JP2743100B2 - Manufacturing method of printed circuit board, photo solder resist and solder resist ink - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a method of manufacturing a printed circuit board for mounting and marking chip components and the like, and a photo solder resist or a solder resist ink for forming a permanent protective film on the substrate.

2. Description of the Related Art Conventionally, on a printed circuit board, after forming a wiring pattern on the substrate, a permanent protective film is formed on the substrate using a photo solder resist or a solder resist ink.

Thereafter, a symbol, a character, or a marking for indicating a chip component mounted on the permanent protective coating is formed.

[Problem to be Solved by the Present Invention] In a conventional method for manufacturing a printed circuit board, after a photo solder resist or a solder resist ink is cured to form a permanent protective film, marking printing is performed, and the marking printing is dried and cured. There is a drawback that the work is required, the production is troublesome and time-consuming, and the cost is high.

In addition, since marking printing is performed by screen printing after forming the permanent protective film, there is a disadvantage that the accuracy of the marking printing position is poor.

The present invention has been made in view of the above-mentioned conventional drawbacks, and can form a permanent protective film and a symbol or a character easily, in a short time, and can form a symbol or a character at a highly accurate position, and It is an object of the present invention to provide a low-cost method for manufacturing a printed circuit board.

Means for Solving the Problems In order to achieve the above object, the present invention provides a pattern forming step of forming a wiring pattern on a substrate and, after this pattern forming step, color formation by exposure of a different wavelength on a substrate including the wiring pattern. A photo solder resist film forming step of forming a photo solder resist film capable of decoloring or discoloring; a film forming exposing step of performing an exposure for forming a permanent protective film after the photo solder resist film forming step; Appearance of characters and the like that develops, decolors, or discolors such that symbols or characters are formed by exposure at a wavelength different from the exposure in the film formation exposure step on the permanent protective film portion after the exposure step, and the appearance of the characters and the like A post-processing step of performing development, washing, drying, etc. after the exposure step constitutes a method of manufacturing a printed circuit board.

Further, the present invention provides a pattern forming step of forming a wiring pattern on a substrate, and a photo solder resist film that can be colored, decolored or discolored by exposure with different irradiation doses on the substrate including the wiring pattern after the pattern forming step. A photo solder resist film forming step of forming, and a film forming exposure step of performing exposure for forming a permanent protective film after the photo solder resist film forming step,
After the film forming exposure process, the permanent protective film site is exposed to light having a different irradiation dose from the exposure in the film forming exposure process to form a symbol, a character, or the like. Development after the exposure process
A post-processing step of washing, drying, and the like constitutes a printed circuit board manufacturing method.

[Operation] In the method of manufacturing a printed circuit board configured as described above, after forming the permanent protective film, symbols, characters, and the like can appear on the permanent protective film by exposure to light of different wavelengths.

"Examples of the present invention" Hereinafter, the present invention will be described in detail with reference to examples shown in the drawings.

1 to 8, reference numeral 1 denotes a pattern forming step for forming a wiring pattern 3 on a substrate 2, and this pattern forming step 1 is performed as shown in FIGS. 2 and 3.
The wiring pattern 3 is formed on the substrate 2 by using the same method as in the related art.

Reference numeral 4 denotes a photo solder resist film forming step of forming a photo solder resist film 5 having a predetermined thickness on the substrate 2 including the wiring pattern 3. The photo solder resist film forming step 4 is as shown in FIG. A photo solder resist film 5 is formed on almost the entire surface by printing using a screen printing plate having no image or by roll coating.

The photo solder resist used in the photo solder resist film forming step 4 is mixed at a predetermined ratio with a pre-selected photo solder resist agent that is cured by, for example, exposure to a wavelength of 300 nm or more, and the photo solder resist agent. Further, a photo-soldering resist which is different from the curing wavelength of the photo-solder resist, for example, a color developing agent which is colored, decolored or discolored by exposure to a wavelength of 300 nm or less is used.

As the photo solder resist agent, a thermosetting type such as a melamine, an alkyd type, and an epoxy-based one-pack type or an ultraviolet curable type is used.

Examples of the coloring agent include photochromic compounds such as spiropyran, fulgide, triphenylimidazolyl, viologen, benzothiopyran, benzothiazoline, dithienylethyne, and spirooxazine.

Note that a coloring agent other than the photochromic compound may be used.

Reference numeral 6 denotes a film forming exposure step for performing exposure for forming a permanent protective film 7 on the substrate 2 on which the photo solder resist film 5 has been formed. As shown in FIG. A positive film 9 on which an image 8 to be formed is formed, and a wavelength selection filter 10 which is provided on the positive film 9 and transmits ultraviolet rays having a wavelength of, for example, 300 nm or more, are positioned on the photo solder resist coating 5. Exposure to ultraviolet light of 300 nm or more for a predetermined time cures the permanent protective film 7.

Reference numeral 11 denotes an appearance exposure step for characters and the like formed by coloring, decoloring, or discoloring symbols and characters on the permanent protective coating 7 cured after the film formation exposure step 6. As shown in FIG. 6, a negative film 12 capable of forming symbols and characters made of a special material, for example, a material that transmits ultraviolet light up to 250 nm, on the permanent protective film 7.
Is performed for a predetermined period of time with ultraviolet rays up to 250 nm, whereby a symbol, character, or the like 13 which is colored, erased, or discolored appears on the cured permanent protective film 7.

Reference numeral 14 denotes a post-processing step in which a development step 15, a water-washing step 16, a drying step 17 and the like are sequentially performed after the above-mentioned character appearance exposure step 11, and the uncured portion of the photo solder resist is formed on the substrate 2 by the post-processing step 14. The printed circuit board 18 is formed on which the permanent protective film 7 on which symbols and characters have appeared as shown in FIGS. 7 and 8 is peeled off.

"Different Embodiments of the Present Invention" Next, different embodiments of the present invention shown in FIGS. 9 to 15 will be described. In the description of these embodiments, the same components as those of the embodiment of the present invention will be denoted by the same reference numerals, and redundant description will be omitted.

9 and 10 are mainly different from the embodiment of the present invention described above in that the permanent protective film 7 and the special positive / negative for forming the symbols and characters 13 after the photo solder resist film forming step 4 are formed. An exposure step 20 by ultraviolet irradiation using the film 19 is performed, and at the same time, the permanent protective coating 7 is cured at the same time, and symbols, characters, etc. 13 are formed on the cured part by coloring, decoloring or discoloring.

By performing the exposure step 20 to manufacture the printed circuit board 18, the permanent protective film 7 and the symbols and characters 13 can be formed in one exposure step, and the printed circuit board 18 can be easily manufactured.

11 to 15 mainly differs from the embodiment of the present invention in that a solder resist ink capable of forming, decoloring or discoloring the permanent protective film 7 by exposure to different wavelengths is used. After performing a permanent protective film forming step 21 for forming on the substrate 2 including the wiring pattern 3 by screen printing, a permanent protective film curing step 22 for curing the permanent protective film 7 by irradiating ultraviolet rays or the like, and a cured permanent protective film The point that the exposure step 11 of appearance of characters and the like by coloring, decoloring, or discoloring so as to become a symbol or a character 13 from FIG.
1, permanent protective film curing step 22, appearance step of characters and the like exposure step 11
The printed circuit board 18 may be manufactured using the method described above.

The permanent protective coating curing step 22 and the appearance exposure step of characters and the like
11 may be performed by one irradiation of ultraviolet rays.

In the above-described embodiments of the present invention, exposure using ultraviolet rays having different wavelengths has been described. However, the present invention is not limited to this, and other wavelengths may be used.

In addition, a printed circuit board may be manufactured using a photo solder resist or a solder resist ink capable of forming, erasing, or discoloring symbols and characters while forming a permanent protective film by exposure with different irradiation doses. .

"Effects of the present invention" As is clear from the above description, the following effects can be obtained in the present invention.

(1) A pattern forming step of forming a wiring pattern on a substrate, and a photo for forming a photo solder resist film capable of developing, decoloring or discoloring by exposure of different wavelengths on the substrate including the wiring pattern after the pattern forming step. A solder resist film forming step, a film forming exposure step of performing an exposure for forming a permanent protective film after the photo solder resist film forming step, and an exposure of the film forming and exposing step to a permanent protective film portion after the film forming exposure step It consists of an exposure step for the appearance of a character or the like that is colored, erased or discolored so as to become a symbol or a character by exposure at a different wavelength, and a post-processing step of developing, washing, drying, etc. after the exposure step for the appearance of the character or the like Therefore, it is possible to easily form a permanent protective film, symbols, characters, and the like. Therefore, the manufacturing cost can be reduced.

(2) According to the above (1), since symbols, characters, and the like can be formed by a photographic method, the dimensional accuracy of the characters and the like can be improved.

(3) According to the above (1), it is unnecessary to heat or ultraviolet cure after marking printing as in the related art for forming characters and the like, so that it can be manufactured in a short time.

(4) Claims 2, 3, and 4 also provide the same effects as (1) to (3).

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process drawing showing one embodiment of the present invention, FIGS. 2 and 3 are explanatory diagrams of a pattern forming process, and FIG. 4 is an explanatory diagram of a photo solder resist film forming process. , FIG. 5 is an explanatory view of a film forming exposure step, FIG. 6 is an explanatory view of an exposure step of appearance of characters and the like, FIG. 7 and FIG. FIG. 10, FIG. 10, and FIG. 11 to FIG. 15 are explanatory views showing different embodiments of the present invention. DESCRIPTION OF SYMBOLS 1 ... Pattern forming process, 2 ... Substrate, 3 ... Wiring pattern, 4 ... Photo solder resist film forming process, 5 ... Photo solder resist film, 6 ... Film forming exposure process, 7 ... Permanent protective film , 8 ... Image, 9 ... Positive film, 10 ... Wavelength selection filter, 11 ... Exposure exposure step for characters, etc., 12 ... Negative film, 13 ... Characters, etc. 14 ... Post-processing step, 15 ... … Development process, 16… Washing process, 17… Drying process, 18 …… Printed circuit board, 19 …… Special positive, negative film, 20 …… Exposure process, 21 …… Permanent protective film forming process, 22 …… Permanent Protective film curing process.

Claims (7)

(57) [Claims] 1. A pattern forming step for forming a wiring pattern on a substrate, and after the pattern forming step, a photo solder resist film capable of developing, decoloring or discoloring by exposure of different wavelengths on the substrate including the wiring pattern. A photo solder resist film forming step, a film forming exposure step of exposing to form a permanent protective film after the photo solder resist film forming step, and an exposure of the film forming and exposing step to a permanent protective film portion after the film forming exposure step An appearance exposure step of a character or the like that is colored, erased or discolored so as to become a symbol or a character by exposure at a wavelength different from the exposure step, and a post-processing step of performing development, washing, drying, etc. after the exposure step of the character or the like A method for manufacturing a printed circuit board, comprising: 2. A wiring pattern forming step for forming a wiring pattern on a substrate, and a photo solder resist film capable of developing, decoloring or discoloring by exposure of different wavelengths on the substrate including the wiring pattern after the pattern forming step. Forming a photo solder resist film,
After the photo solder resist film forming step, a permanent protective film is formed by exposing using a wavelength selection filter and a positive film to form a permanent protective film, and after the film forming and exposing step, a special negative film is used for a permanent protective film portion. And a post-processing step of developing, washing with water, drying and the like after the character and the like appearing and decoloring or discoloring so as to become a symbol or a character. Manufacturing method of printed circuit board. 3. A pattern forming step of forming a wiring pattern on a substrate, and after this pattern forming step, a photo solder resist film capable of developing, decoloring or discoloring by exposure of different wavelengths to the substrate including the wiring pattern is formed. Photo solder resist film forming step, and after this photo solder resist film forming step, a special body,
The method includes a step of forming a permanent protective film by exposure using a negative / multipurpose film and a symbol or a character by coloring, decoloring or discoloring, and a post-processing step of performing development, washing, drying and the like after the exposure step. Characteristic printed circuit board manufacturing method. 4. A pattern forming step for forming a wiring pattern on a substrate, and a photo solder resist film capable of developing, decoloring or discoloring by exposure with different irradiation doses on the substrate including the wiring pattern after the pattern forming step. Forming a photo solder resist film,
A film forming exposure step of performing an exposure for forming a permanent protective film after the photo solder resist film forming step, and an exposure of the film forming and exposing step on the permanent protective film portion after the film forming and exposing step are performed by different exposure amounts. A print characterized by including a step of exposing a character or the like to be colored, decolored, or discolored so as to form a color or a character, and a post-processing step of performing development, washing, drying, etc. after the step of exposing the character or the like. Substrate manufacturing method. 5. A pattern forming step of forming a wiring pattern on a substrate, and after this pattern forming step, a permanent protective film is colored, decolored or discolored on a substrate including the wiring pattern by exposure to light of different wavelengths or to different amounts of irradiation. A permanent protective film forming step formed by screen printing using a solder resist ink capable of being cured, a permanent protective film curing step of curing the permanent protective film after the permanent protective film forming step, and a symbol after the permanent protective film curing step And a process of exposing a character or the like that develops, erases, or changes its color to become a character or a character. 6. A photo-solder resist agent that is cured by exposure at a wavelength selected in advance, and a color formed by exposure at a wavelength different from the exposure at a wavelength that cures the photo-solder resist agent mixed with the photo solder resist agent. What is claimed is: 1. A photo solder resist comprising a color developing agent capable of decoloring or discoloring. 7. A solder resist ink agent which is cured by exposure at a wavelength selected in advance, and a color formed by exposure at a wavelength different from the exposure at a wavelength which cures the solder resist ink agent mixed with the solder resist ink agent. A solder resist ink comprising a decoloring or discoloring color forming agent.