder having a holding hole in which the flux liquid is held and the core wire portion can be inserted and inserted freely while the lifting operation is supported freely. The method of claim 5, The solder attachment unit is provided with a flux jaw storing the flux liquid to be attached to the core wire portion, and the lifting portion of the solder attachment unit has a rising position located above the flux bath and a falling position located in the flux liquid. And a flux liquid holding cylinder having a holding hole in which the flux liquid is held and the core wire portion can be inserted and inserted freely while the lifting operation is supported freely. The method of claim 7, wherein An electric wire processing apparatus comprising a tapered insertion guide surface in which an end portion of the holding hole in the flux liquid holding cylinder is inserted, the end portion of the holding hole being gradually enlarged. The method of claim 8, A support rod is provided in the lifting portion of the solder attachment unit, and the flux liquid holding cylinder and the wire pressing guide are respectively supported at the lower end of the support rod. The solder bath in which the flux liquid holding cylinder is located at the lift position above the flux bath at the rising position of the support rod, and the core wire portion is immersed in the bulging portion caused by the surface tension of the solder. Located at the top, At the lowered position of the supporting rod, the flux liquid holding cylinder is located at the lowered position in the flux liquid, and the core wire is immersed in the bulging portion caused by the surface tension of the solder by the pressing surface of the wire pressing guide. Wire processing apparatus, characterized in that the pressing portion is attached downward. The method of claim 9, The soldering unit further includes a film removing mechanism for removing an oxide film formed on the liquid surface of the solder stored in the solder bath. In the flux coating device for attaching the flux liquid to the core wire exposed at the end of the electric wire, A flux bath in which the flux solution is stored; A flux liquid holding body having a lifting hole freely supported at a rising position located above the flux tank and a falling position located in the flux liquid, and having a holding hole for holding the flux liquid; And a moving means for freely supporting the electric wire and inserting and inserting the core wire portion freely in the holding hole of the flux liquid holding cylinder positioned at the raised position. The method of claim 11, A flux coating device comprising: a tapered insertion guide surface in which an end portion of the flux liquid holding cylinder into which the core wire portion of the holding hole is inserted is gradually enlarged. In the solder attachment device for attaching the solder to the core wire exposed at the end of the electric wire, A solder bath in which the solder in the molten state is stored, And a moving means for freely supporting the electric wire and immersing the core wire in the bulging portion caused by the surface tension of the solder stored in the solder bath by the lowering operation to attach the solder. The method of claim 13, The solder attachment device further includes a wire pressing guide positioned above the solder bath in which the core wire portion is immersed and free to move up and down, wherein the wire pressing guide is immersed in a bulging portion caused by the surface tension of the solder by the lowering operation. And a pressing surface for pressing the core portion downward, and wherein the solder is attached by pulling the core wire portion pressed out from the bulging portion by the retraction operation of the moving means. A solder attachment device for attaching solder to a core wire having a short exposed length at an end of an electric wire, A solder bath in which the solder in the molten state is stored, Moving means for locating the core wire above the solder bath to support the wire freely by a movement operation; A lifting operation is freely arranged above the wire in which the core wire part is located above the solder bath, and a wire pressing guide for pressing the wire downward to immerse the core wire part in the solder is provided by the lowering operation. And the core wire portion is drawn out of the solder by a retraction operation of the moving means. A flux bath having a flux liquid attached to the core wire exposed at the distal end of the electric wire, a solder bath having a molten state of solder attached to the core wire and a flux bath supporting the electric wire and at the same time the flux jaw at the core wire In the solder attachment apparatus provided with the movement means which a liquid is attached and a movement operation is free for attaching the solder in the said solder bath position, The lifting rod is freely supported at the lower end of the supporting rod at a lifting rod which is lifted and operated, at an elevated position positioned above the flux bath and a lowered position positioned in the flux liquid, and at the same time, the flux liquid is maintained and the core wire portion is removed. A flux liquid holding body having a holding hole which can be freely inserted; The flux-liquid holding cylinder is supported at the lower end of the support bar by being positioned above the solder bath in which the core wire portion is immersed in the bulging portion caused by the surface tension of the solder at the raised position of the support rod located in the raised position. And a wire pressing guide provided with a pressing surface for pressing the core liquid portion immersed in the solder downward in a falling position of the supporting rod in which the flux liquid holding body is located in the lowering position.