JP2000101228A - Method and device for soldering lead wire, producing method for electronic circuit board and electronic circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely connect a lead wire to a board, to automate all processes for soldering the lead wire to the board and further to prevent the connected lead wire from contacting a foreign material. SOLUTION: After the terminal part of a lead wire 24 held on the surface of a board 2 while being inclined at a prescribed angle is formed while being almost perpendicularly curved to the board surface, in the state of keeping the inclination angle of the lead wire, the top end of curved terminal part of the lead wire is positioned at the node of the board surface and the lead wire is soldered to the board. In this case, it is preferable that the extension angle of the lead wire is set to 15 to 60 deg.. When this angle is set smaller than 15 deg., an interference with electronic components or the like on the board easily occurs. When the angle is set larger than 60 deg., on the other hand, an interference with a positioning device or beam light radiator easily occurs.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for soldering lead wires.

[0002]

2. Description of the Related Art Lead wires are connected to input / output signals or supply power to an electronic circuit board constituting an electronic circuit. Lead wires are often connected to connection points on a substrate via solder.

[0003] The connection of the lead wire is performed by melting the solder bump or the supplied solder formed at the connection point in advance and pressing the end of the lead wire to the lead wire connection point. Conventionally, an operator melts solder using a soldering iron or the like, and presses an end of a lead wire having a predetermined length to a connection point of the board, thereby connecting the lead wire to the board. Since the work of connecting the lead wires is performed manually, the work requires not only skill but also quality control is extremely difficult.

[0004] In order to solve the above problem, there has been proposed a soldering apparatus which can automate a soldering operation of a lead wire as disclosed in Japanese Patent Publication No. 2-81497.

[0005]

In the soldering apparatus described in the above publication, the lead wire is held in parallel with the surface of the substrate and soldered. For this reason,
In a board on which electronic components are mounted, lead wires can be connected only to the edge of the board.

Further, the lead wires are connected after heating the entire substrate to melt the solder bumps. For this reason, it is difficult to apply it to a substrate on which electronic components having low heat resistance are mounted. Further, since the entire substrate is kept at a high temperature until all the lead wires are connected, the circuit of the substrate and the performance of mounted electronic components may be adversely affected.

When a plurality of lead wires are connected to one board, the solder is kept in a molten state until all the lead wires are connected. Therefore, the connected lead wire is likely to come off, and a connection failure is also likely to occur.
Therefore, applicable substrates are very limited.

In addition, since the lead wire cut into a predetermined length is soldered while holding the lead wire, high precision is required for the shape of the lead wire and the lead wire holding device. In addition, if the lead wires are connected to a plurality of connection points, the device becomes complicated.

Further, it is desirable to apply a flux to a connection portion of a lead wire in order to perform a reliable soldering. However, in a conventional soldering apparatus, it is difficult to automate a flux applying operation. I had to do it by work.

Further, when the lead wire is soldered so as to rise in a direction perpendicular to the surface of the substrate, the lead wire often comes into contact with foreign matter, and the problem of soldering coming off during transportation or the like is likely to occur.

The present invention has been conceived in view of the above-mentioned circumstances, and solves the above-mentioned conventional problems, and can reliably connect a lead wire to a substrate.
It is an object of the present invention to provide a method of soldering a lead wire and a device for soldering a lead wire, which can automate all the steps of soldering a lead wire to a substrate and can prevent the connected lead wire from contacting foreign matter. And

[0012]

Means for Solving the Problems To solve the above problems, the present invention takes the following technical means.

The present invention relates to a method of soldering a lead wire to an electronic circuit board, wherein the end of the lead wire held at a predetermined angle to the substrate surface is bent substantially at right angles to the substrate surface. Thereafter, the tip of the bent end portion of the lead wire is positioned at a connection point on the substrate surface while the inclination angle of the lead wire is maintained, and the lead wire is soldered to the substrate.

In the present invention, soldering is performed while holding the lead wire at a predetermined angle with respect to the substrate surface. Thus, the lead wire, the holding device for holding the lead wire, and the like can be retracted from directly above the lead wire connection point on the substrate.

Since the lead wire does not extend right above, it is possible to perform the work by bringing a soldering iron or the like close to the substrate in a direction opposite to the direction in which the lead wire extends. Also, in the case of soldering using light energy, even if the beam light irradiation device or the like is arranged right above the connection point of the substrate, it does not interfere with the lead wire or the like. For this reason, automation becomes possible, and workability is remarkably improved.

The extension angle of the lead wire is 15 ° to 60 °.
It is preferable to set to °. If set below 15 °,
Interference with electronic components and the like on the substrate becomes easy. On the other hand, 60 °
With the above setting, interference with a positioning device, a light beam irradiation device, and the like is likely to occur. More preferably, the substrate is held at an angle of 25 ° to 35 ° with respect to the substrate surface.

On the other hand, the bent end of the lead wire is bent substantially at right angles to the substrate surface. For this reason, the end of the lead wire can be accurately positioned with respect to the connection point of the substrate.

It is desirable that the bending angle of the bent end is set at a right angle to the substrate surface.
A range of up to 5 ° is acceptable. If the angle of the bent end exceeds 15 °, the positioning accuracy of the bent end is reduced. In addition, it easily interferes with electronic components and the like on the substrate.

By connecting the bent ends so as to rise substantially at right angles from the connection points on the substrate surface, it is possible to connect the lead wires to desired positions on the substrate with high precision. Further, it is possible to provide a connection point at a portion sandwiched between electronic components and connect a lead wire.

Further, since the lead wire extending upward from the bent end is inclined with respect to the substrate surface, it is less likely that the lead wire is bent by hitting a foreign substance or the solder connection is disconnected. For this reason, the incidence of defective products also decreases. In addition, the transfer of the substrate becomes easy.

According to the invention described in claim 2 of the present application, a connection end to solder is formed at the tip of the bent end of the lead wire.

The connection end may have any shape as long as it enhances the bonding strength by soldering, and may be formed in the shape of a nail head.
It may be formed in an L shape. The connection end may be formed at the same time as the bent end is bent, or may be formed separately from the bent end.

It is possible to connect the lead wire by embedding the connection end in the solder piled up at the connection point of the board, and the connection strength of the lead wire to the board is greatly improved.

According to a third aspect of the present invention, there is provided a lead for connecting a leading end of a lead wire fed from a reel to a lead connection point of an electronic circuit board by a lead wire soldering device using a beam light. A method of soldering a wire, wherein a lead wire end forming step of bending and bending an end of a lead wire held at a predetermined angle to a substrate surface at substantially right angles to a substrate surface, and a bent lead A lead wire positioning step of positioning the leading end of the wire at a lead wire connection point on the board, and irradiating a beam light to the leading end of the lead wire or the lead wire connection point on the board to melt the solder, The method includes a lead wire connecting step of connecting the distal end to the substrate, and a lead wire cutting step of cutting the lead connected to the substrate to a predetermined length.

In the present invention, a lead wire is connected using a beam light irradiation device. Since the beam light irradiation device can locally heat only the lead wire connecting portion of the substrate to melt the solder, the other portions of the substrate are less likely to be thermally affected. Therefore, there is little possibility that the performance or the like of the electronic component mounted on the substrate is reduced, and the applicable range is wide. Various light beams such as laser light and plasma light can be used as the light beams.

In the present invention, instead of connecting a lead wire cut in advance to a predetermined length to a substrate, the end of a series of lead wires drawn from a reel is solder-connected to a connection point of the substrate, and then, It is configured to cut to length. This facilitates the routing of the lead wires and automates all the steps of soldering the lead wires.

Since the light beam irradiation device is arranged right above the lead wire connection point, if the work is performed while the lead wire is extended and held directly above, the light beam irradiation device may interfere with the beam light irradiation device, Beam light cannot be efficiently applied to the connection point. In the present invention, the operation is performed while holding the lead wire at a predetermined angle with respect to the substrate surface. As a result, the lead wire and the device for holding the lead wire can be kept away from directly above the connection point of the substrate. Therefore, the lead wire or the like does not interfere with the beam light irradiation device or the like, and the beam light can be reliably irradiated to the connection point.

If the total length of the connected lead wires is upright with respect to the surface of the substrate, the lead wires are likely to come into contact with foreign matter during transportation or when incorporated in the apparatus. For this reason, problems such as disconnection of the lead wire and disconnection from the substrate are likely to occur. According to the present invention, since the lead wire can be extended obliquely along the surface of the substrate, the above-described problem is less likely to occur, and the occurrence of defective products can be prevented beforehand.

On the other hand, in the end forming step, the end of the lead wire is bent substantially at right angles to the surface of the substrate, and the tip of the lead wire connected to the substrate is connected so as to rise substantially perpendicularly from the substrate. Is done. For this reason, it is possible to position the tip end with high precision and to perform soldering. Further, the connection strength to the connection point does not decrease.

Furthermore, since the vicinity of the connection point of the lead wire rises in a direction substantially perpendicular to the connection point, even if the lead wire is connected to a portion sandwiched between the electronic components, the connection is made without interfering with these electronic components. It becomes possible.

In the lead wire positioning step, the tip of the bent lead wire is positioned at a connection point of the substrate. As described above, since the distal end is bent substantially at right angles to the substrate, positioning can be easily performed even if the lead wire is held in an oblique direction. In addition, by performing the lead wire end forming step, the accuracy of the shape of the leading end of the lead wire is improved, and the positioning accuracy with respect to the substrate is also improved.

When the leading end of the lead wire is positioned on the connection point of the substrate and beam light is applied, the solder at the leading end of the lead wire or the connection point is melted, and the solder is connected between the leading end of the lead wire and the connection point. Filled in between and the leads are connected to the substrate. It is desirable that the lead wire be displaced downward at the same time as the solder is melted, so that the solder joint is reliably performed.

In the present invention, the lead wire is cut to a predetermined length while the tip end of the lead wire extending continuously from the reel is connected to the substrate. This makes it possible to connect lead wires of various lengths to the substrate.

To reliably solder the lead wire, it is desirable to apply a flux to the connection portion. The invention described in claim 4 of the present application includes a flux applying step of applying a flux to the end of the lead wire.

The flux prevents oxides from being formed on the surface of the copper constituting the lead wire, lowers the melting point of the solder, and ensures the connection of the lead wire.

As a method of applying the flux, for example, the tip of the lead wire can be immersed in a container filled with the flux, or a brush containing the flux can be used.

As in the invention described in claim 5 of the present application,
By automatically carrying in, carrying out, and positioning the substrate into the processing area, all the steps of soldering lead wires to the substrate can be performed automatically.

As for the solder for connecting the lead wires, a solder pump may be provided in advance at the connection point of the substrate, and the lead wire may be connected by melting the solder pump. As in the seventh aspect of the present invention, the linear solder may be supplied to the leading end or the connection point of the lead wire.

According to the invention described in claim 8 of the present application, the lead wire cutting step, the lead wire end forming step, and the flux applying step are performed continuously by using the movement of a quadrangular link mechanism. It is what was constituted.

For example, a pair of cutting blades can be used in the lead wire cutting step, and a pair of molds can be used in the lead wire end forming step. The above-described quadrangular link mechanism can be used to move these cutting blades and the mold close to and away from each other.

When one connection point of the quadrangular link mechanism is fixed and the connection point opposite to the fixed connection point is linearly reciprocated, the link members supported around the fixed connection point move close to and away from each other. Let me do. The cutting blade and the forming die are held by the link members that are close to and separated from each other, and these steps can be performed as a series of steps.

In the above flux applying step, the tip of the lead wire may be bent and simultaneously enter the flux reservoir.

Further, as in the invention according to claim 9,
The lead wires are connected in series to the reel, and each process from the end forming process to the cutting process is one cycle for the cut end of the lead wire, and a plurality of lead wires are continuously connected to one substrate. Can be connected.

According to a tenth aspect of the present invention, there is provided a lead wire soldering device for soldering and connecting a lead wire to a substrate by using a light beam, and a lead wire feeding mechanism for feeding a lead wire from a winding reel. And a lead wire holding mechanism capable of holding the lead wire in a state in which the lead wire is inclined at a predetermined angle with respect to the substrate surface, and bending and bending the end of the lead wire held and projected substantially perpendicular to the substrate surface. A lead wire end forming mechanism, a flux applying mechanism for applying flux to the bent end of the lead wire, a substrate positioning mechanism for positioning the substrate, and irradiating a beam light to a lead wire connection point on the substrate. Light beam irradiation device, a three-dimensional positioning mechanism for positioning the lead wire holding mechanism and the beam light irradiation device corresponding to a lead wire connection point, and a tip connected to the substrate. Constructed and a lead wire cutting mechanism for cutting the leads to a predetermined length.

In addition to the above configuration, as in the invention according to claim 11, a supply stock table for stocking a plurality of unprocessed substrates, and the substrates are continuously carried into the processing area from the supply stock table. It is also possible to configure a soldering device including a carrying-in unit, a carrying-out unit that carries out the processed substrate from the processing area, and a discharge stock table that stores the processed substrate.

According to a twelfth aspect of the present invention, the lead wire feeding device includes a drawer roller for drawing a lead wire from a winding reel, and a slack applying mechanism for giving slack to the drawn lead wire in accordance with a cutting length. Is provided.

The lead wound on the winding reel has a winding habit, so that the end of the lead cannot be formed with high accuracy, and positioning with high accuracy is performed on the substrate. It is also difficult. In order to solve this problem, in the present invention, the reel wire is drawn out by a draw-out roller. By squeezing the lead wire with the roller, the winding habit of the reel can be removed.

Further, there is a certain distance from the reel around which the lead wire is wound to the lead wire holding mechanism, and a frictional force or the like acts on the routing route between them. Therefore, when tension is applied to the lead wire holding mechanism to pull out the lead wire, a large force acts on the lead wire to cut or
Unnecessary habits may be formed. In the present invention, the above problem is avoided by providing the lead wire pulled out by the roller with a slack in advance. Further, by making the above-mentioned slack correspond to the cutting length of the lead wire, the process can proceed smoothly.

According to a thirteenth aspect of the present invention, the lead wire end forming mechanism includes a pair of forming dies for pressing and forming the lead wire.

According to a fourteenth aspect of the present invention, the above-mentioned flux applying mechanism is provided with a flux reservoir into which the tip of a bent lead wire is inserted.

According to a fifteenth aspect of the present invention, the lead wire cutting mechanism includes a pair of cutting blades meshing with each other.

According to a sixteenth aspect of the present invention, the three-dimensional positioning mechanism holds the lead wire end forming mechanism, the flux applying mechanism, and the lead wire cutting mechanism via a square link mechanism. It is a thing.

By holding the mechanism for processing the end portion of the lead wire by the three-dimensional positioning mechanism for positioning the lead wire, the above-described steps were performed on the end portion of the lead wire extending from the lead wire holding mechanism. Thereafter, it can be directly connected to the substrate. For this reason, not only the configuration of the device is simplified, but also the working time can be reduced.

When one fulcrum of the quadrangular link mechanism is fixed, and a fulcrum opposed to the fixed fulcrum is moved close to and away from the fixed fulcrum, a pair of arms extending outward from the fixed fulcrum to the outside of the link are formed. It is opened and closed. Providing the pair of forming dies and the pair of cutting blades on the pair of arms, and continuously performing the lead wire cutting step and the lead wire end forming step using the opening and closing movement of the arms. Can be.

When the lead wire is bent and formed, the flux reservoir is arranged on a quadrangular link mechanism such that the end of the lead wire protrudes into the flux reservoir. The attaching step can be performed simultaneously.

According to a seventeenth aspect of the present invention, the supply stock table is provided with a base on which a plurality of unprocessed substrates are arranged vertically and horizontally, and a pair of feed belts rotated on both sides of the base. A feed member that moves over the upper surfaces of the two feed belts, moves in the traveling direction of the belts, presses the last row of the aligned substrates, and moves the substrates toward the transport belt; A substrate cutting mechanism for separating a substrate arranged in a front row from a subsequent row and moving the substrate to a carry-in unit is provided.

Some electronic circuit boards are fragile and require careful handling. For example, in the case of a ceramic substrate or the like, there is a case in which chipping or the like occurs due to collision with each other. For this reason, the supply to the soldering device is often performed manually. The present invention is to move a large number of substrates to a transport belt without applying a large force to the substrates.

The feed member moves the substrate by sliding on the pedestal by the frictional force with the feed belt. Therefore, a large force does not act on the substrate. Further, the operator only has to lift the feed member and place the substrate on the pedestal, so that the workability is remarkably improved.

The substrate cutting mechanism is provided for sequentially transferring the frontmost substrate to the conveyor belt and separating the substrate from the subsequent substrate. Specifically, it is sufficient to separate the front row from the following row, and various methods can be adopted.

The substrates in the cut-out row are pressed in a direction orthogonal to the substrate feeding direction in the base portion, and are sequentially moved to the transport belt.

By providing the above-mentioned supply stock table, it is only necessary to periodically fill the supply stock table with the substrate, and it is not necessary for an operator to stick to one apparatus.

The invention described in claim 18 of the present application is characterized in that the discharge stock table is placed on the base for arranging the substrates vertically and horizontally, and the substrate conveyed by the discharge means is pressed to the base. And a substrate moving mechanism for transferring.

As with the supply stock table, the working efficiency can be improved by automatically stocking the processed substrates.

The invention described in claim 19 of the present application is a method of manufacturing an electronic circuit board having lead wires joined by soldering, wherein the tip of the lead wire held at a predetermined angle to the substrate surface is held. After bending the substrate at substantially right angles to the substrate surface, the tip is positioned at a connection point on the substrate surface, and a beam is irradiated from above to connect the lead wire to the substrate. As a result, a circuit board having lead wires can be efficiently manufactured.

According to a twentieth aspect of the present invention, there is provided an electronic circuit board having a lead wire soldered and joined thereto, wherein the lead wire is soldered at a connection point of the board and at the same time with respect to the board surface. It has a rising portion extending substantially at a right angle, and a lead portion bent and extended from the upper end of the rising portion and extending at a predetermined angle with respect to the substrate.

Since the lead portion can be extended along the surface of the substrate, the lead wire is less likely to come into contact with foreign matter, and an unexpected force acts on the lead wire to cause the lead wire to come off from the connection point. Or breakage of the lead wire. In addition, there is an effect that handling and packaging of the substrate are facilitated.

The above-mentioned lead portion is at an angle of 15 ° with respect to the substrate surface.
It can extend at an angle of 〜60 °. If the angle is set to 15 ° or less, it becomes easy to interfere with electronic components on the substrate. On the other hand, when the angle is set to 60 ° or more, interference with a light beam irradiation device or the like becomes easy. Preferably, it extends in the range of 25 ° to 35 ° with respect to the substrate surface.

The height of the rising portion is not particularly limited, but is preferably set to be equal to or higher than the height of the electronic components mounted on the electronic circuit board, as in the twenty-first aspect of the present invention. This is because interference with the electronic components mounted on the substrate can be reliably avoided.

[0069]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a plan view showing an example of an embodiment of a soldering device according to the present invention. The soldering apparatus 1 according to the present embodiment includes a supply stock table 3 for aligning and waiting a substrate 2 to be processed, and transporting means 4 and 5 for transporting the substrate on the supply stock table 3 toward a processing area. A substrate positioning means 6 for positioning the substrate in the processing area; an unloading means 7 for unloading the processed substrate from the processing area; a discharge stock table 8 for storing the processed substrate; a lead wire holding mechanism 9; A three-dimensional positioning mechanism 13 for holding a part forming mechanism 10, a flux coating mechanism 11, a beam light irradiation device 12, etc., and a lead wire feeding mechanism 14 for supplying a lead wire 24 to the lead wire holding mechanism 9 are mounted on a base. 15 and is roughly configured.

As shown in FIG. 2, the supply stock table 3 has a base 16 on which a plurality of unprocessed substrates 2 are arranged in a matrix, and a pair of feeders rotated on both sides of the base 16. The belt 17 is laid over the upper surfaces of the feed belts 17 and 17 and is moved in the traveling direction of the feed belt 17 (in the direction of the arrow), and the last row of the aligned substrates 2 is pressed. And a feeding member 18 for moving the substrate toward the transport belt 4, and a substrate cutting mechanism 19 for moving the substrate arranged in the front row away from the subsequent row and moving the substrate to the carry-in belt 4.

The feed belts 17, 17 are rotated by a motor, and the feed member 18
The feed belts 17, 17 are moved toward the cutout mechanism 19 by rotation. The base 16 is made of a material having a low coefficient of friction, such as a glass plate, and presses the rear edge of the last row of substrates arranged vertically and horizontally by the feed member 18 so that the substrate is pressed. It is slid toward the cutout mechanism 19.

The operator only has to arrange the substrates on the base 16 and set the feed member 18 so as to hang the feed members 18 on the feed belts 17, 17, and the substrates on the supply stock table 3 are processed. Work can be done differently.

Further, the feed member 18 is provided with the feed belt 1.
Since the substrate is pressed by the frictional force exerted by its own weight between the substrates 7 and 17, a large force does not act on the substrate. Therefore, there is no risk of damaging the substrate.

The cut-out mechanism 19 forms a gap between the front row of substrates arranged vertically and horizontally and the subsequent row, and then places the substrates on the conveyor belt 4 at a constant interval by the intermittent feed mechanism 20. It is configured to send out intermittently.

The feed belts 17, 17 are configured to stop in conjunction with the start of the cutout mechanism 19, and while the substrate on the cutout mechanism 19 is transferred to the feed belt 4, the feed members 18 are stopped. Is controlled to stop the movement on the pedestal.

As shown in FIG. 1, an intermittent feed mechanism 5 for a substrate is provided in front of the transport belt 4 in the traveling direction, and intermittently transfers the substrate to a processing area. A heater is provided on the lower surface of the intermittent feed mechanism 5 so that the substrate can be preheated.

In the middle of the intermittent feed mechanism 5, an image recognition device 21 and a defective product eliminating mechanism 22 are provided.
It is configured so that defective products can be eliminated before entering the processing area.

A positioning mechanism 6 for positioning a substrate carried in by the intermittent feed mechanism is provided in the processing area. In this embodiment, positioning is performed by bringing the substrate into contact with a guide wall or the like using a pusher.
The positioning mechanism only needs to fix the substrate at a predetermined position, and various known means can be used.

After the processing area, there is provided a discharge belt 7 for discharging the processed substrate to which the lead wire is connected, and a discharge stock table 8.

The carry-out belt 7 carries the processed substrate to the edge of the discharge stock table 8. The substrates are pushed out onto the discharge stock table 8 by pressing pieces 23 provided on the side portions, and are arranged vertically and horizontally.

As shown in FIGS. 1 and 3, above the substrate 2 positioned by the positioning mechanism 6,
A lead wire holding mechanism 9 for projecting and holding the lead wire 24 at a predetermined angle with respect to the surface of the substrate 2;
A lead wire end forming mechanism 10 for bending the end of the lead wire 24 at substantially right angles to the substrate surface, a flux applying mechanism 11 for applying flux to the tip of the bent lead wire, and a lead for the substrate. A beam light irradiation device 12 for irradiating a beam light to a wire connection point or a leading end of a lead wire; a lead wire cutting mechanism 29 for cutting the lead wire to a predetermined length after the leading end of the lead wire is connected to the substrate; Is provided.

The lead wire holding mechanism 9 and the light beam irradiating device 12 are held by a three-axis positioning mechanism 13 and are configured to be automatically positioned at positions corresponding to a plurality of connection points on the substrate. I have.

The lead wire holding mechanism 9 includes a continuous lead wire 24 fed from the lead wire feeding mechanism 14.
A lead wire holder 30 capable of holding the lead wire in a protruding state and releasing the holding, a slide mechanism 31 for holding the lead wire holder 30 and reciprocating in the axial direction, and And a lead wire holding / releasing mechanism 32 for controlling the holding and release of the lead wire. In the present embodiment, the lead wire holding mechanism 9 holds the lead wire 24 so as to protrude from the surface of the substrate 2 at an angle of 30 °.

The lead wire holder 30 can be constituted, for example, by utilizing a lead holding mechanism of a mechanical pencil. The lead wire holder 30 is configured to release the holding of the lead wire 24 when the rear end portion is pressed similarly to the mechanical pencil. This lead wire holder 3
0 is the air cylinder 33 via the slide mechanism 31
To reciprocate in the direction in which the lead wire extends.

The lead wire holding / releasing mechanism 32 includes a release bar 34 that contacts the rear end of the lead wire holder 30,
An air cylinder 35 for operating the release bar 34 is provided. The air cylinder 35 releases the holding of the lead wire 24 by pressing the rear end of the lead wire holder 30 when the lead wire holder 30 is retracted with respect to the substrate 2, and the lead wire 24 is moved to the lead wire holder 30. It is structured so that it can be pulled out relatively.

As shown in FIG. 8, the lead wire feeding mechanism 14 includes a reel holding mechanism 37 for holding a reel 36 around which the lead wire 24 is wound, and a pair of upper and lower drawing rollers for pulling out the lead wire 24 from the reel 36. 38,39
And a slack giving mechanism 40 for giving a predetermined slack to the lead wire 24 drawn out by the draw-out rollers 38 and 39.
It is comprised including.

The rollers 38 and 39 are pressed by a spring 41. By pulling out the lead wire 24 while pinching it with these rollers 38 and 39, the curl of the lead wire can be removed.

The slack imparting mechanism 40 is provided with a concave portion 42 shaped like a human stomach. A predetermined slack can be imparted to the lead wire by causing the lead wire drawn by the pull-out rollers 38 and 39 to extend along the edge (right edge in the drawing) of the recess 42 in the extending direction.

When the lead wire 24 is pulled by the lead wire holding mechanism 9, the lead wire is displaced to the edge of the recess 42 on the drawing side (the left edge in the drawing), and the slack disappears. The presence / absence of slack is configured to be detected by a pair of sensors 43 and 44, so that slack corresponding to the cut length can be provided every cycle of lead wire connection.

As shown in FIG. 3, the beam light irradiating device 12 converges energy light and irradiates it to a soldered portion, and can use a xenon lamp light source or a laser diode light source. In the present embodiment, the light source is housed in the internal space of the base 15 and the light beam emitted from the light source
Leading up to.

The light beam irradiating device 12 is supported by the three-dimensional positioning mechanism 13 via a position adjusting mechanism 46, and is configured to irradiate a predetermined position on the substrate 2 with the light beam. In addition, a condensing lens and a protective lens are arranged in the cylindrical case 45 so as to be able to converge and irradiate the energy light to the connection point of the substrate 2.

Below the lead wire holding mechanism 9, there is provided a lead wire end forming mechanism 10 for bending the leading end of a lead wire extending from the lead wire holder 30 into a predetermined shape;
A flux applying mechanism 11 for applying a flux to the tip of the lead wire and a lead wire cutting mechanism 29 for cutting a lead wire having a tip connected to the substrate to a predetermined length are provided.

The lead wire end forming mechanism 10, the flux coating mechanism 11, and the lead wire cutting mechanism 29
It is connected to the three-dimensional positioning mechanism 13 via a square link mechanism 48 driven by an air cylinder 47.

As shown in FIGS. 5 to 7, the quadrangular link mechanism 48 has an intermediate portion rotatably connected to the tip of a support member 50 provided at the tip of the air cylinder 47. A substantially V-shaped first link member 51 and a second
Link member 52 and one end of the first link member 51
And a third link member 5 connected to the base end of the second link member 52 and the other end rotatably connected to each other.
The third and fourth link members 54 are provided.

The link mechanism 48 is connected to the support member 50
Are provided on both sides so as to sandwich them. The first link member 51 and the second link member 52 are connected to the support member 5.
0 is integrally formed in a substantially U-shape in a plan view so as to sandwich it from the front end side.

The connecting point P between the third link member 53 and the fourth link member 54 is supported by an elongated hole 55 formed in the axial direction of the support member 50 so as to be movable in the axial direction of the air cylinder 47. And the connecting point P is connected to the air cylinder 47.
The first link member 51 and the second link member 52 can be opened and closed by moving the first and second link members 51 and 52.

At the tip of the first link member 51,
A cutting blade 56 extending toward the distal end of the second link member 52 is provided, while a receiving blade 57 that meshes with the cutting blade 56 is formed at the distal end of the second link member 52. . The cutting blade 56 and the receiving blade 57 constitute the lead wire cutting mechanism 29. As shown in FIG.
By bringing the and the receiving blade 57 close to each other, the lead wire 24 extending between them can be cut.

An upper die that bends the lead wire 24 into a predetermined shape when the cutting blade 56 and the receiving blade 57 are completely engaged with the base end of the cutting blade 56 and the base end of the receiving blade 57. A part 58 and a lower mold part 59 are formed. The upper mold part 58
And the lower mold part 59 constitutes the lead wire end forming mechanism 10, and cuts the lead wire by the cutting blade 56 and the receiving blade 57 to engage the blade, and at the same time, the leading end of the lead wire to be connected next. Can be bent substantially perpendicularly to the surface of the substrate.

Further, between the receiving blade 57 and the lower mold portion 59, a flux applying mechanism 11 for applying a flux to the tip of the bent lead wire 24 is provided. The flux applying mechanism 11 is provided with a flux reservoir 60 into which the tip of a bent lead wire enters.

The leading end of the lead wire is bent and simultaneously projected into the flux reservoir 60, and the leading end of the lead wire is immersed in the flux 63. The flux is replenished periodically. Thereby, cutting of the lead wire, molding of the lead wire, and application of the flux can be performed continuously.

The lead wire is held so as to extend toward the substrate from between the first link member 51 and the second link member 52 of the link mechanism, and is held by the lead wire holding mechanism 9. The above-described steps are configured to be performed on the tip of the lead wire.

Hereinafter, the lead wire feeding mechanism 14, the beam light irradiation device 12, the lead wire holding mechanism 9, the lead wire cutting mechanism 29, the lead wire forming mechanism 10,
The method of connecting the lead wires to the substrate performed by the flux applying mechanism 11 will be described step by step.

As shown in FIGS. 1 and 3, the continuous lead wire 24 wound around the reel 36 is connected to the lead wire feeding mechanism 14, the lead wire holding mechanism 9, and the lead wire cutting mechanism 2.
9. It is passed between the lead wire end forming mechanisms 10.

As shown in FIG. 8, the lead wire feeding mechanism 14 feeds out the lead wire 24 from the reel 36 and imparts a predetermined slack. By winding the lead wire 24 while pressing it between the pair of upper and lower rollers 38 and 39, the curl of the lead wire 24 can be removed. Further, the rollers 38 and 39 feed the lead wire 24 into the concave portion 42 of the human stomach in a plan view shape.

The recess 42 has a right edge set longer than a left edge. The lead wire 24 is fed along the right edge of the recess 42.

The recess 42 is provided with a pair of sensors 43 and 44 using a limit switch, and is configured to detect whether a predetermined slack has been applied. That is, when the arm 61 of the sensor provided at the upper portion is pushed by the lead wire fed by the roller 38.39, it is detected that the lead wire is provided with slack along the right side edge, while the slack is detected. When the minute lead wire is pulled out from the upper end portion and sent to the lead wire holding mechanism, the lead wire goes along the left side edge of the concave portion and the slack disappears. At this time, by detecting that the slack has disappeared by the arm 62 of the sensor 44 provided below, the rollers 38 and 39 are operated to feed the lead wire into the concave portion 42, and the lead wire is prepared for the next connection. The sag is given.

The lead wire 24 extending from the lead wire feeding mechanism 14 is inserted into a tubular flexible protective tube 65 and guided to the lead wire holding mechanism 9. The lead wire holder 30 clamps and holds the lead wire, and extends the lead wire toward the substrate 2 from between the distal end portions of the first link member 51 and the second link member 52 of the link mechanism 48. I have.

In this embodiment, when starting the apparatus, it is necessary to form the end of the lead wire into a predetermined shape. For this purpose, a chuck (not shown) is provided in the vicinity of the processing area of the substrate, which can hold the end of the lead wire in the same state as when it is connected to the substrate, so as to perform initial molding of the end of the lead wire. The lead wire is cut off by gripping the end of the lead wire with the chuck, and the above-mentioned quadrangular link mechanism is operated, and the end of the lead wire is bent and formed in a direction perpendicular to the substrate surface. Is applied.

Hereinafter, the operation of the quadrangular link mechanism will be sequentially described.

As shown in FIG. 5, the square link mechanism 48
When the connection point P between the third link member 53 and the fourth link member 54 is located at the left end of the elongated hole 55 in the drawing, the distal ends of the first link member 51 and the second link member 52 are open. I am in a posture. When the air cylinder 47 is actuated from this state to press the connection point P rightward along the elongated hole 55, the distal ends of the first link member 51 and the second link member 52 come close to each other. Rotationally displaces in the direction.

Then, as shown in FIG.
6 and the receiving blade 57 are first engaged with each other to cut the lead wire 24. Since the leading end of the lead wire before cutting is connected to the substrate 2, a lead wire of a predetermined length is connected to the substrate 2 by the above cutting.

On the other hand, the cut end of the lead wire held by the holder 30 is straight, but by further deforming the link mechanism 48, as shown in FIG. The upper die 58 and the lower die 59 provided at the base end of the lead wire 2
The tip of 4 is bent and formed in a U-shape. This allows
The tip of the lead wire is bent in a direction perpendicular to the substrate surface. The distal end of the long hole 55 is formed so as to be inclined upward so as to bend the lead wire on the locus of the lead wire extending from the holder 30.

As shown in FIG. 7, the upper die 58 and the lower die 5
9 and the lead wire is formed,
4 is made to protrude into the flux pool 60.
The flux 63 is stored in the flux pool 60, and the flux is applied to the tip of the lead wire.

When the cutting and forming of the lead wire are completed, the connecting point P is moved to the left to expand the distal ends of the first link member 51 and the second link member 52. Then, the lead wire holder 30 is moved toward the substrate 2 by the slide mechanism 31, and the bent end of the lead wire is held in a state of protruding from the link mechanism 48. Then 3
The leading end of the lead wire is moved by the two-dimensional positioning mechanism 13
To the next connection point.

Thereafter, a beam light is irradiated from the beam light irradiation device 12 to melt the solder bumps 64 formed at the connection points and connect the lead wires.

After the ends of the lead wires are connected to the substrate 2,
The lead wire is extended by retracting the lead wire holder 30. After that, the above-mentioned quadrangular link mechanism is operated, the lead wire cutting step, the lead end forming step and the flux applying step are performed, and the lead end is moved to the next connection point by the three-dimensional positioning device. Let it.

By repeating the above steps, lead wires of a predetermined length can be automatically connected to a plurality of connection points on one substrate.

After connecting the lead wires to all the connection points,
The substrate is transported by the belt 7 to the discharge stock table 9 and is moved and arranged on the discharge stock table by the pressing piece 23.

In the present embodiment, as shown in FIG. 5, the tip of the lead wire is bent, then positioned at the connection point on the substrate 2, and the beam is irradiated from directly above to perform soldering. . Therefore, the lead wire 24 and the lead wire holder 30
Does not interfere with the irradiation device 12, and the connection point can be reliably irradiated with the light beam to perform soldering.

FIG. 9 shows a connection state of the lead wires connected by the above-mentioned soldering method. As shown in this figure, a lead wire 24 has a rising portion 67 whose tip is soldered to a connection point of the substrate 2 and extends substantially perpendicular to the surface of the substrate 2, and is bent from the upper end of the rising portion 67. And a lead portion 68 that extends.

In this embodiment, the extension angle of the lead portion 68 with respect to the surface of the substrate 2 is set to 30 °.
On the other hand, the height H of the rising portion 67 is set higher than the height of the electronic components mounted on the substrate 2.

As shown in FIG. 10, a plurality of lead wires 24
Can be held and connected to the surface of the substrate 2 in an inclined state with respect to the surface of the substrate 2, so that interference between the lead wires is small. Also, after connection, the lead wire lies down along the board, which can prevent the lead wire from coming into contact with foreign matter and removing soldering. There is also an effect that it becomes easy.

Further, by setting the height H of the rising portion 67 higher than the height of the electronic component 69, even if the lead wire is connected to a portion sandwiched between the electronic components, the lead wire may interfere with the electronic component. However, the lead wires can be securely connected.

The scope of the present invention is not limited to the above embodiment. In the embodiment, the extension angle of the lead portion of the lead wire is set to 30 °. However, the extension angle can be set in the range of 15 ° to 60 ° depending on the type of the substrate and the electronic components to be mounted.

Further, in the embodiment shown in FIG. 10, the connection is made so that the extension portions 68 of the lead wires extend in the same direction, but they may be set differently depending on the connection portions of the lead wires. . For example, it can extend toward the edge of the substrate closest to the connection point.

As shown in FIGS. 11 and 12, the tip of the rising portion has a nail-like connection end 70a or L.
The U-shaped connection end 70b can also be formed.

Further, in the embodiment, the lead wire end forming step, the lead wire cutting step, and the flux applying step are configured to be continuously performed by using a square link mechanism provided near the lead wire holder. However, a mechanism for performing each step may be separately provided on the base side of the apparatus, and each step may be performed while moving the lead wire using a three-dimensional positioning mechanism.

Each of the above-described steps is controlled by a computer (not shown). Control of each step and the like can be performed using a known technique.

[Brief description of the drawings]

FIG. 1 is a plan view showing an entire soldering device according to the present invention.

FIG. 2 is a plan view of a supply stock table.

FIG. 3 is a view of a lead wire holding mechanism, a lead powder end forming mechanism, a flux applying mechanism, and a lead wire cutting mechanism as viewed from the direction of arrow III in FIG. 1;

FIG. 4 is a plan view showing a partial cross section taken along line IV-IV in FIG. 3;

FIG. 5 is a view for explaining the operation of a quadrangular link mechanism.

FIG. 6 is a diagram for explaining the operation of a quadrangular link mechanism.

FIG. 7 is a view for explaining the operation of the quadrangular link mechanism.

FIG. 8 is a front view of a lead wire feeding mechanism.

FIG. 9 is an enlarged view showing a connection state of lead wires.

FIG. 10 is a side view of a substrate to which a plurality of lead wires are connected.

FIG. 11 is a view showing another form of forming a lead wire.

FIG. 12 is a view showing another form of forming a lead wire.

[Brief description of reference numerals]

 REFERENCE SIGNS LIST 1 soldering device 2 substrate 3 supply stock table 4 transport belt (transport means) 5 intermittent feed mechanism (transport means) 6 substrate positioning mechanism 7 discharge belt (discharge means) 8 discharge stock table 9 lead wire holding mechanism 10 lead wire end Forming mechanism 11 Flux coating mechanism 12 Beam light irradiation device 13 Three-dimensional positioning mechanism 14 Lead wire feeding mechanism 29 Lead wire cutting mechanism

Claims (22)

[Claims] 1. A method of soldering a lead wire to an electronic circuit board, comprising bending an end of the lead wire held at a predetermined angle with respect to the substrate surface at a substantially right angle to the substrate surface.
A soldering method for a lead wire, wherein the tip of the bent end of the lead wire is positioned at a connection point on the surface of the substrate and soldered while maintaining the inclination angle of the lead wire. 2. The method of soldering a lead wire according to claim 1, wherein a connection end capable of enhancing the bonding strength with respect to the solder is formed at the tip of the bent end of the lead wire. 3. A method for soldering a lead wire, wherein a leading end of a lead wire fed from a reel is connected to a lead wire connection point of an electronic circuit board by a lead wire soldering device using a light beam. A lead wire end forming step of bending the end of the lead wire held at a predetermined angle to the board surface at substantially right angles to the board surface; and forming a lead on the board with the tip end of the bent lead wire. A lead wire positioning step of positioning at a wire connection point; and a lead wire for irradiating a beam light to the tip of the lead wire or the lead wire connection point on the substrate to melt the solder and connect the tip of the lead wire to the substrate. A lead wire soldering method, comprising: a connecting step; and a lead wire cutting step of cutting a lead wire having a leading end connected to the substrate to a predetermined length. 4. The method of soldering a lead wire according to claim 3, further comprising a flux application step of applying a flux to an end of the bent lead wire. 5. A substrate loading step of continuously loading an unprocessed substrate into a processing area, a substrate positioning step of positioning the substrate in the processing area, and unloading a processed substrate connected to a lead wire from the processing area. The method for soldering a lead wire according to claim 3, further comprising a substrate unloading step. 6. The lead wire soldering method according to claim 3, wherein the lead wires are connected by melting solder bumps formed at the lead wire connection points on the substrate. 7. The method for soldering a lead wire according to claim 3, further comprising a solder supply step of supplying solder to a lead wire connection point on the substrate. 8. The method according to claim 3, wherein the step of cutting the lead wire, the step of forming the end portion of the lead wire, and the step of applying the flux are continuously performed by using the movement of a quadrangular link mechanism. The soldering method for lead wires described in Crab. 9. A plurality of lead wire connection points of one positioned substrate are subjected to a lead wire end forming step, a flux applying step, a lead wire positioning step, a lead wire connecting step, and a lead wire cutting step continuously. 9. The method of soldering a lead wire according to claim 3, wherein the method is performed. 10. A lead wire soldering device for soldering and connecting a lead wire to an electronic circuit board using a beam light, comprising: a lead wire feeding mechanism for feeding a lead wire from a winding reel; A lead wire holding mechanism that can be protruded and held at a predetermined angle with respect to a lead wire end forming mechanism that bends the end of the protruded and held lead wire substantially at right angles to the substrate surface; A flux application mechanism for applying flux to the bent end portion of the lead wire, a substrate positioning mechanism for positioning the substrate, a beam light irradiation device for irradiating a beam light to a lead wire connection point on the substrate, A three-dimensional positioning mechanism for positioning the lead wire holding mechanism and the beam light irradiation device corresponding to a lead wire connection point; and a lead wire having a tip connected to a substrate. Soldering apparatus of leads and a lead wire cutting mechanism for cutting the length of the. 11. A supply stock table for storing a plurality of unprocessed substrates, loading means for continuously loading the substrate from the supply stock table to the substrate positioning mechanism, and unloading means for unloading the processed substrate from the processing area. The lead wire soldering apparatus according to claim 10, further comprising: a discharge stock table that stocks the processed substrate. 12. The lead wire feeding mechanism according to claim 10, further comprising: a pull-out roller for pulling out the lead wire from the winding reel; and a slack applying mechanism for giving a slack to the drawn-out lead wire in accordance with a cutting length. Claim 11
The soldering device according to any one of the above. 13. The lead wire soldering device according to claim 10, wherein the lead wire end forming mechanism includes a pair of forming dies for pressing and forming the lead wire. apparatus. 14. The lead wire soldering device according to claim 10, wherein said flux applying mechanism is provided with a flux reservoir into which a tip of a bent lead wire is inserted. Mounting device. 15. The lead wire soldering device according to claim 10, wherein the lead wire cutting mechanism includes a pair of cutting blades that mesh with each other. 16. The lead wire end forming mechanism, the flux applying mechanism, and the lead wire cutting mechanism are held by the three-dimensional positioning mechanism via a square link mechanism. 16. The lead wire soldering apparatus according to any one of claims 15 to 15. 17. The supply stock table includes: a base on which a plurality of unprocessed substrates are arranged in a matrix, and a pair of feed belts rotated on both sides of the base; and upper surfaces of the feed belts. While moving in the traveling direction of the belt while being hung, the feed member that moves the substrate toward the transport belt by pressing the last row of the aligned substrates, and the substrate arranged in the front row The lead wire soldering device according to any one of claims 10 to 16, further comprising: a substrate cutting mechanism for separating the substrate from a subsequent row and moving the substrate to a loading unit. 18. The discharge stock table, comprising: a base on which the substrates are arranged vertically and horizontally and placed; and a substrate moving mechanism for pressing the substrates conveyed by the discharge means and transferring the substrates to the base. The lead wire soldering device according to any one of claims 10 to 17. 19. A method of manufacturing an electronic circuit board including a lead wire joined by soldering, wherein a tip of the lead wire held at a predetermined angle to the substrate surface is bent substantially at right angles to the substrate surface. After molding, a method of manufacturing an electronic circuit board, in which the tip is positioned at a connection point on the surface of the substrate and the lead wire is connected to the substrate by irradiating a light beam from above. 20. An electronic circuit board to which a lead wire is soldered and joined, wherein the lead wire has a rising portion whose tip is soldered to a connection point of the board and extends substantially at right angles to the board surface. An electronic circuit board comprising: a lead portion bent and extended from an upper end of the rising portion and extending at a predetermined angle with respect to the substrate. 21. The semiconductor device according to claim 21, wherein the lead portion is 15
The electronic circuit board according to claim 20, wherein the electronic circuit board extends at an angle of about 60 °. 22. The electronic circuit board according to claim 20, wherein the height of the rising portion is set to be equal to or higher than the height of an electronic component mounted on the electronic circuit board.