KR200197130Y1 - Direct sensor using the semiconductor for weft-straightener - Google Patents
Direct sensor using the semiconductor for weft-straightener Download PDFInfo
- Publication number
- KR200197130Y1 KR200197130Y1 KR2020000012255U KR20000012255U KR200197130Y1 KR 200197130 Y1 KR200197130 Y1 KR 200197130Y1 KR 2020000012255 U KR2020000012255 U KR 2020000012255U KR 20000012255 U KR20000012255 U KR 20000012255U KR 200197130 Y1 KR200197130 Y1 KR 200197130Y1
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- KR
- South Korea
- Prior art keywords
- sensor
- weft
- semiconductor
- film
- sensing device
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Classifications
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D51/00—Driving, starting, or stopping arrangements; Automatic stop motions
- D03D51/18—Automatic stop motions
- D03D51/34—Weft stop motions
-
- D—TEXTILES; PAPER
- D03—WEAVING
- D03J—AUXILIARY WEAVING APPARATUS; WEAVERS' TOOLS; SHUTTLES
- D03J1/00—Auxiliary apparatus combined with or associated with looms
- D03J1/04—Auxiliary apparatus combined with or associated with looms for treating weft
-
- D—TEXTILES; PAPER
- D03—WEAVING
- D03J—AUXILIARY WEAVING APPARATUS; WEAVERS' TOOLS; SHUTTLES
- D03J2700/00—Auxiliary apparatus associated with looms; Weavening combined with other operations; Shuttles
- D03J2700/06—Auxiliary devices for inspecting, counting or measuring
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- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Looms (AREA)
Abstract
1) 고안에 속한 기술분야1) Technical field of design
직물가공시 위사의 비틀어진 각을 감지하여 그원래 상태로 교정하는 기계장치에 설치하여 직물의 비틀어짐을 감지하는 장치로 반도체 센사 직접감지기를 이용한 위사 감지장치임.It is a weft sensing device using a semiconductor sensor directly sensing device that is installed in a mechanical device that detects the twisted angle of the weft yarn during fabric processing and installs it on the mechanical device that corrects it to its original state.
2) 고안의 목적2) Purpose of devising
기존의 위사감지기의 복잡한 구조를 단순화시켜 센사가 직접감지하는 방식을취함으로 광원을 전달받아 감지장치를 거쳐 감지해야하는데 따른 오차범위를 줄여, 직물 가공시 그 직물의 비틀어진각을 정확히 감지하고자 본 고안을 고안하게 되었음.By simplifying the complex structure of the conventional weft sensor, the sensor detects the twisted angle of the fabric during fabric processing by reducing the error range required to be sensed through the sensing device by receiving the light source. Was devised.
3) 고안의 구성3) Composition of the devise
위사감지기내에 장착된 감지구, 필름, 감지센사를 연결해서 감지하는 방식을 사용하지않고 한 개의 반도체에다 다수의 셀을 마스킹하여 배치하고, 집적해서,그집접회로를 직접부착 하도록 구성되었음.It is configured to directly attach the integrated circuit by masking, placing and integrating a plurality of cells in one semiconductor without using a method of connecting and detecting a sensor, a film, and a sensing sensor mounted in the weft sensor.
4) 고안의 효과4) Effect of the devise
감지경로를 단순화시켜 제작과정을 단순화 시킬 수 있고 감지기내에서 사용된 감지구,필름,감지센사 등의 나열식구조로 인한 감지오차를 없앨수 있다.By simplifying the detection path, the manufacturing process can be simplified, and the detection error due to the array structure of the sensor, the film, and the sensor used in the sensor can be eliminated.
Description
본 고안은 포목교정기에 위사감지기 내의 감지경로를 단순화하므로 제작과정을 단순화 시킬수 있고 감지오차를 없앨수 있으므로 정확한 위사감지를 가능케 하는데 그 목적이 있다 할 수 있다.The present invention simplifies the sensing path in the weft detector in the wood cutter, which can simplify the manufacturing process and eliminate the detection error.
종래의 위사감지창치는 백열등램프의 빛을 원단에 투과시켜 그상(像)을 감지구를 통해 필름으로 투과시켜 감지센사로 직물의 비틀어진각을 감지하는 방법으로 고안되어있다. 기존방법은 투과된 빛에맺힌 상을 감지구로 모아 필름을 거쳐 센사로 감지하는 여러경로를 거치게 되므로 빛의 회절현상에 직진성을 부여해야만 정밀도가 높아지므로 투과된 빛을 렌즈로 모아 그 각을 직진되게 좁혀줘야만 하는데, 그각을 거리에 환산해서 정확하게 잡아주기가 어렵다. 또 기계의 사용 중 진동에 의해 그거리가 달라짐으로 그 편차를 매번 수정해 주지 않으면 그 정확도가 떨어진다 할 수 있다.Conventional weft detection window is designed to transmit the light of the incandescent lamp lamp to the fabric to transmit the image through the sensor through the film to detect the twist angle of the fabric with a sensing sensor. In the conventional method, the image collected by the transmitted light is collected through the sensor and passes through several paths that are sensed through the film. It should be narrowed down, but it is difficult to convert the angle to the distance and hold it accurately. In addition, the distance is changed by the vibration during use of the machine, the accuracy may be lowered if the deviation is not corrected every time.
기존방식은 한 개 혹은 다수(9-11개)의 감지구를 통해 빛을보내고 기준각을 중심으로한 여러개의 각도표시가 있는 필름을 거쳐야만 그 각도표시에 따른PCB기판 위에 장착된 다수의 센서(보통 9개∼11개)에서 비로서 원단각도를 감지할 수 있게 고안되었다.Existing method is to send light through one or many (9-11) detection ports and pass through a film with multiple angle markings centering on the reference angle. In general, it is designed to detect the distal angle as a ratio from 9 to 11).
기존방식은 센사 1개의 부피를 작게 하는데 한계가 있어 감지기 1개에 모든 센사를 배치할 경우 감지기의 크기가 커지고 이에 따라 위치에 따라 밝기가 다른 광원을 사용할 경우 감지 오차가 커질 수밖에 없다.The conventional method has a limitation in reducing the volume of one sensor, so when all the sensors are placed in one sensor, the size of the sensor becomes larger, and accordingly, when using a light source having a different brightness depending on the position, the detection error becomes large.
또 1개센사의 폭을 작게 할수 없으므로 광차단용 필름을 반드시 사용해야만 한다.In addition, since the width of one yarn cannot be reduced, a film for blocking light must be used.
(도1) 은 종래의 위사감지 장치를 장착한 포목교정기의 사시도1 is a perspective view of a wood cutting machine equipped with a conventional weft detection device
(도2) 는 종래의 자동포목교정기의 위사감지장치의 실시예를 도시한 부분단면도Figure 2 is a partial cross-sectional view showing an embodiment of the weft detection device of a conventional automatic tool corrector.
(도3) 은 종래의 자동포목교정기의 위사감지장치의 감지기내 구조의 나열식 단면도Figure 3 is a cross-sectional sectional view of the structure in the detector of the weft detection device of the conventional automatic tool corrector
(도4) 는 종래의 자동포목교정기의 위사감지장치의 감지기내에 장착된 포토셀감지센사의 단면도Fig. 4 is a cross-sectional view of the photocell detection sensor mounted in the detector of the weft detection device of the conventional automatic tool corrector.
(도5) 는 종래의 자동포목교정기의 위사감지장치의 감지기내에 장착된 필름의 단면도Fig. 5 is a sectional view of the film mounted in the detector of the weft detection device of the conventional automatic sanding machine.
(도6) 은 본 고안에 따른 반도체에 다수의 셀을 집적해서 배치한 직접센사의 반도체 단면도6 is a cross-sectional view of a semiconductor of a direct sensor in which a plurality of cells are integrated and arranged in a semiconductor according to the present invention.
(도7)은 본고안에 따른 반도체를 사용한 직접센사의 외형 단면도Figure 7 is an external cross-sectional view of a direct sensor using a semiconductor according to the present proposal
[도면의 주요부분에 대한 부호의 설명][Explanation of symbols on the main parts of the drawings]
1. 발광부 2. 수광부(감지기) 3. 직물 4. 백열등 5., 위사감지구(다수의 렌즈 사용) 6. 필름 7. 감지센사 8. 집적회로 9. 집적회로의 배치형상 10. 센사의 외형 11. 전선1. Light-emitting part 2. Light-receiving part (detector) 3. Fabric 4. Incandescent lamp 5., Weft sensing area (using multiple lenses) 6. Film 7. Sensing sensor 8. Integrated circuit 9. Layout of integrated circuit 10. Appearance of Sensa 11. Electric wire
[고안의 구성 및 효과][Configuration and Effect of Design]
자동포목교정기의 위사감지장치는 위사감지구(5),필름(6) ,감지센사(7)등 주요 세부분으로 나누어져 구성되어있다. 이 기존의 세부분으로된 위사감지장치를 위사감지구(5)와 필름(6) 및 감지센사(7)를 없애고 한개의 반도체에다 다수의 셀을 마스킹 배치하여 집적(8)하고 그 집적회로를 위사감지장치에 배치(9)해 직접감지함으로 빛의 회절현상에 따른 감지오차를 없앨 수 있고, 제작과정의 단순화로 감지구 제작과정에서의 편차, 필름의 제작편차, 기판제작등에 따른 제작편차를 없앨 수있다.The weft detection device of the automatic sawing cutter is divided into the main details such as weft detection zone (5), film (6), detection sensor (7). This conventional subdivision weft sensing device is removed by weft sensing zone (5), film (6) and sensing sensor (7) and integrated (8) by masking and arranging a number of cells in one semiconductor. It can be arranged in the weft detection device (9) to directly detect and eliminate the detection error due to the diffraction phenomenon of light. Can be eliminated
본 고안은 다수의 감지센사를 축약시켜 한개의 반도체 셀에 집약하므로 감지오차를 줄여 감지정밀도를 높일수 있고, 셀을 배치할 때 각도를 주어 배치 하므로 감지구나 필름을 사용할 필요가 없다.The present invention condenses a plurality of sensing sensors into one semiconductor cell, thus reducing the detection error, thereby increasing the detection accuracy and eliminating the need for a sensor or film because the cells are placed at an angle when the cells are placed.
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KR2020000012255U KR200197130Y1 (en) | 2000-04-25 | 2000-04-25 | Direct sensor using the semiconductor for weft-straightener |
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KR2020000012255U KR200197130Y1 (en) | 2000-04-25 | 2000-04-25 | Direct sensor using the semiconductor for weft-straightener |
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