CN217334019U - Chip detection module and chip transfer device with same - Google Patents
Chip detection module and chip transfer device with same Download PDFInfo
- Publication number
- CN217334019U CN217334019U CN202123388193.7U CN202123388193U CN217334019U CN 217334019 U CN217334019 U CN 217334019U CN 202123388193 U CN202123388193 U CN 202123388193U CN 217334019 U CN217334019 U CN 217334019U
- Authority
- CN
- China
- Prior art keywords
- chip
- light
- unit
- luminous flux
- receiving unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model relates to a chip detection module and a chip transfer device with the same, which mainly comprises a photoelectric sensor, a chip carrier and a luminous flux attenuation sheet; the luminous flux attenuation sheet is arranged between the light sending unit and the light receiving unit of the photoelectric sensor; the light transmitting unit transmits the sensing light to the light receiving unit to form a light path, and the light path passes through the chip containing groove and the luminous flux attenuation sheet on the chip carrier. Therefore, the utility model discloses adjust the light quantity of sensing light with the luminous flux decay piece, even if consequently sense the light and pass through the transparent cover plate of chip and when only taking place a trace amount of light decay, this chip also can be surveyed easily to photoelectric sensor. Moreover, the utility model discloses the luminous flux attenuation piece of different luminous flux is chooseed for use to visual actual use condition, so applicable to survey all types of chips.
Description
Technical Field
The utility model relates to a chip detection module and possess the chip of this module and move and carry the device, especially indicate that one kind can survey the chip that uses transparent glass as the chip of encapsulation apron and survey the module and possess the chip of this module and move and carry the device.
Background
As for the chip packaging technology, different packaging methods are adopted according to chips with different characteristics and different functions. For example, image (image) sensors such as CCD or CMOS are devices that convert optical signals into analog electrical signals, and therefore, it is particularly required that the packaging material of the light receiving surface on the chip package is a material with high luminous flux, such as transparent glass, to reduce the light attenuation rate as much as possible so as not to affect the sensing result.
Furthermore, most of the conventional chip inspection apparatuses use a photoelectric sensor to detect the existence or the positioning of a chip. For example, the photo sensor is usually a correlation type photo switch, which includes a transmitter and a receiver, and the transmitter transmits infrared light to the receiver, and the chip is determined to be present or already in place once the transmission of the infrared light is interrupted by the chip, that is, the receiver cannot receive the infrared light.
In addition, in order to enhance the resistance to external light, i.e. to avoid the external light from affecting the sensing result, the conventional photoelectric sensor generally increases the luminous flux of the infrared light emitted by the emitter and decreases the illuminance sensing threshold of the receiver; therefore, a chip using a light-permeable material as a packaging material, such as an image sensor, cannot intercept infrared light and thus cannot be detected successfully, resulting in erroneous judgment.
Please refer to fig. 1, which is a schematic diagram of light transmission of an image sensor. However, in the image sensor 1 using the transparent cover 11, since the light penetration of the transparent cover 11 is good, even though the chip is in place, the infrared light RL emitted by the emitter still penetrates the transparent cover 11, that is, the infrared light RL cannot be blocked, so that the receiver can successfully receive the infrared light RL, and further, it is determined that the chip is not present. More simply, known chip probing systems using photosensors cannot be used to probe chips employing transparent packages.
As can be seen from the above, the chip detection technology that can accurately detect the existence of the transparent packaged chip or the positioning of the transparent packaged chip by adopting a general photoelectric sensor and modifying the sensor properly is an invaluable technology in the industry.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a chip detection module and chip transfer device with the same, which can accurately detect whether the chip exists or not, and is suitable for all chip types, including chips packaged by transparent covers, and has low cost, stability and reliability.
In order to achieve the above object, the present invention provides a chip detection module, which mainly comprises a photoelectric sensor, a chip carrier and a luminous flux attenuation sheet; the photoelectric sensor comprises a light transmitting unit and a light receiving unit; the chip carrying platform is provided with at least one chip containing groove, and the chip containing groove is used for containing a chip; the luminous flux attenuation sheet is arranged between the light sending unit and the light receiving unit; the light transmitting unit transmits the sensing light to the light receiving unit to form a light path, and the light path passes through at least one chip containing groove and the luminous flux attenuation sheet.
Therefore, the utility model discloses utilize the luminous flux decay piece to adjust the light quantity of sensing light, even if the light quantity attenuation of only taking place micro-when passing through the transparent cover plate of chip is sensed to the event, this chip also can be detected easily. In other words, the present invention can be applied to detect all types of chips, and even an image sensor using transparent glass as a package cover plate can be accurately detected; moreover, the structure is quite simple, stable and reliable, and the cost is low.
Preferably, the chip carrier of the present invention may include a chip accommodating groove, and at least a part of the luminous flux attenuation sheet may be accommodated in the chip accommodating groove; and the chip accommodating groove can be arranged between the light sending unit and the chip accommodating groove. In addition, the chip carrier may include an optical path long groove extending along the optical path, which may penetrate the chip accommodating groove and the chip accommodating groove, and the optical path long groove may be orthogonal to the chip accommodating groove.
In addition, the luminous flux of the luminous flux attenuation sheet of the present invention may be between 10% to 50% of the luminous flux of the sensing light emitted by the light transmitting unit; and the light receiving unit may include an indicator lamp which may emit an indicator light signal indicating that the chip has been detected when the luminous flux received by the light receiving unit is lower than a specific value (e.g., 10% or lower, such as 2%) of the luminous flux of the sensing light emitted by the light transmitting unit.
In order to achieve the above object, the present invention provides a chip transfer device with a chip detection module, which mainly comprises a chip carrier, a plurality of photoelectric sensors and at least one light flux attenuation sheet; the chip carrying platform is provided with a plurality of chip accommodating grooves, and each chip accommodating groove is used for accommodating one chip; each photoelectric sensor comprises a light transmitting unit and a light receiving unit; the luminous flux attenuation sheet is arranged between the light sending unit and the light receiving unit of the photoelectric sensor. The light transmitting unit of each photoelectric sensor transmits sensing light to the light receiving unit to form a light path, and the light path passes through at least one chip containing groove and at least one luminous flux attenuation sheet.
In other words, the utility model provides a chip that possesses chip detection module moves and carries device, it can transport a plurality of chips simultaneously, and can survey a plurality of chips simultaneously, and especially single photoelectric sensor can survey more than two chips simultaneously, and single luminous flux attenuation piece also can supply more than two light paths to pass through simultaneously.
Furthermore, the utility model discloses a chip moves and carries device can still include control unit and microscope carrier drive unit, and control unit can connect in microscope carrier drive unit, and the steerable microscope carrier drive unit of control unit removes with the drive chip microscope carrier. In addition, the chip transferring device of the utility model can also comprise a warning unit, and the plurality of photoelectric sensors and the warning unit can be electrically connected with the control unit; when the light flux received by the light receiving unit of one of the plurality of photoelectric sensors is higher than the specific value of the light flux of the sensing light emitted by the light sending unit, the control unit can control the warning unit to send out warning information, namely, the warning information indicates that the chip is not detected.
Drawings
FIG. 1 is a schematic diagram of light penetration of an image sensor;
fig. 2 is a schematic view of a first embodiment of the present invention;
fig. 3 is a system architecture diagram of a second embodiment of the present invention;
fig. 4 is a schematic view of a second embodiment of the present invention.
Detailed Description
Before the chip detecting module and the chip transferring device having the same are described in detail in the present embodiment, it should be noted that similar elements will be denoted by the same reference numerals in the following description. The drawings of the present invention are for illustrative purposes only and are not necessarily to scale, nor are all details thereof presented in the drawings.
Please refer to fig. 2, which is a schematic diagram of a first embodiment of the present invention, wherein the first embodiment of the present invention is a chip detection module 8, which can be applied to chip production equipment, chip detection equipment of a back-end process of a chip production process, and other electronic devices or equipment that need to sense whether a chip exists.
As shown in the drawing, the chip detection module 8 of the present embodiment mainly includes a photosensor 2, a chip stage 3, and a light flux attenuation sheet 4. The photoelectric sensor 2 used in the present embodiment is an infrared light correlation type photoelectric switch sensor, and includes a light transmitting unit 21 and a light receiving unit 22, and the light transmitting unit 21 and the light receiving unit 22 are respectively provided on the upper and lower corresponding sides of the chip stage 3. On the other hand, on the chip stage 3, a chip accommodating groove 31 is formed between the light transmitting unit 21 and the light receiving unit 22, and the chip accommodating groove 31 accommodates the chip C.
Further, the light transmitting unit 21 of the photoelectric sensor 2 can emit sensing light to the light receiving unit 22 to form the light path WL, and the sensing light is red visible light to facilitate adjustment of the optical axis, thereby achieving alignment between the light transmitting unit 21 and the light receiving unit 22. In addition, chip carrier 3 is further provided with a chip accommodating groove 32 and an optical path long groove 33, which are orthogonal; the sheet accommodating groove 32 is provided between the light transmission unit 21 and the chip accommodating groove 31, and the sheet accommodating groove 32 is used for disposing the light flux attenuation sheet 4.
Furthermore, in the present embodiment, the light flux attenuation sheets 4 can be easily assembled by arranging the sheet accommodating grooves 32, and the light flux attenuation sheets 4 with different light flux parameters can be easily replaced according to actual requirements, or the number of the light flux attenuation sheets 4 can be increased or decreased. The optical path long groove 33 extends along the optical path WL and penetrates the chip accommodating groove 32 and the chip accommodating groove 3. In fact, the sensing light emitted by the light transmitting unit 21 will pass within the optical path long groove 33.
Furthermore, the luminous flux attenuation sheet 4 of the present embodiment is made of a matte acrylic material, but not limited thereto, and may also be made of acrylic or glass with a light shielding film attached to the surface or other light shielding or light diffusing microstructures formed on the surface. In addition, the luminous flux of the luminous flux attenuation sheet 4 may be between 10% to 50% of the luminous flux of the sensing light emitted by the light sending unit 21; that is, the luminous flux attenuation sheet 4 can shield 50% to 90% of the light quantity, all depending on the transmittance and the number of the inspected member (chip cover plate) and the sensing threshold of the light receiving unit 22.
In the present embodiment, the chip container 31 of the chip carrier 3 is used for loading the image sensor by default, and the image sensor is mounted with a transparent cover plate of high light-transmitting glass (refer to fig. 1), and the light transmittance thereof is usually as high as 80% or more. For this reason, the luminous flux attenuation sheet 4 used in the present embodiment has a luminous flux of 10%; that is, the light flux attenuation sheet 4 of the present embodiment will attenuate the amount of light passing through by about 90%.
On the other hand, the light receiving unit 22 of the present embodiment includes an indicator lamp 221; when the light flux received by the light receiving unit 22 is lower than 2% or less of the light flux of the sensing light emitted by the light transmitting unit 21, the indicator lamp 221 will emit an indicator lamp signal; that is, the photosensor 2 of the present embodiment determines that the threshold value at which light is interrupted is 2% of the original sensed light luminous flux, and if the light receiving unit 22 receives a luminous flux lower than 2% of the original sensed light luminous flux, the indicator light will light up to indicate that the sensed light is interrupted by the chip.
The practical operation of the embodiment is described below, when a chip is placed in the chip receiving slot 31 of the chip carrier 3, the light flux attenuation sheet 4 and the transparent cover plate of the chip (refer to fig. 1) attenuate the sensing light to below 2%; at this point, the indicator light will light up, thereby indicating that the chip has been completely placed in the chip pocket 31.
In contrast, if no chip is accommodated in the chip accommodating groove 31 or the chip is not placed, that is, the sensing light does not pass through the transparent cover plate of the chip (refer to fig. 1); at this time, since the light quantity is attenuated insufficiently and the light quantity is higher than 2% of the light quantity of the sensing light emitted from the light transmission unit 21, the indicator light will not be lighted, i.e., it means that no chip is detected.
Referring to fig. 3 and 4 together, fig. 3 is a system architecture diagram of a second embodiment of the present invention, and fig. 4 is a schematic diagram of the second embodiment of the present invention. The following second embodiment is used to describe that the chip detection module 8 of the above embodiment is applied to a chip transfer device 9, for example, an output shuttle (output shuttle) of a chip detection device.
As shown in fig. 3, the chip transfer apparatus 9 of the present embodiment mainly includes a control unit 5, a stage driving unit 6, a warning unit 7, and a photoelectric sensor 2; the stage driving unit 6, the warning unit 7 and the photoelectric sensor 2 are electrically connected and controlled by the control unit 5. Wherein the control unit 5 controls the stage driving unit 6 to drive the chip stage 3 to move. In addition, the warning unit 7 can send out warning information, which can be a warning light, sound or display information on a computer screen, for reporting the detection result of the photoelectric sensor 2.
As shown in fig. 4, chip stage 3 is provided with 8 chip accommodating grooves 31, 2 chip accommodating grooves 32, and 4 optical path long grooves 33; each optical path long groove 33 is connected in series with 2 chip accommodating grooves 31, and each chip accommodating groove 32 spans 2 optical path long grooves 33. That is, each flux attenuation sheet 4 will be shared by 2 groups of photosensors 2, and each photosensor 2 will sense chips within 2 chip pockets 31 simultaneously.
However, with the setting of the present embodiment, since the light flux of the transparent cover of each chip is about 80%, and the sensing threshold of the light receiving unit 22 is 2% of the light flux, the light flux of the light flux attenuation sheet 4 of the present embodiment is set to 20%, that is, the amount of the detection light passing through the light flux attenuation sheet 4 will be attenuated by about 80%.
Thus, when one of the chips is not placed in the chip accommodating slot 31, since the transparent cover plate of one chip is omitted to attenuate the sensing light, the luminous flux of the sensing light received by the light receiving unit 22 is about 4%, which exceeds the sensing threshold by 2%, and at this time, the control unit 5 controls the warning unit 7 to send out warning information. Only when all the chip containing slots 31 contain chips, the normal state is reached, and the alarm unit 7 will not be activated.
To sum up, the utility model discloses possess following advantage at least:
the detection of the chip with the transparent cover plate can be realized by simple modification, namely, a luminous flux attenuation sheet is arranged between the light sending unit and the light receiving unit; the structure is simple, the cost is low, and the stability and the reliability are realized;
the luminous flux attenuation sheet is used for adjusting the light quantity of the sensing light, so that the method can be suitable for detecting all types of chips, and even an image sensor using transparent glass as a packaging cover plate can be accurately detected;
the luminous flux attenuation sheets with different luminous flux values can be easily replaced according to different requirements; in other words, the light flux value of the light flux attenuation sheet can be simply set for chips with different transmittances or different numbers of detected chips to realize the detection function;
through the arrangement of the sheet accommodating groove, the luminous flux attenuation sheets can be easily assembled, and can be easily replaced, increased or decreased in number or even removed according to actual requirements.
The above-described embodiments are merely exemplary for convenience of description, and the claimed invention should not be limited to the above-described embodiments, but should be limited only by the appended claims.
Description of the symbols
1: image sensor with a plurality of pixels
2: photoelectric sensor
3: chip carrying platform
4: luminous flux attenuation sheet
5: control unit
6: stage drive unit
7: warning unit
8: chip detection module
9: chip transfer device
11: transparent cover plate
21: optical transmission unit
22: light receiving unit
31: chip containing groove
32: tablet containing groove
33: long slot of light path
221: indicator light
C: chip and method for manufacturing the same
RL: infrared light
WL: an optical path.
Claims (10)
1. A chip detection module, characterized by includes:
a photosensor including a light transmitting unit and a light receiving unit;
the chip carrying platform is provided with at least one chip containing groove, and the at least one chip containing groove is used for containing a chip; and
a luminous flux attenuation sheet provided between the light transmitting unit and the light receiving unit;
the light transmitting unit transmits sensing light to the light receiving unit to form a light path, and the light path passes through the at least one chip containing groove and the luminous flux attenuation sheet.
2. The chip probe module of claim 1, wherein the chip carrier includes a chip receiving slot, the flux attenuation sheet being at least partially received in the chip receiving slot.
3. The chip probe module of claim 2, wherein the chip receiving slot is disposed between the light transmitting unit and the at least one chip receiving slot.
4. The chip probe module of claim 2, wherein the chip carrier includes an optical path slot extending along the optical path; the light path long groove penetrates through the chip accommodating groove and the at least one chip accommodating groove; the long optical path slot is orthogonal to the sheet accommodating slot.
5. The chip detection module according to claim 1, wherein the luminous flux of the luminous flux attenuator is between 10% and 50% of the luminous flux of the sensing light emitted from the light transmitting unit.
6. The chip detection module according to claim 1, wherein the light receiving unit includes an indicator light; when the luminous flux received by the light receiving unit is lower than a specific value of the luminous flux of the sensing light emitted by the light transmitting unit, the indicator lamp emits an indicator light signal.
7. A chip transfer device with a chip detection module is characterized by comprising:
the chip carrying platform is provided with a plurality of chip containing grooves, and each chip containing groove is used for containing one chip;
a plurality of photoelectric sensors, each photoelectric sensor including a light transmitting unit and a light receiving unit; and
at least one luminous flux attenuation sheet disposed between the light transmitting unit and the light receiving unit of the plurality of photosensors;
the light transmitting unit of each photoelectric sensor transmits sensing light to the light receiving unit to form a light path, and the light path passes through at least one of the plurality of chip accommodating grooves and the at least one luminous flux attenuation sheet.
8. The device for transferring a chip as claimed in claim 7, further comprising a control unit and a stage driving unit, wherein the control unit is electrically connected to the stage driving unit, and the control unit controls the stage driving unit to drive the chip stage to move.
9. The chip transfer device according to claim 8, further comprising an alarm unit, wherein the plurality of photoelectric sensors and the alarm unit are electrically connected to the control unit; when the light flux received by the light receiving unit of one of the plurality of photoelectric sensors is higher than the specific value of the light flux of the sensing light emitted by the light sending unit, the control unit controls the warning unit to send warning information.
10. The chip transfer apparatus according to claim 9, wherein the chip carrier includes at least one chip accommodating groove, and at least a part of the at least one luminous flux attenuation sheet is accommodated in the at least one chip accommodating groove; the at least one chip accommodating groove is arranged between the light sending unit of the plurality of photoelectric sensors and the plurality of chip accommodating grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123388193.7U CN217334019U (en) | 2021-12-30 | 2021-12-30 | Chip detection module and chip transfer device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123388193.7U CN217334019U (en) | 2021-12-30 | 2021-12-30 | Chip detection module and chip transfer device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217334019U true CN217334019U (en) | 2022-08-30 |
Family
ID=82992327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123388193.7U Active CN217334019U (en) | 2021-12-30 | 2021-12-30 | Chip detection module and chip transfer device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217334019U (en) |
-
2021
- 2021-12-30 CN CN202123388193.7U patent/CN217334019U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9513745B2 (en) | Night vision touchscreen | |
| US8558815B2 (en) | Dual touchscreen | |
| KR101603666B1 (en) | Sensing device and method of sening a light by using the same | |
| JP5583120B2 (en) | Photoelectric switch and method for detecting objects | |
| CN101361187B (en) | Photosensor, target detection method and display panel | |
| CN105629213A (en) | Multi-sensor proximity sensing | |
| US20120169962A1 (en) | Optical sensor and display device | |
| CN217334019U (en) | Chip detection module and chip transfer device with same | |
| TWI710151B (en) | Optical sensing system and electronic display system | |
| CN107782354B (en) | Motion sensor detection system and method | |
| CN112800808A (en) | Fingerprint identification method and electronic equipment | |
| TWM626115U (en) | Chip detection module and chip transfer device equipped with the same | |
| CN213042338U (en) | Adhesive tape detection module and currency detection device using same | |
| WO2003063096A1 (en) | The detector in-built to transparent taped banknote for photo sensors | |
| JPH02144714A (en) | Optical touch panel apparatus | |
| US4296332A (en) | Sprocket hole sensing detector for moving translucent paper sheets | |
| CN108508428B (en) | Proximity sensor package with one or more recesses in module cover | |
| JP2992260B2 (en) | Photoelectric key operation array | |
| CN109324351B (en) | Optical medicine box sensor and medicine box | |
| CN110243286A (en) | A kind of back drill offset detecting device and image acquiring device | |
| CN111857436B (en) | Backlight source assembly, touch display module, touch display device and touch sensing method | |
| CN112396967B (en) | Optical sensing module, screen assembly, electronic device, detection method and storage medium | |
| CN210534183U (en) | Remote direction distinguishing sensor | |
| CN115127979A (en) | Small particle detection grating sensing device | |
| CN213180068U (en) | Groove type industrial photoelectric sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |