KR20020017258A - An apparatus for uniform coating of board - Google Patents

Abstract

PURPOSE: An apparatus for uniformly plating a substrate is provided which prevents generation of plating deviation during etching, thereby forming a uniformed plating layer on the substrate by installing an etching device so that etching is sequentially performed from the central part to the outer side so as to prevent non-etching problems. CONSTITUTION: The apparatus for uniformly plating a substrate comprises a substrate upper etching part(100) in which etchant spray nozzles(110) are arranged in a concyclic shape on the bottom surface of an upper base(140); a substrate lower etching part(200) which is oppositely installed to the substrate upper etching part(100), and etchant spray nozzles(210) are projected from the upper side of a lower base(220) so that they are positioned at the central parts of dense patterns(300) of a substrate(230) respectively; and a substrate fixing part(300) in which a plurality of supporting rollers(330) are integrally installed on the inner side surface of a frame(310) into which the substrate(230) is inserted; wherein spray devices at the outer side of which air ejection nozzles are equipped are integrally installed in the etchant spray nozzles(110), the spray devices are installed so that the etchant is sequentially sprayed from the central part toward the outskirts, and a sensor is installed at one side of the upper base(140) so as to sense whether the substrate(230) is entered into the apparatus or not.

Description

Substrate uniform plating equipment {AN APPARATUS FOR UNIFORM COATING OF BOARD}

The present invention provides a substrate manufacturing apparatus in which an etching apparatus is provided so that etching is sequentially performed from the center portion to the outside to prevent the unetching phenomenon due to the liquid accumulation when the etching liquid is applied to the substrate. The present invention relates to a uniform plating apparatus for a substrate which is prevented from forming a uniform plating layer.

In a conventionally known substrate, uniform etching is required as the pattern formed on the substrate is reduced to 50 µm or less. As shown in FIG. When the support plate 20 is installed to support the substrate 10 installed to move by a), and the injection device 40 having a plurality of nozzles 30 on the upper and lower sides of the support plate 20 is installed Consist of

In the plating apparatus of the substrate as described above, when the substrate 10 conveyed by the conveyor is located on the upper side of the support plate 20 and left to stand, the injection apparatus 40 having a plurality of nozzles 30 is installed on the upper and lower sides thereof. Each is positioned, and at this time, the etching liquid is sprayed from the nozzle 30 to perform etching on the upper and lower sides of the substrate 10.

In addition, the upper nozzle 30 increases the injection pressure to prevent the liquid level above the substrate 10, and the nozzle 30 provided below the substrate 10 has a certain amount of liquid due to its own weight at the time of spraying the etching liquid. This uniformity is carried out so as to have a normal pressure.

However, in the plating apparatus of the above-mentioned substrate tape, even if the injection pressure of the nozzle 30 provided in the upper part of the board | substrate 10 increases, the etching deviation of a center part and an outer part becomes difficult to reduce, and a yield falls, and Uneven coating results in damage to the pattern and unetched phenomena, plating thickness is less than the target value to reduce the reliability of the product, there was a problem such that it is impossible to etch the uniform line width by the liquid high.

The present invention is to solve the various problems of the prior art as described above, the purpose is to form a certain plating thickness quickly to shorten the work process, to minimize the deviation of the center and the outside to prevent the occurrence of defective products, It is to provide a uniform plating apparatus for a substrate that is uniformly coated with an etching solution to prevent the occurrence of unetched phenomenon and to form a uniform plating thickness, thereby improving the reliability of the product.

1 is a schematic view showing a conventional substrate plating apparatus

Figure 2 is a schematic diagram showing a uniform plating apparatus of a substrate according to the present invention

Figure 3 is a schematic view of the main portion showing a uniform plating apparatus according to the present invention

Figure 4 is a schematic diagram showing a uniform plating apparatus according to another embodiment of the present invention

Explanation of symbols on the main parts of the drawings

100 ... etching part on substrate 110 ... etching liquid spray nozzle

200 ... substrate lower part 230 ... substrate

300 ... Government Board 310 ... Supporting Projection

As a technical configuration for achieving the above object, the present invention, a plurality of injection nozzles are arranged in a circumferential position on the substrate upper portion is installed so as to sequentially spray toward the outside from the central portion,

A lower portion of the substrate corresponding to the upper portion of the substrate and having a plurality of nozzles installed to etch the lower portion of the substrate;

By providing a uniform plating apparatus for a substrate comprising a substrate fixing portion which is integrally formed with a support bar having a number of support protrusions on the inner side of the frame to support the substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a schematic diagram showing a uniform plating apparatus of the substrate according to the present invention, Figure 3 is a schematic diagram showing the main portion of the uniform plating apparatus according to the present invention, Figure 4 is an operational state diagram of the uniform plating apparatus according to the present invention The upper portion is formed by the etching portion 100 on the substrate and the etching portion 200 and the substrate fixing portion 300 on the lower substrate.

In the upper portion of the substrate, an etching solution spray nozzle 110 is circumferentially arranged on the bottom surface of the upper base 140, and the etching solution spray nozzle 110 is installed so as to be sequentially sprayed from the center toward the outside. do.

In addition, an injection device 130 having an air injection nozzle is integrally installed on the outside of the etching liquid injection nozzle 110 and mounted on the bottom surface of the upper base 140, wherein the etching liquid injection nozzle 110 and the injection device ( 130) It is also installed to be sprayed sequentially from the center toward the outside.

In the lower portion of the substrate 200, which is installed on the substrate 100 on the substrate 100, a plurality of etching liquid spray nozzles 210 protrude from the lower base 220, and the etching liquid spray nozzles 210 are formed on the substrate. The central portion of the dense pattern 300 of 230 is installed so as to position each.

The substrate fixing part 300 installed to support the substrate 230 has a configuration in which the support roller 330 is integrally installed on the inner surface of the frame 310 in which the substrate 230 is inserted.

Reference numeral 350 is a sensor installed to detect the entry of the substrate 230 on one side of the upper base 140.

Referring to the operation of the present invention made of such a configuration as follows.

As shown in FIGS. 2 to 4, when the substrate 230 having a width of 510: 405 having a size of a general substrate 230 enters the inside of the frame 310, the detection sensor 350 detects the size of the substrate 230. do.

At this time, the etching liquid spray nozzles 110 and 210 installed on the upper base 140 and the lower base 220 are operated to perform etching on the substrate 230.

And, the etching liquid injection nozzle 110 is installed on the upper base 140 is arranged in a circumferential shape on the bottom of the upper base 140 to be sequentially sprayed toward the outside from the center portion, the adjustment of the injection time is a timer Enabled by (not shown).

When the injection pressure of the etching liquid injection nozzles 110 and 210 is about 1.8 kg / cm 2, the pressure acting on the upper and lower sides of the substrate 230 becomes uniform, so that a separate substrate 230 support device is unnecessary. do.

In addition, the etching liquid spray nozzles 210 installed on the lower base 220 are disposed to be positioned at the center of each pattern positioned below the substrate 230 to accurately etch the dense pattern portion.

The etching spray nozzles 110 and 210 are formed in a cone shape, and the etching liquid is sprayed to diffuse from the upper side to the lower side.

In addition, in the substrate fixing part 300 installed to support the substrate 230, the support piece 320 having the support protrusion 310 is integrally installed on the inner edge of the frame 310. The support protrusion 310 is inserted into the support groove 360 formed at the corner of the support to be supported.

In addition, the support bars 340 intersecting with each other inside the frame 310 are installed, and the support protrusions 310 are installed on the upper side thereof, thereby minimizing the area supported by the substrate 230 during etching, thereby making the etching uniform. The support protrusion 310 is positioned between the dense patterns.

According to the uniform plating apparatus of the substrate according to the present invention as described above, it is possible to form a constant plating thickness quickly to shorten the work process, to minimize the deviation of the center and the outside to prevent the occurrence of defective products, uniform coating of the etching solution Therefore, it is possible to prevent the occurrence of unetched phenomenon and to form a uniform plating thickness, thereby improving the reliability of the product.

Claims (4)

The etching solution injection nozzle 110 is a etched portion 100 on the substrate circumferentially arranged on the bottom of the upper base 140, The substrate lower part etching part protruding on the upper part of the lower base 220 so that the etching liquid injection nozzle 210 is positioned at the center of the dense pattern 300 of the substrate 230 while being largely attached to the etching part 100 at the upper part of the substrate ( 200) and, Uniform plating apparatus for a substrate, characterized in that it comprises a substrate fixing portion 300 is provided with a plurality of support rollers 330 integrally installed on the inner surface of the frame 310 is inserted into the substrate 230 The uniform plating apparatus of claim 1, wherein the etching liquid spray nozzle 110 is integrally provided with an injection device 130 having an air spray nozzle on the outside thereof. According to claim 1 or claim 2, The injector 130 is a uniform plating apparatus for a substrate, characterized in that the spraying is installed in order from the center toward the outside in sequence According to claim 1, The upper base 140, the uniform plating device of the substrate, characterized in that the sensor 350 is installed to detect whether the entry of the substrate 230 on one side