KR200169687Y1 - Apparatus for fabricating semiconductor wafer - Google Patents
Apparatus for fabricating semiconductor wafer Download PDFInfo
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- KR200169687Y1 KR200169687Y1 KR2019960038074U KR19960038074U KR200169687Y1 KR 200169687 Y1 KR200169687 Y1 KR 200169687Y1 KR 2019960038074 U KR2019960038074 U KR 2019960038074U KR 19960038074 U KR19960038074 U KR 19960038074U KR 200169687 Y1 KR200169687 Y1 KR 200169687Y1
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- semiconductor wafer
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- manufacturing apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 반도체 웨이퍼 제조장치에 관한 것으로, 종래 반도체 웨이퍼 제조용 퍼내스에서는 각 공정을 진행하기 위하여 한공정이 끝나면 캐리어를 이용하여 다음공정으로 이동하고, 그 공정이 끝나면 다시 다음공정으로 이동해야 하므로, 각 공정을 이동하는 시간이 상당이 많이 소요되어 시간의 절감에 따른 생산성을 향상시키는데 한계가 있는 문제점이 있었다. 본 고안 반도체 웨이퍼 제조장치는 챔버의 내부에 3가지의 공정을 진행할 수 있도록 3개의 가열노를 설치하고, 그 각각의 가열노에 웨이퍼를 로딩/언로딩하기 위한 트위저가 구비된 로봇을 설치하여, 1개의 챔버 내에서 여러가지 공정을 진행할 수 있도록 함으로서, 종래와 같이 각 공정을 진행하기 위하여 캐리어로 각각의 공정에 웨이퍼를 이동하는 동작을 생략하게 되어 이동시간의 절감에 따른 생산성이 향상되는 효과가 있다.The present invention relates to a semiconductor wafer manufacturing apparatus. In the conventional semiconductor wafer manufacturing furnace, in order to proceed with each process, after one step is completed, the carrier is moved to the next step, and when the process is finished, the next step is required. It takes a lot of time to move the process has a problem that there is a limit to improve the productivity according to the saving of time. In the semiconductor wafer manufacturing apparatus of the present invention, three heating furnaces are installed in the chamber so that three processes can be performed, and a robot equipped with a tweezer for loading / unloading wafers is installed in each heating furnace, By allowing various processes to be carried out in one chamber, the operation of moving wafers to carriers in each process is omitted in order to proceed with each process as in the prior art, thereby improving productivity due to reduction of travel time. .
Description
본 고안은 반도체 웨이퍼(WAFER) 제조장치에 관한 것으로, 특히 1개의 챔버(CHAMBER)에 여러개의 가열노를 설치하여 생산성을 향상시키도록 하는데 적합한 반도체 웨이퍼 제조장치에 관한 것이다.The present invention relates to a semiconductor wafer (WAFER) manufacturing apparatus, and more particularly to a semiconductor wafer manufacturing apparatus suitable for improving the productivity by installing a plurality of heating furnace in one chamber (CHAMBER).
도1은 종래 반도체 웨이퍼 제조용 퍼내스를 이용하여 작업을 진행하는 상태를 보인 정면도로서, 도시된 바와 같이, 종래에는 트위저(TWEEZER)(1)를 이용하여 캐리어(CARRIER)(2)에 수납되어 있는 웨이퍼(W)를 인출하여 보트(BOAT)(3)에 장착하고, 그 웨이퍼(W)가 장착된 보트(3)를 튜브(4)의 내측에 위치하도록 한 다음, 해당공정을 진행한다.FIG. 1 is a front view showing a state in which a work is performed by using a furnace for manufacturing a semiconductor wafer in the related art. The wafer W is taken out and mounted on the boat BOAT 3, the boat 3 on which the wafer W is mounted is positioned inside the tube 4, and then the process is performed.
즉, 산화막(OXIDATION)형성공정, 증착(DEPOSITION)공정, 확산(DIFFUSITION)공정을 진행시에는 상기와 같이 구성되어 있는 제조용 퍼내스를 각각 설치하여 하나의 작업이 끝난 뒤에는 캐리어(2)를 이용하여 다음공정으로 이동하고, 다음공정에서도 그 공정의 전용 트위저를 이용하여 캐리어에서 웨이퍼를 인출하여 보트에 장착한다음, 그 보트를 튜브의 내부로 위치시키고 작업을 실시하는 것이다.That is, during the oxide formation process, the deposition process, and the diffusion process, each of the manufacturing furnaces configured as described above is installed, and after one operation is completed, the carrier 2 is used. After moving to the next step, the wafer is removed from the carrier and mounted on the boat using the dedicated tweezer of the process, and then the boat is placed inside the tube and the work is performed.
그러나, 상기와 같이 종래에는 웨이퍼 제조시 각 공정을 진행하기 위하여 한공정이 끝나면 캐리어를 이용하여 다음공정으로 이동하고, 그 공정이 끝나면 다시 다음공정으로 이동해야 하므로, 각 공정을 이동하는 시간이 상당이 많이 소요되어 시간의 절감에 따른 생산성을 향상시키는데 한계가 있는 문제점이 있었다.However, as described above, in order to proceed with each process during wafer manufacturing, when one process is finished, the carrier must be moved to the next process, and when the process is finished, the process must be moved back to the next process. There was a problem that there is a limit to improve the productivity according to the saving of a lot of time.
상기와 같은 문제점을 감안하여 안출한 본 고안의 목적은 캐리어를 이용하여 웨이퍼를 각 공정으로 이동하는 것을 생략하여 이동시간의 절감에 따른 생산성을 향상시키도록 하는데 적합한 반도체 웨이퍼 제조장치를 제공함에 있다.An object of the present invention devised in view of the above problems is to provide a semiconductor wafer manufacturing apparatus suitable for improving the productivity according to the reduction of the movement time by omitting the movement of the wafer in each process using a carrier.
도1은 종래 반도체 웨이퍼 제조용 퍼내스를 이용하여 작업을 진행하는 상태를 보인 정면도.1 is a front view showing a state in which work is performed using a conventional semiconductor wafer manufacturing furnace.
도2a는 본 고안 반도체 웨이퍼 제조장치의 구성을 보인 종단면도.Figure 2a is a longitudinal sectional view showing the configuration of the semiconductor wafer manufacturing apparatus of the present invention.
도2b는 본 고안 반도체 웨이퍼 제조장치의 구성을 보인 횡단면도.Figure 2b is a cross-sectional view showing the configuration of the semiconductor wafer manufacturing apparatus of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
11 : 챔버 12 : 가열노11: chamber 12: heating furnace
13 : 보트 14 : 트위저13: boat 14: tweezers
16 : 로봇 W : 웨이퍼16: robot W: wafer
상기와 같은 본 고안의 목적을 달성하기 위하여 공정 챔버와, 그 챔버의 내측에서 공정조건을 각각 콘트롤할 수 있도록 되어 있는 수개의 가열노와, 그 각각의 가열노에 웨이퍼를 로딩/언로딩 시키기 위한 트위저가 구비된 로봇으로 구성된 것을 특징으로 하는 반도체 웨이퍼 제조장치가 제공된다.In order to achieve the object of the present invention as described above, a process chamber, several heating furnaces each of which can control process conditions inside the chamber, and a tweezer for loading / unloading wafers into the respective heating furnaces Provided is a semiconductor wafer manufacturing apparatus, characterized in that consisting of a robot provided with.
이하, 상기와 같이 구성되는 본 고안 반도체 웨이퍼 제조장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the subject innovation semiconductor wafer manufacturing apparatus configured as described above in detail as follows.
도2a는 본 고안 반도체 웨이퍼 제조장치의 구성을 보인 종단면도이고, 도2b는 본 고안 반도체 웨이퍼 제조장치의 구성을 보인 횡단면도이다.Fig. 2A is a longitudinal sectional view showing the construction of the inventive semiconductor wafer manufacturing apparatus, and Fig. 2B is a cross sectional view showing the construction of the inventive semiconductor wafer manufacturing apparatus.
도시된 바와 같이, 본 고안 반도체 웨이퍼 제조장치는 공정 챔버(11)와, 그 공정 챔버(11)의 내측에 설치되는 3개의 가열노(12:12', 12", 12"')와, 그 가열노(12)의 내측에 다수개의 웨이퍼(W)를 로딩 또는 언로딩하는 트위저(14)가 구비된 로봇(16)으로 구성된다.As shown, the inventive semiconductor wafer manufacturing apparatus includes a process chamber 11, three heating furnaces 12: 12 ', 12 ", 12"' installed inside the process chamber 11, and The robot 16 is provided with a tweezer 14 for loading or unloading a plurality of wafers W inside the heating furnace 12.
즉, 웨이퍼(W)에 산화막을 형성시키기 위한 산화막형성공정과, 폴리 필름을 증착시키기 위한 증착공정과, 불순물을 도핑시키기 위한 확산공정을 1개의 챔버(11) 내부에서 진행할 수 있도록 구성하고, 또한 공정간의 웨이퍼(W) 이동을 1개의 트위저(14)로 수행할 수 있도록 하였다.That is, an oxide film forming step for forming an oxide film on the wafer W, a deposition step for depositing a poly film, and a diffusion step for doping impurities can be performed in one chamber 11, and The wafer W movement between the processes can be performed with one tweezers 14.
그리고, 상기 가열노(12)는 산화막형성공정, 폴리증착공정, 불순물확산공정등을 진행시에 사용하는 통상적인 가열노(12)의 구성으로 되어 있으며, 그 가열노(12)의 가열온도 및 사용가스등은 공정에 따라 각각 다르다.The heating furnace 12 has a configuration of a conventional heating furnace 12 which is used for performing an oxide film forming process, a poly deposition process, an impurity diffusion process, and the like, and the heating temperature and The gas used varies depending on the process.
도면중 미설명 부호 15는 웨이퍼를 수납하여 이동하는 캐리어이다.In the figure, reference numeral 15 denotes a carrier for storing and moving wafers.
이와 같이 구성되는 본 고안 반도체 웨이퍼 제조장치는 캐리어(15)로 이동된 웨이퍼(W)를 트위저(14)를 이용하여 산화막형성을 진행하기 위한 가열노(12')의 보트(13)에 탑재하고, 그 보트(13)을 튜브(12')의 내측으로 로딩한 다음, 산화막형성공정을 진행하고, 작업을 마친 뒤에는 보트(13)을 언로딩하고, 다시 그 보트(13)에 탑재되어 있는 웨이퍼(W)를 트위저(14)로 이동하여 다른 가열노(12")에서 증착공정을 진행하며, 증착공정을 마친후에는 확산공정을 실시하기 위한 다른 가열노(12'")로 이동하여 확산공정을 진행하는 방법으로 1개의 챔버(11) 내부에서 연속작업을 실시하게 된다.The semiconductor wafer manufacturing apparatus of the present invention configured as described above mounts the wafer W transferred to the carrier 15 in the boat 13 of the heating furnace 12 'for performing oxide film formation using the tweezers 14, After the boat 13 is loaded into the tube 12 ', the oxide film forming process is performed, and after the work is completed, the boat 13 is unloaded, and the wafer mounted on the boat 13 is again loaded. (W) is moved to the tweezers 14 to proceed with the deposition process in another heating furnace 12 ", and after completion of the deposition process, moves to another heating furnace 12 '" In this manner, the continuous operation is performed in one chamber 11.
이상에서 상세히 설명한 바와 같이 본 고안 반도체 웨이퍼 제조장치는 챔버의 내부에 3개의 공정을 진행할 수 있도록 3개의 가열노를 구비하고, 그 각각의 가열노에 웨이퍼를 이동하기 위한 트위저가 구비된 로봇을 구비하여 공정을 진행할 수 있도록 함으로서, 종래와 같이 각 공정을 진행하기 위하여 캐리어로 각각의 공정에 웨이퍼를 이동하는 동작을 생략하게 되어 이동시간의 절감에 따른 생산성이 향상되는 효과가 있다.As described in detail above, the inventive semiconductor wafer manufacturing apparatus includes three heating furnaces for carrying out three processes inside the chamber, and a robot equipped with a tweezer for moving the wafers to the respective heating furnaces. By allowing the process to proceed, the operation of moving the wafer to the carrier in each process in order to proceed with each process as in the prior art has the effect of improving the productivity according to the reduction of the travel time.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960038074U KR200169687Y1 (en) | 1996-11-01 | 1996-11-01 | Apparatus for fabricating semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960038074U KR200169687Y1 (en) | 1996-11-01 | 1996-11-01 | Apparatus for fabricating semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980025323U KR19980025323U (en) | 1998-08-05 |
| KR200169687Y1 true KR200169687Y1 (en) | 2000-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960038074U KR200169687Y1 (en) | 1996-11-01 | 1996-11-01 | Apparatus for fabricating semiconductor wafer |
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| Country | Link |
|---|---|
| KR (1) | KR200169687Y1 (en) |
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1996
- 1996-11-01 KR KR2019960038074U patent/KR200169687Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR19980025323U (en) | 1998-08-05 |
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