KR200183546Y1 - Semiconductor wafer sawing apparatus - Google Patents
Semiconductor wafer sawing apparatus Download PDFInfo
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- KR200183546Y1 KR200183546Y1 KR2019970039474U KR19970039474U KR200183546Y1 KR 200183546 Y1 KR200183546 Y1 KR 200183546Y1 KR 2019970039474 U KR2019970039474 U KR 2019970039474U KR 19970039474 U KR19970039474 U KR 19970039474U KR 200183546 Y1 KR200183546 Y1 KR 200183546Y1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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Abstract
본 고안은 반도체 웨이퍼 소잉장치에 관한 것으로, 본 고안은 접착제가 묻어 있는 스틱키 테이프에 부착된 웨이퍼가 컷팅시 안착되는 컷팅 테이블과, 상기 컷팅 테이블 상의 석정반 상부에 수평 방향으로 배치되어 별도의 구동 수단에 의해 전진 및 후진하면서 컷팅시 구동하는 제1,2스핀들 모터와, 상기 제1,2스핀들 모터의 모터축에 설치되어 제1,2스핀들 모터의 구동에 의해 회전하여 웨이퍼를 절단하기 위한 제1,2블레이드가 구비되는 반도체 와이어 소잉장치에 있어서, 상기 제1,2스핀들 모터가 컷팅 테이블 상의 제1,2석정반 상부에 상호 직각 방향으로 배치되어 상기 제1,2스핀들 모터의 구동에 의해 제1,2블레이드가 회전하여 웨이퍼를 수평 및 수직 방향으로 동시에 절단시키도록 된 것을 그 특징으로 한다.The present invention relates to a semiconductor wafer sawing apparatus. The present invention relates to a cutting table on which a wafer attached to an adhesive-stick stick key tape is seated upon cutting, and is disposed in a horizontal direction on a top of a stone plate on the cutting table to drive a separate drive. First and second spindle motors driven at the time of cutting while moving forward and backward by means, and provided to motor shafts of the first and second spindle motors to rotate by driving the first and second spindle motors to cut the wafer. In the semiconductor wire sawing device provided with the first and second blades, the first and second spindle motors are disposed at right angles to the first and second stone platforms on the cutting table, and are driven by the first and second spindle motors. The first and second blades are rotated to simultaneously cut the wafer in the horizontal and vertical directions.
따라서, 웨이퍼를 수평 및 수직 방향으로 동시에 컷팅시킬 수 있는 한편, 웨이퍼를 컷팅시 웨이퍼를 회전시키지 않아도 됨에 따른 컷팅시의 소요되는 시간을 대폭 효율적으로 단축시킬 수 있게 된다.Therefore, the wafer can be cut simultaneously in the horizontal and vertical directions, and the time required for cutting can be significantly reduced effectively because the wafer is not rotated when the wafer is cut.
Description
본 고안은 반도체 웨이퍼 소잉장치에 관한 것으로서, 더욱 상세하게는 반도체 제조공정중 웨이퍼를 절단하기 위한 웨이퍼 소잉장치에서 웨이퍼를 동시에 양방향으로 절단시킬 수 있도록 한 것이다.The present invention relates to a semiconductor wafer sawing device, and more particularly to a wafer sawing device for cutting a wafer in a semiconductor manufacturing process to simultaneously cut the wafer in both directions.
일반적으로, 반도체 제조 공정중 반도체 웨이퍼 소잉(Sawing) 장치는 웨이퍼의 전면을 사각형의 칩으로 절단하기 위한 장치로서, 상기 반도체 웨이퍼 소잉장치에서 소잉 작업을 하기 위해서는 웨이퍼를 접착제가 묻어 있는 스틱키 테이프(Sticky Tape)에 붙이고(이것을 웨이퍼 마운팅이라고 한다). 이 스틱키 테이프를 컷팅 테이블 위에 얹어 진공으로 흡착시킨 후 부분 또는 완전 절단하여 다음 공정으로 넘기게 된다.In general, a semiconductor wafer sawing device during a semiconductor manufacturing process is a device for cutting the entire front surface of the wafer into rectangular chips. In order to perform the sawing operation in the semiconductor wafer sawing device, a sticky tape in which the wafer is glued ( Sticky Tape) (this is called wafer mounting). The sticky tape is placed on a cutting table, adsorbed by vacuum, then partially or completely cut and passed to the next step.
제1도는 종래 반도체 웨이퍼 소잉장치에서 웨이퍼를 컷팅하기 위한 블레이드가 1개의 컷팅 라인을 컷팅시의 상태를 나타낸 평면도이고, 제2도는 종래 반도체 웨이퍼 소잉장치에서 웨이퍼를 컷팅하기 위한 블레이드가 2개의 컷팅 라인을 컷팅시의 상태를 나타낸 평면도로서, 컷팅 테이블(2a)상에 석정반(3a)에 의해 지지되는 제1,2스핀들 모터(5a)(6a)가 평향한 상태로 설치되어 상기 커팅 테이블(2a)상에 안착된 웨이퍼(1)를 컷팅시 상기 제1,2스핀들 모터(5a)(6a)가 구동함에 따라 각각의 모터축(7)이 회전하게 됨과 동시에 모터축(7)의 끝단에 설치되어 있는 다이아몬드 툴인 제1,2볼스크류(8a)(9a)가 회전하여 수평 방향의 컷팅을 완료한 후, 상기 컷팅 테이블(2a)이 90° 회전함에 따라 웨이퍼(1)가 90° 회전을 하여 수직 방향의 컷팅을 진행하게 된다.1 is a plan view showing a state in which a blade for cutting a wafer in a conventional semiconductor wafer sawing apparatus is cut at one cutting line, and FIG. 2 is a diagram showing two cutting lines in a blade for cutting a wafer in a conventional semiconductor wafer sawing apparatus. Is a plan view showing a state at the time of cutting, wherein the first and second spindle motors 5a and 6a, which are supported by the stone slab 3a on the cutting table 2a, are installed in a flat state and the cutting table 2a is provided. The first and second spindle motors 5a and 6a are driven to cut the wafer 1 seated on the slit, so that each motor shaft 7 rotates and is installed at the end of the motor shaft 7. After the first and second ball screws 8a and 9a, which are diamond tools, are rotated to complete the cutting in the horizontal direction, the wafer 1 is rotated by 90 ° as the cutting table 2a is rotated by 90 °. The cutting in the vertical direction is performed.
이때, 제1도와 같이 제1,2블레이드(8a)(9a)가 동일선상에 배치된 상태에서는 상기 제1,2블레이드(8a)(9a)의 회전에 의해 웨이퍼(1)를 1개의 컷팅 라인(CL1)만 컷팅시키게 되고, 제2도와 같이 제1,2블레이드(8a)(9a)의 위치가 차이가 나도록 배치된 상태에서는 2개의 컷팅 라인(CL1)(CL2)을 동시에 컷팅시키게 된다.At this time, in the state where the first and second blades 8a and 9a are arranged on the same line as shown in FIG. 1, the cutting line 1 is cut by one of the cutting lines 1 by the rotation of the first and second blades 8a and 9a. Only CL1 is cut, and as shown in FIG. 2, two cutting lines CL1 and CL2 are simultaneously cut in a state in which the positions of the first and second blades 8a and 9a are different from each other.
한편, 제1,2스핀들 모터(5a)(6a)의 모터축(7)에는 웨이퍼(1)를 컷팅하고자 하는 작업 환경에 따라 임의로 각각 다른 직경을 갖는 블레이드 설치하여 컷팅 작업을 진행하기도 하고, 상기 제1,2스핀들 모터(5a)(6a)가 높이차를 갖도록 설치하여 컷팅 작업을 진행하기도 하며, 도시는 생략했으나 제1,2스핀들 모터(5a)(6a)는 석정반(3a) 상에서 별도의 구동 수단에 의해 전,후진하면서 컷팅 작업을 진행하게 된다.On the other hand, in the motor shaft 7 of the first and second spindle motors 5a and 6a, blades having different diameters may be arbitrarily installed according to a working environment to cut the wafer 1, and the cutting operation may be performed. The first and second spindle motors 5a and 6a may be installed to have a height difference, and the cutting operation may be performed. Although not illustrated, the first and second spindle motors 5a and 6a may be separately disposed on the stone platform 3a. The cutting means advances and reversals by the driving means.
그러나, 이와 같은 종래의 반도체 웨이퍼 소잉장치는 제1,2블레이드(8a)(9a)가 설치됨에도 불구하고 제1,2블레이드(8a)(9a) 사이의 거리(D) 만큼은 한 번의 동작을 통하여 웨이퍼(1)를 절단하는 것이 불가능하며, 제1,2블레이드(8a)(9a)를 장착하였다 하더라도 위치가 서로 평행한 상태로 설치되어 있을 때는 1개의 블레이드만을 장착한 소잉장치에 비하여 두배의 컷팅 스피드가 나오지 않게 되므로 작업시의 효율이 저하되었다.However, in the conventional semiconductor wafer sawing apparatus, although the first and second blades 8a and 9a are installed, the distance D between the first and second blades 8a and 9a is operated through one operation. It is impossible to cut the wafer 1, and even if the first and second blades 8a and 9a are mounted, the cutting is doubled compared to the sawing device having only one blade when the positions are installed in parallel with each other. As speed does not come out, efficiency at the time of work fell.
특히, 종래의 반도체 웨이퍼 소잉장치의 경우 제1,2블레이드(8a)(9a)의 수평 장착을 위한 최소한의 거리(D)가 반드시 필요하므로 인해 웨이퍼(1)의 크기가 작으면 작을수록 작업 성능이 떨어지게 되어 생산성이 저하되는 등의 많은 문제점이 있었다.In particular, the conventional semiconductor wafer sawing apparatus requires a minimum distance (D) for horizontal mounting of the first and second blades (8a) and (9a). Therefore, the smaller the size of the wafer 1, the smaller the performance. There have been many problems such as falling off productivity.
따라서, 본 고안의 목적은 상기한 제반 문제점을 해결하기 위한 것으로서, 반도체 제조 공정중 웨이퍼를 절단하기 위한 웨이퍼 소잉장치에서 웨이퍼를 동시에 양방향으로 컷팅시킬 수 있을 뿐만 아니라 웨이퍼를 컷팅시 웨이퍼를 회전시키지 않아도 됨에 따른 컷팅 시간을 크게 단축시킬 수 있도록 하여 작업 능률의 향상에 의한 생산성을 대폭 증대시킬 수 있는 반도체 웨이퍼 소잉장치를 제공하는데 그 목적이 있다.Accordingly, an object of the present invention is to solve the above-mentioned problems, and in the wafer sawing device for cutting a wafer during a semiconductor manufacturing process, the wafer can be simultaneously cut in both directions and the wafer is not rotated when the wafer is cut. It is an object of the present invention to provide a semiconductor wafer sawing apparatus capable of greatly shortening the cutting time due to the increase, thereby significantly increasing productivity by improving work efficiency.
제1도는 종래 반도체 웨이퍼 소잉장치에서 웨이퍼를 컷팅하기 위한 블레이드가 1개의 컷팅 라인을 컷팅시의 상태를 나타낸 평면도.1 is a plan view showing a state in which a blade for cutting a wafer in a conventional semiconductor wafer sawing device cuts one cutting line.
제2도는 종래 반도체 웨이퍼 소잉장치에서 웨이퍼를 컷팅하기 위한 블레이드가 2개의 컷팅 라인을 컷팅시의 상태를 나타낸 평면도.2 is a plan view showing a state in which a blade for cutting a wafer in a conventional semiconductor wafer sawing device cuts two cutting lines.
제3도는 본 고안을 나타낸 평면도.3 is a plan view showing the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 웨이퍼 2 : 컷팅 테이블1: wafer 2: cutting table
3 : 제1석정반 4 : 제2석정반3: 1st class 4: 2nd class
5 : 제1스핀들 모터 6 : 제2스핀들 모터5: first spindle motor 6: second spindle motor
7 : 모터축 8 : 제1블레이드7: motor shaft 8: first blade
9 : 제2블레이드 10 : 제1볼스크류9: 2nd blade 10: 1st ball screw
11 : 제2볼스크류 12 : 제1스텝모터11: 2nd Ball Screw 12: 1st Step Motor
13 : 제2스텝모터13: second step motor
상기한 목적을 달성하기 위해 본 고안은 접착제가 묻어 있는 스틱키 테이프에 부착된 웨이퍼가 컷팅시 안착되는 컷팅 테이블과, 상기 컷팅 테이블 상의 석정반 상부에 수평 방향으로 배치되어 별도의 구동 수단에 의해 전진 및 후진하면서 컷팅시 구동하는 제1,2스핀들 모터와, 상기 제1,2스핀들 모터의 모터축에 설치되어 제1,2스핀들 모터의 구동에 의해 회전하여 웨이퍼를 절단하기 위한 제1,2블레이드가 구비되는 반도체 웨이퍼 소잉장치에 있어서, 상기 제1,2스핀들 모터가 컷팅테이블 상의 제1,2석정반 상부에 상호 직각 방향으로 배치되어 상기 제1,2스핀들 모터의 구동에 의해 제1,2블레이드가 회전하여 웨이퍼를 수평 및 수직 방향으로 동시에 절단시키도록 된 것을 특징으로 하는 반도체 와이어 소잉장치가 제공되므로서 달성된다.In order to achieve the above object, the present invention provides a cutting table on which a wafer attached to an adhesive-stick stick key tape is seated upon cutting, and is disposed in a horizontal direction on an upper part of a stone plate on the cutting table and moved by a separate driving means. And first and second spindle motors driving backward when cutting, and first and second blades installed on the motor shafts of the first and second spindle motors to rotate by driving the first and second spindle motors to cut the wafer. In the semiconductor wafer sawing apparatus is provided, the first and second spindle motors are arranged on the cutting table on the first and second stone plate at right angles to each other by driving the first and second spindle motors. This is achieved by providing a semiconductor wire sawing device, characterized in that the blades are rotated to simultaneously cut the wafer in the horizontal and vertical directions.
여기서, 상기 컷팅 테이블은 고정된 상태로 설치되고, 상기 제1,2석정반의 하부에는 제1,2석정반을 수평 이동시키기 위한 수단이 더 구비된 것을 그 특징으로 한다.Here, the cutting table is installed in a fixed state, characterized in that the lower portion of the first and second stone plate is further provided with means for horizontally moving the first and second stone plate.
또한, 상기 수평 이동수단은 제1,2석정반의 하부에 설치되어 제1,2석정반의 하부와 맞물려 제1,2석정반의 수평 이동을 안내하기 위한 제1,2블레이드와, 상기 제1,2볼스크류의 각 단부에 설치되어 제1,2볼스크류를 회전시키는 동력을 발생시키기 위한 구동 수단으로 구성되는데, 이때 상기 구동 수단은 제1,2볼스크류를 정,역 방향으로 회전시키기 위한 동력을 발생시키는 제1,2스탭모터로 된 것을 그 특징으로 한다.In addition, the horizontal moving means is installed in the lower portion of the first and second stone plate, the first and second blades for guiding the horizontal movement of the first and second stone plate and the first and second stone plate, and the first and second It is provided at each end of the ball screw is composed of a drive means for generating a power for rotating the first and second ball screw, wherein the drive means is a power for rotating the first and second ball screw in the forward and reverse directions Characterized in that the first and second step motor to be generated.
따라서, 본 고안에 의하면, 반도체 제조 공정중 웨이퍼를 절단하기 위한 웨이퍼 소잉장치에서 웨이퍼를 수평 및 수직 방향으로 동시에 컷팅시킬 수 있는 한편, 웨이퍼를 컷팅시 웨이퍼를 회전시키지 않아도 됨에 따른 컷팅시의 소요되는 시간을 대폭 효율적으로 줄일 수 있게 된다.Therefore, according to the present invention, a wafer sawing device for cutting a wafer during a semiconductor manufacturing process can simultaneously cut the wafer in the horizontal and vertical directions, while cutting the wafer as the cutting does not require rotating the wafer. The time can be greatly reduced.
이하, 상기한 목적을 달성하기 위한 본 고안의 바람직한 실시예를 첨부 도면에 의거하여 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention for achieving the above object will be described in detail with reference to the accompanying drawings.
제3도는 본 고안을 나타낸 평면도로서, 종래의 기술과 동일한 부분에 대해서는 동일부호를 부여하여 본 고안을 설명한다.3 is a plan view showing the present invention, and the same parts as in the prior art will be described with the same reference numerals.
본 고안은 반도체 와이어 소잉장치의 접착제가 묻어 있는 스틱키 테이프에 부착된 웨이퍼(1)가 컷팅시 안착되는 컷팅 테이블(2)이 고정된 상태로 설치되고, 상기 컷팅 테이블(2)의 상부에는 상호 직각 방향으로 배치되어 각각 수평 방향으로 이동하는 제1,2석정반(3)(4)이 설치된다.The present invention is installed with the cutting table 2 fixed to the wafer 1 attached to the stick key tape on which the adhesive of the semiconductor wire sawing device is fixed, and fixed to the upper surface of the cutting table 2. First and second stone tablets 3 and 4 are arranged in the right angle and move in the horizontal direction, respectively.
또한, 제1,2석정반(3)(4) 상에는 제1,2스핀들 모터(5)(6)가 별도의 구동 수단(도시는 생략함)에 의해 전진 및 후진가능하도록 설치되고, 상가 제1,2스핀들 모터(5)(6)의 모터축(7)에는 각각 제1,2스핀들 모터(5)(6)의 구동에 의해 회전하여 웨이퍼(1)를 수평 및 수직 방향으로 절단시키기 위한 제1,2볼스크류(8)(9)가 설치된다.Further, the first and second spindle motors 5 and 6 are installed on the first and second stone shelves 3 and 4 so as to be movable forward and backward by separate driving means (not shown). The motor shaft 7 of the first and second spindle motors 5 and 6 rotates by driving the first and second spindle motors 5 and 6, respectively, to cut the wafer 1 in the horizontal and vertical directions. First and second ball screws 8 and 9 are provided.
그리고, 상기 제1,2석정반(3)(4)의 하부에는 제1,2석정반(3)(4)의 하부와 맞물려 제1,2석정반(3)(4)의 수평 이동을 안내하기 위한 제1,2볼스크류(10)(11)가 설치되며, 상기 제1,2볼스크류(10)(11)의 각 단부에는 제1,2볼스크류(10)(11)를 정,역 방향으로 회전시키기 위한 동력을 발생시키는 제1,2스텝모터(12)(13)가 설치되어 구성된다.In addition, a lower portion of the first and second stone tablets 3 and 4 is engaged with a lower portion of the first and second crystal tablets 3 and 4 so as to horizontally move the first and second stone tablets 3 and 4. First and second ball screws 10 and 11 are provided for guiding, and first and second ball screws 10 and 11 are defined at each end of the first and second ball screws 10 and 11. The first and second step motors 12 and 13 for generating power for rotating in the reverse direction are provided.
상기와 같이 구성된 본 고안은 제3도에 나타낸 바와 같이, 반도체 와이어 소잉장치의 접착제가 묻어 있는 스틱키 테이프에 부착된 웨이퍼(1)가 안착되는 컷팅 테이블(2)이 고정된 상태로 설치되고, 컷팅 테이블(2)의 상부에 설치되어 상호 직각 방향으로 배치되도록 각각 수평 방향으로 이동하는 제1,2석정반(3)(4) 상에는 제1,2스핀들 모터(5)(6)가 별도의 구동 수단(도시는 생략함)에 의해 전진 및 후진가능하도록 설치된 상태에서 웨이퍼(1)를 절단하고자 할 때에는 우선, 상기 컷팅 테이블(2)의 상부에 웨이퍼(1)를 안착시키면 상기 제1,2석정반(3)(4)의 하부에 설치되어 제1,2석정반(3)(4)의 하부와 맞물려 제1,2석정반(3)(4)의 수평 이동을 안내하기 위한 제1,2볼스크류(10)(11)의 각 단부에 설치되어 있는 제1,2스텝모터(12)(13)가 구동하게 된다.According to the present invention configured as described above, as shown in FIG. 3, the cutting table 2 on which the wafer 1 adhered to the stick key tape on which the adhesive of the semiconductor wire sawing device is buried is mounted is fixed. The first and second spindle motors 5 and 6 are provided on the first and second stone platform 3 and 4 which are installed at the upper part of the cutting table 2 and move in the horizontal direction so as to be disposed at right angles to each other. When the wafer 1 is to be cut in a state where the driving means (not shown) is installed to be capable of moving forward and backward, first, when the wafer 1 is seated on an upper portion of the cutting table 2, the first and the second First to be installed in the lower portion of the stone plate (3) (4) to engage the lower portion of the first and second stone plate (3) (4) to guide the horizontal movement of the first and second stone plate (3) (4) The first and second step motors 12 and 13 provided at each end of the two ball screws 10 and 11 are driven.
이와 동시에, 상기 제1,2볼스크류(10)(11)가 정,역 방향으로 회전하게 됨에 따라 상기 제1,2석정반(3)(4)이 상기 제1,2볼스크류(10)(11)의 안내에 의해 좌,우방향으로 이동하게 됨과 동시에, 상기 제1,2석정반(3)(4) 상에 별도의 구동 수단에 의해 전진 및 후진가능하도록 설치된 제1,2스핀들 모터(5)(6)가 구동함에 따라 제1,2스핀들 모터(5)(6)의 모터축(7)에 각각 설치된 제1,2블레이드(8)(9)가 전,후진하는 한편, 회전함에 따라 컷팅 테이블(2) 상에 안착된 웨이퍼(1)를 수평 및 수직 방향으로 동시에 절단할 수 있다.At the same time, as the first and second ball screws 10 and 11 are rotated in the forward and reverse directions, the first and second stone plates 3 and 4 become the first and second ball screws 10. The first and second spindle motors which are moved in the left and right directions by the guidance of (11), and which are installed on the first and second stone platforms 3 and 4 so as to be moved forward and backward. (5) As the 6 drives, the first and second blades 8 and 9 installed on the motor shaft 7 of the first and second spindle motors 5 and 6 respectively move forward and backward while rotating. As a result, the wafer 1 seated on the cutting table 2 may be simultaneously cut in the horizontal and vertical directions.
즉, 본 발명은 웨이퍼(1)의 컷팅시 상기 컷팅 테이블(2)은 고정된 상태에서 상기 제1,2석정반(3)(4)이 좌,우 방향으로 이동함과 동시에, 제1,2스핀들 모터(5)(6)가 별도의 구동 수단에 의해 전,후진하면서 구동함에 따라 제1,2블레이드(8)(9)의 회전에 의해 웨이퍼(1)를 수평 및 수직 방향으로 동시에 컷팅시켜 컷팅작업을 완료할 수 있게 되는 것이다.That is, in the present invention, when the cutting table 2 is fixed when the wafer 1 is cut, the first and second stone plates 3 and 4 move in the left and right directions, Cutting the wafer 1 simultaneously in the horizontal and vertical directions by the rotation of the first and second blades 8 and 9 as the two-spindle motors 5 and 6 are driven forward and backward by separate driving means. It will be able to complete the cutting work.
이상에서와 같이, 본 고안은 반도체 제조 공정중 웨이퍼를 절단하기 위한 웨이퍼 소잉장치에서 웨이퍼를 수평 및 수직 방향으로 동시에 컷팅시킬 수 있는 한편, 웨이퍼를 컷팅시 웨이퍼를 회전시키지 않아도 됨에 따른 컷팅 시간을 크게 단축시킬 수 있으므로써 작업 능률의 향상에 의한 생산성을 대폭 증대시킬 수 있으므로 인해 장치의 효율성 및 신뢰성을 대폭 향상시킨 매우 유용한 고안이다.As described above, the present invention can simultaneously cut the wafer in the horizontal and vertical directions in the wafer sawing apparatus for cutting the wafer during the semiconductor manufacturing process, while greatly reducing the cutting time due to the need not to rotate the wafer when cutting the wafer. It is a very useful design that can greatly improve the efficiency and reliability of the device because it can greatly increase the productivity by improving the work efficiency.
이상에서는 본 고안의 바람직한 실시예를 도시하고 또한 설명하였으나, 본 고안은 상기한 실시예에 한정되지 않고, 이하 청구범위에서 청구하는 본 고안의 요지를 벗어남이 없이 당해 고안이 속하는 기술 분야에서 통상의 지식을 가진자라면 누구든지 다양한 변경 실시가 가능할 것이다.Although the above has shown and described a preferred embodiment of the present invention, the present invention is not limited to the above-described embodiment, it is common in the technical field to which the subject innovation belongs without departing from the gist of the subject innovation claimed in the claims below. Anyone with knowledge will be able to make various changes.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970039474U KR200183546Y1 (en) | 1997-12-22 | 1997-12-22 | Semiconductor wafer sawing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970039474U KR200183546Y1 (en) | 1997-12-22 | 1997-12-22 | Semiconductor wafer sawing apparatus |
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| Publication Number | Publication Date |
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| KR19990026920U KR19990026920U (en) | 1999-07-15 |
| KR200183546Y1 true KR200183546Y1 (en) | 2000-06-01 |
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| KR2019970039474U KR200183546Y1 (en) | 1997-12-22 | 1997-12-22 | Semiconductor wafer sawing apparatus |
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| KR (1) | KR200183546Y1 (en) |
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