KR200173896Y1 - 다중 스핀들을 이용한 웨이퍼 절단장치 - Google Patents
다중 스핀들을 이용한 웨이퍼 절단장치 Download PDFInfo
- Publication number
- KR200173896Y1 KR200173896Y1 KR2019970038797U KR19970038797U KR200173896Y1 KR 200173896 Y1 KR200173896 Y1 KR 200173896Y1 KR 2019970038797 U KR2019970038797 U KR 2019970038797U KR 19970038797 U KR19970038797 U KR 19970038797U KR 200173896 Y1 KR200173896 Y1 KR 200173896Y1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- cutting
- spindle
- spindles
- cutters
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 34
- 239000004575 stone Substances 0.000 claims abstract description 12
- 230000002950 deficient Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 22
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (1)
- 커팅 테이블의 양측에 대칭되게 설치된 석정반과, 상기 석정반의 일직선상에 위치되게 각각 설치되어 구동하는 스핀들과, 상기 스핀들에 회전가능하게 설치되어 웨이퍼를 절단하는 커터로 구성된 다중 스핀들을 이용한 웨이퍼 절단장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019970038797U KR200173896Y1 (ko) | 1997-12-19 | 1997-12-19 | 다중 스핀들을 이용한 웨이퍼 절단장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019970038797U KR200173896Y1 (ko) | 1997-12-19 | 1997-12-19 | 다중 스핀들을 이용한 웨이퍼 절단장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990026263U KR19990026263U (ko) | 1999-07-15 |
KR200173896Y1 true KR200173896Y1 (ko) | 2000-03-02 |
Family
ID=19517467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019970038797U KR200173896Y1 (ko) | 1997-12-19 | 1997-12-19 | 다중 스핀들을 이용한 웨이퍼 절단장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200173896Y1 (ko) |
-
1997
- 1997-12-19 KR KR2019970038797U patent/KR200173896Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19990026263U (ko) | 1999-07-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100278070B1 (ko) | 다이싱 장치 | |
US6459105B2 (en) | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | |
US6593170B2 (en) | Semiconductor wafer dividing method | |
JP2002237472A (ja) | 被加工物の切削方法 | |
US6662799B2 (en) | Vertical wafer sawing apparatus | |
US20070068504A1 (en) | Group encapsulated dicing chuck | |
KR20140133451A (ko) | 웨이퍼 절삭 방법 | |
US6006739A (en) | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | |
US6578567B2 (en) | Wafer sawing apparatus | |
US3326071A (en) | Dicing machine | |
KR200173896Y1 (ko) | 다중 스핀들을 이용한 웨이퍼 절단장치 | |
JP3470177B2 (ja) | 切削装置 | |
JP2001230221A (ja) | ウェーハ切断装置及びその方法 | |
KR100207810B1 (ko) | 와이어 톱의 웨이퍼 절단방법 및 그 장치 | |
JPH09207124A (ja) | デュアルマルチブレードカッティングソー | |
JP2004304194A (ja) | 半導体パッケージ作製工程用ソーイング装置及びその制御方法 | |
JP4763398B2 (ja) | 切削装置 | |
JP4676288B2 (ja) | 切削装置 | |
CN101197316A (zh) | 加工装置 | |
MY115490A (en) | Apparatus and method for centering and feeding log | |
KR100337450B1 (ko) | 반도체 패키지 제조를 위한 웨이퍼와 부착된 써킷 테이프 커팅장치 | |
KR100340599B1 (ko) | 반도체 소잉장치 | |
JP2000031096A (ja) | 基板を切断する方法 | |
KR19990026920U (ko) | 반도체 웨이퍼 소잉장치 | |
KR930000859Y1 (ko) | 세라믹 기판 절단 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 19971219 |
|
UA0201 | Request for examination |
Patent event date: 19971219 Patent event code: UA02012R01D Comment text: Request for Examination of Application |
|
UG1501 | Laying open of application | ||
E701 | Decision to grant or registration of patent right | ||
UE0701 | Decision of registration |
Patent event date: 19991129 Comment text: Decision to Grant Registration Patent event code: UE07011S01D |
|
REGI | Registration of establishment | ||
UR0701 | Registration of establishment |
Patent event date: 19991223 Patent event code: UR07011E01D Comment text: Registration of Establishment |
|
UR1002 | Payment of registration fee |
Start annual number: 1 End annual number: 3 Payment date: 19991224 |
|
UG1601 | Publication of registration | ||
UR1001 | Payment of annual fee |
Payment date: 20021120 Start annual number: 4 End annual number: 4 |
|
UR1001 | Payment of annual fee |
Payment date: 20031119 Start annual number: 5 End annual number: 5 |
|
UR1001 | Payment of annual fee |
Payment date: 20041119 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20051116 Year of fee payment: 7 |
|
UR1001 | Payment of annual fee |
Payment date: 20051116 Start annual number: 7 End annual number: 7 |
|
LAPS | Lapse due to unpaid annual fee | ||
UC1903 | Unpaid annual fee |
Termination date: 20071210 Termination category: Default of registration fee |