KR200189113Y1 - Photo solder resist drying method of printed circuit board - Google Patents
Photo solder resist drying method of printed circuit board Download PDFInfo
- Publication number
- KR200189113Y1 KR200189113Y1 KR2020000003625U KR20000003625U KR200189113Y1 KR 200189113 Y1 KR200189113 Y1 KR 200189113Y1 KR 2020000003625 U KR2020000003625 U KR 2020000003625U KR 20000003625 U KR20000003625 U KR 20000003625U KR 200189113 Y1 KR200189113 Y1 KR 200189113Y1
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- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- lamp
- solder resist
- photo solder
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
본 고안은 인쇄회로기판의 포토 솔더 레지스트(Printed Circuit Board Photo Solder Resist) 건조장치에 관한 것으로서,램프를 IR램프로 구성하되 램프(1)와 인쇄회로기판(3) 사이에 소정 주파수 대역의 자외선 파장을 차단하기 위한 색상필터(2)를 설치하여서 된 것으로서, 구조가 간단하여 제작이 용이하고 램프에서 발산되는 UV광선을 차단하여 기판을 건조시킴으로서 제품의 불량을 최소로 줄여 생산량을 극 대회 시킬수 있는 유용한 고안인 것이다.The present invention relates to a printed circuit board photo solder resist drying apparatus for a printed circuit board, wherein the lamp is composed of an IR lamp, but has an ultraviolet wavelength in a predetermined frequency band between the lamp 1 and the printed circuit board 3. It is made by installing the color filter (2) to cut off, and the structure is simple and easy to manufacture, and it is useful to minimize the defect of the product by minimizing the defect of the product by drying the substrate by blocking the UV rays emitted from the lamp. It is an idea.
Description
본 고안은 인쇄회로기판의 포토 솔더 레지스트(Printed Circuit Board Photo Solder Resist) 건조장치에 관한 것으로서, 더욱 상세하게는 인쇄회로기판 표면에 형성되는 포토 솔더 레지스트(Photo Solder Resist)의 해상도를 높이면서도 안정성을 높일 수 있고, 포토 솔더 레지스트를 형성하는 각 단계에서 적외선 건조시 자외선에 의해 인쇄회로기판과 포토 솔더 레지스트 등이 들뜨는 것(under-cut)을 방지할 수 있도록한 인쇄회로기판의 포토 솔더 레지스트 건조장치에 관한 것이다.The present invention relates to a printed circuit board photo solder resist drying apparatus of a printed circuit board, and more particularly, to improve stability while increasing the resolution of a photo solder resist formed on the surface of the printed circuit board. Photo solder resist drying apparatus of a printed circuit board which can increase and prevent under-cut of printed circuit board and photo solder resist by ultraviolet rays during infrared drying at each step of forming photo solder resist It is about.
급속한 산업발전과 함께 인쇄회로기판(Printed Circuit Board)산업도 발전되어 경·박·단· 소에 따른 고품질 고생산성의 공법을 요구하고 있다. 이러한 인쇄회로기판산업의 공정 중 일예로서는 포토 솔더 레지스트(Photo Solder Resist)을 들 수 있는 데, 이 포토 솔더 레지스트는 BGA(Ball Grid Array), 마이크로 BGA(micro Ball Grid Array), CSP(Chip Size Package) 등으로서 반도체 수준의 사양을 요구하고 있다.Along with the rapid industrial development, the printed circuit board industry has also developed, requiring high-quality, high-productivity methods for light, thin, short and small. One example of the process of the printed circuit board industry is a photo solder resist (Photo Solder Resist), which is a ball grid array (BGA), micro ball grid array (BGA), Chip Size Package And the like, and require semiconductor-level specifications.
여기서, 포토 솔더 레지스트는 인쇄회로기판에서 패턴회로의 보호를 요구하는 한편, 솔더 리플로우(solder reflow)시 솔더에 의한 쇼트(short)방지는 물론 인쇄회로기판 공정상 각종 화학처리에 대한 내성을 요구하고 있다.Here, the photo solder resist requires the protection of the pattern circuit in the printed circuit board, while preventing the short circuit caused by the solder during solder reflow as well as the resistance to various chemical treatments in the printed circuit board process. Doing.
그러나, 인쇄회로기판 표면에 포토 솔더 레지스트를 형성하는 각 과정에 있어서 일반적으로 열풍건조에 의한 오븐(oven)을 사용하는 데, 이는 감광성 수지에 포함되어 있는 솔벤트(solvent) 성분을 휘발시키기 위함으로 적외선에 비해 온도와 시간에 안정적인 성향을 보이기 때문이나 IR에 비해 건조시간과 표면으로부터 열전달이 되는 관계로 기저부위의 감광성 수지의 휘발이 적어 노광시간 후 언더컷이 발생한다.However, in each process of forming a photo solder resist on a printed circuit board surface, an oven by hot air drying is generally used, which is intended to volatilize a solvent component contained in the photosensitive resin. Compared to IR, it shows stable tendency at temperature and time, but due to heat transfer from drying time and surface compared to IR, undercutting occurs after exposure time due to less volatilization of photosensitive resin at the base part.
이에 비해 적외선은 복사에너지를 사용하므로 동일 온도에서 짧은 시간에 건조를 완료할 수 있는 장점은 있으나, 안정성이 떨어진다는 결점이 있다.On the other hand, infrared uses radiant energy, but drying may be completed in a short time at the same temperature.
특히, 적외선 램프에서 발생되는 자외선(UV:Ultra Violet)가 조사되면서 과도한 노광이 이루어져 안정성이 저하된다는 결점이 있다.In particular, the ultraviolet light (UV: Ultra Violet) generated from the infrared lamp is irradiated with excessive exposure is a disadvantage that the stability is lowered.
본 고안은 상기와 같은 종래의 결점을 해결하기 위하여 안출된 것으로서, 인쇄회로기판 표면에 형성되는 포토 솔더 레지스트(Photo Solder Resist)의 해상도를 높이면서도 안정성을 높일 수 있고, 포토 솔더 레지스트를 형성하는 각 단계에서 적외선 건조시 자외선에 의해 인쇄회로기판과 포토 솔더 레지스트 등이 들뜨는 것(under-cut)을 방지할 수 있도록 IR램프의 하단에 필터를 설치하여서 된 것으로서 이하 본 고안을 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.The present invention has been made to solve the above-mentioned drawbacks, and can increase the stability of the photo solder resist (Photo Solder Resist) formed on the surface of the printed circuit board, while increasing the stability, each forming the photo solder resist In order to prevent under-cut of the printed circuit board and photo solder resist by ultraviolet rays during the infrared drying in the step, the filter is installed at the bottom of the IR lamp. The explanation is as follows.
도1은 본 고안에 따른 인쇄회로기판의 포토 솔더 레지스트의 건조과정을 설명하기 위한 개략 측 단면도1 is a schematic side cross-sectional view for explaining a drying process of a photo solder resist of a printed circuit board according to the present invention
※ 도면의 주요 부분에 대한 부호의 설명 ※※ Explanation of code about main part of drawing ※
1 : 적외선 램프 2 : 색상필터1: infrared lamp 2: color filter
3 : 인쇄회로기판3: printed circuit board
인쇄회로기판의 포토 솔더 레지스트 건조시 사용되는 램프를 IR 적외선 램프(1)를 설치하되 그 하단에 UV차단용 필터를 설치하여서 된 것이다.The lamp used to dry the photo solder resist of the printed circuit board is installed by installing an IR infrared lamp (1), but the UV blocking filter at the bottom thereof.
상기 제1단계는 적외선 램프로부터 조사되는 적외선 중 자외선을 필터링한 적외선을 열원으로 하는 75 내지 85℃의 열풍으로 감광성 수지를 건조하도록 함이 적절하다.In the first step, it is appropriate to dry the photosensitive resin with hot air at 75 to 85 ° C. using infrared rays filtered through ultraviolet rays among infrared rays irradiated from the infrared lamp.
상기 적외선 램프로부터 조사되는 적외선 중 자외선을 필터링하는 필터는 적외선에 포함된 자외선을 필터링할 수 있는 녹색필터 또는 황색필터를 사용하는 것이 적절하다.As the filter for filtering ultraviolet rays among the infrared rays emitted from the infrared lamp, it is appropriate to use a green filter or a yellow filter capable of filtering the ultraviolet rays contained in the infrared rays.
이하, 본 고안의 바람직한 일 실시예를 예시도면과 함께 보다 상세히 설명한다.Hereinafter, a preferred embodiment of the present invention will be described in more detail with an exemplary drawing.
본 고안은 도1에 도시한 것처럼, 표면에 소정의 패턴회로가 형성되고 그 위에 감광성 수지가 도포된 인쇄회로기판(3)이 적외선 램프(1)의 하단에 고정 설치되어 있고, 이 인쇄회로기판(3)의 상부에는 적외선 파장을 조사할 수 있도록 이로부터 소정거리 이격되게 적외선 램프(1)를 설치하며, 인쇄회로기판(3) 상부에는 인쇄회로기판(3)과 근접되게 필림이 설치되어 있고, 이 인쇄회로기판(3)과 적외선 램프(1) 사이에는 소정 주파수 대역의 자외선 파장을 차단하기 위한 녹색필터 혹은 황색필터 등의 색상필터(2)를 설치하여서 된 것이다.In the present invention, as shown in Fig. 1, a printed circuit board 3 having a predetermined pattern circuit formed on the surface thereof and a photosensitive resin applied thereon is fixedly installed at the lower end of the infrared lamp 1, and this printed circuit board is provided. The upper part of the (3) is installed with an infrared lamp (1) spaced apart from the predetermined distance so as to irradiate the infrared wavelength, the upper part of the printed circuit board (3) is provided with a film in close proximity to the printed circuit board (3) The color filter 2, such as a green filter or a yellow filter, is provided between the printed circuit board 3 and the infrared lamp 1 to block the ultraviolet wavelength of a predetermined frequency band.
이와 같은 구성에 의한 포토 솔더 레지스트의 건조과정을 설명한다.The drying process of the photo solder resist by this structure is demonstrated.
적외선램프(1)의 하단에 인쇄회로기판을 올려놓은 다음 적외선램프를 점등시키면 적외선 램프(1)로부터 조사되는 적외선 중 자외선을 색상필터(2)에 의해 필터링한 적외선을 열원으로 하는 75 내지 85℃의 적외선으로 인쇄회로기판(3)의 전면을 15분간 가해 인쇄회로기판(3)에 도포된 감광성 수지 중에 포함되어 있는 휘발성의 솔벤트 성분을 증발시키게 되는 것이다.When the printed circuit board is placed on the lower end of the infrared lamp 1 and the infrared lamp is turned on, the infrared light filtered from the infrared lamp 1 by the color filter 2 is used as a heat source. The front surface of the printed circuit board 3 is applied for 15 minutes with infrared light to evaporate the volatile solvent component contained in the photosensitive resin applied to the printed circuit board 3.
상기와 같이 본 고안은 모든 건조과정을 적외선 램프(1)로 건조하되 적외선램프와 인쇄회로기판(3) 사이에 소정 파장의 자외선을 필터링할 수 있는 녹색 혹은 황색 등의 색상필터(2)를 설치하여서 된 것이다.As described above, the present invention is to dry all the drying process with an infrared lamp (1), but between the infrared lamp and the printed circuit board (3) is installed a color filter (2), such as green or yellow, which can filter ultraviolet rays of a predetermined wavelength It was done.
즉 적외선 램프(1)에서 발생되는 적외선 파장 중 불필요한 자외선 파장이 색상필터(2)에 의해 필터링되고 300 내지 400nm의 적외선 파장만이 색상필터(2)를 통과하여 인쇄회로기판(3) 표면에 조사되어 건조되도록한 것이다.That is, unnecessary ultraviolet wavelengths among the infrared wavelengths generated by the infrared lamp 1 are filtered by the color filter 2, and only 300-400 nm infrared wavelengths pass through the color filter 2 and irradiate the surface of the printed circuit board 3. It will be dried.
이상과 같이 본 고안은 적외선 건조시 자외선에 의해 인쇄회로기판과 포토 솔더 레지스트 등이 들뜨는 것(under-cut)을 방지할 수 있도록 IR램프의 하단에 필터를 설치하여서 된 것으로서, 구조가 간단하여 제작이 용이하고 램프에서 발산되는 UV광선을 차단하여 기판을 건조시킴으로서 제품의 불량을 최소로 줄여 생산량을 극 대회 시킬수 있는 유용한 고안인 것이다.As described above, the present invention is made by installing a filter at the bottom of the IR lamp to prevent under-cut of the printed circuit board and photo solder resist by ultraviolet rays during infrared drying. It is easy and it is a useful design that can maximize the production by minimizing the defect of the product by drying the substrate by blocking the UV light emitted from the lamp.
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000006432A KR100334338B1 (en) | 2000-02-11 | 2000-02-11 | Photo Solder Resist drying method of Printed Circuit Board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000006432A Division KR100334338B1 (en) | 2000-02-11 | 2000-02-11 | Photo Solder Resist drying method of Printed Circuit Board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200189113Y1 true KR200189113Y1 (en) | 2000-07-15 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000006432A KR100334338B1 (en) | 2000-02-11 | 2000-02-11 | Photo Solder Resist drying method of Printed Circuit Board |
| KR2020000003625U KR200189113Y1 (en) | 2000-02-11 | 2000-02-11 | Photo solder resist drying method of printed circuit board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000006432A KR100334338B1 (en) | 2000-02-11 | 2000-02-11 | Photo Solder Resist drying method of Printed Circuit Board |
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| KR (2) | KR100334338B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100340432B1 (en) * | 2000-08-31 | 2002-06-12 | 이형도 | A method for developing photo solder resist of bga board |
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2000
- 2000-02-11 KR KR1020000006432A patent/KR100334338B1/en not_active IP Right Cessation
- 2000-02-11 KR KR2020000003625U patent/KR200189113Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR20000036342A (en) | 2000-07-05 |
| KR100334338B1 (en) | 2002-04-25 |
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